JP2590064Y2 - Circuit board for electrical equipment - Google Patents

Circuit board for electrical equipment

Info

Publication number
JP2590064Y2
JP2590064Y2 JP1993067371U JP6737193U JP2590064Y2 JP 2590064 Y2 JP2590064 Y2 JP 2590064Y2 JP 1993067371 U JP1993067371 U JP 1993067371U JP 6737193 U JP6737193 U JP 6737193U JP 2590064 Y2 JP2590064 Y2 JP 2590064Y2
Authority
JP
Japan
Prior art keywords
circuit board
connector
conductors
conductor
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1993067371U
Other languages
Japanese (ja)
Other versions
JPH0736471U (en
Inventor
恒二 蒲原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
U-SHINLTD.
Original Assignee
U-SHINLTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by U-SHINLTD. filed Critical U-SHINLTD.
Priority to JP1993067371U priority Critical patent/JP2590064Y2/en
Publication of JPH0736471U publication Critical patent/JPH0736471U/en
Application granted granted Critical
Publication of JP2590064Y2 publication Critical patent/JP2590064Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【考案の詳細な説明】[Detailed description of the invention]

【0001】[0001]

【産業上の利用分野】本考案は、電気機器の回路基板に
関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board for electric equipment.

【0002】[0002]

【従来の技術】電気機器の回路基板において、2個以上
の導電体を絶縁基板上に配列する方法として、それらの
導電体を成形金型にセットし、この成形金型に形成され
たキャビティに樹脂材料を充填することにより、導電体
を絶縁基板にインサートする方法がある。しかしなが
ら、導電体の数が増えると、導電体を一つずつ成形金型
にセットする作業が極めて煩わしくなる。
2. Description of the Related Art As a method of arranging two or more electric conductors on an insulating substrate in a circuit board of an electric device, the electric conductors are set in a molding die, and are placed in cavities formed in the molding die. There is a method of inserting a conductor into an insulating substrate by filling a resin material. However, as the number of conductors increases, the task of setting conductors one by one in a molding die becomes extremely troublesome.

【0003】このようなことから、複数の導電体をブリ
ッジにより接続した回路形成体を設け、この回路形成体
を成形金型にセットして絶縁基板を成形し、成形後の二
次加工としてブリッジを剪断して個々の導電体を分離す
る方法がある。
[0003] For this reason, a circuit forming body in which a plurality of conductors are connected by a bridge is provided, and the circuit forming body is set in a molding die to form an insulating substrate. To separate individual conductors.

【0004】以下、図6ないし図8を参照して従来例を
説明する。まず、図6に示すように、複数の導電体1,
2,3,4をブリッジ5により連続してなる回路形成体
6を設ける。導電体1は連続する導電部1aと接続部1
bとを有し、導電体2は連続する導電部2a,2a’と
接続部2bとを有し、導電体3は連続する導電部3aと
接続部3bとを有し、導電体4は連続する導電部4a,
4a’と接続部4bとを有する。
Hereinafter, a conventional example will be described with reference to FIGS. First, as shown in FIG.
A circuit forming body 6 composed of 2, 3, and 4 connected by a bridge 5 is provided. The conductor 1 includes a continuous conductive portion 1a and a connecting portion 1
b, the conductor 2 has continuous conductive portions 2a, 2a 'and a connection portion 2b, the conductor 3 has a continuous conductive portion 3a and a connection portion 3b, and the conductor 4 has a continuous Conductive portions 4a,
4a ′ and a connecting portion 4b.

【0005】そして、回路形成体6を成形金型(図示せ
ず)にセットし、その成形金型のキャビティに樹脂を充
填することにより、図7に示すように、樹脂が硬化した
絶縁基板7と、この絶縁基板7に埋設された導電体1,
2,3,4とよりなる回路基板8が成形される。この回
路基板8は、この例ではスイッチに使用されるターミナ
ルベースである。この絶縁基板7を成形する成形金型
は、前記導電部1a,2a’の間に接続される電球(図
示せず)及び前記導電部2a,4aの間に接続される電
球を保持するための電球保持部9と、前記接続部1b,
2b,3b,4bを囲繞する角筒部10と、前記ブリッ
ジ5の両面を開放する貫通孔11と、前記導電部3a,
4a’の間に位置するアーク遮断用の溝12とが形成さ
れるように構成されている。
[0005] Then, the circuit forming body 6 is set in a molding die (not shown), and the cavity of the molding die is filled with a resin. As a result, as shown in FIG. And conductors 1 embedded in the insulating substrate 7
A circuit board 8 composed of 2, 3, and 4 is formed. This circuit board 8 is a terminal base used for a switch in this example. A molding die for molding the insulating substrate 7 holds a bulb (not shown) connected between the conductive parts 1a and 2a 'and a bulb connected between the conductive parts 2a and 4a. The bulb holding section 9 and the connection section 1b,
2b, 3b, 4b, a rectangular tube part 10 surrounding the bridge 5, a through-hole 11 opening both sides of the bridge 5, and a conductive part 3a,
It is configured such that an arc blocking groove 12 located between 4a ′ is formed.

【0006】そして、絶縁基板7を成形した後に、各導
電体1,2,3,4を接続しているブリッジ5を剪断す
る。すなわち、図8に示すように、各ブリッジ5の上下
両面は貫通孔11により露出されているので、下方の貫
通孔11内でブリッジ5をダイ(図示せず)により支
え、上方の貫通孔11からパンチ(図示せず)でブリッ
ジ5を剪断する。この作業はマッチングカットと称せら
れている。
After the insulating substrate 7 is formed, the bridge 5 connecting the conductors 1, 2, 3, 4 is sheared. That is, as shown in FIG. 8, since the upper and lower surfaces of each bridge 5 are exposed by the through-hole 11, the bridge 5 is supported in the lower through-hole 11 by a die (not shown), and the upper through-hole 11 is supported. Then, the bridge 5 is sheared with a punch (not shown). This operation is called a matching cut.

【0007】このようにして製造された回路基板8(タ
ーミナルベース)は、図8に示すようにスイッチケース
13に組み込まれる。このスイッチケース13は、絶縁
基板7の表面に露出する導電部(接点)3a,4a’を
接続する可動接点(図示せず)や、この可動接点を移動
する操作部(図示せず)を有する。図8では、一つの導
電体1しか図示しないが、各導電体1,2,3,4の接
続部1b,2b,3b,4bは、コネクタ14に接続さ
れる。このコネクタ14は、接続部1b,2b,3b,
4bのそれぞれを外部回路に接続する複数の接続端子1
5と、これらの接続端子15を囲繞する絶縁性の外筐1
6とよりなり、この外筐16の外周の一部には係止突部
17aが形成され、この係止突部17aが弾性的に係止
される係止凹部17bが回路基板8の角筒部10の一部
に形成されている。
[0007] The circuit board 8 (terminal base) manufactured in this manner is incorporated in a switch case 13 as shown in FIG. The switch case 13 has a movable contact (not shown) for connecting the conductive portions (contacts) 3a and 4a 'exposed on the surface of the insulating substrate 7, and an operation unit (not shown) for moving the movable contact. . Although only one conductor 1 is shown in FIG. 8, the connection portions 1 b, 2 b, 3 b, and 4 b of the conductors 1, 2, 3, and 4 are connected to the connector 14. The connector 14 includes connection portions 1b, 2b, 3b,
4b are connected to an external circuit.
5 and an insulating outer casing 1 surrounding these connection terminals 15.
6, a locking projection 17a is formed on a part of the outer periphery of the outer casing 16, and a locking recess 17b in which the locking projection 17a is elastically locked is formed by a rectangular cylinder of the circuit board 8. It is formed in a part of the part 10.

【0008】[0008]

【考案が解決しようとする課題】従来の回路基板8は、
スイッチケース13に組み込んだ状態においても、回路
基板8の外側の貫通孔11が外部に露出するため、異物
が混入することがある。異物が導電性の場合には電気的
短絡事故が発生する危険がある。
The conventional circuit board 8 is
Even in a state in which the circuit board 8 is incorporated in the switch case 13, the through holes 11 outside the circuit board 8 are exposed to the outside. If the foreign matter is conductive, there is a danger that an electrical short circuit may occur.

【0009】[0009]

【課題を解決するための手段】本考案は、電気回路に接
続される導電部とコネクタに接続される接続部とを有し
分離部により互いに分断された複数の導電体と、前記導
電部と前記接続部とが露出されるように前記複数の導電
体を覆う絶縁基板とを備えた電気機器の回路基板におい
て、前記接続部を前記コネクタに接続したときに、前記
分離部をコネクタにより覆われるようにした。
According to the present invention, a plurality of conductors having a conductive portion connected to an electric circuit and a connecting portion connected to a connector and separated from each other by a separating portion are provided. A circuit board of an electric device including: an insulating substrate that covers the plurality of conductors such that the connection portion is exposed; and when the connection portion is connected to the connector, the separation portion is covered by the connector. I did it.

【0010】[0010]

【作用】この考案によれば、絶縁基板を成形した後に各
導電体を分離部により分断するが、各導電体の接続部を
コネクタに接続したときにそのコネクタにより分離部を
閉塞することが可能となる。
According to this invention, after the insulating substrate is formed, each conductor is divided by the separating portion, but when the connecting portion of each conductor is connected to the connector, the separating portion can be closed by the connector. Becomes

【0011】[0011]

【実施例】本考案の一実施例を図1ないし図5に製造工
程順に説明する。図6ないし図8において説明した部分
と同一構造の部分については同一符号を用いて説明す
る。まず、図2に示すように、複数の導電体1,2,
3,4をブリッジ19により連続してなる回路形成体1
8を設ける。導電体1は連続する導電部1aと接続部1
bとを有し、導電体2は連続する導電部2a,2a’と
接続部2bとを有し、導電体3は連続する導電部3aと
接続部3bとを有し、導電体4は連続する導電部4a,
4a’と接続部4bとを有する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIGS. 6 to 8 will be described using the same reference numerals. First, as shown in FIG.
Circuit forming body 1 consisting of 3, 4 connected by bridge 19
8 is provided. The conductor 1 includes a continuous conductive portion 1a and a connecting portion 1
b, the conductor 2 has continuous conductive portions 2a and 2a 'and a connection portion 2b, the conductor 3 has a continuous conductive portion 3a and a connection portion 3b, and the conductor 4 has a continuous Conductive portions 4a,
4a ′ and a connecting portion 4b.

【0012】そして、回路形成体18を成形金型(図示
せず)にセットし、その成形金型のキャビティに樹脂を
充填することにより、図3に示すように、樹脂が硬化し
た絶縁基板20と、この絶縁基板20にインサートされ
た導電体1,2,3,4とよりなる回路基板21を成形
する。この回路基板21は、この例ではスイッチに使用
されるターミナルベースである。この絶縁基板20を成
形する成形金型は、前記導電部1a,2a’の間に接続
される電球23(図5参照)及び前記導電部2a,4a
の間に接続される電球24(図5参照)を保持するため
の電球保持部9と、前記接続部1b,2b,3b,4b
を囲繞する角筒部10と、前記ブリッジ19の周囲を開
放する貫通孔22と、前記導電部3a,4a’の間に位
置するアーク遮断用の溝12とが形成されるように構成
されている。
Then, the circuit forming body 18 is set in a molding die (not shown), and the cavity of the molding die is filled with a resin, as shown in FIG. Then, a circuit board 21 including the conductors 1, 2, 3, and 4 inserted into the insulating board 20 is formed. The circuit board 21 is a terminal base used for a switch in this example. A molding die for molding the insulating substrate 20 includes a bulb 23 (see FIG. 5) connected between the conductive portions 1a and 2a 'and the conductive portions 2a and 4a.
A light bulb holding portion 9 for holding a light bulb 24 (see FIG. 5) connected therebetween, and the connection portions 1b, 2b, 3b, 4b
, A through-hole 22 opening around the bridge 19, and an arc-blocking groove 12 located between the conductive portions 3 a and 4 a ′. I have.

【0013】ここで、図1に示すように、前記ブリッジ
19は、絶縁基板20の角筒部10の底部20aにおい
てコネクタ14の外筐16の先端で覆われる位置に配列
されている。そして、絶縁基板20を成形した後に、各
導電体1,2,3,4を接続しているブリッジ19を剪
断する。すなわち、図1に示すように、各ブリッジ19
の周囲は貫通孔22により露出されているので、ブリッ
ジ19の一面をダイ(図示せず)により受け、反対側か
らパンチ(図示せず)を貫通孔22に通すことにより、
ブリッジ19を剪断する。この切断により、図4に示す
ように、各導電体1,2,3,4の間に分離部19aが
形成される。
Here, as shown in FIG. 1, the bridges 19 are arranged at positions at the bottom 20a of the rectangular tube portion 10 of the insulating substrate 20 so as to be covered by the tip of the outer casing 16 of the connector 14. Then, after forming the insulating substrate 20, the bridge 19 connecting the conductors 1, 2, 3, and 4 is sheared. That is, as shown in FIG.
Of the bridge 19 is received by a die (not shown), and a punch (not shown) is passed through the through hole 22 from the opposite side.
The bridge 19 is sheared. By this cutting, as shown in FIG. 4, a separation portion 19a is formed between the conductors 1, 2, 3, and 4.

【0014】このような構成において、回路基板21
(ターミナルベース)は、図1に示すようにスイッチケ
ース13に組み込まれる。そして、角筒部10にコネク
タ14の外筐16を嵌合することにより、接続部1b,
2b,3b,4bのそれぞれが図5に示す外部回路Cに
接続される。すなわち、接続部3bはIG(イグニショ
ン)スイッチ25を介して電源26に接続され、接続部
1bはILL(イルミネーション)端子27に接続さ
れ、接続部4aは負荷28に接続される。
In such a configuration, the circuit board 21
(Terminal base) is incorporated in the switch case 13 as shown in FIG. Then, by fitting the outer casing 16 of the connector 14 to the rectangular tube part 10, the connection part 1b,
Each of 2b, 3b, and 4b is connected to external circuit C shown in FIG. That is, the connection 3b is connected to a power supply 26 via an IG (ignition) switch 25, the connection 1b is connected to an ILL (illumination) terminal 27, and the connection 4a is connected to a load 28.

【0015】このように、接続部1b,2b,3b,4
bを外部回路Cに接続した状態では、導電体1〜4を分
離する分離部19a及び分離部19aを形成するための
貫通孔22がコネクタ14の外筐16の先端に覆われる
ため、分離部19aを含む貫通孔22からの異物の侵入
を防止することができる。
As described above, the connection portions 1b, 2b, 3b, 4
In a state in which the connector b is connected to the external circuit C, the separation portion 19a for separating the conductors 1 to 4 and the through hole 22 for forming the separation portion 19a are covered by the tip of the outer casing 16 of the connector 14, so that the separation portion Foreign matter can be prevented from entering through the through hole 22 including the hole 19a.

【0016】なお、接続部1b〜4bを囲繞する角筒部
10は不可欠のものではなく、分離部19a及びこの分
離部19aを形成する貫通孔22がコネクタ14により
覆われれば足りる。
The rectangular tube portion 10 surrounding the connecting portions 1b to 4b is not indispensable, and it is sufficient that the separating portion 19a and the through hole 22 forming the separating portion 19a be covered by the connector 14.

【0017】[0017]

【考案の効果】本考案は、電気回路に接続される導電部
とコネクタに接続される接続部とを有し分離部により互
いに分断された複数の導電体と、前記導電部と前記接続
部とが露出されるように前記複数の導電体を覆う絶縁基
板とを備えた電気機器の回路基板において、前記接続部
を前記コネクタに接続したときに、前記分離部をコネク
タにより覆われるようにしたので、絶縁基板を成形した
後に各導電体を分離部により分断するが、各導電体の接
続部をコネクタに接続したときにそのコネクタにより分
離部を閉塞することができ、これにより、分離部からの
異物の侵入を防止することができる。
According to the present invention, there are provided a plurality of conductors having a conductive portion connected to an electric circuit and a connecting portion connected to a connector, separated from each other by a separating portion, and the conductive portion and the connecting portion. In the circuit board of an electric device including an insulating substrate that covers the plurality of conductors so that the connector is exposed, when the connecting portion is connected to the connector, the separating portion is covered by the connector. After the insulating substrate is formed, each conductor is separated by the separating portion. However, when the connecting portion of each conductor is connected to the connector, the separating portion can be closed by the connector. Foreign matter can be prevented from entering.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本考案の一実施例に係る回路基板とコネクタと
の接続関係を示す一部の縦断側面図である。
FIG. 1 is a partial longitudinal sectional view showing a connection relationship between a circuit board and a connector according to an embodiment of the present invention.

【図2】回路形成体の斜視図である。FIG. 2 is a perspective view of a circuit forming body.

【図3】ブリッジを切断する前の回路基板の斜視図であ
る。
FIG. 3 is a perspective view of a circuit board before cutting a bridge.

【図4】分離部を形成した後の回路基板の斜視図であ
る。
FIG. 4 is a perspective view of a circuit board after forming a separation portion.

【図5】回路基板が接続される外部回路図である。FIG. 5 is an external circuit diagram to which a circuit board is connected.

【図6】従来の回路形成体を示す斜視図である。FIG. 6 is a perspective view showing a conventional circuit forming body.

【図7】回路基板の斜視図である。FIG. 7 is a perspective view of a circuit board.

【図8】回路基板とコネクタとの接続関係を示す一部の
縦断側面図である。
FIG. 8 is a partial vertical side view showing a connection relationship between a circuit board and a connector.

【符号の説明】[Explanation of symbols]

1〜4 導電体 1a〜4a 導電部 1b〜4b 接続部 2a’,4a’ 導電部 14 コネクタ 19a 分離部 20 絶縁基板 1-4 Conductor 1a-4a Conductor 1b-4b Connection 2a ', 4a' Conductor 14 Connector 19a Separator 20 Insulating substrate

Claims (1)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項1】 電気回路に接続される導電部とコネクタ
に接続される接続部とを有し分離部により互いに分断さ
れた複数の導電体と、前記導電部と前記接続部とが露出
されるように前記複数の導電体を覆う絶縁基板とを備え
た電気機器の回路基板において、前記分離部は、前記接
続部を前記コネクタに接続したときにこのコネクタによ
り覆われる位置に形成されていることを特徴とする電気
機器の回路基板。
1. A plurality of conductors having a conductive part connected to an electric circuit and a connecting part connected to a connector, and separated from each other by a separating part, and the conductive part and the connecting part are exposed. As described above, in the circuit board of the electric device including the insulating substrate that covers the plurality of conductors, the separating portion is formed at a position covered by the connector when the connecting portion is connected to the connector. A circuit board for an electric device, characterized by:
JP1993067371U 1993-12-17 1993-12-17 Circuit board for electrical equipment Expired - Lifetime JP2590064Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1993067371U JP2590064Y2 (en) 1993-12-17 1993-12-17 Circuit board for electrical equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1993067371U JP2590064Y2 (en) 1993-12-17 1993-12-17 Circuit board for electrical equipment

Publications (2)

Publication Number Publication Date
JPH0736471U JPH0736471U (en) 1995-07-04
JP2590064Y2 true JP2590064Y2 (en) 1999-02-10

Family

ID=13343096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1993067371U Expired - Lifetime JP2590064Y2 (en) 1993-12-17 1993-12-17 Circuit board for electrical equipment

Country Status (1)

Country Link
JP (1) JP2590064Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1154889A (en) * 1997-08-07 1999-02-26 Matsushita Electric Ind Co Ltd Manufacture of component mounting board and board manufactured by the method

Also Published As

Publication number Publication date
JPH0736471U (en) 1995-07-04

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