JP2608017B2 - Container type heat treatment equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat treatment apparatus for applying heat to an object to be heat-treated to heat the object, for example, as in a heat treatment step in a process of manufacturing a semiconductor substrate, an electric printed board, a display board, and the like. It is effectively used when a large number of works are processed in a short time in a magazine unit.

[0002]

2. Description of the Related Art As conventional heat treatment apparatuses, there are known a batch type heat treatment apparatus in which a magazine containing a work is directly put into a heat treatment tank and a heat treatment apparatus which automatically takes in and out a plurality of magazines containing a work in a heating chamber. Have been.

However, in these conventional devices,
Since a heat insulating layer is required, the heating tank becomes large. In addition, since the air does not easily flow in the magazine, it takes time to heat-treat the work, and the temperature distribution of the work is poor. Furthermore, in the batch method, there is a problem that the temperature of the heating tank needs to be increased and decreased for safe loading and unloading of the magazine into and from the heating tank, and the throughput is small. And in such a conventional device,
It is difficult to change the temperature at which the workpiece is heated for a short time to provide a temperature gradient in the heat treatment.

[0004]

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems in the prior art, and the invention of claim 1 is to provide a small-sized heat treatment apparatus having a large heat treatment capacity by making the heat treatment temperature of an object to be treated uniform. The object of the present invention is to provide
In addition to the above, an object of the present invention is to provide a heat treatment apparatus that can cope with a case where the heat treatment time is different. In addition to the objects of the invention of claim 3 and the invention of claim 1, a heat treatment capable of changing the heat treatment temperature It is an object to provide a device.

[0005]

In order to solve the above-mentioned problems, the present invention is directed to a heat treatment apparatus, comprising: a mounting portion for mounting an object to be heat-treated; a first opening; A container substantially covered with a second opening that communicates with the container, and an air supply port facing the first opening and an intake port facing the second opening when the container is installed at a predetermined position. And an air supply means for sending gas to the air supply port, a heating means for heating the gas, and an intake means for sucking gas from the intake port. In addition to,
The air supply port and the air intake port each have a plurality of nozzles, and the invention according to claim 3 is characterized in that the air supply port, the air intake port, and the heating port are provided in addition to the features of the invention according to claim 1. There are a plurality of means, and a plurality of the heating means heat the gas at different temperatures.

[0006]

According to the first aspect of the present invention, when the object to be heat-treated is placed on the placing portion in the container and the container is set at a predetermined position, the first opening of the container and the air supply port face each other, and The opening faces the intake port. Next, when the air supply means, the heating means, and the suction means are operated, the portion other than the opening of the container is almost covered, so that the heated gas is sent from the air supply port to the first opening, and the inside of the container is The air passes through the second opening and is sucked into the air inlet by the air suction means. In this case, since the portion of the container other than the first and second openings is substantially covered, the heated gas is forced to flow in the container. For this reason, the object to be processed in the container is efficiently transferred with the heat of the gas and is heated to a uniform temperature. In addition, since the inside of the container is directly heated, the temperature of the object to be processed in the container is sufficiently larger than the temperature of the container itself, so that heat loss for heating the container itself is small and heat is effectively used. Therefore, the processing capacity is increased even with a small device.

[0007] The gas sucked by the suction means may be discharged to the outside or may be sent again to the air supply means.
Further, the gas supply means and the gas suction means may be the same, and the gas may be circulated and used.

According to the second aspect of the present invention, since both the air supply port and the intake port have a plurality of nozzles, it is possible to cope with the difference in the heat treatment time in the continuous processing step of the work.

According to the third aspect of the present invention, there are a plurality of air inlets, air inlets, and heating means, and the plurality of heating means heat the gas to different temperatures. And, by sequentially moving to the position of the suction port, the object to be processed placed in the container can be heat-treated stepwise at different temperatures. In this case, the operation of setting or moving the container to a predetermined position may be performed manually, or may be performed automatically or manually by providing an appropriate transport device.

[0010]

FIG. 1 shows an example of a heat treatment apparatus to which the present invention is applied, in which an IC chip is mounted on a lead frame and bonded.
FIG. 2 shows an overall configuration of a C lead frame curing device, and FIG. 2 shows a schematic structure of the magazine. This apparatus includes a shelf frame 1a as a mounting portion on which a lead frame W on which an IC chip as a work as an object to be mounted is mounted, an air inlet 1b as a first opening, and a second conductive material connected to the first opening. A magazine 1 which is an example of a container which is provided with an air outlet 1c as an opening and is substantially covered, and when the magazine 1 is installed at predetermined positions P ₂ , P ₃ , P ₄ and P ₅ shown in the drawings. A plurality of air inlets 2 and 3 opposed to the air inlet 1b, a plurality of air inlets 4 and 5 opposed to the air outlet 1c, push-in fans 6 and 7 serving as air sending means for sending air to the air inlet, It has heaters 8 and 9 as a plurality of heating means for heating air to different temperatures, respectively, and an exhaust fan 10 and a push-in fan 7 as suction means for sucking air from an intake port. Further, the apparatus of this embodiment is provided with high-performance filters (HEPA filters) 11 and 12 so that a clean heat treatment can be performed. In a system in which hot air flows from the air supply port 3 to the intake port 5, the pushing fan 7 is also used as an air supply unit and an air intake unit, and air is circulated through a circulation path.

[0011] The capacity of the push-in fan is such that the flow velocity is 1 m / s.
The capacity is set such that hot air of about 5 m / s can flow through the magazine 1. In this case, in order to obtain a slow flow velocity, the rotation of the fan may be controlled, or the damper provided in the duct may be throttled. When the flow velocity is made variable in this manner, an appropriate flow velocity can be selected so as not to cause displacement due to wind pressure resistance due to differences in the mass and shape of the work. The reason why the flow velocity is set to 5 m / s or less is that the heat transfer coefficient is not so large even if it is higher than 5 m / s.

The above equipment and piping are appropriately kept warm. Further, the HEPA filter can be omitted in a heat treatment system that is not a clean specification.

FIGS. 3A and 3B show the entire structure of the IC lead frame curing device, showing the front and side surfaces, respectively. In the lower structure 100, a fan, a heater, a filter, a piping system for connecting them, and the like are arranged, and an air supply port, an intake port, an exhaust fan, etc., and a transfer device 20 for transferring the magazine 1 are provided above the lower structure 100. Further, a control panel 13 and an operation panel 14 are integrally mounted. In addition, a cover 15 is placed on a portion through which the heated air passes for safety.

FIGS. 4 to 6 show an example of the transport device 20 for transporting the magazine 1. FIG. The transport device 20 includes a slide unit 21 mounted on the lower structure 100,
A base 22 fixed thereto, an air cylinder 23 fixed thereto, a support member 24 into which these rods 23a are inserted and raised and lowered by the air cylinder 23, and a seven pair fixed to this and guiding the magazine 1 Finger 25
A pair of rails 26 supported by the lower structure 100 and supporting the magazine 1; an air cylinder 27 attached to the lower structure 100 and reciprocating the base 22; and a reverse screw for adjusting the width of the rail 26 It is composed of a unit 28 and the like. The transfer device is not limited to the device using the air cylinder as described above, and a belt or another transfer device may be used.

FIG. 7 shows an example of the structure of the air supply ports 2 and 3 and the intake ports 4 and 5. These are the main units 2-1 and 3-1 on the air supply side connected to the air supply pipe 16 and the intake pipe 17, respectively.
And the main body parts 4-1 and 5-1 on the intake side, the nozzle parts 2a, 3a, 3b and 3c on the air supply side and the nozzle part 4a on the intake side.
5a, 5b and 5c. The nozzle has a honeycomb rectifying plate inside, and has a structure that can be attached to and detached from the main body by insertion and replacement. Therefore, by selecting and mounting nozzles of an appropriate length, the distance between the surfaces can be adjusted to correspond to the width dimension of the magazine arranged therebetween. Thus, the nozzle is the air inlet 1 of the magazine 1
b and the air outlet 1c. In order to minimize the leakage of hot air, the opening size is set to be slightly smaller on the air inlet side on the nozzle side than on the magazine side, and on the air outlet side on the magazine. It is desirable to make the nozzle side slightly larger than the nozzle side. It should be noted that the air inlet, the air inlet, the air pipe, and the air intake pipe are simply heat-insulated.
Then, these are covered with a cover 15 and an air layer is present between them, thereby protecting the person.

With the above configuration, the IC lead frame curing device operates as follows. Set up the loaded magazine 1 of the lead frame W topped the IC chip as a work to be heat-treated to the loader positive I Deployment P _1,
When the device is operated by operating the operation panel 14, the heat treatment is started by a predetermined control sequence. Magazine 1
Is transferred from the P ₁ position in P ₂ position is precured position by the transport device 20. That is, the air cylinder 2
3 and 23 are actuated, the support member 24 and the finger 25 are lifted, and the magazine 1 installed on the rail 26 is slightly lifted so as not to rub against the rail when moving, the air cylinder 27 is actuated, and the magazine P ₁ P ₂ from position
The base 22, the support member 24, etc. are moved by one pitch via the slide unit 21 until the position is reached, and the air cylinders 23, 23 are actuated again to lower the support member 24, and the magazine 1 is placed on the rail 26. This is P ₂
Set to position. Thereafter, the base 22 and the like are returned to the initial reference position again by the operation of the air cylinder 27.

During this time, the heater 8 is turned on, the pushing fan 6 and the exhaust fan 10 are started, and the HEPA
For example, clean hot air of about 100 ° C. passes through the magazine 1 through the filter 11 and efficiently heats the lead frame W on which the internal IC chip is mounted. According to such a method, the work can be easily heated to the predetermined temperature in a short time. In such a precure,
Since the work is heated at a relatively low temperature to sufficiently remove the gas from the bonding solvent, the heated air contains a gas and is exhausted to the outside by an exhaust fan.

When the pre-curing is performed for a predetermined time, the magazine 1
In a similar manner the movement of the P ₂ position from the P ₁ position, P
It is moved from _second position to the first post-cure position P _3. Note that at this time, also placed on the next magazine P ₁ position P
It is moved to _two positions and the pre-curing described above is performed. P
_{At the 3} position, when the heater 9 is turned on and the magazine 1 is installed, the push-in fan 7 is operated, and hot air of, for example, about 150 ° C. flows through the HEPA filter to the magazine 1 so that the internal work is immediately performed. Heated and heated.
Since no gas is generated in this post cure, the hot air is sucked into the push-in fan again and the thermal economy is maintained by circulation. In this apparatus, the post-curing time is set to be three times as long as that of the pre-curing, and the post-curing positions are set to _three positions P ₃ , P ₄ and P ₅ to perform the tact operation. Accordingly, even in P ₃ position, it is heat-treated by the same time as the pre-curing of the P ₂ position.

[0019] In this way successively magazine from P ₁ to P ₅ and is installed, the post-cure of the magazine of P ₅ is completed, the magazine 1 is moved to the cooling position P _6, unloader position P after being cooled predetermined time Moved to ₇ ,
It is taken out.

According to such a heat treatment apparatus, the hot air is forcibly flown in the magazine at a predetermined flow rate, so that the heat exchange performance is good and the workpiece rises to the predetermined temperature in a short time.
Further, since the magazine itself that does not require heating is not heated, heat loss is reduced. For this reason, even for a small device,
Has a large heat treatment capacity. Further, there is an effect that the temperature distribution of the work becomes uniform. By providing a plurality of temperature steps, it is possible to set a temperature gradient in the heat treatment. Further, since the volume of the heating portion is small, simple heat insulation can be performed, and the heating system can be configured by a piping structure. Therefore, the device is downsized, and the installation space is significantly reduced as compared with the conventional device. Therefore, such a heat treatment apparatus is particularly effective for an apparatus requiring an automatic heat treatment line with a minimum space by providing a temperature step.

In the above description, the temperature step is set to two steps,
The example in which the pre-cure is set to one position and the post-cure is set to three positions with respect to the difference in the tact time is shown. However, it is needless to say that the present invention is not limited to the above-described device. These are arbitrarily determined according to the type of the work to be heat-treated, and for example, the heat treatment temperature steps are set to three stages of 100 ° C., 130 ° C. and 150 ° C. The number of steps is set according to the number of steps, and the number of positions for each temperature step can also be determined according to the heat treatment time.

[0022]

As described above, according to the present invention, in the first aspect of the present invention, the heated gas can be forced to flow directly into the container, so that the temperature distribution of the object to be treated can be made uniform,
In addition, heat loss is small, heat exchange performance is improved, heat treatment capability is improved, the apparatus can be downsized, and a heat cycle is not required, so that heat treatment time is shortened. In the invention of claim 2, in addition to the above, both the air supply port and the intake port have a plurality of nozzles, so that it is possible to cope with the difference in the tact time of the heat treatment. In the invention of claim 3, in addition to the effect of the invention of claim 1, since a plurality of heating means are used to heat the gas at different temperatures, a plurality of steps are provided for the heat treatment temperature and a temperature gradient is set. be able to.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of a mount cure device which is an embodiment of a heat treatment device.

FIG. 2 is a perspective view showing a schematic structure of a magazine of the device.

FIGS. 3A and 3B show the overall structure of the above-described device, wherein FIG. 3A is a front view and FIG. 3B is a side view.

FIG. 4 is a front view showing an example of a transport device of the above device.

FIG. 5 is a view taken in the direction of arrows AA in FIG. 4;

6 is a view as viewed in the direction of arrows BB in FIG. 4;

FIG. 7 is a side view showing an air inlet and an air inlet of the device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Magazine (container) 1a Shelf frame (placement part) 1b Air inlet (1st opening) 1c Air outlet (2nd opening) 2, 3 Air supply port 4, 5 Air inlet 6, 7 Push-in fan (air supply means, Intake means) 8, 9 Heater (heating means) 10 Exhaust fan (intake means) W IC chip (material to be processed)

Claims (3)

(57) [Claims] 1. A container having a mounting portion for mounting an object to be heat-treated, a first opening, and a second opening communicating with the first opening, the container being substantially covered, and the container being set at a predetermined position. An air inlet facing the first opening and an air inlet facing the second opening, an air sending means for sending a gas to the air opening, a heating means for heating the gas, and the air inlet And a suction means for sucking a gas from the heat treatment apparatus. 2. The heat treatment apparatus according to claim 1, wherein each of the air supply port and the air intake port has a plurality of nozzles. 3. The apparatus according to claim 2, wherein the air supply port, the air intake port, and the heating means are provided in a plurality, and the plurality of heating means heat the gas at different temperatures. 2. The heat treatment apparatus according to 1.