JP2506112B2 - Wafer support device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Outline] The present invention is a device for supporting a wafer, and by supporting the wafer on a coating layer formed of vinyl resin, the occurrence of scratches and dirt on the wafer surface is significantly reduced. It is something that is done.

[Industrial applications]

The present invention relates to a wafer supporting device, and more particularly to a supporting device for supporting a wafer for numbering and the like.

At the first stage where no pattern is formed on the wafer, a number is assigned to the wafer surface (front surface or back surface) for the purpose of allowing the operator to confirm the wafer type in each subsequent manufacturing process. Numbering can be done.

Even when such wafer numbering and other patterns are formed on the wafer, it is necessary to support and fix the wafer by the wafer supporting device in order to perform a predetermined process on the wafer. Therefore, it is necessary for the wafer supporting device to reliably support the wafer without damaging it.

[Conventional technology]

FIG. 2 (final diagram) is a block diagram of an example of a conventional wafer supporting apparatus. In the figure, 4 is a base on which a wafer 5 is placed.

When performing the above-mentioned wafer numbering on the wafer 5 supported on the base 4, a method is used in which the upper surface of the wafer 5 is the back surface on which no pattern is formed, and the back surface is numbered with a diamond pen. Alternatively, there is a method of entering a number while melting the surface layer portion of the front surface or the back surface of the wafer 5 with a laser beam.

[Problems to be solved by the invention]

However, at the time of the above-mentioned wafer numbering, the surface layer portion of the wafer 5 is chopped or melted, and at that time, fragments of extremely small size are scattered, and these fragments wrap around the contact surface between the base 4 and the wafer 5. It will stick.

Therefore, in the conventional wafer supporting apparatus, there is a problem that the contact surface of the wafer 5 with the base 4 is scratched or adhered as dust due to the debris adhered around.

The present invention was created in view of the above points, and it is an object of the present invention to provide a novel wafer supporting apparatus that solves the above problems.

[Means for solving problems]

The wafer supporting apparatus of the present invention is configured to support the wafer on the upper surface of the vinyl resin coating layer formed on the base.

[Action]

Since the vinyl resin is flexible and has a property of absorbing small pieces, the minute pieces scattered during the wafer numbering are almost absorbed by the vinyl resin. Therefore, the above-mentioned debris can be hardly generated on the contact surface between the wafer and the coating layer of vinyl resin.

The vinyl resin also has a property of adsorbing dust and dirt on the wafer surface.

〔Example〕

1 (A) and 1 (B) show a perspective view and a front view, respectively, of an embodiment of the device of the present invention. In the figure, 1 is a cylindrical base made of fluororesin or metal, 2 is a vinyl acetate resin coating layer as an example of vinyl resin formed on the base 1, and 3 is a silicon wafer. is there.

The coating layer 2 is formed by applying a vinyl acetate solution on the base 1 and then drying (100 ° C. to 150 ° C. baking). It should be noted that the baking makes the coating layer 2 firmer, but it does not matter if the baking is not performed. The wafer 3 is placed on the upper surface of the coating layer 2.

When the wafer 3 supported by the wafer supporting apparatus of the present embodiment is subjected to wafer numbering by the above-mentioned diamond pen or laser, fine debris scattered due to the property of vinyl acetate resin is coated layer 2
Since most of them are absorbed, the scratches on the contact surface of the wafer 3 with the coating layer 2 due to the above-mentioned fragments hardly occur. According to the results of a trial experiment conducted by the present inventor, the occurrence of scratches on the wafer 3 was reduced to about 1/10 to 1/20 as compared with the conventional case.

Further, since the coating layer 2 made of vinyl acetate resin has a dust adsorbing action, it is possible to prevent the adhesion of fine fine particles and dust. Furthermore, since the coating layer 2 can be easily peeled off and can be easily re-formed, it can be easily changed to a new coating layer if necessary.

The wafer supporting device according to the present invention can be widely applied not only as a wafer supporting device for wafer numbering but also as a device for supporting a wafer when processing the wafer surface. Further, it goes without saying that the shape of the base 1 is not limited to that of the embodiment.

〔The invention's effect〕

As described above, according to the present invention, since it is possible to almost absorb fine debris and dust generated at the time of wafer numbering between the wafer and the coating layer, the generation of scratches and dust on the wafer surface due to the fine debris can be prevented. It is possible to significantly reduce it compared to the conventional method, which can improve the yield, and also clean the dirt on the contact surface of the wafer with the coating layer, and easily change to a new coating layer when necessary. Therefore, it is possible to always obtain a coating layer having a desired adsorption property for dust and the like.

[Brief description of drawings]

 FIG. 1 is a block diagram of an embodiment of the device of the present invention, and FIG. 2 is a block diagram of an example of a conventional device. In the figure, 1 is a base, 2 is a coating layer, and 3 is a wafer.

Claims (1)

(57) [Claims] 1. A wafer supporting apparatus comprising a base (1) and a vinyl resin coating layer (2) formed on the base (1) and supporting the wafer (3) on the upper surface of the coating layer (2).