JP2588412Y2 - Substrate fixing device - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate fixing device for fixing a substrate to a substrate mounting dome used in a vacuum evaporation apparatus or the like.

[0002]

2. Description of the Related Art Conventionally, an elastic body such as a coil spring or a leaf spring has been used as a substrate fixing device for fixing a substrate such as a glass substrate of a reflecting mirror for a halogen lamp to a substrate mounting dome in a vacuum evaporation apparatus. The substrate is pressed and fixed to the substrate mounting dome using the elastic force of these elastic bodies. After fixing the substrate, the substrate mounting dome was housed in a vacuum evaporation apparatus and the vacuum evaporation apparatus was operated to form a thin film on the surface of the substrate fixed to the substrate mounting dome.

[0003]

However, the conventional substrate fixing device utilizing the elastic force of the elastic body has the following disadvantages.

[0004] In a substrate fixing apparatus using a coil spring, 1) a work of manually applying a spring to the substrate is indispensable, and the work is complicated against the elastic force of the coil spring. There are many substrates to be fixed, and the working time is long. Human mistakes that cause the plastic deformation of the spring occur frequently. 2) It is difficult to automate the fixing of the substrate to the dome for mounting the substrate, and even if it is realized, the device becomes complicated and expensive. There are drawbacks such as.

[0005] Further, in a substrate fixing device using a leaf spring, 1) as in the case of the coil spring, there are many human mistakes that cause plastic deformation of the spring. 2) There is no flexibility in changing the shape of the board to be mounted, and when the shape of the board changes, it is necessary to change or adjust the spring shape and the mounting position each time. There are drawbacks such as.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide a substrate fixing device which can fix substrates collectively after placing the substrates on a substrate mounting dome. And

[0007]

A solution for the present invention, in order to achieve the object, the substrate fixing device for fixing the substrate formed in a curved shape in the substrate mounting dome to be used in vacuum deposition apparatus, the substrate Mounting dome mounting holes
Are arranged in at least three equidistant positions in an elongated shape.
Equipped with a shape memory alloy that deforms into a bent shape due to heat.
The substrate is pressed and fixed to the substrate mounting dome only by the recovery force of the shape memory alloy .

[0008]

Since the present invention is constructed as described above, the operator simply mounts the substrate on the substrate mounting dome by pressing and fixing the substrate on the substrate mounting dome by the shape recovery force of the shape memory alloy. Simple work is required, and work efficiency can be improved.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is an external view showing a state in which a substrate is mounted on a dome, FIG. 2 is a diagram showing a state in which a substrate is fixed by a substrate fixing device according to an embodiment of the present invention, and FIG. It is.

In the above figure, reference numeral 1 denotes a dome for mounting a substrate in the form of a broken sphere (hereinafter simply referred to as a dome) used in, for example, a vacuum evaporation apparatus. A plurality of substrate mounting holes 3 are formed corresponding to positions where a substrate 2 formed into a curved shape such as a glass substrate of a reflecting mirror is mounted, and the plurality of substrate mounting holes 3 are formed.
The board 2 is mounted at the position 3. Thus multiple substrates
Attach one to several domes 1 with 2 attached to the rotating jig in the vacuum evaporation apparatus, and rotate the dome 1 to
A thin film is uniformly formed on the curved surface inside the substrate 2.

Reference numeral 4 denotes a substrate mounting ring (hereinafter, simply referred to as a ring) disposed for each substrate mounting hole 3 of the dome 1. The ring 4 has a nut at one end thereof.
5 is fixed to the dome 1 by being fixed to the dome 1.When the ring 4 is fixed, one end of the shape memory alloy 6 for fixing the substrate 2 to the dome 1 is connected to the dome 1 by a ring.
4 and the other end thereof, the shape memory alloy 6 is also fixed to the dome 1 at the same time. On the other hand, the other end of the shape memory alloy 6 is a free end. A mounting portion 4a on which the substrate 2 is mounted is formed in the middle of the ring 4. In addition,
Although the shape memory alloys 6 are arranged at three equally spaced positions on the ring 4 (see FIG. 3), it goes without saying that the number of shape memory alloys 6 can be appropriately increased or decreased according to the size of the substrate 2 to be mounted. .

In this embodiment, the shape memory alloy 6 has a martensite reverse transformation end temperature (Af point) of 50 ° C. or more.
A material having a characteristic of 100 ° C. is used, and the shape memory alloy 6 having this characteristic is used at 400 ° C. to 500 ° C. for 10 to 30 minutes.
It is subjected to partial heat treatment and is memorized in the shape shown in the bent A. When mounting the substrate 2 at room temperature, the shape memory alloy 6
Is deformed into the shape shown in B which is elongated so that the substrate 2 can be mounted artificially or mechanically.

Next, the fixing of the substrate 2 to the dome 1 by the shape memory alloy 6 as a substrate fixing device of one embodiment of the present invention will be described.

First, the shape memory alloy 6 is artificially or mechanically deformed into the shape B so that the substrate 2 can be mounted. After the deformation, the substrate 2 is manually or in a state shown in FIG. Is mounted and mounted on the mounting portion 4a of the ring 4. Substrate 2 is all rings 4 or a certain number of rings 4
After being placed and mounted on the mounting portion 4a, the dome 1 on which the substrate 2 is mounted is inserted into a dedicated furnace maintained at an Af point of + 60 ° C. or lower in order to recover the shape memory of the shape memory alloy 6. .

The shape memory alloy 6 inserted into the dedicated furnace instantly tries to transform from the shape of B to the shape of A which has been memorized, and the recovery force of the shape memory alloy 6 at this time causes the substrate 2 to be deformed.
Is held by the shape memory alloy 6 while being pressed against the mounting portion 4a of the ring 4, and is firmly fixed to the dome 1.

After the substrate 2 is fixed by the shape memory alloy 6, the dome 1 is taken out of the dedicated furnace and placed in a vacuum deposition apparatus. The shape memory alloy 6 taken out of the dedicated furnace at room temperature is stored and processed. The shape of A is maintained, and a film is formed on the curved surface inside the substrate 2 while maintaining the shape of A.

As described above, according to this embodiment, the substrate
2 can be mounted on the dome 1 simply by placing the 2 on the mounting portion 4a of the ring 4, eliminating the need for manual spring work, thus simplifying the work of mounting the substrate 2 on the dome 1. And automation becomes possible. The work time required for mounting the substrate 2 can be reduced. Even if the worker deforms the shape memory alloy 6, the ability to fix the substrate 2 by the shape recovery processing of the shape memory alloy 6 is not affected at all. And so on.

In the above embodiment, the mounting portion 4a for mounting the substrate 2 on the ring 4 arranged for each substrate mounting hole 3
And the shape memory alloy 6 is fixed to the dome 1 by the ring 4.However, the present invention is not limited to this, and the mounting portion for mounting the substrate 2 by processing the periphery of the substrate mounting hole 3 is provided. It may be formed and the shape memory alloy 6 may be fixed to the dome 1 by appropriate means such as a nut,
It is not necessary to arrange the ring 4 for each substrate mounting hole 3, and the configuration can be simplified.

In the above embodiment, the shape recovery processing of the shape memory alloy 6 is performed in a dedicated furnace. However, the present invention is not limited to this, and the mounting of the dome 1 to the vacuum deposition apparatus does not cause the substrate 2 to drop. If the substrate heating temperature of the vacuum vapor deposition device is about the Af point + 60 ° C. or less, the dome 1 is mounted on the vacuum vapor deposition device without performing a shape recovery process in a dedicated furnace, and the substrate 2 is heated and the shape is memorized. The shape recovery treatment of the alloy 6 may be performed in the vacuum evaporation apparatus,
By doing so, it is possible to omit the step of the shape recovery processing using a dedicated furnace, and the lead time is further reduced.

Further, the present invention is not limited to the above-described embodiment, but can be variously modified without departing from the gist of the present invention.

[0022]

As described in detail above, according to the substrate fixing device of the present invention, the operator mounts the substrate by pressing and fixing the substrate to the substrate mounting dome by the shape recovery force of the shape memory alloy. A simple operation of simply mounting the substrate on the dome is sufficient, the substrate can be automatically mounted on the substrate mounting dome, and the operation efficiency can be improved by shortening the operation time.

Further, even if the shape memory alloy is deformed, there is an effect that the ability to fix the substrate by the shape recovery processing of the shape memory alloy is not affected at all.

[Brief description of the drawings]

FIG. 1 is an external view showing a state where a substrate is mounted on a substrate mounting dome.

FIG. 2 is a diagram illustrating a state of fixing a substrate by the substrate fixing device according to the embodiment of the present invention;

FIG. 3 is a plan view when the substrate is fixed.

[Explanation of symbols]

 1 ... Dome for mounting on board 2 ... Board 6 ... Shape memory alloy

Continuation of the front page (56) References JP-A 2-110667 (JP, U) JP-A 2-142464 (JP, U) JP-A 4-108855 (JP, U) JP-A 4-48262 (JP , U) Jikken 46-35246 (JP, Y1) (58) Fields investigated (Int. Cl. ⁶ , DB name) C23C 14/50 H01L 21/203 H01L 21/68

Claims (1)

(57) [Scope of request for utility model registration] 1. A substrate fixing device for fixing a substrate formed in a curved shape to a substrate mounting dome used in a vacuum evaporation apparatus or the like, wherein the substrate mounting dome has a substrate mounting hole.
Are arranged in at least three equidistant positions in an elongated shape.
Equipped with a shape memory alloy that deforms into a bent shape due to heat.
And fixing the substrate to the substrate mounting dome only by the recovery force of the shape memory alloy .