JP2643150B2 - Bar type cleaning nozzle - Google Patents

Description

Description: FIELD OF THE INVENTION The present invention relates to a bar-type cleaning nozzle, and more particularly to a bar-type cleaning nozzle suitable for cleaning semiconductor wafers, metal magnetic disks, etc., which require high cleanliness. Get involved.

[Prior Art] For example, one of the manufacturing processes of a semiconductor device includes a cleaning process. Conventionally, for cleaning semiconductor wafers, a device containing a heated cleaning solution in a cleaning tank is used, and a plurality of wafers are immersed in the cleaning solution in a cassette, and the frequency is reduced.
Washed with 28-200kHz ultrasonic. However, when such a cleaning device is used, there is a problem that fine dirt on the wafer surface cannot be removed satisfactorily. In addition, there is a problem that stagnation of a cleaning liquid or the like occurs on the contact surface between the cassette and the wafer, and the cleaning effect of the wafer near the contact surface deteriorates.

For this reason, a cylindrical cleaning nozzle for ejecting a cleaning liquid to which vibration is applied as shown in FIGS. 5A and 5B has been developed. That is, reference numeral 1 in the drawing denotes a nozzle body. The main body 1 has a cylindrical shape with one end formed in a shell shape, and has a circular nozzle port 2 for discharging a cleaning liquid at the tip of the shell portion. The nozzle body 1
A round vibrator 3 is disposed in the inside opposite to the nozzle port 2 so as to face the nozzle port 2. An oscillator 4 is connected to the vibrator 3. A cleaning liquid introduction pipe 5 is connected to a side wall of the main body 1 located between the nozzle port 2 and the vibrator 3. According to this configuration, the oscillator 4 applies a high frequency to the vibrator 3 to vibrate the vibrator 3 while introducing the cleaning liquid into the nozzle main body 1 from the introduction pipe 5 and filling the main body 1 with the cleaning liquid. In addition, the vibration-applied cleaning liquid can be discharged from the nozzle port 2, and fine dirt on the surface of a semiconductor wafer (not shown) or the like disposed close to the nozzle port 2 can be satisfactorily cleaned. In addition, since the processing is a single-wafer processing, stagnation of the cleaning liquid on the contact surface between the cassette and the wafer, which occurs when cleaning is performed with the wafer stored in the cassette, can be eliminated, and the entire wafer can be cleaned well.

[Problems to be Solved by the Invention] According to the above-mentioned conventional cylindrical cleaning nozzle, the size and cost of the apparatus can be reduced. However, since the diameter of the round vibrator 3 provided in the nozzle body 1 is 5 mm, its cleaning range is narrow. As a result, when cleaning a semiconductor wafer, it is necessary to move either the cleaning nozzle or the wafer in a two-dimensional manner, resulting in a problem that the cleaning efficiency is extremely low.

In order to improve the cleaning efficiency, it is conceivable that a plurality of the cleaning nozzles shown in FIG. 5 described above are linearly arranged and the nozzles (or the semiconductor wafer) are cleaned by scanning in one dimension. . However, in such cleaning, a region where the cleaning liquid is not sprayed on the wafer, that is, a so-called dead space occurs due to the relationship between the diameter of the nozzle port 2 and the diameter of the cylindrical portion of the nozzle body 1.
Uniform cleaning becomes difficult.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and it is possible to jet a cleaning liquid flow to which a vibration is applied in a strip shape, and to perform fine one-dimensional scanning on a surface of a processing object by scanning in a one-dimensional direction. It is an object of the present invention to provide a bar-type cleaning nozzle capable of cleaning satisfactorily and efficiently.

[Means for Solving the Problems] The present invention provides a nozzle body having an elongated nozzle port for discharging a cleaning liquid, and a thickness formed of tantalum provided in the nozzle body so as to face the nozzle port. 0.1-1.5mm
A vibrating plate, and a rectangular vibrator that is arranged on the outer surface of the vibrating plate so as to face the nozzle port and is subjected to sound wave vibration,
A bar-type cleaning nozzle comprising: an oscillator for driving the vibrator; and a cleaning liquid introduction pipe connected to a side wall of the main body located between the nozzle port and the vibration plate.

[Operation] A bar-type cleaning nozzle according to the present invention is formed in a nozzle main body, has a nozzle opening for discharging a cleaning liquid having an elongated shape, and has a vibration plate disposed on the nozzle main body so as to face the nozzle opening, Further, the vibration plate has a structure in which a rectangular vibrator is provided. Further, since the diaphragm is formed of tantalum having a particularly high tensile strength among refractory metals such as molybdenum, and is a thin film having a thickness of 0.1 to 1.5 mm, the vibration conversion efficiency is related to the vibrator. Is high. In a bar-type cleaning nozzle having such a structure, a cleaning liquid is introduced into the main body from a cleaning liquid introduction pipe connected to a side wall of the main body located between the nozzle port and the diaphragm, and an oscillator connected to the vibrator is used. When giving a high frequency of 1.8 MHz to the vibrator, the vibrator vibrates,
The thin-film vibrating plate made of the rectangular tantalum to which the vibrator is attached vibrates efficiently and generates a high frequency of 1.8 MHz, which is the same as the applied frequency. As a result, the vibration from the vibrating plate is imparted to the cleaning liquid in the main body with straightness so as to reach the entire elongated nosle port, so that a strip-shaped cleaning liquid flow can be jetted from the nozzle port. Therefore, by scanning at least one of the object to be processed such as the bar-type cleaning nozzle or the semiconductor wafer in a one-dimensional direction relatively, an unsprayed area of the cleaning liquid does not occur on the surface of the object to be processed. Fine dirt, particles and the like on the surface of the processed material can be cleaned well. In addition, since a large area object can be cleaned in one scan,
The cleaning efficiency can be greatly improved.

Hereinafter, embodiments of the present invention will be described in detail with reference to FIG. 1 to FIG.

FIG. 1 is a bar type cleaning nozzle showing an embodiment of the present invention.
11, FIG. 2 is a sectional view taken along line II-II of the cleaning nozzle 11 of FIG. 1, and FIG. 3 is a III-I of the cleaning nozzle 11 of FIG.
FIG. 2 is a cross-sectional view taken along the line II, in which 12 is a nozzle body made of, for example, polypropylene. This nozzle body 12
It has a rectangular cylindrical shape, and a pair of opposed side walls are tapered, and an elongated nozzle port 13 for discharging a cleaning liquid is formed at the tip of the tapered portion. The nozzle body
A frame-like flange 14 is formed in an opening of the nozzle 12 opposite to the nozzle port 13. On this flange 14, a rectangular tantalum diaphragm 15 having a thickness of, for example, 0.1 mm is arranged. A frame 16 having substantially the same shape as the flange 14 is disposed on the diaphragm 15, and the diaphragm 16 is screwed from the frame 16 to the diaphragm 15 and the flange 14 by a screw (not shown).
15 is supported and fixed between the flange 14 and the frame 16. A vibrator 17 is fixed on a region of the diaphragm 15 exposed from the frame 16. An oscillator 18 is connected to the vibrator 17 via a cable 19. Further, the nozzle body 12
A cleaning liquid introduction pipe 20 is connected to the side wall of the cleaning liquid.

According to such a configuration, the bar-type cleaning nozzle 11 is
As shown in the figure, after being disposed above an object to be processed (for example, a semiconductor wafer) 21, a cleaning liquid is introduced into a nozzle main body 12 through an introduction pipe 20 to fill the main body 12 with the cleaning liquid.
1.8M through the cable 19 to the rectangular vibrator 17
When a high frequency of Hz is applied, the vibrator 17 vibrates,
The rectangular tantalum diaphragm 15 to which the is attached is vibrated favorably, and generates a high frequency of 1.8 MHz substantially similar to the above. As a result, vibration is transmitted to the cleaning liquid in the nozzle body 12 that comes into contact with the diaphragm 15, and the nozzle body that faces the diaphragm 15
A strip-shaped cleaning liquid flow 22 is jetted from the 12 nozzle openings 13. When the bar-type cleaning nozzle 11 is scanned in a one-dimensional direction as indicated by an arrow in such a state, a belt-shaped cleaning liquid flow 22 to which vibration is applied is jetted onto the entire surface of the semiconductor wafer 21.

Therefore, according to the bar-type cleaning nozzle 11 of the present invention, an unsprayed area (dead space) of the cleaning liquid onto the surface of the semiconductor wafer 21 does not occur due to the one-dimensional scanning of the nozzle 11 and the fineness of the surface of the wafer 21 is reduced. In addition to being able to satisfactorily clean unnecessary contaminants and the like, the cleaning efficiency can be significantly improved. In addition, since the processing is a single-wafer processing, stagnation of the cleaning liquid on the contact surface between the cassette and the wafer, which occurs when cleaning is performed with the wafer stored in the cassette, can be eliminated, and the entire wafer can be cleaned well.

Further, the vibration of the vibrator 17 is transmitted through the diaphragm 15 to the nozzle body.
If it is configured to transmit to the cleaning liquid in 12, the diaphragm 15 made of high-purity tantalum or the like comes into contact with the cleaning liquid,
Secondary contamination of the cleaning liquid caused by the vibrator 17 made of ceramics or the like coming into direct contact with the cleaning liquid can be prevented. Moreover, since the vibrator 17 can be attached to the diaphragm 15 mechanically fixed by the flange 14 and the frame 16 of the nozzle body 12, the brittleness becomes more remarkable mechanically as the size increases. It is possible to prevent cracks, cracks, and the like from occurring when the vibrator made of ceramic or the like is directly fixed between the flange and the frame body.

In the above embodiment, the nozzle body is formed of polypropylene, but is not limited to this. For example, it may be formed of stainless steel lined with a fluororesin or ceramics such as alumina.

In the above embodiment, the transmission of the sonic vibration to the cleaning liquid in the nozzle body was performed via the vibration plate from the vibrator to which the high frequency was applied, but the sonic vibration was directly transmitted from the vibrator to the cleaning liquid in the nozzle body. Is also good.

In the above embodiment, the cleaning of the semiconductor wafer was performed by scanning the bar-type cleaning nozzle in one-dimensional direction. However, the bar-type cleaning nozzle was fixed, and the semiconductor wafer was cleaned by scanning in one-dimensional direction. Good.

In the above embodiment, an example in which the present invention is applied to cleaning at the wafer stage has been described. However, the present invention can be similarly applied to a process of forming an element on a wafer surface. In this case, when the present invention is applied to a wafer provided with a groove for forming a groove-type capacitor or a groove-type field region, the cleaning liquid can be sufficiently introduced into the fine groove, so that good cleaning and etching can be performed. Also, not limited to silicon wafers, III-V compound semiconductor wafers, A
The present invention can be similarly applied to cleaning of a magnetic disk made of metal such as l.

[Effect of the Invention] As described in detail above, according to the bar-type cleaning nozzle of the present invention, the cleaning liquid flow to which the vibration is applied can be ejected in a belt shape.
The bar-type cleaning nozzle (or an object to be processed such as a semiconductor wafer)
The cleaning in the one-dimensional direction does not generate an unsprayed area (dead space) of the cleaning liquid on the surface of the object to be processed. It has remarkable effects such as improvement.

[Brief description of the drawings]

1 is a perspective view of a bar-type cleaning nozzle showing one embodiment of the present invention, FIG. 2 is a cross-sectional view of the cleaning nozzle of FIG. 1 along the line II-II, and FIG. 3 is a cleaning nozzle of FIG. FIG. 4 is a sectional view taken along line III-III of FIG. 4, FIG. 4 is a perspective view for explaining the operation of the bar-type cleaning nozzle of this embodiment, FIG. 5 (A) is a perspective view showing a conventional cylindrical cleaning nozzle, FIG. 2B is a cross-sectional view of FIG. 11 ... Bar-type cleaning nozzle, 12 ... Nozzle body, 13 ... Elongated nozzle port, 15 ... Rectangular tantalum diaphragm, 17 ... Rectangular vibrator, 18 ... Oscillator, twenty one……
Semiconductor wafer (object to be processed), 22 ... Strip-shaped cleaning liquid flow.

 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-62-286231 (JP, A) JP-A-62-210082 (JP, A) JP-A-61-147534 (JP, A) JP-A-55-1986 1114 (JP, A) Fully open sho 59-177943 (JP, U) Fully open sho 62-20688 (JP, U) Fully open sho 61-37280 (JP, U)

Claims (1)

(57) [Claims] 1. A nozzle body having an elongated nozzle port for discharging a cleaning liquid, and a thickness of 0.1 to 1.5 mm made of tantalum disposed on the nozzle body so as to face the nozzle port.
A vibrating plate, and a rectangular vibrator that is arranged on the outer surface of the vibrating plate so as to face the nozzle port and is subjected to sound wave vibration,
A bar-type cleaning nozzle, comprising: an oscillator for driving the vibrator; and a cleaning liquid introduction pipe connected to a side wall of the main body located between the nozzle port and the vibration plate.