JP2602000B2 - Mask for forming a coating pattern - Google Patents
Mask for forming a coating patternInfo
- Publication number
- JP2602000B2 JP2602000B2 JP6227603A JP22760394A JP2602000B2 JP 2602000 B2 JP2602000 B2 JP 2602000B2 JP 6227603 A JP6227603 A JP 6227603A JP 22760394 A JP22760394 A JP 22760394A JP 2602000 B2 JP2602000 B2 JP 2602000B2
- Authority
- JP
- Japan
- Prior art keywords
- mask
- pattern
- copper
- forming
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は例えば銅プラズマ溶射に
用いる被覆パターン形成用マスクに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mask for forming a coating pattern used for, for example, copper plasma spraying.
【０００２】[0002]
【従来の技術】例えば自動車エンジンの電気系統に用い
る半導体装置として、ジュラルミンなどの金属からなる
基板に半導体素子を取着したものがあり、この半導体装
置では金属の基板に所定パターンの銅被覆層を形成し、
この銅被覆層に半導体素子をハンダ付けにより固着して
いる。2. Description of the Related Art For example, as a semiconductor device used for an electric system of an automobile engine, there is a semiconductor device in which a semiconductor element is mounted on a substrate made of metal such as duralumin. In this semiconductor device, a copper coating layer having a predetermined pattern is formed on a metal substrate. Forming
A semiconductor element is fixed to the copper coating layer by soldering.
【０００３】しかして、この半導体装置の基板に銅被覆
層を形成するためには、プラズマ溶射法により銅を基板
表面に溶射して被覆層を形成する方法が採用されてい
る。そして、基板に形成する被覆層は所定のパターンを
持つものであることから、基板に銅プラズマ溶射を行う
場合には、所定パターンの銅被覆層を形成するためにマ
スクを用いている。[0003] In order to form a copper coating layer on the substrate of this semiconductor device, a method of spraying copper onto the substrate surface by a plasma spraying method to form the coating layer has been adopted. Since the coating layer formed on the substrate has a predetermined pattern, when copper plasma spraying is performed on the substrate, a mask is used to form a copper coating layer having a predetermined pattern.
【０００４】この溶射用マスクは被覆層のパターンに対
応した形状のパターン孔を有するもので、基板の前方に
配置して、プラズマジェット装置から噴射される銅溶融
粒子をパターン孔のみに通して銅溶融粒子の噴射範囲を
パターン形状に規制するものである。This thermal spray mask has a pattern hole having a shape corresponding to the pattern of the coating layer. The mask is disposed in front of the substrate, and copper molten particles sprayed from a plasma jet apparatus are passed through only the pattern hole to form copper. The injection range of the molten particles is regulated to a pattern shape.
【０００５】そして、従来基板に対する銅プラズマ溶融
に用いるマスクは、鉄系合金で形成され、その表面にク
ロムメッキを施したものが用いられている。このクロム
メッキはマスクの表面に強度をもたせるためのものであ
る。[0005] Conventionally, a mask used for copper plasma melting of a substrate is formed of an iron-based alloy and its surface is subjected to chrome plating. This chrome plating is for giving strength to the surface of the mask.
【０００６】[0006]
【発明が解決しようとする課題】しかして、プラズマ溶
射に用いるマスクに対しては、高温の溶融金属粒子が噴
射される環境下で使用するために、耐熱性および耐熱衝
撃性と、耐食性とが要求され、さらに被溶射体上に所定
パターンの被覆層を常に精度良く形成できるようにパタ
ーン孔の形状寸法を常に精度良く保持できることが要求
される。However, since a mask used for plasma spraying is used in an environment in which high-temperature molten metal particles are jetted, heat resistance, thermal shock resistance, and corrosion resistance are low. In addition, it is required that the shape and size of the pattern hole can be always maintained with high accuracy so that a coating layer having a predetermined pattern can always be formed with high accuracy on the object to be sprayed.
【０００７】しかるに、鉄系合金で形成されかつ表面に
クロムメッキを施した従来のプラズマ溶射用マスクは、
耐熱性および耐熱衝撃性と耐食性に優れているが、しか
しながら次の点で問題がある。すなわち、従来のプラズ
マ溶射用マスクは銅の溶融粒子とのぬれ性が良く、プラ
ズマジェット装置から噴射される銅の溶融粒子がマスク
の表面に溶着する。このため、マスクに形成したパター
ン孔の周縁部にも銅溶融粒子が溶着して、パターン孔の
寸法形状が早期に変化しパターン孔の寸法形状を長期に
わたり精度良く確保しにくい。すなわち、プラズマジェ
ット装置から噴射される銅溶融粒子に対するマスクによ
る噴射範囲の規制の精度が早期に低下し、長期にわたり
基板上に所定パターンの被覆層を精度良く形成すること
が困難となる。However, a conventional plasma spraying mask formed of an iron-based alloy and having a chromium plating on the surface is:
It is excellent in heat resistance, thermal shock resistance and corrosion resistance, but has problems in the following points. That is, the conventional plasma spray mask has good wettability with the molten copper particles, and the molten copper particles sprayed from the plasma jet device are deposited on the surface of the mask. For this reason, the molten copper particles are also deposited on the periphery of the pattern hole formed in the mask, and the size and shape of the pattern hole change early, making it difficult to ensure the size and shape of the pattern hole accurately over a long period of time. That is, the accuracy of the regulation of the ejection range of the copper molten particles ejected from the plasma jet device by the mask is reduced at an early stage, and it becomes difficult to form a coating layer of a predetermined pattern on the substrate with high accuracy over a long period of time.
【０００８】本発明は前記事情に基づいてなされたもの
で、被覆層のパターンを長期にわたり精度良く形成する
ことができる高い耐久性を備えた被覆パターン形成用マ
スクを提供することを特徴とする。The present invention has been made in view of the above circumstances, and has a feature of providing a coating pattern forming mask having high durability and capable of forming a pattern of a coating layer with high accuracy over a long period of time.
【０００９】[0009]
【課題を解決するための手段】本発明の発明者らは溶射
などの被覆層を形成する場合に用いるマスクについて種
々研究を重ね、溶融した金属の溶着を防止するために鉄
系合金に代わりモリブデンなどの金属材料を採用してマ
スクを製作して試験を行ったが、いずれも目的を果たす
ことはできなかった。このことから発明者らは、マスク
の材料として金属に代わる新しい材料が必要であると判
断し、さらに研究を重ねた結果、マスクに要求される性
質を備えた材料として窒化けい素セラミックスが最適で
あることを見出した。Means for Solving the Problems The inventors of the present invention have conducted various studies on a mask used for forming a coating layer such as thermal spraying, and have found that molybdenum is used instead of an iron-based alloy in order to prevent welding of a molten metal. A mask was manufactured by using a metal material such as that described above, and a test was performed, but none of the objectives could be achieved. From these facts, the inventors concluded that a new material was required instead of metal as the material for the mask, and as a result of further studies, silicon nitride ceramics was the most suitable material with the properties required for the mask. I found something.
【００１０】すなわち、本発明の被覆パターン形成用マ
スクは、窒化けい素セラミックスの焼結体で形成され、
被覆層のパターンに応じた形状寸法を有し、かつ表面粗
さがＲｍａｘで０．２Ｓ以下であることを特徴とするも
のである。That is, the mask for forming a coating pattern of the present invention is formed of a sintered body of silicon nitride ceramics,
It has a shape and dimension according to the pattern of the coating layer, and has a surface roughness of 0.2 S or less in Rmax.
【００１１】本発明の被覆パターン形成用マスクの基本
的な構成は、被覆層のパターンに応じた形状寸法を有す
るものである。パターン孔は１組に限らず、被覆層形成
の能率を向上させるために複数組形成しても良い。マス
クは軽量化とパターン孔の形成の容易化を図るために、
平板体とすることが好ましい。The basic structure of the mask for forming a coating pattern according to the present invention has a shape and size corresponding to the pattern of the coating layer. The number of pattern holes is not limited to one, and a plurality of patterns may be formed in order to improve the efficiency of forming the coating layer. To reduce the weight of the mask and facilitate the formation of pattern holes,
It is preferable to use a flat plate.
【００１２】本発明のマスクは窒化けい素セラミックス
の焼結体で形成したものである。この窒化けい素セラミ
ックスは、耐熱性、耐熱衝撃性および耐食性に優れてお
り、加えて緻密なものが容易に得られ、かつ変形が少な
く熱膨張係数が小さい特性を有している。さらに、窒化
けい素は金属の溶融粒子とのぬれ性が悪く、金属の溶融
粒子が溶着することがないという性質を有している。The mask of the present invention is formed of a sintered body of silicon nitride ceramics. This silicon nitride ceramic is excellent in heat resistance, thermal shock resistance, and corrosion resistance, and can be easily obtained as a dense one, and has characteristics of being less deformed and having a small coefficient of thermal expansion. Furthermore, silicon nitride has poor wettability with molten metal particles, and has the property that molten metal particles are not welded.
【００１３】窒化けい素セラミックスの焼結体を形成す
るために、窒化けい素に焼結助剤として希土類酸化物お
よびアルミナを含有するものを加える。マスクを形成す
る窒化けい素セラミックスの代表的な組成は、窒化けい
素（Ｓｉ3 Ｎ4 ）１００重量部、イットリア（Ｙ2 Ｏ
3 ）２〜８重量部、アルミナ（Ａｌ2 Ｏ3 ）１〜６重量
部、窒化アルミニウム（ＡｌＮ）１〜５重量部、炭化モ
リブデン（Ｍｏ2 Ｃ）３重量部以下である。この組成に
より窒化けい素の特性を充分活かした焼結体を得ること
ができる。In order to form a sintered body of silicon nitride ceramics, a silicon nitride containing a rare earth oxide and alumina is added as a sintering aid. A typical composition of the silicon nitride ceramics forming the mask is 100 parts by weight of silicon nitride (Si 3 N 4 ), yttria (Y 2 O).
3) 2-8 parts by weight, alumina (Al 2 O 3) 1 to 6 parts by weight, aluminum (AlN) 1 to 5 parts by weight nitride, molybdenum carbide (Mo 2 C) is 3 parts by weight or less. With this composition, a sintered body that makes full use of the characteristics of silicon nitride can be obtained.
【００１４】本発明のマスクは、窒化けい素焼結体の表
面が充分平滑である。これは焼結体の表面に金属の溶融
粒子が溶着することをさらに一層防止するためである。
具体的には焼結体の表面粗さがＲｍａｘ（最大表面粗
さ）で０．２Ｓ以下とする。In the mask of the present invention, the surface of the silicon nitride sintered body is sufficiently smooth. This is to further prevent the molten particles of the metal from welding to the surface of the sintered body.
Specifically, the surface roughness of the sintered body is set to Rmax (maximum surface roughness) of 0.2 S or less.
【００１５】本発明のマスクは次の製造方法で製作す
る。前記の組成の窒化けい素セラミックス粉末を加圧し
た後に焼結（炉焼結）して薄板をなす窒化けい素セラミ
ックスの焼結体を製作する。ついで、焼結体にダイヤモ
ンドなどによる研磨の後にラッピング加工を施してその
表面をＲｍａｘで０．２Ｓ以下に仕上げ、さらに焼結体
に超音波加工を施して所定の寸法形状をなすパターン孔
を形成する。The mask of the present invention is manufactured by the following manufacturing method. After the silicon nitride ceramic powder having the above composition is pressed, it is sintered (furnace sintered) to produce a sintered body of silicon nitride ceramic forming a thin plate. Then, the sintered body is polished with diamond or the like and then subjected to lapping to finish the surface with Rmax of 0.2 S or less, and further subjected to ultrasonic processing to form a pattern hole having a predetermined size and shape. I do.
【００１６】このように構成した本発明のマスクは、例
えば半導体装置における金属製の基板に対して銅プラズ
マ溶射を行い、半導体基板の表面に所定パターンをなす
銅被覆層を形成する場合に用いる。プラズマ溶射の他に
は、ガス溶射、スパッタリングなどの金属を溶融状態に
して物体の表面に付着させて被覆膜を形成する方法にお
いて、物体表面に対する金属溶融粒子の付着範囲を規制
して所定パターンの被覆層を形成する場合に種々広く使
用できる。The mask of the present invention configured as described above is used, for example, when a metal substrate in a semiconductor device is subjected to copper plasma spraying to form a copper coating layer having a predetermined pattern on the surface of the semiconductor substrate. In addition to plasma spraying, gas spraying, sputtering and other methods of forming a coating film by melting a metal in the molten state and adhering to the surface of the object, regulate the adhesion range of the molten metal particles to the surface of the object and apply a predetermined pattern Can be used widely when forming a coating layer.
【００１７】[0017]
【作用】しかして、本発明の被覆パターン形成用マスク
は、窒化けい素セラミックスの焼結体からなるために、
耐熱性、耐熱衝撃性および耐食性が優れており、さらに
溶融した金属粒子とのぬれ性が悪い。しかも、焼結体の
表面はきわめて平滑であるから、溶融金属粒子の付着が
きわめて困難である。したがって、本発明のマスクを例
えば銅プラズマ溶射に用いた場合には、プラズマジェッ
ト装置から噴射される銅の溶射粒子がマスクの表面に付
着しない。このため、マスクのパターン孔の周縁部にも
銅の溶融粒子が付着しない。したがって、パターン孔の
寸法形状が長期にわたり変化せず、その精度を確保する
ことができる。これによりマスクが銅の噴射範囲を常に
精度良く所定パターンに規制し、長期にわたり基板表面
に所定パターンの銅被覆層を形成することができる。ま
た、本発明のマスクは他の被覆方法に使用した場合にも
同等の効果を得ることができる。The mask for forming a coating pattern according to the present invention comprises a sintered body of silicon nitride ceramics.
Excellent heat resistance, thermal shock resistance and corrosion resistance, and poor wettability with molten metal particles. Moreover, since the surface of the sintered body is extremely smooth, it is extremely difficult to adhere the molten metal particles. Therefore, when the mask of the present invention is used for, for example, copper plasma spraying, the sprayed copper particles sprayed from the plasma jet device do not adhere to the surface of the mask. Therefore, the molten copper particles do not adhere to the periphery of the pattern hole of the mask. Therefore, the dimensional shape of the pattern hole does not change for a long time, and the accuracy can be ensured. This allows the mask to always accurately control the copper spray range to a predetermined pattern and form a copper coating layer of the predetermined pattern on the substrate surface for a long time. Further, the same effect can be obtained when the mask of the present invention is used for another coating method.
【００１８】[0018]
【実施例】以下、本発明の実施例について説明する。Ｓ
ｉ3 Ｎ4 １００重量部、Ｙ2 Ｏ3 ５重量部、Ａｌ2 Ｏ3
４重量部、ＡｌＮ３重量部、Ｍｏ2 Ｃ１重量部からなる
粉末を１トン／ｃｍ2 の成形圧で加圧して成形体を得、
この成形体を窒素雰囲気、温度１８００℃×２時間の条
件で焼結して図１および図２で示す厚さ１ｍｍの薄板を
なす焼結体を得た。この薄板焼結体にダイヤモンド研磨
を施した後にラッピング加工を施して表面をＲｍａｘで
０．２Ｓ以下に仕上げ、その後に超音波加工を施して薄
板焼結体１に図面に示す形状のパターン孔２を形成し
た。このように製作したマスクを、プラズマ溶射により
ジュラルミン基板に銅被覆層を形成する場合に使用し
た。この結果、マスクを１０００時間使用した時点でも
マスクに銅の溶着が発生せず、基板に精度良く銅被覆層
を形成することができた。Embodiments of the present invention will be described below. S
i 3 N 4 100 parts by weight, Y 2 O 3 5 parts by weight, Al 2 O 3
A powder comprising 4 parts by weight, 3 parts by weight of AlN, and 1 part by weight of Mo 2 C was pressed at a molding pressure of 1 ton / cm 2 to obtain a compact.
The compact was sintered under a nitrogen atmosphere at a temperature of 1800 ° C. for 2 hours to obtain a sintered compact having a thickness of 1 mm as shown in FIGS. 1 and 2. The thin-plate sintered body is subjected to diamond polishing and then lapping to finish the surface to 0.2S or less with Rmax, and then to ultrasonic processing to form a pattern hole 2 having the shape shown in the drawing in the thin-plate sintered body 1. Was formed. The mask thus manufactured was used when a copper coating layer was formed on a duralumin substrate by plasma spraying. As a result, even when the mask was used for 1000 hours, no copper was deposited on the mask, and a copper coating layer could be accurately formed on the substrate.
【００１９】また、この実施例の窒化けい素焼結体の表
面をダイヤモンド研磨によりＲｍａｘで０．８Ｓに仕上
げた後に超音波加工によりパターン孔を形成してマスク
を製作した。このマスクを前記銅プラズマ溶射に使用し
た。この結果、使用開始後１００時間の時点でマスクに
銅が溶着し始め、５００時間の時点で基板に形成する被
覆層のパターンが変形してマスクの使用が困難となっ
た。Further, the surface of the silicon nitride sintered body of this embodiment was finished to 0.8S with Rmax by diamond polishing, and then pattern holes were formed by ultrasonic processing to produce a mask. This mask was used for the copper plasma spraying. As a result, copper began to be deposited on the mask 100 hours after the start of use, and the pattern of the coating layer formed on the substrate was deformed 500 hours later, making it difficult to use the mask.
【００２０】さらに、比較例として銅板からなりかつ表
面にクロムメッキを施してなるマスクを前記銅プラズマ
溶射に使用した結果、使用後２０時間でマスクに銅が溶
着し始め、５０時間後にはマスクの使用が困難になっ
た。Further, as a comparative example, as a result of using a mask made of a copper plate and having a chromium plating on the surface for the copper plasma spraying, copper began to be deposited on the mask 20 hours after use, and 50 hours after the use of the mask. Difficult to use.
【００２１】[0021]
【発明の効果】以上説明したように本発明の被覆パター
ン形成用マスクによれば、溶融した金属の溶着を防止し
て、長期にわたり精度良く被覆層を形成することがで
き、かつマスクとして高い耐久性を有する。As described above, according to the mask for forming a coating pattern of the present invention, the deposition of a molten metal can be prevented, and a coating layer can be formed with high precision over a long period of time. Has the property.
【図１】本発明の被覆パターン形成用マスクの一実施例
の正面図FIG. 1 is a front view of an embodiment of a mask for forming a coating pattern according to the present invention.
【図２】本発明の被覆パターン形成用マスクの一実施例
の断面図FIG. 2 is a sectional view of one embodiment of a mask for forming a coating pattern according to the present invention.
１…焼結体 ２…パターン孔 1: Sintered body 2: Pattern hole
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｃ２３Ｃ 14/50 Ｃ２３Ｃ 14/50 Ｆ 14/56 14/56 Ｊ (56)参考文献 特開 昭60−2662（ＪＰ，Ａ) 特開 昭61−295366（ＪＰ，Ａ) 特開 昭62−182163（ＪＰ，Ａ) 特開 昭58−151371（ＪＰ，Ａ)──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification number Agency reference number FI Technical indication location C23C 14/50 C23C 14/50 F 14/56 14/56 J (56) References JP-A-60 -2662 (JP, A) JP-A-61-295366 (JP, A) JP-A-62-182163 (JP, A) JP-A-58-151371 (JP, A)
Claims (3)
され、被覆層のパターンに応じた形状寸法を有し、かつ
表面粗さがＲｍａｘで０．２Ｓ以下であることを特徴と
する被覆パターン形成用マスク。1. A coating pattern formed of a sintered body of silicon nitride ceramics, having a shape and size corresponding to a pattern of a coating layer, and having a surface roughness of Rmax of 0.2 S or less. Forming mask.
化けい素１００重量部、イットリア２〜８重量部、アル
ミナ１〜６重量部、窒化アルミニウム１〜５重量部、炭
化モリブデン３重量部以下からなるものである請求項１
記載の被覆パターン形成用マスク。2. The sintered body of silicon nitride ceramics contains 100 parts by weight of silicon nitride, 2 to 8 parts by weight of yttria, 1 to 6 parts by weight of alumina, 1 to 5 parts by weight of aluminum nitride, and 3 parts by weight or less of molybdenum carbide. Claim 1 comprising:
The mask for forming a coating pattern according to the above.
項１または２記載の被覆パターン形成用マスク。3. The coating pattern forming mask according to claim 1, which is used for copper plasma spraying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6227603A JP2602000B2 (en) | 1994-09-22 | 1994-09-22 | Mask for forming a coating pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6227603A JP2602000B2 (en) | 1994-09-22 | 1994-09-22 | Mask for forming a coating pattern |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07166318A JPH07166318A (en) | 1995-06-27 |
| JP2602000B2 true JP2602000B2 (en) | 1997-04-23 |
Family
ID=16863532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6227603A Expired - Lifetime JP2602000B2 (en) | 1994-09-22 | 1994-09-22 | Mask for forming a coating pattern |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2602000B2 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19910577B4 (en) * | 1998-12-18 | 2010-09-09 | Volkswagen Ag | Method and arrangement for the thermal coating of surfaces of an interior, in particular of cylinder running surfaces of a cylinder crankcase of an internal combustion engine |
| DE102004058705B3 (en) * | 2004-12-06 | 2006-08-17 | Daimlerchrysler Ag | Thermal surface coating process operated in conjunction with a mask of pressed moist particles |
| TW200718805A (en) | 2005-11-07 | 2007-05-16 | United Technologies Corp | Coating methods and apparatus |
| DE102008011249A1 (en) * | 2008-02-26 | 2009-09-10 | Maschinenfabrik Reinhausen Gmbh | Process for producing structured surfaces |
| DE102008056652A1 (en) | 2008-11-10 | 2010-05-12 | Mtu Aero Engines Gmbh | Mask for kinetic cold gas compacting |
| JP5769447B2 (en) * | 2011-02-28 | 2015-08-26 | 三菱重工業株式会社 | Partial repair method of thermal barrier coating |
| JP6443315B2 (en) * | 2015-12-08 | 2018-12-26 | トヨタ自動車株式会社 | Masking jig for thermal spraying and masking method in thermal spraying using the same |
| CN111549310B (en) * | 2020-04-13 | 2021-01-15 | 南京深光科技有限公司 | Ceramic powder, mask and manufacturing method thereof |
| DE102021206224A1 (en) | 2021-06-17 | 2022-12-22 | Robert Bosch Gesellschaft mit beschränkter Haftung | Mask for producing a component with a structure, method and system for producing a component with a structure |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58151371A (en) * | 1982-02-25 | 1983-09-08 | 住友電気工業株式会社 | Manufacture of silicon nitride sintered body |
| JPS602662A (en) * | 1983-06-21 | 1985-01-08 | Agency Of Ind Science & Technol | Formation of ceramics coated layer |
| JPS61295366A (en) * | 1985-06-24 | 1986-12-26 | Sumitomo Electric Ind Ltd | Masking material for vapor deposition |
| JPS62182163A (en) * | 1986-01-31 | 1987-08-10 | 株式会社東芝 | Silicon nitride ceramic sintered body and manufacture |
-
1994
- 1994-09-22 JP JP6227603A patent/JP2602000B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07166318A (en) | 1995-06-27 |
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