JP2641335B2 - Replacement method of semiconductor wafer - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for replacing a semiconductor wafer, and more particularly to a method for replacing a wafer between a jig for holding a wafer and a carrier.

[0002]

2. Description of the Related Art A conventional semiconductor wafer replacement method is as follows.
As shown in FIG. 3, the wafer 4 is previously turned from the carrier into a furnace holding jig 2 dedicated to the heating furnace outside the furnace, and the furnace holding jig 2 on which the wafer 4 is mounted is placed on the holding arm 1. And the holding arm 1 is inserted into the furnace core tube 3a of the heating furnace 3, and the in-furnace holding jig 2 is set in the furnace, or the wafer 4 together with the in-furnace holding jig 2 from the furnace. Had been taken out of the furnace.

[0003]

In this conventional method for refilling a semiconductor wafer, the jig for holding the furnace reciprocates between the outside and the inside of the furnace each time the wafer is loaded and unloaded. Is repeated. Therefore, the distortion and deterioration of the furnace holding jig are fast, and the heat capacity of the furnace holding jig is much larger than that of the wafer, so that the wafer is heated in the furnace or cooled outside. There was a problem that it took time.

[0004]

According to the present invention, there is provided a method for refilling a semiconductor wafer, comprising the steps of: inserting a semiconductor wafer held by a holding arm for carrying in and out of a furnace into a furnace; It is configured to include means for pulling the holding arm out of the furnace after being placed on the jig, or for taking out only the semiconductor wafer placed on the holding jig in the furnace out of the furnace by a reverse procedure. .

[0005]

Next, the present invention will be described with reference to the drawings.

FIG. 1 is a schematic plan view for explaining an embodiment of the present invention, and FIGS. 2 (a) to 2 (d) are views of FIG. 1 showing an operation order for explaining the embodiment of the present invention. It is sectional drawing along the AA 'line and BB' line.

First, as shown in FIGS. 1 and 2 (a),
The wafer 4 is lifted by a pusher 5 from below the carrier 6 containing the wafer 4 outside the heating furnace.

Next, as shown in FIG. 2 (b), both sides of the wafer 4 placed on the pusher 5 are sandwiched and held by the holding arm 1 for carrying in and out of the furnace.
Is lowered.

Next, as shown in FIG. 1 and FIG. 2 (c), the holding arm 1 is moved to insert the tip into the furnace core tube 3a of the heating furnace 3, and previously set in the furnace core tube 3a. The wafer 4 is lowered onto the furnace holding jig 2 and turned upside down. next,
The holding arm 1 is opened right and left and separated from the wafer 4, and the holding arm 1 is pulled out of the furnace core tube 3a.

When the wafer 4 is pulled out of the furnace, the procedure may be reversed.

[0011]

As described above, the present invention provides a heating furnace in which only a wafer held by a holding arm for transferring in and out of the furnace is turned on a holding jig in the furnace which is previously set in the furnace. The wafer temperature can be reduced by changing the temperature inside the furnace due to the loading and unloading of the dedicated furnace holding jig with a large heat capacity, until the wafer temperature rises and the processing temperature stabilizes. The time required for cooling can be reduced, and the time required for cooling to room temperature after furnace release can be shortened.Furthermore, distortion and deterioration can occur because the dedicated furnace holding jig is not exposed to repeated temperature rise and fall between room temperature and furnace temperature. It has the effect of being small.

[Brief description of the drawings]

FIG. 1 is a schematic plan view for explaining an embodiment of the present invention.

FIGS. 2A and 2B are a sectional view taken along the line AA 'and a sectional view taken along the line BB' of FIG.

FIG. 3 is a schematic cross-sectional view for explaining an example of a conventional semiconductor wafer replacement method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Holding arm 2 Furniture holding jig 3 Heating furnace 3a Furnace tube 4 Wafer 5 Pusher 6 Carrier

Claims (1)

(57) [Claims] 1. A semiconductor wafer held by a holding arm for transfer into and out of a furnace is inserted into the furnace, placed on a furnace holding jig previously set in the furnace, and then the holding arm is removed from the furnace. A means for taking out only the semiconductor wafer placed on the holding jig in the furnace by a reverse procedure or taking out the semiconductor wafer from the furnace.