JP2652481B2 - Substrate development processing method - Google Patents

Substrate development processing method

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Publication number
JP2652481B2
JP2652481B2 JP30666191A JP30666191A JP2652481B2 JP 2652481 B2 JP2652481 B2 JP 2652481B2 JP 30666191 A JP30666191 A JP 30666191A JP 30666191 A JP30666191 A JP 30666191A JP 2652481 B2 JP2652481 B2 JP 2652481B2
Authority
JP
Japan
Prior art keywords
substrate
developer
developing solution
developing
meniscus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP30666191A
Other languages
Japanese (ja)
Other versions
JPH05119482A (en
Inventor
昌宏 美作
憲司 杉本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP30666191A priority Critical patent/JP2652481B2/en
Publication of JPH05119482A publication Critical patent/JPH05119482A/en
Application granted granted Critical
Publication of JP2652481B2 publication Critical patent/JP2652481B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】この発明は、半導体基板やフォト
マスク用のガラス基板、光ディスク用の基板、液晶表示
装置の基板等(以下単に基板と称する)を回転させなが
ら、基板表面のフォトレジスト膜やポリイミド樹脂膜、
カラーフィルター膜等の感光性樹脂膜を現像する基板の
現像処理方法に関し、さらに詳しくは、いわゆるパドル
式現像方法、つまり、回転する基板に現像液を供給し続
けながら現像するのではなくて、基板上面が現像液で覆
われた時点で現像液の供給を停止して、表面張力の作用
でメニスカス状に基板上に保持された現像液で現像する
方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photoresist film on a substrate surface while rotating a substrate for a semiconductor substrate, a glass substrate for a photomask, a substrate for an optical disk, a substrate for a liquid crystal display device (hereinafter simply referred to as a substrate). Or polyimide resin film,
More specifically, a so-called paddle type developing method, that is, a developing method of a substrate for developing a photosensitive resin film such as a color filter film, that is, a developing method in which a developing solution is not supplied to a rotating substrate while continuing to supply the developing solution to the substrate. The present invention relates to a method for stopping the supply of a developer when the upper surface is covered with the developer, and performing development with a developer held on a substrate in a meniscus shape by the action of surface tension.

【0002】[0002]

【従来の技術】パドル式現像処理方法としては、例えば
特開昭55−96944号公報に開示された方法が従来
より知られている。それは、スピンチャックで保持した
基板を低速(100rpm)で回転しつつ、そのフォトレジ
スト表面上に現像液を供給し、その表面張力で基板のフ
ォトレジスト表面を現像液で覆い(以下、この基板上に
メニスカス状に盛られた現像液をメニスカスという)、
このメニスカスを形成した状態で現像液の供給を停止
し、次いで基板を一層低速(50rpm)で回転するか又は
停止する現像処理方法である。なお、このようなパドル
式現像方法が提案される以前には、主として、いわゆる
スプレ式現像方法と称される現像方法、すなわち、スプ
レノズル等にて現像の間、絶えず現像液を基板に供給し
続けながら現像する手法が多用されていたが、それに対
してパドル式現像方法は、次のような長所を有してい
る。つまり、パドル式現像方法は、基板上にメニスカス
が形成された時点で現像液の供給を停止するので、スプ
レ式現像方法のように現像の間中絶えず現像液を基板へ
向けて供給するのとは異なり、基板へ向けて供給される
現像液の勢いでフォトレジスト膜面が損傷を受ける程度
がきわめて低く、また、供給する現像液供給量の不均一
さに起因する現像ムラも低く、また、現像液消費量が少
ない等の長所を有している。
2. Description of the Related Art As a paddle type development processing method, for example, a method disclosed in JP-A-55-96944 has been conventionally known. That is, while rotating the substrate held by the spin chuck at a low speed (100 rpm), a developer is supplied onto the photoresist surface, and the photoresist surface of the substrate is covered with the developer by the surface tension (hereinafter, referred to as the substrate surface). The meniscus developer is called a meniscus),
In this development processing method, the supply of the developer is stopped in a state where the meniscus is formed, and then the substrate is rotated or stopped at a lower speed (50 rpm). Before such a paddle type developing method was proposed, mainly a developing method called a so-called spray type developing method, that is, a developing solution was continuously supplied to a substrate during development with a spray nozzle or the like. In contrast, the paddle type developing method has the following advantages. That is, in the paddle type developing method, the supply of the developing solution is stopped when the meniscus is formed on the substrate, so that the developing solution is constantly supplied to the substrate during the development as in the spray type developing method. Differently, the degree of damage to the photoresist film surface due to the force of the developing solution supplied toward the substrate is extremely low, and the development unevenness due to the uneven supply amount of the developing solution supplied is low, and It has advantages such as low developer consumption.

【0003】[0003]

【発明が解決しようとする課題】前述のように、パドル
式現像方法は優れた現像方法であるが、なお、以下のよ
うなパドル式現像方法に特有の問題を有する。即ち、容
易に現像液のメニスカスが形成され、かつ形成されたメ
ニスカスが崩れないように、当初から基板を比較的低速
(100rpm)で回転しつつ、そのフォトレジスト表面上
に現像液を供給することから、この程度の回転速度では
遠心力で現像液が基板上面に広がる作用をあまり期待で
きず、フォトレジスト膜面に現像液が馴染まず、現像液
が部分的にはじかれて、基板の全面を覆うようにメニス
カスを形成できず、基板上で部分的に現像液と触れない
箇所ができ、現像ムラを生じる。
As described above, the paddle type developing method is an excellent developing method, but has the following problems peculiar to the paddle type developing method. That is, the substrate is moved at a relatively low speed from the beginning so that the meniscus of the developing solution is easily formed and the formed meniscus does not collapse.
Since the developer is supplied onto the photoresist surface while rotating at (100 rpm), the effect that the developer spreads on the upper surface of the substrate due to centrifugal force cannot be expected at such a rotational speed. When the developer does not become familiar, the developer is partially repelled, a meniscus cannot be formed so as to cover the entire surface of the substrate, and a portion of the substrate that does not come into contact with the developer is formed, resulting in uneven development.

【0004】これを解消するには、現像液のメニスカス
を形成するのに必要以上の現像液を供給する方法(以下
改良案1という)、あるいは、前述のスプレ式現像方法
に使用される手法でプリウエットと称されるムラ無く現
像する手法をパドル式現像方法に転用する方法(以下改
良案2という)が考えられる。なお、プリウエット手法
とは、例えば、本出願人が先に出願した特開昭57−1
36646号(発明の名称「ポジ型フォトレジストの現
像方法」)に記載のように、基板へ現像液を供給する際
に、前段処理として薄めの現像液ないし純水からなるプ
リウエット液を基板に供給するもので、そのようにする
ことで、フォトレジスト膜表面が現像液にムラ無く馴染
むようにすることを、意図するものである。
To solve this problem, a method of supplying a developing solution more than necessary to form a meniscus of the developing solution (hereinafter referred to as "improvement 1") or a method used in the above-mentioned spray developing method is used. A method (hereinafter referred to as "improvement 2") in which a method called "pre-wet" for developing without unevenness is diverted to a paddle type developing method is considered. The pre-wet method is described in, for example, Japanese Patent Application Laid-Open No. 57-1 filed earlier by the present applicant.
As described in No. 36646 (Title of Invention: "Positive Photoresist Developing Method"), when a developing solution is supplied to a substrate, a thin developing solution or a pre-wet liquid composed of pure water is applied to the substrate as a pretreatment. It is intended to make the surface of the photoresist film conform to the developer evenly by doing so.

【0005】しかし、改良案1ではメニスカスを形成す
るのに必要な量(メニスカスの体積)より大量の現像液を
消費するので、ランニングコストが高くつく。他方改良
案2では、基板表面にプリウエット液を供給することに
より、高価な現像液の消費量を削減でき、また現像液が
基板のフォトレジスト表面に馴染み易くなるが、引き続
き現像液を供給する際に、現像の初期においてプリウエ
ット液と現像液とが混在し、局部的に現像液濃度が不均
一となり、現像ムラの原因となる。本発明はこのような
パドル式現像方法に特有の事情に鑑みてなされたもの
で、 イ.現像液が基板の全面を覆うような状態でメニスカス
を形成できないことに起因して、生じる現像液ムラを解
消すること、 ロ.現像液を多量に供給することによってのみ現像ムラ
を回避する従来手法よりも現像液の消費を低減すること を技術課題とする。
However, the improvement 1 consumes a larger amount of developing solution than the amount required for forming a meniscus (volume of the meniscus), so that the running cost is high. On the other hand, in the improvement 2, the consumption of expensive developer can be reduced by supplying the pre-wet liquid to the substrate surface, and the developer can be easily adapted to the photoresist surface of the substrate. In this case, the pre-wet liquid and the developer are mixed in the early stage of the development, and the concentration of the developer becomes locally non-uniform, which causes uneven development. The present invention has been made in view of the circumstances peculiar to such a paddle type developing method. Eliminate unevenness in the developing solution caused by the inability to form a meniscus in a state where the developing solution covers the entire surface of the substrate; It is an object of the present invention to reduce the consumption of the developing solution as compared with the conventional method of avoiding development unevenness only by supplying a large amount of the developing solution.

【0006】[0006]

【課題を解決するための手段】本発明は上記課題を解決
するものとして、以下のように構成される。即ち、第1
工程とこれに続く第2工程とからなる現像液供給工程
と、現像液の供給を停止した状態で基板表面の感光性樹
脂膜面を現像する現像液保持工程とを含んで成る基板の
現像処理方法であって、上記第1工程では、基板を高速
回転しつつ現像液を少量供給して当該現像液を基板の全
面に行き渡らせることにより、現像液を基板表面の感光
性樹脂膜面の全面に馴染ませ、上記第2工程では、前記
基板を低速回転ないし回転停止させた状態で現像液を供
給して感光性樹脂膜面上に現像液のメニスカスを形成
し、上記現像液保持工程では、上記現像液のメニスカス
を維持する程度に基板を低速回転ないし回転停止させた
状態で上記感光性樹脂膜面を現像することを特徴とする
基板の現像処理方法である。
The present invention is configured as follows to solve the above-mentioned problems. That is, the first
A developing solution supply step including a step and a second step following the step, and a developing solution holding step of developing the photosensitive resin film surface of the substrate surface in a state where the supply of the developing solution is stopped. a method, in the first step, by disseminating the developer on the entire surface of the substrate a substrate by supplying a small amount of high speed quality one current image liquid photosensitive resin film surface of the developer substrate surface adapt to the entire surface, in the second step, by supplying the current image liquid in a state where the substrate is stopped low speed to rotate the meniscus of the liquid developer formed on the photosensitive resin layer surface, the developer holding The step is a substrate development processing method, wherein the photosensitive resin film surface is developed while the substrate is rotated at a low speed or stopped so that the meniscus of the developer is maintained.

【0007】[0007]

【作用】本発明では、現像液供給工程は第1工程と第2
工程とからなり、その第1工程で基板を高速で回転しつ
つ、基板上に現像液を少量供給する。つまり、第1工程
では、現像液はメニスカスを形成することはないが、現
像液は基板の回転中心から端へ向かって、遠心力により
瞬時に薄膜状に現像液の層を形成するように広がって、
基板上の感光性樹脂膜の表面全域が、余すところなく確
実に現像液と接触し、感光性樹脂膜の全面が現像液と馴
染み易い状態となる。
According to the present invention, the developer supply step comprises the first step and the second step.
It consists of a step, while rotating the substrate at high speed at the first step, supplying a small amount of current image liquid onto the substrate. In other words, in the first step, the developer does not form a meniscus, but the developer spreads from the center of rotation of the substrate toward the end by a centrifugal force so as to instantaneously form a thin layer of the developer. hand,
The entire surface of the photosensitive resin film on the substrate is securely and thoroughly contacted with the developing solution, so that the entire surface of the photosensitive resin film becomes easily compatible with the developing solution.

【0008】そして第2工程では、基板を低速回転ない
し回転停止させた状態で、その全面が現像液と馴染み易
い状態となった感光性樹脂膜面上に現像液を供給するこ
とから、短時間で基板の感光性樹脂膜面上に現像液のメ
ニスカスが形成される。これにより、基板上に、基板の
全面を余すところなく覆うようにメニスカス状に現像液
を保持することができるので、現像ムラの発生を無くす
ることができる。また、前述のように第1工程で感光性
樹脂膜の全面が現像液と馴染み易い状態になってから第
2工程でメニスカスを形成するため、前記従来例のよう
に現像液を多量に供給する物量的手法でメニスカスを形
成するのとは異なり、現像液を節約できる。
[0008] Then, in the second step, in a state where the substrate is stopped low speed or rotation, since its entire surface to supply the current image liquid developing solution and familiar becomes easily state photosensitive resin film plane, short A meniscus of the developing solution is formed on the photosensitive resin film surface of the substrate in a short time. Thus, the developer can be held in a meniscus shape so as to cover the entire surface of the substrate over the entire surface of the substrate, so that development unevenness can be prevented. Further, as described above, since the meniscus is formed in the second step after the entire surface of the photosensitive resin film becomes easily compatible with the developer in the first step, a large amount of the developer is supplied as in the conventional example. Unlike forming a meniscus by a physical method, the developer can be saved.

【0009】[0009]

【実施例】以下本発明の実施例を図面に基づいて説明す
る。図1は本発明の実施例に係る基板の現像処理方法を
例示する工程図、図2はその現像処理装置の概要図であ
る。この現像処理装置は図2に示すように、回転処理ユ
ニット1と、現像液吐出ノズル6と、現像液タンク10
と、現像液吐出ノズル6と現像液タンク10とを連通連
結する給液管7と、それぞれ給液管7に付設された温度
調節器12、フィルター13、及び流量計14とを具備
して成る。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a process diagram illustrating a substrate development processing method according to an embodiment of the present invention, and FIG. 2 is a schematic diagram of the development processing apparatus. As shown in FIG. 2, the developing apparatus includes a rotation processing unit 1, a developing solution discharge nozzle 6, a developing solution tank
And a liquid supply pipe 7 for connecting and connecting the developer discharge nozzle 6 and the developer tank 10, and a temperature controller 12, a filter 13, and a flow meter 14 respectively attached to the liquid supply pipe 7. .

【0010】上記回転処理ユニット1は、スピンチャッ
ク2と、スピンチャック2を回転する駆動モータ3と、
スピンチャック2を囲うように設けられたカップ4とか
ら成り、スピンチャック2で基板Wを吸着保持して水平
回転しつつ、現像液やリンス液を供給して所定の表面処
理をするように構成されている。
The rotation processing unit 1 includes a spin chuck 2, a drive motor 3 for rotating the spin chuck 2,
A cup 4 provided so as to surround the spin chuck 2. The spin chuck 2 sucks and holds the substrate W and horizontally rotates, while supplying a developing solution or a rinsing liquid to perform a predetermined surface treatment. Have been.

【0011】上記現像液吐出ノズル6は有底筒状であ
り、基板Wに対して直立状に配置され、かつ図示しない
ノズル昇降手段にてノズル先端を基板に対して近接自在
に設けられ、ノズル本体の筒壁にあけた複数の吐出孔6
aから現像液5を吐出するように構成されている。つま
り、現像液5の供給時に現像液吐出ノズル6を基板Wに
近接させ、落差を小さくして現像液供給の衝撃を極力与
えないように配慮され、また、ノズル6内へ供給された
現像液は、有底筒状のノズル6内にて、一旦底面に当た
って液の流れの勢いを弱め、ノズル筒壁の前記吐出孔6
a群から、四方均等にゆるやかに、あふれ出るようにし
て現像液5を基板Wの全面に亙り、十分に供給すること
ができるようになっている。
The developing solution discharge nozzle 6 has a bottomed cylindrical shape, is arranged upright with respect to the substrate W, and has a nozzle tip provided so as to be close to the substrate by a nozzle elevating means (not shown). A plurality of discharge holes 6 formed in the cylinder wall of the main body
The developer 5 is configured to be discharged from a. That is, when supplying the developing solution 5, the developing solution discharge nozzle 6 is brought close to the substrate W so that the head is reduced so as to minimize the impact of the supplying of the developing solution. Is used to weaken the flow of the liquid by once hitting the bottom surface in the bottomed cylindrical nozzle 6 and reduce the discharge hole 6 in the nozzle cylindrical wall.
The developing solution 5 can be sufficiently supplied over the entire surface of the substrate W so as to gradually and uniformly overflow from the group a.

【0012】上記給液管7は、上流側で2つの分流管7
a・7bに分岐され、それぞれに開閉弁8a・8bが設
けられ、各分流管7a・7bの先端は現像液タンク10
内の現像液5中に没入して設けられている。そして現像
タンク10は、上蓋11で開閉可能に密閉され、上蓋1
1に付設されたガス導入管11aより不活性ガスN2
圧入し、各分流管7a・7bを介して現像液5を圧送す
るように構成されている。ここで上記現像液は、前記プ
リウエット液ではなく現像処理に使用する通常の濃度の
現像液である(以下、同じ)。
The liquid supply pipe 7 has two branch pipes 7 on the upstream side.
a, 7b, each of which is provided with an on-off valve 8a, 8b.
It is provided so as to be immersed in the developing solution 5 therein. The developing tank 10 is hermetically sealed by an upper lid 11 so as to be opened and closed.
1 gas inlet tube 11a from the inert gas N 2, which is attached by press-fitting to, and is configured to pump the current image liquid 5 through the respective shunt tubes 7a · 7b. Here, the developer is
A developer usual concentration used in the developing process rather than rewetting liquid (hereinafter, the same).

【0013】以下図1に基づき、本実施例装置による現
像処理手順について説明する。本実施例の現像処理方法
は、第1工程S1とこれに続く第2工程S2とからなる現
像液供給工程と、現像液の供給を停止して基板上にて表
面張力の作用で現像液を保持する現像液保持工程S
3と、基板を回転して基板に保持されている現像液を遠
心力で振り切る振り切り工程S4とからなる。なお、前
記S1〜S4からなる一連の現像処理の後には、基板から
現像液の成分を洗い流すリンス処理工程S6が施され
る。先ず第1工程S1では、スピンチャック2で保持し
た基板Wを比較的高速(1000rpm)で回転しつつ、そ
のフォトレジスト表面上に現像液5を比較的少流量(2
50ml/min)の連続流で2秒間供給する。これにより、
現像液5は強い遠心力により一瞬にして基板の全面に行
き渡り、フォトレジスト膜面は現像液5に馴染む。
Referring now to FIG. 1, a description will be given of a developing procedure by the apparatus of the present embodiment. Developing method of this embodiment, the developing solution supply step comprising a first step S 1 and the second step S 2 Metropolitan following this, the development by the action of surface tension at by stopping the supply of the developing solution on the substrate Developer holding step S for holding the liquid
3, consisting of shaking off step S 4 Metropolitan spin off by centrifugal force a developer held on the substrate by rotating the substrate. Incidentally, after a series of development processing consisting of the S 1 to S 4 is rinsing step S 6 to wash away the ingredients of the developer from the substrate is performed. First, at the first step S 1, while rotating at a relatively high speed of the substrate W held by the spin chuck 2 (1000 rpm), a relatively low flow the current image liquid 5 on the photoresist surface (2
(2 ml) with a continuous flow of 50 ml / min). This allows
The developing solution 5 instantaneously spreads over the entire surface of the substrate by the strong centrifugal force, and the photoresist film surface is adapted to the developing solution 5.

【0014】次いで第2工程S2では、基板Wを低速回
転(30rpm)ないし回転停止の状態で、そのフォトレ
ジスト膜面上に現像液5を比較的多流量(650ml/mi
n)の連続流で2秒間供給する。続いて次の現像液保持
工程S3では、現像液5の供給を停止し、かつスピンチ
ャックを先の第2工程S2と同速ないし一層低速(0〜
30rpm)で回転させるか又は停止させる状態を約50
秒間維持する。これにより、現像液5は図2の破線に示
すようにその表面張力で基板Wのフォトレジスト膜面上
にメニスカス形成した状態となり、基板Wの表面は全面
が均一に現像される。なお、第1工程S1で供給する現
像液と第2工程S2で供給する現像液とは、ともに前記
通常の濃度の現像液であるため、第2工程S2の初期に
おいて第1工程S1で供給された現像液と第2工程S2
供給された現像液が混在しても、濃度差はなく、局部的
に現像濃度が不均一になるといったようなことは生じて
いないので、基板全面にわたって均一な現像を行うこと
ができる。
[0014] Then the second step S 2, the substrate W in a state of low-speed rotation (30 rpm) to rotation stop, relatively multi rate (650 ml / mi the current image liquid 5 in the photoresist film plane
Feed for 2 seconds with continuous flow of n). Then in the next developer holding step S 3, to stop the supply of the developing solution 5, and the spin chuck previous second step S 2 and more slow to not the speed (0
Rotation or stop at about 30 rpm)
Hold for seconds. As a result, the developing solution 5 is in a state of forming a meniscus on the photoresist film surface of the substrate W due to its surface tension as shown by the broken line in FIG. 2, and the entire surface of the substrate W is uniformly developed. Incidentally, the developer supplied in the first step S 1 and the developer supply in the second step S 2, both the
Since a developer usual concentrations, even developing solution and developing solution supplied in the second step S 2 of the second step S 2 initial supplied in the first step S 1 is mixed, the concentration difference In other words, since the development density does not locally become nonuniform, uniform development can be performed over the entire surface of the substrate.

【0015】次いで振り切り工程S4では、基板Wを比
較的高速(1000rpm)で2秒間回転して現像液5を基
板表面から排除する。ステップS5では、上記ステップ
2〜S4の工程を繰り返した回数Nが、予め設定した必
要回数Cに達したかを判断し、到達していれば上記一連
の現像処理は終了し、次のリンス処理工程のステップS
6へ移行する。ただし、上記ステップS2〜S4の工程を
繰り返す予め設定した必要回数C(1以上の整数)とは、
前もって実験的手法等で意図する良好な現像結果を得る
のに必要な繰り返しの回数を求めておいたものであり、
フォトレジストの種類や現像液の濃度等の種類のファク
タの影響を受けて定まる。なお、上記ステップS2〜S4
の工程を繰り返す代わりに、ステップS1〜S4の工程を
繰り返すようにしてもよく、あるいは、繰り返さなくて
もよい。最後にリンス処理工程S6では、別のノズル
(図示せず)より回転する基板Wの表面にリンス液を供
給して、基板Wの表面を約10秒間リンス処理し、その
後液切り乾燥する。
Next, in the shaking-off step S 4 , the developing solution 5 is removed from the substrate surface by rotating the substrate W at a relatively high speed (1000 rpm) for 2 seconds. In step S 5, the number N of repeating the process of step S 2 to S 4 are preset or the determined reached required number C of the above series of development processing if reached is terminated, the next Step S of the rinsing process
Move to 6 . However, as in step S 2 to S repeated 4 steps preset required number C (1 or more integer), the
The number of repetitions necessary to obtain the intended good development result was determined in advance by an experimental method, etc.
It is determined by the influence of factors such as the type of the photoresist and the concentration of the developer. It is to be noted that the step S 2 to S 4
Instead of repeating the steps may be repeated a process of Step S 1 to S 4, or may be repeated. Finally, in the rinsing step S 6, by supplying a rinse liquid to the surface of the rotating substrate W than another nozzle (not shown), the surface for about 10 seconds rinsing of the substrate W, then liquid cut dry.

【0017】なお、本発明は上記実施例に限るものでは
なく、現像液5の流量Qや基板Wの回転数nについて
も、基板Wのサイズ等に応じて適宜変更を加えて実施し
得ることは、多言を要しない。また現像液供給に係る配
管系も上記実施例に限定されるものではなく、例えば給
液管7を分流管7a・7bに分岐することなく流量調整
機能を有する1つの開閉弁を用いた構成でもよく、要は
第1工程と第2工程に於いて給液される現像量の流量を
変更できる構成であればよい。
The present invention is not limited to the above-described embodiment, but can be carried out by appropriately changing the flow rate Q of the developing solution 5 and the rotation speed n of the substrate W according to the size of the substrate W and the like. Does not require multiple words. Further, the piping system for supplying the developer is not limited to the above-described embodiment. For example, a configuration using one open / close valve having a flow rate adjusting function without branching the liquid supply pipe 7 into the branch pipes 7a and 7b may be used. In short, any structure may be used as long as the flow rate of the developing amount supplied in the first step and the second step can be changed.

【0018】ちなみに上記の例では、基板Wの直径が6
インチの場合に、従来例に比べて現像液の消費量を約20
%程度節約できる。これはランニングコストの大幅な低
減を意味する。また、前記実施例はフォトレジスト膜の
現像に関するものであるが、本件発明は、ポリイミド樹
脂膜、カラーフィルター膜等の各種感光性樹脂膜の現像
に適用できる。また、前記実施例では、現像液保持工程
3の後、振り切り工程S4を経てからリンス処理工程S
6へ移行しているが、振り切り工程S4を省略し、現像液
保持工程S3から、ただちにリンス処理工程S6へ移行し
てもよい。
In the above example, the diameter of the substrate W is 6
In the case of inches, the consumption of the developer is about 20
% Savings. This means a significant reduction in running costs. Although the above embodiments relate to the development of a photoresist film, the present invention is applicable to the development of various photosensitive resin films such as a polyimide resin film and a color filter film. In the above embodiment, after the developer holding step S 3, shaking off step S 4 step rinsing from via S
Although shifts to 6, omitting the shaking step S 4, the developer holding step S 3, it may be immediately shifted to the rinsing step S 6.

【0019】[0019]

【発明の効果】本発明は、以下の効果を奏する。 イ.本発明では、第1工程で基板を高速回転しつつ現
液を少量供給して当該現像液を基板の全面に行き渡らせ
ることにより、現像液を基板表面の感光性樹脂膜面の全
面に馴染ませ、第2工程で基板を低速回転ないし回転停
止させた状態で現像液を供給して感光性樹脂膜面上に現
像液のメニスカスを形成し、現像液保持工程で上記現像
液のメニスカスを維持する程度に基板を低速回転ないし
回転停止させた状態で上記感光性樹脂膜面を現像するこ
とから、基板上に現像液を供給してメニスカス状に現像
液を保持するにも拘わらず、現像ムラの問題を解消する
ことができる。 ロ.第1工程では感光性樹脂膜の全面を現像液と馴染み
易い状態にしてから、第2工程でメニスカスを形成する
ので、前記現像ムラを生じなくなるまで現像液を多量に
供給する従来例と比較して、現像液を節約することがで
きる。 ハ.また、第1工程で供給される現像液と、第2工程で
供給される現像液はともに同じ濃度の像液であるた
め、第2工程の初期において第1工程で供給された現像
液と第2工程で供給された現像液が混在しても、局部的
に現像液濃度差が生じて現像が不均一となるといったよ
うな問題を生ずることがなく基板全面にわたり均一な現
像を実現することができる。
The present invention has the following effects. I. In the present invention, by spread the developing solution on the entire surface of the substrate the substrate in the first step by supplying a small amount of high speed quality one current image solution, a developing solution to the entire surface of the photosensitive resin film surface of the substrate surface familiarizing the substrate in the second step by supplying the current image liquid in a state of low-speed rotation to the rotation stopping the meniscus of the liquid developer formed on the photosensitive resin layer surface, the meniscus of the liquid developer in the developer holding step since developing the photosensitive resin layer surface in a state where the substrate to the extent of maintaining stopping low speed to rotate, despite holding a developer by supplying a current image liquid onto the substrate to a meniscus shape Thus, the problem of uneven development can be solved. B. After the entire surface of the photosensitive resin layer in the current image liquid and familiar prone state in the first step, because it forms a meniscus in the second step, compared with the conventional example in which a large amount of supplying a developing solution until no cause the uneven development Thus, the developer can be saved. C. Further, a developing solution to be supplied in the first step, since the developing solution supplied in the second step are both current image solution of the same concentration was supplied in the first step at the beginning of the second step development liquid and even developing solution supplied in the second step are mixed, a uniform development over locally developer developer density difference occurs arise problems such as a nonuniform this and without the entire substrate surface Can be realized.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る現像処理方法の工程図である。FIG. 1 is a process chart of a development processing method according to the present invention.

【図2】本発明を実施するための現像処理装置の実施例
を示す概要図である。
FIG. 2 is a schematic diagram showing an embodiment of a developing apparatus for carrying out the present invention.

【符号の説明】[Explanation of symbols]

W…基板、 5…現像液、 S1
第1工程、 S2…第2工程、 S3…現像液保持工程、 S4
振り切り工程、S6…リンス処理工程。
W: substrate, 5: developer, S 1 ...
First step, S 2 ... second step, S 3 ... developer holding step, S 4 ...
Shaking-off process, S 6 rinsing process.

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭58−88749(JP,A) 特開 昭55−96944(JP,A) 特開 平2−303116(JP,A) ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-58-88749 (JP, A) JP-A-55-96944 (JP, A) JP-A-2-303116 (JP, A)

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 第1工程とこれに続く第2工程とからな
る現像液供給工程と、現像液の供給を停止した状態で基
板表面の感光性樹脂膜面を現像する現像液保持工程とを
含んで成る基板の現像処理方法であって、 上記第1工程では、基板を高速回転しつつ現像液を少量
供給して当該現像液を基板の全面に行き渡らせることに
より、現像液を基板表面の感光性樹脂膜面の全面に馴染
ませ、 上記第2工程では、前記基板を低速回転ないし回転停止
させた状態で現像液を供給して感光性樹脂膜面上に現像
液のメニスカスを形成し、 上記現像液保持工程では、上記現像液のメニスカスを維
持する程度に基板を低速回転ないし回転停止させた状態
で上記感光性樹脂膜面を現像することを特徴とする基板
の現像処理方法。
1. A developer supply step comprising a first step and a second step subsequent thereto, and a developer holding step of developing a photosensitive resin film surface on a substrate surface in a state where the supply of the developer is stopped. a comprising at developing method of the substrate, in the first step, the substrate and the substrate by supplying a small amount of high speed quality one current image liquid by disseminating the developer on the entire surface of the substrate, the developer adapt the entire surface of the photosensitive resin film surface of the surface, in the second step, the meniscus of the liquid developer on the substrate a low-speed rotation or in a state in which rotation is stopped by supplying the current image liquid photosensitive resin film plane Forming the developing solution, wherein the developing solution holding step includes developing the photosensitive resin film surface in a state where the substrate is rotated at a low speed or stopped so as to maintain a meniscus of the developing solution. .
JP30666191A 1991-10-25 1991-10-25 Substrate development processing method Expired - Lifetime JP2652481B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30666191A JP2652481B2 (en) 1991-10-25 1991-10-25 Substrate development processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30666191A JP2652481B2 (en) 1991-10-25 1991-10-25 Substrate development processing method

Publications (2)

Publication Number Publication Date
JPH05119482A JPH05119482A (en) 1993-05-18
JP2652481B2 true JP2652481B2 (en) 1997-09-10

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Country Link
JP (1) JP2652481B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7074726B2 (en) 2002-01-31 2006-07-11 Dainippon Screen Mfg. Co., Ltd. Substrate treating method and substrate treating apparatus
JP5797532B2 (en) * 2011-02-24 2015-10-21 東京エレクトロン株式会社 Development processing method and development processing apparatus using developer containing organic solvent
US20150050602A1 (en) * 2011-12-06 2015-02-19 National Institute Of Advanced Industrial Science And Technology Spin Development Method and Apparatus
JP5940022B2 (en) * 2013-06-13 2016-06-29 三菱電機株式会社 Manufacturing method of semiconductor device

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