JP2625466B2 - Polishing equipment - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus used for polishing a floating surface of a head piece assembly of a floating magnetic head, for example.

<Prior Art> FIGS. 3 and 4 show a conventional example of a polishing apparatus for polishing the flying surface of a slider carrying a read / write element in a manufacturing process of a flying magnetic head. In the figure, 1
Is a rotating body, 2 is a headpiece assembly which is an object to be polished, and 3 is a jig for supporting the headpiece assembly 2. Rotating body 1
Is driven to rotate in the a1 direction indicated by an arrow by a motor (not shown) or the like. The rotating body 1 is formed by bonding a support member 102 formed of a metal material such as stainless steel to a back surface of a polishing member 101 formed of a disk shape using a soft metal member such as tin. The surface is integrally joined by the agent 103. The support member 102 is made of a soft metal material such as tin and has a mechanical strength that is insufficient.
And has a different coefficient of thermal expansion from that of the polishing member 101.

The headpiece assembly 2 forms a plurality of magnetic head elements Q1, Q2, Q3,... In one direction by sharing a slider member 21 made of a ceramic structure, as shown in an enlarged manner in FIG. Jig 3 using adhesive 4 such as hot melt resin
Is fixed to the lower surface. The lower surface 211 of the slider member 21 becomes a floating surface when a magnetic head is used.

In the polishing, the rotating body 1 is rotated in the plane of the arrow a1 and the surface (a) of the polishing member 101 is supplied to the surface (a) of the polishing member 101 while supplying the abrasive containing diamond particles and the like to the surface (a). Then, the lower surface 211 of the slider member 21 of the head piece assembly 2 is brought into contact. The jig 3 is moved in parallel in the rotational radius direction indicated by the arrow b1 or b2, and the surface (a) of the polishing member 101 is moved.
Polishing is performed on the entire surface of the substrate. The jig 3 and the bed piece assembly 2 rotate as indicated by an arrow a2. Since the flying surface of the magnetic head is required to have a high degree of flatness of about 0.05 μm, the lower surface 211 of the slider member 21 needs to be polished so as to obtain the high degree of flatness as described above.

After the polishing is completed, the head piece assembly 2 is removed from the jig 3 and used for the next step. Since the portions 2-3 are bonded with an adhesive such as a hot melt resin, they can be easily removed by means such as heating. Also, since the polishing member 101 is worn away by the polishing work,
If necessary, remove it from the support member 102 and replace it with a new one.

<Problems to be solved by the invention> However, a polishing member made of a soft metal material such as tin.
101 and a supporting member 102 made of a metal material such as stainless steel having a different coefficient of thermal expansion are joined to form the rotating body 1. Therefore, when a temperature change such as heat generation in the polishing operation occurs, Due to the difference in the coefficient of thermal expansion between the two members 101 and 102, the entire rotating body 1 is warped, curved, and the like, and the polishing member
In some cases, the surface (a) of 101 may be concavely curved or curved as shown by the dashed line (b) in FIG. Alternatively, depending on the coefficient of thermal expansion between the polishing member 101 and the support member 102, the polishing member 101 may be curved in a convex shape as shown by a dotted line (c). Since the polished surface of the polished object 2 faithfully captures the flatness of the surface (a) of the polishing member 101, when the above-described curvature occurs, the polished surface 211 of the polished object 2 also bends, The required flatness cannot be secured. In particular, the air bearing surface of the magnetic head is 0.
Since a high degree of flatness of about 05 μm is required, even if the surface (a) of the polishing member 101 is slightly warped or curved due to the difference in the coefficient of thermal expansion, the effect is extremely large.

A similar problem also occurs when the surface (a) of the polishing member 101 is worn and deformed by the polishing operation, or depending on the state of adhesion of the polishing member 101 to the support member 102.

<Means for Solving the Problems> In order to solve the conventional problems described above, the present invention is to rotate a rotating body configured by surface joining at least two plate members having different coefficients of thermal expansion, A polishing apparatus for polishing an object to be polished on the surface of a rotating body includes a temperature control device for controlling the temperature of the rotating body to control the flatness of the surface of the rotating body.

As one mode, the temperature control device is provided with a device that generates the Peltier effect in surface contact with the back surface of the rotating body, and switches the direction of current to the device that generates the Peltier effect, thereby performing both cooling and heating. Get.

As another aspect, the temperature control device includes a container containing a refrigerant or a heat medium. The rotator is disposed in the coolant or the heat medium so as to be located above the liquid surface of the surface coolant or the heat medium, and the polishing of the object to be polished is performed outside the coolant or the heat medium. Done.

<Operation> Since the polishing apparatus according to the present invention has the temperature control device for controlling the temperature of the rotating body to control the flatness of the surface of the rotating body, the heat between the two plate members constituting the rotating body is controlled. By utilizing the difference between the expansion coefficients, the rotating body is deformed in a direction in which the surface is warped or curved, and a high degree of flatness can be secured.

In addition, when it is necessary not only to improve the flatness but also to polish the object to be polished while curving, the temperature of the rotating body is controlled so that the surface of the rotating body has the required flatness. It is also possible to bend.

In one aspect, the temperature control device obtains both cooling and heating effects by attaching a device that generates the Peltier effect to the back surface of the rotating body and switching the direction of current to the device that generates the Peltier effect. According to this temperature control device, the curvature of the surface of the rotating body can be adjusted with high accuracy by a simple operation of adjusting the magnitude of the current and switching the direction.

Since the device for generating the Peltier effect is mounted on the back surface of the rotating body, it is protected from the abrasive supplied to the surface of the rotating body. Also, since the device that generates the Peltier effect is mounted in surface contact with the back surface of the rotating body, the thermal coupling of the device that generates the Peltier effect to the rotating body is dense, and the heat absorption and heat generation of the device that generates the Peltier effect are reduced. , Can be reliably and uniformly transmitted to the rotating body over a wide area.

In another aspect, the temperature control device includes a container containing a refrigerant or a heat medium. The rotating body is disposed in a cooling medium or a heating medium. Therefore, the entire rotating body is cooled or heated by the refrigerant or the heat medium, and the flatness or curvature of the surface of the rotating body can be efficiently controlled. The rotating body is
The cooling medium or the heating medium is disposed in the cooling medium or the heating medium such that the surface is located above the liquid level of the cooling medium or the heating medium. According to this structure, the object to be polished can be polished without being affected by the refrigerant or the heat medium.

<Embodiment> Fig. 1 is a front view showing a main part of a polishing apparatus according to the present invention. In the drawings, the same reference numerals as those in FIGS. 3 and 4 indicate the same components. In this embodiment, a device 8 for generating the Peltier effect is mounted on the rotating body 1 to control the temperature of the rotating body 1. As is well known, the Peltier effect is a phenomenon in which when two kinds of metals or semiconductors are joined and an electric current is applied, heat is generated or absorbed at the junction. For example, when a current is caused to flow by joining antimony and bismuth, heat is absorbed at a junction in the direction from antimony to bismuth to lower the temperature, and heat is generated at a junction in the opposite direction. Therefore, by switching the direction of the current, it is possible to obtain both effects of cooling and heating.
In this embodiment, a device 8 that generates the Peltier effect is mounted on the back surface of the rotating body 1 around the rotation axis, and the temperature of the rotating body 1 is controlled by switching the current direction by the power supply device 9. .

In the above configuration, when a current that generates heat absorption or heat is supplied to the joining point to the device 8 that generates the Peltier effect, a cooling or heating action is given to the rotating body 1, and the rotation between the polishing member 101 and the support member 102 is performed. Depending on the difference in the coefficient of thermal expansion,
The flatness of the surface (a) of the polishing member 101 is controlled. For example, in the case where a high degree of flatness is required, if the surface (a) of the polishing member 101 is curved or warped due to heat generation or abrasion accompanying the polishing operation, the joining point is connected to the device 8 which generates the Peltier effect. Is supplied with a current in a direction that generates an endothermic effect. Thereby, the curvature and warpage of the surface (a) of the polishing member 101 are corrected, and a high degree of flatness is obtained. When a current in a direction that generates heat is supplied to the junction point to the device 8 in which the Peltier effect occurs, it is possible to adjust the curvature and the warpage in the opposite direction.

As described above, by switching the direction of the electric current to the device 8 that generates the Peltier effect, both cooling and heating effects are obtained. Therefore, according to this temperature control device, the curvature of the surface of the rotating body can be adjusted with high accuracy by a simple operation of adjusting the magnitude of the current and switching the direction.

Since the device 8 for generating the Peltier effect is mounted on the back surface of the rotating body 1, it is protected from the abrasive supplied to the surface of the rotating body 1. Further, since the device 8 for generating the Peltier effect is mounted in surface contact with the back surface of the rotating body 1, the thermal coupling of the device 8 for generating the Peltier effect to the rotating body 1 is dense, and the device 8 for generating the Peltier effect is tight. The generated endothermic and exothermic effects can be reliably and evenly transmitted to the rotating body 1 over a wide area. For this reason, the rotating body can be reliably deformed in a direction to correct the surface warpage, curvature, and the like, and the object to be polished can be polished to have a high degree of flatness.

FIG. 2 is a partial sectional view of another embodiment of the polishing apparatus according to the present invention. This embodiment shows a configuration for controlling the ambient temperature of the rotating body 1, and the rotating body 1 is controlled by a refrigerant or a heating medium 10.
Are arranged in a container 11 in which is stored. Reference numeral 6 denotes a pump, and 7 denotes a temperature control unit for a refrigerant or a heat medium. The refrigerant and the heat medium are
As is clear from the illustration in FIG.

Therefore, the entire rotating body 1 is cooled or heated by the cooling medium or the heating medium 10, and the flatness or curvature of the surface of the rotating body 1 can be efficiently controlled.

The rotating body 1 is disposed in the refrigerant or the heat medium 10 such that the surface (a) is located above the liquid level of the refrigerant or the heat medium 10. According to such a structure, the work 2 can be polished without being affected by the cooling medium or the heating medium 10.

In the above embodiment, the polishing apparatus for polishing the flying surface of the magnetic head has been described as an example. However, the present invention can be similarly applied to other polishing apparatuses such as a magnetic disk polishing apparatus.

<Effects of the Invention> As described above, according to the present invention, the following effects can be obtained.

(A) A polishing apparatus capable of deforming a rotating body in a direction in which surface warpage, curvature, and the like are corrected and polishing an object to be polished to a high degree of flatness can be provided.

(B) It is possible to provide a polishing apparatus capable of bending the surface of a rotating body so as to have a required flatness and polishing an object to be polished so as to have an arbitrary flatness.

[Brief description of the drawings]

FIG. 1 is a front view of a polishing apparatus according to the present invention, FIG. 2 is a front partial cross-sectional view of another embodiment, FIG. 3 is a plan view of a main part of a conventional polishing apparatus, and FIG. FIG. 5 is a front view, FIG. 5 is a view showing a joined state of a head piece assembly as a work to be polished and a jig, and FIG. 6 is a view showing a problem of a conventional polishing apparatus. DESCRIPTION OF SYMBOLS 1 ... Rotating body 101 ... Polishing member 102 ... Supporting member 8 ... Device which produces a Peltier effect

Claims (2)

(57) [Claims] 1. A polishing apparatus for rotating a rotator constituted by surface-attaching at least two plate members having different coefficients of thermal expansion and polishing an object to be polished on the surface of the rotator, A temperature control device for controlling the temperature of the body to control the flatness of the surface of the rotating body, wherein the temperature control device is mounted on the back surface of the rotating body in a face contact with a device that generates a Peltier effect. A polishing apparatus that obtains both cooling and heating actions by switching the direction of current to a device that produces the Peltier effect. 2. A polishing apparatus for rotating a rotator constituted by surface-attaching at least two plate members having different coefficients of thermal expansion, and polishing an object to be polished on the surface of the rotator, A temperature control device that controls the temperature of the body to control the flatness of the surface of the rotating body; the temperature control device includes a container containing a refrigerant or a heat medium; The surface is positioned above the liquid surface of the coolant or the heat medium, and the surface is located in the coolant or the heat medium, and the object to be polished is polished outside the coolant or the heat medium Polishing equipment.