JP2605526Y2 - Chip type solid electrolytic capacitor - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip type solid electrolytic capacitor, and more particularly to a chip type solid electrolytic capacitor in which the shape of a lead terminal of a cathode is improved.

[0002]

2. Description of the Related Art A conventional chip type solid electrolytic capacitor is shown in FIG. In this chip-type solid electrolytic capacitor, a cathode lead-out terminal 7 and a cathode element 2 of a solid electrolytic capacitor provided with a conductive paste are fixedly connected via a conductive adhesive 3. The anode lead wire 4 of the solid electrolytic capacitor is welded to the anode lead terminal 5 by a joining method such as resistance welding. Thereafter, the exterior is formed by using a mold resin 6 such as an epoxy resin.

[0003]

However, the conventional chip-type solid electrolytic capacitor has a structure in which the cathode lead terminal 7 and the cathode element 2 of the solid electrolytic capacitor are connected by the conductive adhesive 3. The connection strength depends only on the bonding strength of the conductive adhesive 3.
For this reason, it is inevitable that a connection failure between the cathode terminal 2 and the cathode lead-out terminal 7, for example, an open or loose contact, etc., occurs depending on the variation in the fixing property of the conductive adhesive 3. As a result, there is a problem that desired electric characteristics of the solid electrolytic capacitor cannot be obtained.

When the conductive adhesive 3 is solidified by heating, the cathode element 2 is inclined or lifted with respect to the cathode lead terminal 7. As a result, a connection failure between the cathode element 2 and the cathode lead terminal 7 occurs. In addition, there is a problem that a problem such as exposure of the cathode element 2 from the mold resin occurs after packaging with the mold resin.

[0005]

According to the present invention, a solid-state electronic device is provided.
In the chip-type solid electrolytic capacitor obtained by connecting the anode lead terminal and the cathode lead terminal to the elements of the dissolving capacitor, respectively, and molding, the cathode lead lead terminal has a spring property and has a U-shaped cross section .
Curls are formed by bending the ends of both ends inward
And pulling out the cathode element of the solid electrolytic capacitor from the cathode
Is pressed into the inside of the curled portion of the lead terminal pressure clamping, the cathode lead-out lead terminal and Chip solid electrolytic capacitor characterized in that the anchoring Connect by the conductive adhesive and the cathode element of the solid electrolytic capacitor can get.

[0006]

The function of the cathode element of the solid electrolytic capacitor is as described above.
Pressing into the inside of the curled part of the cathode lead lead terminal
Since it is sandwiched and fixedly connected by the conductive adhesive, it is possible to prevent the occurrence of poor connection between the cathode element and the cathode lead-out terminal. Also on that it is possible to prevent inclination or floating of the cathode element, it causes no the cathode element is exposed from the mold resin.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below. FIG. 1 shows a chip-type solid electrolytic capacitor according to Embodiment 1 of the present invention. In this chip-type solid electrolytic capacitor, an anode lead lead terminal 4 and a cathode lead lead terminal 1 each having a substantially U-shaped cross section (longitudinal section) are connected to a cathode element 2, respectively. Element 2
Are fixedly connected to each other by a conductive adhesive 3. On the lower right side of the drawing of the cathode lead terminal 1, a section 11 having a U-shaped cross section (cross section) is integrally provided. Then, both side surfaces of the cathode element 2 are sandwiched by both ends 12 having a spring property of the portion 11 having a U-shaped cross section.

The chip-type solid electrolytic capacitor according to the first embodiment is manufactured by the following steps, for example. That is, after pressing the tantalum metal powder, it is sintered in a high temperature and high vacuum to obtain an anode body. On this anode body, a tantalum oxide film is formed as a dielectric layer. Subsequently, on the tantalum oxide film, a manganese dioxide layer, a graphite layer,
A cathode element 2 is obtained by sequentially forming a silver paste layer.

Next, the cross section is U-shaped and both ends 1
A cathode lead terminal 1 having a thickness of 0.1 mm, which is formed by bending the base member 2 into a trapezoidal shape in the vertical direction, is prepared, and both end portions 12 are pressed and held from the lower surface side of the cathode element 2 to both side surfaces of the cathode element 2. At this time, the conductive adhesive 3 is applied in advance to the contact portion of the cathode lead terminal 1 with the cathode element 2. Subsequently, the conductive adhesive 3 is cured by heating at 150 ° C. for 90 minutes in a drying furnace.

The anode lead wire 4 drawn from the cathode element 2 is welded to the anode lead terminal 5 by a joining method such as resistance welding. After that, exterior molding is performed with a molding resin 6 such as an epoxy resin except for the terminal portions of the cathode lead terminal 1 and the anode lead terminal 5. Then, a length of 3.6 obtained by the above steps was obtained.
Example 1 A chip-type solid electrolytic capacitor of Example 1 having a width of 1.6 mm and a height of 1.6 mm was obtained.

In the chip-type solid electrolytic capacitor of the first embodiment, the cathode element 2 and the cathode lead-out terminal 1 are fixedly connected to each other with a conductive adhesive 3, and the cathode lead-out terminal 1 is formed in a cross section having its spring property. Is pressed against the side surface of the cathode element 2 by the U-shaped portion 11 and has a holding force of 1.5 times the connection strength ratio as compared with the conventional example.
As a result, as shown in Table 1, the incidence of connection failure between the cathode element 2 and the cathode lead terminal 1 and the incidence of exposure of the cathode element 2 can be significantly reduced.

[0012]

[Table 1]

FIG. 2 shows a chip type solid electrolytic capacitor according to a second embodiment of the present invention. This embodiment is substantially the same as the first embodiment except that the cross section of the cathode extraction lead terminal 1 has a bent shape at both ends 12 of the U-shaped portion 11. That is, in the second embodiment, in order to secure the resilience when the cathode element 2 is pressed and held, the plate thickness is 0.1 mm.
The ends of both ends 12 of the portion of the cathode lead terminal 1 having a U-shaped cross section are bent inward to form curled portions 13.
Is formed. The cathode element 2 is press-fitted inside these curled portions 13 and both side surfaces thereof are pressed and held. Note that the conductive adhesive 3 has been applied on the cathode lead terminal in advance of the pressing and clamping.

The chip type solid electrolytic capacitor of the second embodiment has the same effect as that of the first embodiment. That is, the occurrence rate of the connection failure and the exposure rate of the cathode element can be halved as compared with the conventional example.

Although the above is an example in which a tantalum sintered body is used as the anode body, the present invention is also applied to a chip type solid electrolytic capacitor using an anode body made of another metal having a valve action. Needless to say, a similar effect can be obtained.

[0016]

As described above, in the chip type solid electrolytic capacitor of the present invention, the cathode lead terminal and the cathode element of the solid electrolytic capacitor are fixedly connected via the conductive adhesive, and the spring of the cathode lead terminal is connected. The tip of both ends of the part that has a
Each is bent inward to form a curled part, and the solid electrolytic capacitor
The cathode element of the sensor
Since it is configured to be pressed into the inside of the portion and pressed and held, it is possible to obtain a stable connection strength which does not depend on the variation in the fixing characteristics of the conductive adhesive. Moreover, depending on the shape of the curl part
No scratches etc. occur when inserting the cathode element
Has a double structure and increases the mechanical strength when molding
Can withstand the mold resin injection pressure. Therefore, poor connection between the cathode element and the cathode lead terminal can be significantly reduced. In addition, since the inclination and lifting of the cathode element can be prevented, poor exposure of the cathode element can be significantly reduced. As a result, a chip-type solid electrolytic capacitor excellent in quality can be provided.

[Brief description of the drawings]

FIG. 1 is a perspective perspective view of a chip-type solid electrolytic capacitor according to a first embodiment of the present invention.

FIG. 2 is a perspective perspective view of a chip-type solid electrolytic capacitor according to a second embodiment of the present invention.

FIG. 3 is a perspective perspective view of a conventional chip-type solid electrolytic capacitor.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1, 7 Cathode lead terminal 2 Cathode element 3 Conductive adhesive 4 Anode lead wire 5 Anode lead lead terminal 6 Mold resin 11 Section having a U-shaped cross section 12 Both ends 13 Curl

Claims (1)

(57) [Scope of request for utility model registration] An anode lead lead terminal and a cathode lead lead terminal are connected to elements of a solid electrolytic capacitor, respectively, and the chip lead solid electrolytic capacitor is formed by molding and the cathode lead lead terminal has a spring property and a cross section. Fold both ends of the U-shaped part inward
Bend to form a curled part, the cathode element of the solid electrolytic capacitor
Press the electrode inside the curled part of the cathode lead terminal.
Is input shi pressure clamping, the cathode lead-out lead terminal and the solid Chip solid electrolytic capacitor characterized in that the anchoring Connect by the conductive adhesive and the cathode element of the electrolytic capacitor.