JP2600354Y2 - Rutile single crystal and metal joints - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonded part of rutile single crystal and metal used as an optical part such as a prism or a polarizer.

[0002]

2. Description of the Related Art When a rutile single crystal is used, it is necessary to attach a terminal, and a stainless plate or the like is used as the terminal. The conventional example will be described with reference to the cross-sectional view of FIG. 2. Reference numeral 1 denotes a rutile single crystal. When stainless steel 2 is attached to this as a metal of a joining part, metallized layers 3 and 3-1 are formed on both, Is fixed.

[0003]

[Problems to be Solved by the Invention]
Since bonding is performed by soldering, the metallized layer is likely to peel off due to a change in temperature during bonding, or a crack may be formed in the rutile single crystal due to a difference in expansion coefficient between the two, and there is a problem in reliability. Was. The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a reliable bonded part of rutile single crystal and metal.

[0004]

According to a first aspect of the present invention, there is provided a bonded part of rutile single crystal and metal, wherein a ceramic plate is provided between both members to be bonded in a bonded part of rutile single crystal and metal. Intervened. The bonded part of rutile single crystal and metal according to claim 2 of the present invention has a ceramic plate having a coefficient of thermal expansion of 5 to 9 × 10 ⁻⁶ K ⁻¹ . The bonded part of rutile single crystal and metal according to [claim 3] of the present invention,
The joint surface between the rutile single crystal and the metal or ceramic plate was formed of a metallized layer. According to the fourth aspect of the present invention, the rutile single crystal-metal joining part is formed by soldering the rutile single crystal-ceramic plate and the ceramic plate-metal joining.

According to the first aspect of the present invention, in the joining part of the rutile single crystal and the metal, since the ceramic plate is interposed between the two members to be joined, the difference in thermal expansion between the metal and the rutile single crystal can be absorbed. In [Claim 2], the coefficient of thermal expansion of the ceramic plate is set to 5 to 9 × 10 ⁻⁶ K ⁻¹ , which is close to the coefficient of thermal expansion of rutile single crystal to 7 to 8 × 10 ⁻⁶ K ⁻¹ . as a result,
The difference in thermal deformation disappeared. In this case, the coefficient of thermal expansion is required to be at least in the range of 5 to 9 × 10 ⁻⁶ K ⁻¹ , and alumina, zirconia, quartz, glass, or the like can be used as a material. Further, in [Claim 3], since each bonding surface is a metallized layer, bonding is facilitated. The reason for this is that a known sputtering method, vapor deposition method, plating method, or the like is used for forming the metallized layer in order to make it possible to join with solder. Further, in [Claim 4], since the joining surfaces are soldered via the metallized layer, the joining is facilitated.

[0005]

An embodiment will be described below with reference to the drawings. FIG.
FIG. 3 is a configuration diagram of an embodiment of the present invention, and the same parts as those in FIG. The feature of this embodiment is that a ceramic plate 5 is interposed between the rutile single crystal 1 and the metal (stainless steel) 2. A 0.5 mm thick alumina plate was used as the ceramic plate, and a 0.5 mm thick stainless steel (SUS304) plate was used as the metal. Furthermore, on both surfaces of the alumina plate and the joining surface of the stainless steel plate and the rutile single crystal, metallized layers 3,3-1, 3-2,
3-3 is provided. As a solder, a rutile single crystal 1, an alumina plate 5 and a stainless steel plate 2 were joined by using an Au-Su type solder to obtain a joined part of a rutile single crystal and a metal as shown in FIG. When a characteristic test was performed, the bonding strength was 100 kg / cm ² or less without the conventional alumina plate.
The sample of this example had a weight of 100 kg / cm ² or more, and even after 100 cycles of the temperature cycle test (−20 ° C. to 100 ° C.), no deterioration in characteristics due to heat change was observed.

[0006]

As described above, according to the present invention, when joining a rutile single crystal and a metal, a ceramic plate is interposed between the two members, and a metallized layer is formed on each joint surface to form a solder. As a result, the bonding strength between the rutile single crystal and the metal is increased, the inconvenience such as cracking of the rutile single crystal due to a temperature change is eliminated, and the reliability is improved.

[Brief description of the drawings]

FIG. 1 is a structural view of an embodiment of a bonded part of rutile single crystal and metal according to the present invention.

FIG. 2 is a diagram illustrating a conventional technique.

[Explanation of symbols]

 1 Rutile single crystal 2 Metal 3,3-1, 3-2, 3-3 Metallized layer 4,4-1 Solder 5 Ceramic plate

Continuation of front page (58) Field surveyed (Int. Cl. ⁶ , DB name) C04B 37/02

Claims (4)

(57) [Scope of request for utility model registration] 1. A rutile single crystal / metal joining part, characterized in that a ceramic plate is interposed between both joining members when joining the rutile single crystal and the metal. 2. The ceramic plate has a coefficient of thermal expansion of 5 to 9 ×.
^10-6 rutile single crystal and the metal bonding component of claim 1, wherein it is a K ^-1. 3. The joined part of a rutile single crystal and a metal according to claim 1, wherein the joint surface between the rutile single crystal and the metal or ceramic plate is formed of a metallized layer. 4. The joined part of a rutile single crystal and a metal according to claim 1, wherein the joining of the rutile single crystal and the ceramic plate and the joining of the ceramic plate and the metal are performed by soldering.