JP2585660B2 - Tablet molding method - Google Patents
Tablet molding methodInfo
- Publication number
- JP2585660B2 JP2585660B2 JP62319751A JP31975187A JP2585660B2 JP 2585660 B2 JP2585660 B2 JP 2585660B2 JP 62319751 A JP62319751 A JP 62319751A JP 31975187 A JP31975187 A JP 31975187A JP 2585660 B2 JP2585660 B2 JP 2585660B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- density
- tablet
- sealing material
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B11/00—Making preforms
- B29B11/06—Making preforms by moulding the material
- B29B11/12—Compression moulding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） 本発明は、電子部品の封止材の高密度なタブレットを
成形する方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial application field) The present invention relates to a method for molding a high-density tablet of a sealing material for electronic components.
（従来の技術） 従来から、半導体のような電子部品を絶縁性樹脂で封
止するには、基板等の上に電子部品をボンディングし下
処理を行った後、100〜200個の封止材のタブレットをピ
ックアップしこれらを一度にトランスファー成形する方
法が採られていた。そしてこのような封止材のタブレッ
トとしては、例えばエポキシ樹脂の場合には、直径75m
m、厚さ30〜40mm、密度80〜85％程度のものが使用され
ていた。(Prior art) Conventionally, to seal an electronic component such as a semiconductor with an insulating resin, after bonding the electronic component on a substrate or the like and performing a preparation process, 100 to 200 sealing materials are used. A method of picking up tablets and transfer-molding them at a time. And as a tablet of such a sealing material, for example, in the case of epoxy resin, a diameter of 75 m
m, a thickness of 30 to 40 mm, and a density of about 80 to 85% were used.
しかし近年、封止作業の自動化、オンライン化が進
み、スプルーやランナーにおける無駄な低減と製品歩留
り向上のために、タブレットの高密度化と少数個取りの
方式へと変化するにつれて、直径８〜20mm、厚さ15〜20
mm、密度90％以上と小型で高密度のタブレットが要求さ
れるようになった。However, in recent years, the automation of sealing work and the progress of onlineization have progressed, and in order to reduce wasteful use of sprues and runners and improve product yield, the density of tablets has changed and the number of single-pieces has changed. , Thickness 15-20
Small, high-density tablets with mm and a density of 90% or more have come to be required.
（発明の解決しようとする問題点） このような封止材の高密度なタブレットを成形する方
法としては、成形圧力を高くする方法が考えられる。し
かしこの方法では、成形機全体を圧縮比の高いものに変
えなければならず、また封止材を高圧で加圧すると、金
型の表面温度が急激に上昇するため、封止材が金型内周
面に付着し、タブレットの端面に欠け等が生じやすいと
いう問題があった。(Problems to be Solved by the Invention) As a method of molding such a high-density tablet of a sealing material, a method of increasing the molding pressure can be considered. However, in this method, it is necessary to change the entire molding machine to one having a high compression ratio, and when the sealing material is pressurized at a high pressure, the surface temperature of the mold rises sharply. There is a problem in that it adheres to the inner peripheral surface and chipping or the like is likely to occur on the end face of the tablet.
さらに、従来からの金型上下からの同時加圧方法や加
圧タイミングをずらして上下から加圧する方法では、厚
さ方向にどの部分も均一な密度を有するタブレットは得
ることはむずかしかった。Furthermore, it has been difficult to obtain a tablet having a uniform density in any part in the thickness direction by a conventional simultaneous pressing method from above and below a mold or a method of pressing from above and below by shifting the pressing timing.
本発明はこれらの問題を解決するためになされたもの
で、比較的低圧で加圧し、高密度で厚さ方向に均一な密
度を有する封止材のタブレットを成形する方法を提供す
ることを目的とする。The present invention has been made to solve these problems, and an object of the present invention is to provide a method of forming a tablet of a sealing material having a high density and a uniform density in a thickness direction by applying a relatively low pressure. And
［発明の構成］ （問題点を解決するための手段） 本発明のタブレットの成形方法は、粉末状または微粒
子状の電子部品封止材を金型内に充填した後、これに加
圧方向の振動を加えながら、少なくとも金型上部から加
圧圧縮して成形することを特徴としている。[Structure of the Invention] (Means for Solving the Problems) According to the tablet molding method of the present invention, after a powdery or fine particle-shaped electronic component sealing material is filled in a mold, it is pressed in a pressing direction. It is characterized in that it is molded by applying pressure and compression at least from above the mold while applying vibration.
（作用） 本発明においては、金型内に充填された粉末状または
微粒子状の封止材に、加圧方向と平行な方向の振動を加
えることによって、封止材粒子間にはさみこまれた多数
の微小な空気粒が揮散除去される。そして、このような
振動を加えつつ、金型の上方から或いは上、下方両方向
から加圧圧縮することによって、従来より低圧で加圧し
ても、高密度で上下均一な密度を有する封止材タブレッ
トが得られる。(Action) In the present invention, the powdery or particulate sealing material filled in the mold is vibrated in a direction parallel to the pressing direction, thereby being sandwiched between the sealing material particles. Many small air particles are volatilized and removed. A sealing material tablet having a high-density and uniform density in the upper and lower directions even when pressurized at a lower pressure than before by compressing from above or from above and below the mold while applying such vibration. Is obtained.
（実施例） 以下、本発明の実施例について記載する。(Examples) Hereinafter, examples of the present invention will be described.
実施例 図面に示すように、所定形状のキャビティを有する金
型１内に、封止用のエポキシ樹脂粉末（50〜200メッシ
ュ）２を充填し、これを、油圧式プレスに連結されたポ
ンチ３で上方向から加圧した。このときポンチ３に上下
方向の振動（振幅0,3mm）を加えながら、エポキシ樹脂
粉末２に1.2〜1.3kg/mm2の面圧を６秒間かけ圧縮成形し
た。EXAMPLE As shown in the drawing, a mold 1 having a cavity of a predetermined shape is filled with an epoxy resin powder (50 to 200 mesh) 2 for sealing, and this is filled with a punch 3 connected to a hydraulic press. And pressurized from above. At this time, a vertical pressure (amplitude: 0.3 mm) was applied to the punch 3 while applying a surface pressure of 1.2 to 1.3 kg / mm 2 to the epoxy resin powder 2 for 6 seconds to perform compression molding.
こうして得られたエポキシ樹脂タブレット（直径12m
m、厚さ14mm）の密度を測定したところ、92％であり、
厚さ方向にどの部分も均一な密度を有していた。Epoxy resin tablet (diameter 12m) thus obtained
m, thickness 14mm) was measured to be 92%,
Every portion in the thickness direction had a uniform density.
また比較のために、実施例と同じ粒径のエポキシ樹脂
粉末を金型内に充填し、従来通り油圧式プレスによっ
て、上下方向から同時に加圧圧縮して成形を行った。For comparison, a mold was filled with an epoxy resin powder having the same particle size as that of the example, and pressed and compressed simultaneously from above and below by a hydraulic press as in a conventional case.
このときの成形圧力は35〜37kg/mm2、成形時間は４秒
間であった。また、得られた実施例と同じ大きさのタブ
レットの密度を測定したところ、平均密度は92％程度で
あるが、厚さ方向に各部の密度が均一でなく、中心部に
密度が低い部分があった。The molding pressure at this time was 35 to 37 kg / mm 2 , and the molding time was 4 seconds. When the density of a tablet having the same size as that of the obtained example was measured, the average density was about 92%. However, the density of each part was not uniform in the thickness direction, and the low density part was located at the center. there were.
［発明の効果］ 以上の説明から明らかなように、本発明のタブレット
の成形方法においては、高密度でしかも密度が厚さ方向
にどの部分も均一な封止材のタブレットを成形すること
ができる。[Effects of the Invention] As is clear from the above description, in the tablet molding method of the present invention, a tablet of a sealing material having a high density and a uniform density in any part in the thickness direction can be molded. .
また、比較的低圧で加圧して成形を行うことができる
ので、金型の表面温度があまり上がらず、封止材が金型
内周面に付着してタブレットに欠け等が生じることもな
い。In addition, since molding can be performed by applying pressure at a relatively low pressure, the surface temperature of the mold does not rise so much, and the tablet is not chipped due to the sealing material adhering to the inner peripheral surface of the mold.
第１図は本発明の実施例を説明するための断面図であ
る。 １……金型 ２……エポキシ樹脂粉末 ３……ポンチFIG. 1 is a sectional view for explaining an embodiment of the present invention. 1. Mold 2. Epoxy resin powder 3. Punch
Claims (1)
金型内に充填した後、これに加圧方向の振動を加えなが
ら、少なくとも金型上部から加圧圧縮して成形すること
を特徴とするタブレットの成形方法。1. A method in which a mold or a powdery or particulate electronic component sealing material is filled in a mold, and then molded by pressing and compressing at least from the upper part of the mold while applying vibration in a pressing direction to the mold. Characteristic tablet molding method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62319751A JP2585660B2 (en) | 1987-12-17 | 1987-12-17 | Tablet molding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62319751A JP2585660B2 (en) | 1987-12-17 | 1987-12-17 | Tablet molding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01159211A JPH01159211A (en) | 1989-06-22 |
| JP2585660B2 true JP2585660B2 (en) | 1997-02-26 |
Family
ID=18113763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62319751A Expired - Lifetime JP2585660B2 (en) | 1987-12-17 | 1987-12-17 | Tablet molding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2585660B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5200125A (en) * | 1988-12-24 | 1993-04-06 | T&K International Laboratory, Ltd. | Method for seal molding electronic components with resin |
| JP2694288B2 (en) * | 1989-01-13 | 1997-12-24 | トーワ株式会社 | Thermosetting resin material used for encapsulation molding of electronic parts and manufacturing method thereof |
| CN106042213A (en) * | 2016-07-21 | 2016-10-26 | 上海市凌桥环保设备厂有限公司 | Polytetrafluoroethylene material preforming system and method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6140353A (en) * | 1984-07-31 | 1986-02-26 | Shin Etsu Chem Co Ltd | Method and apparatus for producing resin tablet for semiconductor sealing |
-
1987
- 1987-12-17 JP JP62319751A patent/JP2585660B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01159211A (en) | 1989-06-22 |
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