JP2588549B2 - Semiconductor device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a technology that is effective when applied to a technology for mounting input / output pins in a semiconductor device having many input / output pins.

[Conventional technology]

In order to cope with the increase in the number of input / output pins accompanying the high integration of semiconductor integrated circuit devices at a low price, for example, Nikkei McGraw-Hill, published on June 11, 1984, `` Micro Devices, Nikkei Electronics Separate Volume, no. 2 ", P160-P168
Are known.

The outline is that a plurality of through holes are formed in a printed circuit board made of glass fiber reinforced resin, etc., which can realize a highly accurate wiring structure by photolithography relatively easily and at low cost, and for each of these through holes The one end of the input / output pin is press-fitted and fixed to form a so-called pin grid array type sealing form.

[Problems to be Solved by the Invention] However, in the method of forming a through hole in a printed circuit board and fixing a large number of input / output pins as in the above-described conventional technique, the semiconductor integrated circuit element is fixed on the printed circuit board. At the same time, a through hole for fixing the input / output pin is opened on the surface on which the wiring structure for connecting the semiconductor integrated circuit element and the input / output pin is formed. It is said that the routing of the wiring structure is greatly restricted due to such obstacles, and the advantage of the printed circuit board that a high-precision wiring structure can be realized relatively easily and at a low price by photolithography as described above cannot be effectively utilized. The inventor has found a problem.

An object of the present invention is to provide a semiconductor device that can easily cope with an increase in input / output pins.

The above and other objects and novel features of the present invention are as follows.
It will be apparent from the description of this specification and the accompanying drawings.

[Means for solving the problem]

The outline of a representative invention among the inventions disclosed in the present application will be briefly described as follows.

That is, the first plate body having a wiring layer conductive to the through wiring formed in the small-diameter through-hole and the second plate body having the large-diameter through-hole are bonded to each other, and the glass fiber reinforced structure is provided. A wiring board made of a resin printed circuit board, a semiconductor integrated circuit element mounted on the first plate body side and electrically connected to the wiring layer, and a second board body side of the wiring board housed in the through hole. A semiconductor device is formed by a plurality of input / output pins which are formed in an array and are electrically connected to electrodes of a semiconductor integrated circuit element through through wirings and wiring layers.

[Action]

According to the above-described means, since the through holes for pin fixing are not formed in the first plate on which the wiring layer is formed, the wiring layer can be laid out freely. Thus, the wiring layer is free of obstacles in the wiring, so that the density of the wiring layer can be increased, and it is possible to easily cope with an increase in the number of input / output pins.

〔Example〕

FIG. 1 is a sectional view showing a main part of a semiconductor device according to one embodiment of the present invention.

The printed circuit board 1 of the semiconductor device according to the present embodiment has a laminated structure in which a first plate 1a and a second plate 1b made of, for example, glass epoxy resin, which is a kind of glass fiber reinforced resin, are bonded. ing.

A plurality of wiring structures (wiring layers) 2 are formed on the upper surface of the first plate body 1a, for example, by performing photolithography on a metal foil or the like attached on the entire surface. A semiconductor integrated circuit element 3 is mounted, and a plurality of input / output electrodes (not shown) formed on the semiconductor integrated circuit element 3 are electrically connected to the respective wiring structures 2 via bonding wires 4. Have been.

In this case, a plurality of large-diameter through holes 5 are formed in the second plate 1b.
Is formed, and the inner end side of the through-hole 5 is a second plate body.
It is closed by a first plate 1a attached to 1b.

Further, in each of the plurality of through holes 5 of the second plate 1b whose inner end side is closed by the first plate 1a, a plurality of input / output pins 6 are provided with an enlarged diameter portion formed at one end thereof. By press-fitting 6a, it is locked without being exposed on the upper surface side of the first plate 1a on which the semiconductor integrated circuit element 3 is mounted.

A first plate 1a and a second plate constituting the printed circuit board 1
A plurality of wiring structures 2a are formed at the joint interface with the wiring structure 1b, and one end of the wiring structure 2a is exposed to the inner end side of the through hole 5 formed in the second plate 1b so that the input / output is formed. The other end is connected to the pin 6 and the other end is connected to the inner periphery of a plurality of small-diameter through holes 7 formed in the inside and the side of the first plate body 1a (the wiring connection structure ( 1st via through wiring) 2b
Are electrically connected to a plurality of wiring structures 2 formed on the upper surface of the plate body 1a.

That is, input / output electrodes (not shown) provided on the semiconductor integrated circuit element 3 mounted on the first plate 1a of the printed board 1 are formed on the bonding wires 4 and the first plate 1a. I / O pins 6 through the wiring structure 2, the wiring connection structure 2 b formed on the inner periphery of the conduction hole 7, and the wiring structure 2 a formed on the joint surface of the second plate 1 b of the first plate 1 a. The input and output are electrically connected, and input / output signals and operating power are exchanged between the outside and the semiconductor integrated circuit device 3.

Further, as shown in FIG. 1, the semiconductor integrated circuit element 3 mounted on the printed board 1 is mounted on a cap (not shown) mounted on the printed board 1 or a resin (not shown) applied by potting or the like. By being enclosed, a final sealed form is obtained.

Here, in the present embodiment, as described above, the large-diameter through-hole 5 formed in the second plate 1b and locked at one end of the input / output pin 6 is formed in the first plate in which the wiring structure 2 is formed. The opening of the input / output pin 6 is not formed on the upper surface of the plate 1a.
It is not exposed on the upper surface of 1a.

For this reason, for example, the number of input / output electrodes (not shown) increases due to the high integration of the semiconductor integrated circuit element 3, and thus a plurality of wiring structures 2 formed on the upper surface of the first plate 1 a
Even if the density of the first plate increases, the first plate
Restriction of the routing of the plurality of wiring structures 2 on the upper surface of the first plate body 1a due to the heads of the input / output pins 6 exposed on the upper surface of 1a is reliably avoided.

As a result, the advantage of the printed circuit board 1 that the high-precision wiring structure 2 can be realized relatively easily and at a low price can be effectively utilized, and the number of input / output electrodes (not shown) in the semiconductor integrated circuit element 3 is increased. An increase in the number of pins 6 can be easily handled.

As described above, in the present embodiment, the following effects can be obtained.

(1). A printed circuit board 1 has a first plate 1a on which a semiconductor integrated circuit element 3 is mounted and a wiring structure 2 is formed.
And the second plate 1b are attached to each other, and the input / output pins 6 are formed in the large-diameter through-hole 5 formed in the second plate 1b and having the inner end side closed by the first plate 1a. Since one end is press-fitted, the ends of the large-diameter through hole 5 and the input / output pin 6 are not exposed on the upper surface side of the first plate 1a. The wiring and the like of the wiring structure 2 formed at the same time are not restricted by the exposed head of the input / output pin 6 or the like.

Thus, it is possible to easily cope with an increase in the number of input / output electrodes (not shown), that is, an increase in the number of input / output pins 6 accompanying the high integration of the semiconductor integrated circuit element 3.

(2). As a result of the above (1), the advantage of the printed circuit board 1 that the high-precision wiring structure 2 can be realized relatively easily and at low cost can be effectively utilized, and therefore, the manufacturing cost due to the increase of the input / output pins 6 in the semiconductor device can be achieved. Increase can be suppressed.

(3). As a result of the above (1) and (2), productivity in manufacturing a semiconductor device is improved.

Although the invention made by the inventor has been specifically described based on the embodiment, the present invention is not limited to the embodiment, and it is needless to say that various modifications can be made without departing from the gist of the invention. Nor.

For example, the material forming the printed circuit board is not limited to glass epoxy resin, but may be any other material.

The means for connecting the input / output electrodes of the semiconductor integrated circuit element and the wiring structure is not limited to wire bonding, but may be any means such as flip chip bonding.

In the above description, the case where the invention made by the inventor is mainly applied to the mounting technology of the input / output pin in the semiconductor device, which is the application field as the background, has been described. However, the present invention is not limited to this. Widely applicable to electronic component assembly techniques.

〔The invention's effect〕

The effect obtained by the representative one of the inventions disclosed in the present application will be briefly described as follows.

That is, the semiconductor device of the present invention comprises the first plate and the second plate.
A wiring board, a semiconductor integrated circuit element mounted on the first plate body side of the wiring board;
And a plurality of input / output pins which are formed in an array from the through holes of the plate and electrically connected to the electrodes of the semiconductor integrated circuit element. Therefore, it is not necessary to open a large-diameter through hole for fixing the input / output pin on the surface on which the wiring layer is formed.

This eliminates the problem of the wiring layer, which is a through hole, and greatly improves the degree of freedom in wiring design. Therefore, a high-precision wiring layer can be realized relatively easily and at low cost, and it is possible to easily cope with an increase in the number of input / output pins.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a main part of a semiconductor device according to one embodiment of the present invention. 1 ... printed circuit board, 1a ... first plate, 1b ... second plate, 2, 2a ... wiring structure, 2b ... wiring connection structure, 3 ...
Semiconductor integrated circuit device, 4, bonding wire, 5
... through-hole, 6 ... input / output pin, 6a ... large diameter part, 7 ...
Conduction hole.

Continued on the front page (72) Inventor Hiroharu Otsuka 2326 Imai, Ome-shi, Tokyo Inside the Device Development Center, Hitachi, Ltd. (72) Takayuki Okinaga 1448, Josuihoncho, Kodaira-shi, Tokyo Hitachi, Ltd. In-house Engineering Co., Ltd. (72) Inventor Shoji Matsugami 1448, Kamizu Honcho, Kodaira-shi, Tokyo In-house Hitachi Cho LSE Engineering Co., Ltd. (56) References JP-A-62-242350 (JP, A) JP-A-62-194655 (JP, A) JP-A-58-73193 (JP, A)

Claims (1)

(57) [Claims] A first plate having a wiring layer conductive to a through wire formed in a small-diameter conductive hole and a second plate having a large-diameter through-hole formed therein; A wiring board made of a glass fiber reinforced resin printed board; a semiconductor integrated circuit element mounted on the first plate body side and electrically connected to a wiring layer; A semiconductor that is formed to project from the second plate body side in an array, and includes a plurality of input / output pins that are electrically connected to the electrodes of the semiconductor integrated circuit element through the through wiring and the wiring layer. apparatus.