JP2644105B2 - Method for detecting plating failure in hoop material plating equipment - Google Patents
Method for detecting plating failure in hoop material plating equipmentInfo
- Publication number
- JP2644105B2 JP2644105B2 JP15303591A JP15303591A JP2644105B2 JP 2644105 B2 JP2644105 B2 JP 2644105B2 JP 15303591 A JP15303591 A JP 15303591A JP 15303591 A JP15303591 A JP 15303591A JP 2644105 B2 JP2644105 B2 JP 2644105B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- hoop material
- detecting
- failure
- constant current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【産業上の利用分野】本発明はフープ材のメッキに際
し、材料のメッキ不良を検出するメッキ不良検出方法に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating failure detecting method for detecting a plating failure of a material when plating a hoop material.
【従来の技術】従来、フープ材をメッキする際に生じる
メッキ不良は、図２に示すように、フープ材７上におけ
る材料自身の上下あるいは前後の位置ずれにより生じる
のが一般的であった為、光電スイッチ、マイクロスイッ
チ、タッチスイッチ等のセンサー１１で材料の位置ずれ
を検出し、メッキ不良と判断していた。その為、メッキ
噴射用回転ドラム１０の位置ずれなど他の要因でのメッ
キ不良は検知出来なかった。2. Description of the Related Art Conventionally, plating defects that occur when plating a hoop material are generally caused by a displacement of the material on the hoop material 7 in the vertical or horizontal direction, as shown in FIG. The displacement of the material was detected by a sensor 11 such as a photoelectric switch, a micro switch, and a touch switch, and it was determined that the plating was defective. For this reason, a plating defect due to other factors such as a displacement of the plating spray rotating drum 10 could not be detected.
【発明が解決しようとする課題】上述した従来のメッキ
不良検出方法においては、材料自身が明らかに正常な位
置からずれていた場合に限りメッキ不良と判断する為、
メッキ液を噴射する回転ドラムの位置ずれや、メッキ液
の噴射の強弱によって発生するメッキ不良の検出は困難
であった。また検出用のセンサーがメッキ槽内という悪
環境に設置されるので、不具合が発生し易い欠点があ
る。In the conventional plating defect detection method described above, plating is determined to be defective only when the material itself is clearly shifted from a normal position.
It has been difficult to detect a displacement of the rotating drum that sprays the plating solution and a plating defect that occurs due to the strength of the spraying of the plating solution. Further, since the detection sensor is installed in a bad environment such as in the plating tank, there is a disadvantage that a problem is easily generated.
【課題を解決するための手段】本発明のフープ材のメッ
キ装置におけるメッキ不良検出方法は、フープ材のメッ
キ装置において、メッキ液を噴射する回転ドラム側に設
けた第１の電極と、搬送されるフープ材側に設けた第２
の電極との間に定電流電源からの定電流を流し、前記第
１及び第２の電極間の電位差を検知することによってメ
ッキ不良を検出するようにしたものである。According to the present invention, there is provided a method for detecting a plating failure in a hoop material plating apparatus, comprising the steps of: Second hoop material side
A constant current from a constant current power supply flows between the first and second electrodes, and a potential difference between the first and second electrodes is detected to detect a plating defect.
【実施例】次に本発明について図面を参照して説明す
る。図１は本発明の一実施例を示し、同図（ａ）は本実
施例を適用した装置の構成図、同図（ｂ）は回転ドラム
と材料の位置関係を示す斜視図である。電圧測定器１の
測定端子１ａは定電流電源２の出力端子２ａへ接続す
る。さらに定電流電源２の出力端子２ａはメッキ液噴射
用の回転ドラム側電極３とフープ材側電極ガイド４へ接
続し、定電流を流す構成とする。メッキされるフープ材
７はフープ材側電極ガイド４及びメッキ液噴射用回転ド
ラム５を経由し、フープ材巻取りモータ６によって搬送
される。なお図１（ｂ）に示すように、メッキ液噴射用
回転ドラム５より噴射されたメッキ液９はメッキされる
部品８のポイントをメッキするように位置決めされてい
る。このような本実施例において、搬送される材料自身
が上下あるいは前後に位置ずれを生じた場合、さらには
メッキ液を噴射する回転ドラム５の位置ずれや、メッキ
液の噴射の強弱によりメッキ不良が生じた場合、フープ
材７に当たるメッキ液の量が変化する為、メッキ液を噴
射する回転ドラム５とフープ材７間の抵抗が変化し、定
電流電源２の出力電圧が変化する。電圧測定器１はこの
電圧の変化を検知し、メッキ不良を検出する事が出来
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. 1A and 1B show an embodiment of the present invention. FIG. 1A is a configuration diagram of an apparatus to which the embodiment is applied, and FIG. 1B is a perspective view showing a positional relationship between a rotating drum and a material. The measuring terminal 1a of the voltage measuring device 1 is connected to the output terminal 2a of the constant current power supply 2. Further, the output terminal 2a of the constant current power supply 2 is connected to the rotating drum side electrode 3 for spraying the plating solution and the hoop material side electrode guide 4, so that a constant current flows. The hoop material 7 to be plated is conveyed by the hoop material winding motor 6 via the hoop material side electrode guide 4 and the plating solution jetting rotary drum 5. As shown in FIG. 1B, the plating solution 9 ejected from the plating solution ejecting rotary drum 5 is positioned so as to plate the point of the component 8 to be plated. In this embodiment, when the conveyed material itself is displaced up and down or back and forth, furthermore, a plating defect is caused by a displacement of the rotating drum 5 for ejecting the plating solution and the strength of the ejection of the plating solution. When this occurs, the amount of the plating solution that hits the hoop material 7 changes, so that the resistance between the rotating drum 5 that sprays the plating solution and the hoop material 7 changes, and the output voltage of the constant current power supply 2 changes. The voltage measuring device 1 can detect this change in voltage and detect a plating defect.
【発明の効果】以上説明した様に本発明は、メッキ液を
噴射する回転ドラム側電極と搬送されるフープ材側電極
とに接続した定電流電源に電圧測定器を接続する事によ
り、従来のフープ材自身の位置ずれによるメッキ不良以
外に、メッキ液噴射用回転ドラムの位置ずれや、メッキ
液の噴射の強弱によるメッキ不良まで検出できる効果が
ある。さらに、従来のように不具合の発生し易いセンサ
ーを削除出来る効果もある。As described above, according to the present invention, a conventional voltage measuring device is connected to a constant current power supply connected to a rotating drum side electrode for spraying a plating solution and a conveyed hoop material side electrode. In addition to the plating failure due to the displacement of the hoop material itself, there is an effect that it is possible to detect the displacement of the rotating drum for plating solution spraying and the plating failure due to the strength of the plating solution spraying. Further, there is an effect that a sensor in which a problem easily occurs as in the related art can be deleted.
【図１】本発明の一実施例を示し、同図（ａ）は本実施
例を適用した装置の構成図、同図（ｂ）はメッキ液噴射
用回転ドラムと材料の位置関係を示す斜視図である。1A and 1B show an embodiment of the present invention, wherein FIG. 1A is a configuration diagram of an apparatus to which the embodiment is applied, and FIG. 1B is a perspective view showing a positional relationship between a plating solution jetting rotary drum and a material; FIG.
【図２】従来のメッキ不良検出方法の一例を示す斜視図
である。FIG. 2 is a perspective view showing an example of a conventional plating defect detection method.
１ 電圧測定器 ２ 定電流電源 ３ 回転ドラム側電極 ４ フープ材側電極ガイド ５，１０ メッキ液噴射用回転ドラム ６ フープ材巻取りモータ ７ フープ材 ８ 部品 ９ メッキ液 １１ センサー DESCRIPTION OF SYMBOLS 1 Voltage measuring device 2 Constant current power supply 3 Rotating drum side electrode 4 Hoop material side electrode guide 5, 10 Rotating drum for plating liquid spray 6 Hoop material winding motor 7 Hoop material 8 Parts 9 Plating liquid 11 Sensor
Claims (1)
液を噴射する回転ドラム側に設けた第１の電極と、搬送
されるフープ材側に設けた第２の電極との間に定電流電
源からの定電流を流し、前記第１及び第２の電極間の電
位差を検知することによってメッキ不良を検出すること
を特徴とするフープ材のメッキ装置におけるメッキ不良
検出方法。In a hoop material plating apparatus, a constant current power supply is provided between a first electrode provided on a rotating drum side for spraying a plating solution and a second electrode provided on a conveyed hoop material side. A plating defect in a hoop material plating apparatus, wherein a plating defect is detected by flowing a constant current of (i) and detecting a potential difference between the first and second electrodes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15303591A JP2644105B2 (en) | 1991-06-25 | 1991-06-25 | Method for detecting plating failure in hoop material plating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15303591A JP2644105B2 (en) | 1991-06-25 | 1991-06-25 | Method for detecting plating failure in hoop material plating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0572159A JPH0572159A (en) | 1993-03-23 |
| JP2644105B2 true JP2644105B2 (en) | 1997-08-25 |
Family
ID=15553552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15303591A Expired - Lifetime JP2644105B2 (en) | 1991-06-25 | 1991-06-25 | Method for detecting plating failure in hoop material plating equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2644105B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3559719B2 (en) | 1998-01-13 | 2004-09-02 | キヤノン株式会社 | Plasma address type liquid crystal display |
-
1991
- 1991-06-25 JP JP15303591A patent/JP2644105B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0572159A (en) | 1993-03-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20130021404A1 (en) | Method for monitoring a jetting performance of a print head | |
| US4815001A (en) | Ultrasonic wire bonding quality monitor and method | |
| EP0065001A4 (en) | Ink droplet sensing apparatus. | |
| JP2644105B2 (en) | Method for detecting plating failure in hoop material plating equipment | |
| US4631550A (en) | Device and method for sensing the impact position of an ink jet on a surface of an ink catcher, in a continuous ink jet printer | |
| JP4022805B2 (en) | Ink remaining amount detection device and detection method for ink jet printer | |
| JPH03500271A (en) | Method and apparatus for monitoring the ejection of ink droplets from the discharge nozzle of an ink recording head | |
| US5565786A (en) | Detection of erroneous ink-jet printing | |
| JPH02172629A (en) | Work device | |
| EP1013426B1 (en) | Short detection for ink jet printhead | |
| EP0771655B1 (en) | Short detection circuit for ink jet printer | |
| US4329695A (en) | Charge timing evaluation in an ink jet system printer of the charge amplitude controlling type | |
| US6128450A (en) | Method and apparatus for detecting ink concentration | |
| RU2370784C1 (en) | Method of determining location and type of defects in active part of electric machine in operating mode | |
| JPS56154069A (en) | Detecting device for amount of electrification of ink particle in ink-jet printer | |
| JPH0674930A (en) | Defect detecting method for can cover inside coating film and device therefor | |
| JP3340983B2 (en) | Liquid leak inspection system | |
| US20040008233A1 (en) | Method and apparatus for machine specific overcurrent detection | |
| JPH0799362B2 (en) | Sensor connection judgment circuit in potentiostatic electrolysis gas measuring device | |
| JPH0231189Y2 (en) | ||
| JP2655533B2 (en) | Sensor connection judgment circuit in constant potential electrolysis type gas measurement device | |
| JP4050436B2 (en) | Print marking device and print coil defect detection method | |
| SU889335A1 (en) | Device for pressure welding | |
| CN114674513A (en) | Performance test system and method for vibration reliability of circuit interface | |
| JPH0498161A (en) | Polarity detection method for aluminum electrolytic capacitor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19970325 |