JP2649265B2 - Tile polishing equipment - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an improvement in a tile polishing apparatus.

[Prior Art] FIG. 2 is a front view showing a conventional apparatus and method for continuously grinding and polishing the surface of a tile.
Denotes a rough grinding section, F denotes a finish grinding section, P denotes a polishing section, 1 denotes a tile, 2 denotes a belt conveyor, 3 denotes a grinding tool, and 4 denotes a polishing tool.

As shown in the figure, the tiles 1 are arranged on a conveyor equipment, for example, a belt conveyor 2 in the figure, and the grinding and polishing tools 3 and 4 are rotated to continuously grind and polish the surface of the tile 1 moved by the conveyor 2. is there. The grinding step is for uniformly finishing the tile thickness, and a grinding tool having a grinding portion formed by embedding a diamond chip or the like in a grinding surface is used. The polishing step is performed for polishing the tile surface, and the tool is a grindstone or a buff.

[Problems to be Solved by the Invention] By the way, in the above-described conventional grinding method of the continuous grinding and polishing apparatus, when there is a difference in the thickness of the tile, the polishing tool is inclined as shown in FIG. 3 (a). The edge 5 of the tile A is excessively polished, or the edge 6 of the tile B is
May be insufficiently polished, causing uneven polishing on the surface of the tile. On the contrary, as shown in FIG. 3 (b), the edge 7 of the polishing tool 4 As a result, uneven wear occurs on the tool 4 and the polishing of the tile surface becomes uneven. For this reason, uneven gloss is generated, the quality of the tile is not stabilized, the yield is considerably reduced, and the polishing tool 4 is quickly consumed and the processing cost is greatly increased. Was.

The present invention has been made to solve the above-described problems of the conventional apparatus, and even if there is a slight difference in the thickness of the tile, the polishing tool life is greatly extended without causing uneven polishing on the tile surface. It is an object of the present invention to provide a polishing apparatus for extending the length.

[Means for Solving the Problems] In order to achieve the above object, in a polishing apparatus for a bright tile according to the present invention, a back plate provided with a liquid passage hole and connected to the driving source; A telescopic buffer member fixedly provided with a liquid passage hole communicating with the liquid passage hole, and a liquid passage hole attached to the back plate via the buffer member and communicating with the liquid passage hole at a central portion. A polishing member formed of an abrasion-resistant elastic body containing no abrasive grains. The polishing tool is constituted by the polishing member, the cushioning member, and the back plate. A polishing liquid supplied from the through-holes of the back plate and suspending the free abrasive grains is jetted from a central portion of the polishing member toward a polishing surface of the tile moving on the base, and the surface of the tile is polished. Like polishing I made it.

[Operation] Since the tile polishing apparatus is as described above, the polishing member is almost uniformly and closely contacted with the tile polishing surface by the function of the buffer member, and the polishing liquid is ejected from the center of the polishing member toward the tile polishing surface. The space between the polishing member of the polishing tool and the tile surface is filled with a polishing liquid that has suspended free abrasive grains, and the free abrasive grains in the polishing liquid polish the tile surface by rotating the tool and moving the tile. Will be. Even if there is a step between tiles due to liquid polishing, or if there is undulation on the tile polishing surface,
The polishing surface is in close contact with the tile polishing surface. Also, even when a portion that is difficult to contact is generated, the polishing liquid penetrates into the gap between the polished surface and the polished surface of the tile, and the abrasive grains uniformly polish the surface of the tile without being affected by steps or undulations of the tile. As a result, there is no unpolished portion on the tile surface, no polishing unevenness occurs, and the polishing member mounted on the cushioning member is formed of an abrasion-resistant elastic body. Because of the action of the member and the elasticity of the polishing member, the material escapes without biting into the edge portion of the tile. Therefore, the tile edge portion of the polishing member does not suffer from chipping and uneven wear, and does not cause tool wear.

[Embodiment of the Invention] Fig. 1 is an enlarged view of a main part of a tile polishing apparatus according to an embodiment of the present invention, wherein 1 is a tile, 2 is a belt conveyor, and 10 is a belt conveyor.
Is a polishing tool, 11 is a polishing member, 12 is a buffer member, 13 is a back rate provided with a liquid passage hole, and 14 is a polishing liquid.

As shown in the figure, the polishing tool used in the polishing apparatus according to the present invention has a sponge-shaped neoprene buffer member 12 fixed to a back plate 13 and a urethane polishing member 11 mounted thereon. Thus, the polishing liquid 14 in which free abrasive grains are suspended is ejected below the center of the polishing member 11.

When polishing the surface of the tile 1, the belt conveyor 2
The tiles 1 are arranged on the upper side, and the polishing liquid 14 is jetted downward from the center of the rotating polishing member 11 while moving the conveyor 2 in the direction indicated by the arrow. The polishing liquid 14 in which the polishing grains are suspended flows out as indicated by arrows 15 on the tile surface from the center of the polishing member 11 in all directions. At that time, the tiles are moved by the conveyor 2,
Due to the rotation of the polishing tool 10 and the outflow of the polishing liquid, the abrasive grains suspended in the polishing liquid 14 interposed between the polishing member 11 and the tile surface relatively move along the tile surface at a considerable speed, and the tile surface Polish.

As described above, the polishing of the tile surface is performed by the polishing liquid 14, and the buffer member 12 is a sponge-like neoprene rubber that can expand and contract, and the polishing member 11 has elasticity.
There is a difference in the thickness of the tiles 1. Therefore, even if the tiles 1 arranged on the conveyor have steps or undulations on the polished surface of the tiles, the polished surface is in close contact with the polished tile surface. Even if it occurs, the polishing liquid 14 does not enter the gap between the polished surface and the tile polished surface, and does not cause unevenness on the tile polished surface.

Further, since the polishing member 11 is formed of an elastic material such as urethane rubber having abrasion resistance, even if the polishing member 11 hits a step of the tile 1, it is not damaged, and the life of the polishing tool 10 is greatly extended.

In the present embodiment, the buffer member 12 of the polishing tool is formed of sponge-like neoprene.However, the present invention is not limited to this, and a bellows or a spring may be used, and the polishing member may use a nonwoven fabric or the like. .

Further, the polishing apparatus according to the present invention can be widely used for general surface polishing without limiting the object to the surface of the tile.

[Effects of the Invention] The present invention provides, as a polishing apparatus for a plurality of tile surfaces placed adjacently on a base, a polishing member of a polishing tool including a wear-resistant elastic body containing no abrasive grains via a buffer member. It was used by attaching it to the back plate, and the polishing liquid in which free abrasive grains were suspended was flowed out along the tile surface from the center of the polishing member of the polishing tool to the outside, so as described below. I was able to get a great effect.

(1) Since a polishing solution in which free abrasive grains are suspended is used for polishing, even if there is a step between the tiles arranged or undulations on the tile surface, polishing unevenness does not occur on the tile surface.

(2) Since the polishing member of the polishing tool uses a wear-resistant elastic body such as urethane mounted on the buffer member, even if the polishing member hits a step of the tile, the pressing force is reduced by the action of the buffer member. Reduced, less damage like whetstones and buffs, greatly extending the life of the polishing tool.

(3) As described above, uneven polishing on the tile surface is prevented, and the life of the polishing tool is extended.
This has led to an increase in productivity and a reduction in consumables, and has enabled a significant reduction in processing costs.

[Brief description of the drawings]

FIG. 1 is a front view showing a tile polishing apparatus according to one embodiment of the present invention, FIG. 2 is a front view of a conventional polishing apparatus, and FIG. 3 is a partial sectional view showing a polishing tool at a step portion of the tile. is there. In the figure, 1 is a tile, 2 is a belt conveyor, 10 is a polishing tool, 11 is a polishing member, 12 is a buffer member, 13 is a back plate, and 14 is a polishing liquid. The first reference numerals in the drawings indicate the same or corresponding parts.

 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Minoru Iseda 1-44-19 Komaba, Meguro-ku, Tokyo Mitsui Kinzoku Dormitory 5-2 (56) References JP-A-57-57612 (JP, A) JP-A-61 -19559 (JP, A) Real opening 62-46550 (JP, U)

Claims (1)

(57) [Claims] 1. A polishing tool, which is provided above the base and rotates by being driven by a drive source, is brought into contact with the surface of a plurality of tiles placed adjacent to the moving base on the moving base in the moving direction. A tile polishing apparatus for polishing the surface of the tile by providing a liquid passage hole and a back plate connected to the driving source; and a liquid passage hole fixed to a plate surface of the back plate and communicating with the liquid passage hole. A wear-resistant elastic body which is attached to the back plate via the cushioning member and has a liquid-passing hole which communicates with the liquid-passing hole at a center portion and which does not contain abrasive grains. A polishing member formed by the polishing member, the polishing member is constituted by the polishing member, the buffer member, and the back plate, and the polishing tool is rotated to be supplied and released from a liquid passage hole of the back plate. Polishing with abrasive grains suspended A tile polishing apparatus, wherein a liquid is ejected from a central portion of the polishing member toward a polishing surface of a tile moving on the base to polish the surface of the tile.