JP2585752Y2 - IC contact mechanism to measurement board - Google Patents

Description

[Detailed description of the invention]

[0001]

The present invention relates to a mechanism for contacting an IC lead to a measuring substrate in which the lead pressing surface and the pattern surface are parallel to each other when an IC lead is pressed on the pattern of the measuring substrate with a lead pressing surface of a pusher to make contact therewith. Is about.

[0002]

2. Description of the Related Art Next, an IC for a measurement substrate according to the prior art is described.
The structure of the contact mechanism will be described with reference to FIG. In FIG. 3, reference numeral 1 denotes a suction block, 1A denotes a suction pad, 2 denotes an IC, 3 denotes a measurement substrate, 4 denotes a pusher, and 5 denotes a lead holding block.
In FIG. 3, the suction pad 1A is attached to the tip of the suction block 1, and the lead holding block 5 is attached to the pusher 4. The suction pad 1A attaches and detaches the IC 2, and the suction block 1 moves up and down in the through holes of the pusher 4 and the lead holding block 5. The measurement substrate 3 has a pattern surface 3A that is in contact with the leads 2A of the IC 2.

Next, a state where the IC 2 is brought into contact with the measurement substrate 3 by a conventional contact mechanism will be described with reference to FIG. FIG. 4A shows a state in which the suction block 1 sucks the IC 2 and waits on the measurement substrate 3. From the state of FIG.
The pusher 4 and the pusher 4 descend together, and the state shown in FIG. FIG. 4A shows a state in which the leads 2A of the IC 2 are in contact with the pattern surface 3A of the measurement substrate 3. FIG. 4C shows a state in which the pusher 4 is lowered from the state shown in FIG. 4A, and the lead 2A is pressed against the pattern surface 3A by the lead holding surface 5A of the lead holding block 5.

[0004]

FIG. 5 shows a state in which the IC 2 is pressed against the measurement substrate 3 when the pusher 4 in FIG. In the state shown in FIG. 5, since the pattern surface 3A of the measurement substrate 3 and the lead pressing surface 5A of the lead holding block 5 are not parallel, the leads 2A of the IC 2 cannot be pressed evenly, resulting in poor contact. When the size of the IC 2 is reduced, it is necessary to provide a highly accurate guide mechanism so that the pusher 4 does not tilt. However, there is a problem that the device is expensive and complicated. An object of the present invention is to provide an IC contact mechanism for a measurement substrate that absorbs a tilt of a pusher by attaching rubber between a pusher and a lead holding block.

[0005]

In order to solve this problem, according to the present invention, the suction block 1 having a suction pad 1A at its tip is used to suck the IC 2 and the suction block 1 is lowered onto the measurement substrate 3; The measurement board 3 is connected to the lead holding surface 5A of the lead holding block 5 attached to the end of the
Presses the lead 2A of the IC2 onto the pattern surface 3A
In the C contact mechanism, a rubber 6 is attached between the pusher 4 and the lead holding block 5.

[0006]

Next, the configuration of the IC contact mechanism according to the present invention will be described with reference to FIG. Reference numeral 6 in FIG. 1 denotes rubber, and the other components are the same as those in FIG. That is, FIG. 1 shows a configuration in which rubber 6 is attached between the pusher 4 and the lead holding block 5 in FIG.

FIG. 2 shows a contact mechanism according to the present invention.
Is pressed against the measurement substrate 3. In FIG. 2, even if the pusher 4 is slightly inclined, the rubber 6 absorbs the inclination of the pusher 4, so that the lead pressing surface 5A presses the leads 2A of the IC 2 evenly.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The pusher 4 shown in FIG. 1 is made of metal, and the lead holding block 5 is made of a hard synthetic resin material. Rubber 6
If a conductive rubber is used, the elasticity of the rubber can be utilized, and the grounding of the pusher 4 can prevent the IC 2 from being electrostatically damaged without charging the rubber.

[0009]

[Effects of the Invention] In this invention, when rubber is mounted between the pusher and the lead holding block when the IC lead is pressed by the lead holding block directly on the pattern of the measuring board, the rubber is attached to the pusher. The inclination can be absorbed, and the IC can be stably contacted.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of an IC contact mechanism according to the present invention.

FIG. 2 shows a lead 2A of an IC 2 with a contact mechanism according to the present invention.
FIG. 5 is a state diagram in which the pressure is pressed against the measurement substrate 3.

FIG. 3 is a configuration diagram of a contact mechanism of an IC to a measurement substrate according to a conventional technique.

FIG. 4 is a state change diagram in which an IC 2 is brought into contact with a measurement substrate 3 by a conventional contact mechanism.

FIG. 5 shows that when the pusher 4 in FIG.
FIG. 3 is a diagram showing a state in which is pressed against a measurement substrate 3.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Suction block 1A Suction pad 2 IC 2A lead 3 Measurement board 3A Pattern surface 4 Pusher 5 Lead holding block 5A Lead holding surface 6 Rubber

Claims (1)

(57) [Scope of request for utility model registration] An IC (2) is sucked by a suction block (1) having a suction pad (1A) at its tip, and the suction block (1) is lowered onto a measurement substrate (3). In the IC contact mechanism that presses the lead (2A) of the IC (2) against the pattern surface (3A) of the measurement board (3) with the lead holding surface (5A) of the lead holding block (5) attached to the ) And lead holding block (5).
(6) An IC contact mechanism for a measurement board, characterized by attaching.