JP2616489B2 - Thermal monitoring sensor for on-board power supply - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sensor for monitoring the heat of a distributed power supply (on-board power supply) used in a communication device or the like, and more particularly, to an on-board power supply for outputting information about the temperature of the on-board power supply itself or the surroundings. The present invention relates to a sensor for monitoring power supply heat.

[0002]

2. Description of the Related Art FIG. 4 shows a conventional example. In FIG. 4, reference numeral 50 indicates a distributed power supply power supply device including a plurality of assemblies of a package 56 equipped with a distributed power supply (on-board power supply). The distributed power supply device 50 shown in FIG. 4 is provided with two exhaust heat fans 51 and 52 at an upper portion thereof at a predetermined interval.

The exhaust heat fans 51 and 52 are provided with rotation detecting sensors (not shown) for detecting the presence or absence of normal rotation. This rotation detection sensor has a function of operating when an abnormality occurs in the rotation of the exhaust heat fans 51 and 52 and outputting a predetermined alarm signal. When the alarm signal is output, the alarm signal is externally received, the failure of the exhaust heat fans 51 and 52 is detected, and the on-board power supply 55 in the distributed power supply device 50 is thereby detected.
A method of detecting the temperature rise beforehand has been adopted. Reference numeral 57 denotes a connector provided for each package 56.

[0004]

However, in the above conventional example, since the temperature of the on-board power supply 55 in the distributed power supply device 50 is not directly detected, not only the temperature detection capability is low but also the fan alarm The fan with the tag is expensive, so that there is a disadvantage that the whole device is expensive.

On the other hand, since the on-board power supply 55 is provided for each package 56, the temperature varies depending on the package 56, and the temperature may be locally high. Further, even if the environment of the apparatus is poor, if the fan is operating normally, an alarm is not sent out. For example, the temperature rise of the on-board power supply 55 cannot be accurately detected.

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to provide a heat monitoring sensor for an on-board power supply capable of improving the disadvantages of the prior art and, in particular, outputting the temperature information of a plurality of on-board power supplies to the outside with high accuracy and speed. That is its purpose.

[0007]

According to the first aspect of the present invention, a copper pattern having a predetermined length is provided on a circuit board such as ceramic or glass epoxy provided with an on-board power supply,
A thermocouple is formed by bringing one end of the copper pattern into contact with the end of the other metal pattern, and the other end of the copper pattern and the other end of the other metal are used as sensor output terminals. I have. This aims to achieve the above-mentioned object.

According to a second aspect of the present invention, in the thermal monitoring sensor for an on-board power supply according to the first aspect, a temperature monitoring circuit is provided at a sensor output terminal. The temperature monitoring circuit has an overheat signal output function of operating when a predetermined level of output is obtained from the sensor output terminal and outputting a predetermined overheat signal to the outside. .

According to a third aspect of the present invention, the above-mentioned other metal pattern is formed of constantan or the like. This aims to achieve the above-mentioned object.

[0010]

[Operation] When the circuit board 1 is used with an on-board power supply, the temperature rise is constantly output to the outside by the thermocouple 10. In this case, a plurality of circuit boards 1 are provided for each package as in the case of the conventional example described above.
Even when the plurality of circuit boards 1 are provided, temperature information is individually output.

Therefore, even if the temperature differs locally for each package and the temperature becomes high locally, the information is output as it is to the outside. For this reason, it is possible to externally output the temperature information of the plurality of on-board power supplies individually, with high accuracy, and quickly.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIG. In FIG. 1, reference numeral 1 denotes a circuit board for an on-board power supply. This circuit board 1 is formed of ceramic, glass epoxy, or the like. On the circuit board 1, a copper pattern 2 having a predetermined width and a constantan pattern 3 which is another metal are vapor-deposited substantially in parallel at a predetermined interval. One end of each of the patterns 2 and 3, that is, the left end in FIG. 1 is bent toward the other party and deposited in contact with each other, thereby forming a thermocouple 10. Reference numeral 4 denotes a bonding surface between the copper pattern 2 and the constantan pattern 3 which is another metal.

The other end of each of the patterns 2 and 3, that is, the right end in FIG. 1 is connected to the output terminals 2A and 3A provided at the edge of the circuit board 1, respectively. 3A constitutes each sensor output terminal of the copper pattern 2 and the constantan pattern 3 which is another metal.

For this reason, when the circuit board 1 is used with an on-board power supply, the temperature rise of the
Is always output externally. In this case, a plurality of circuit boards 1 are provided for each package as in the case of the above-described conventional example. Even when the plurality of circuit boards 1 are provided, temperature information is individually output.

Therefore, in the first embodiment, the same information can be output to the outside even if the temperature is different for each package or the temperature is locally high. Temperature information of a plurality of on-board power supplies can be externally output individually, with high accuracy, and quickly.

Also, since the temperature information is externally output, since it is information from the thermocouple 10, it can be externally output with high accuracy and speed, and a power supply or the like is not required. In addition, a power supply or the like for outputting temperature information is not required at all, and can be obtained at low cost. In addition, since the thermocouple 10 is provided by vapor deposition, the size and weight can be reduced, and the space can be minimized. (They do not take up space).

Next, a second embodiment will be described with reference to FIG. The second embodiment shown in FIG. 2 is characterized in that a temperature monitoring circuit 20 is provided at the sensor output terminal disclosed in the first embodiment.

The temperature monitoring circuit 20 has an overheat signal output function that operates when an output of a predetermined level is obtained from the output terminals 2A and 3A and outputs a predetermined overheat signal to the outside.

Therefore, when a predetermined overheat signal is output from the temperature monitoring circuit 20, it becomes clear that an abnormality has occurred in the on-board power supply of the package. For this reason,
There is an advantage that the repair work of the on-board power supply can be quickly and accurately performed without externally determining whether there is any abnormality.

The other constructions, functions and effects are the same as those of the first embodiment.

[0021]

As described above, according to the present invention,
By the action of the thermocouple provided for each on-board power supply, it is possible to detect a local temperature rise of the device, and the detection output enables to quickly take measures to prevent abnormal temperature rise. An unprecedented onboard power supply thermal monitoring sensor that is relatively inexpensive and durable because the temperature can be directly detected by a thermocouple, and also enables individual and highly accurate temperature detection for each package. Can be provided.

[Brief description of the drawings]

FIG. 1 is a partially omitted plan view showing a first embodiment of the present invention.

FIG. 2 is a partially omitted plan view showing a second embodiment of the present invention.

FIG. 3 is a schematic explanatory diagram showing an example of a distributed power supply (on-board power supply) used for a communication device and the like in a conventional example.

FIG. 4 is a schematic perspective view showing a part of FIG. 3 and showing an example of installation of an on-board power supply in a package.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Circuit board 2 Copper pattern 2A, 3A Output terminal 3 Constantan pattern which is a pattern of other metals 4 Joining surface 10 Thermocouple 20 Temperature monitoring circuit

Claims (3)

(57) [Claims] A copper pattern having a predetermined length is provided on a circuit board such as ceramic or glass epoxy provided with an on-board power supply, and an end of another metal pattern is brought into contact with one end of the copper pattern. A heat monitoring sensor for an on-board power supply, wherein a pair is formed, and the other end of the copper pattern and the other end of the other metal are used as sensor output terminals. 2. The sensor for monitoring heat of an on-board power supply according to claim 1, further comprising a temperature monitoring circuit provided at said sensor output terminal, said temperature monitoring circuit obtaining an output of a predetermined level from said sensor output terminal. A heat monitoring sensor for an on-board power supply, characterized in that the sensor has an overheat signal output function for outputting a predetermined overheat signal to the outside when activated. 3. The thermal monitoring sensor for an on-board power supply according to claim 1, wherein the pattern of the other metal is formed of constantan or the like.