JP2584945B2 - Apparatus and method for polishing true sphere of ceramics - Google Patents
Apparatus and method for polishing true sphere of ceramicsInfo
- Publication number
- JP2584945B2 JP2584945B2 JP20911193A JP20911193A JP2584945B2 JP 2584945 B2 JP2584945 B2 JP 2584945B2 JP 20911193 A JP20911193 A JP 20911193A JP 20911193 A JP20911193 A JP 20911193A JP 2584945 B2 JP2584945 B2 JP 2584945B2
- Authority
- JP
- Japan
- Prior art keywords
- lapping
- groove
- polishing
- lap
- sphere
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ボールベアリングに用
いるセラミックス球の真球研磨装置と、真球研磨を行う
ときに真球研磨装置へのラップ液供給方法に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sphere polishing device for a ceramic ball used for a ball bearing, and a method of supplying a lapping liquid to the sphere polishing device when the sphere polishing is performed.
【０００２】[0002]
【従来の技術】従来の上部、下部のラップ円盤からなる
ラップ盤では、外周側・円周方向にＶ溝またはＵ溝が穿
設された下部ラップ円盤が用いられている。このような
ラップ盤によるセラミックスの真球の研磨では、Ｖ溝又
はＵ溝の外側と内側との周速度の差によるセラミックス
球の転動によって、その球がラップ研磨されるが、長時
間のラップ研磨によって方向性が生じ、断面楕円状にな
る。ここで転動するセラミック球の位相を変えるため、
一定時間毎に上部、下部ラップ円盤からセラミックス球
を取り出して、改めて上部、下部ラップ円盤の間に供給
し直して真球に研磨していた。したがって、高精度、高
能率なラップ研磨は容易に行えず、セラミックス球の真
球研磨には１週間程度の長時間を要していた。2. Description of the Related Art In a conventional lapping machine composed of upper and lower lapping disks, a lower lapping disk having a V-groove or a U-groove formed in an outer peripheral side and a circumferential direction is used. In the polishing of a ceramic sphere by such a lapping machine, the sphere is lap-polished by the rolling of the ceramic sphere due to the difference in the peripheral speed between the outside and the inside of the V-groove or U-groove. The polishing produces directionality, and the cross section becomes elliptical. Here, to change the phase of the rolling ceramic ball,
The ceramic spheres were taken out of the upper and lower lap disks at regular intervals and supplied again between the upper and lower lap disks and polished into true spheres. Therefore, high-precision and high-efficiency lap polishing cannot be easily performed, and it takes a long time of about one week for true sphere polishing of ceramic balls.
【０００３】すなわち、図１で凹溝３のない下部ラップ
円盤１（直径：100m/m，厚み：16 m/m，Ｖ溝Ｒ1 ：60 m
/m，Ｒ2 ：89 m/m，Ｄ：６m/m ）と、平盤な上部ラップ
円盤とからなるラップ円盤を用い、ラップ円盤を載置す
る機械架台10をアンカーボルトなどで固定し（図３参
照）、かつラップ液を断続的に上部ラップ円盤の開口部
から上部、下部ラップ円盤の間に供給して、ＺｒＯ2 が
主成分で直径14m/m の被研磨セラミックス球１６個を同
時に表１の仕上IIの条件で研磨した。That is, in FIG. 1, a lower lap disk 1 without a concave groove 3 (diameter: 100 m / m, thickness: 16 m / m, V-groove R 1 : 60 m)
/ m, R 2 : 89 m / m, D: 6 m / m) and a flat upper lap disk, and the machine base 10 on which the lap disk is mounted is fixed with anchor bolts or the like ( The lapping liquid is intermittently supplied from the opening of the upper lap disk to the space between the upper and lower lap disks, and simultaneously, 16 ZrO 2 -based ceramic balls having a diameter of 14 m / m are polished. Polishing was performed under the conditions of finish II in Table 1.
【０００４】このときの研磨時間（ｈ）と真球度（μ
ｍ）との関係を図８に示したが、研磨時間７０時間経過
しても真球度１μｍであり、真球度 0.5μｍの真球を得
るためには、セラミックス球の入替え作業などで手間が
かかり、１週間程度の長時間を要していた。At this time, the polishing time (h) and the sphericity (μ
FIG. 8 shows the relationship with m), and the sphericity is 1 μm even after the polishing time of 70 hours has elapsed. In order to obtain a sphere with a sphericity of 0.5 μm, it is troublesome to replace ceramic balls. And took a long time of about one week.
【０００５】[0005]
【発明が解決しようとする課題】セラミックス製のボー
ルベアリングは耐食性、耐摩耗性などに優れ、例えば海
水中で使用しても腐食や摩耗が生ぜず長時間の使用に耐
えうるので広い産業分野からの需要が多いが、従来の真
球研磨では１週間もかかり、加工コストが高いという問
題があった。SUMMARY OF THE INVENTION Ceramic ball bearings have excellent corrosion resistance and wear resistance. For example, they can be used in seawater without corrosion or wear and can be used for a long time. However, there is a problem that conventional spherical polishing requires as long as one week and processing cost is high.
【０００６】本発明は、かかる現状に鑑みて、セラミッ
クス球の真球研磨を精度よく、かつ能率的に行える技術
を提供するためになされたものである。The present invention has been made in view of the above situation, and has been made in order to provide a technique capable of accurately and efficiently polishing a ceramic sphere with a true sphere.
【０００７】[0007]
【課題を解決するための手段】本発明は、Ｖ溝またはＵ
溝の外側と内側との周速度の差で転動するセラミックス
球の位相を、ラップ円盤の直径方向の凹溝または凹凸を
利用して、積極的に変化させれば、セラミックス球を真
球に研磨できるという知見に基づいてなされたものであ
る。SUMMARY OF THE INVENTION The present invention is directed to a V-groove or U-groove.
If the phase of the ceramic sphere rolling by the difference in the peripheral speed between the outside and the inside of the groove is positively changed using the concave groove or unevenness in the diameter direction of the lap disk, the ceramic sphere becomes a true sphere This is based on the finding that polishing is possible.
【０００８】すなわち本発明は、外周側・円周方向に
Ｖ溝またはＵ溝が穿設されている下部ラップ円盤と、前
記の溝が穿設されていない上部ラップ円盤とからなるラ
ップ盤であって、下部ラップ円盤の外周側・円周方向に
穿設されたＶ溝またはＵ溝に、下部ラップ円盤の直径方
向に断面が矩形の凹溝を数個以上穿設したことを特徴と
するセラミックスの真球研磨装置で、外周側・円周方
向にＶ溝またはＵ溝が穿設されている下部ラップ円盤
と、前記の溝が穿設されていない上部ラップ円盤とから
なるラップ盤であって、下部ラップ円盤の外周側・円周
方向に穿設されたＶ溝またはＵ溝の表面に、下部ラップ
円盤の円周方向にうねり状の凹凸が形成されたセラミッ
クスの真球研磨装置で、前記うねり状の凹凸は、ラッ
プ研磨中に回転力で振動を誘発させ、その振動により形
成された前記記載のセラミックスの真球研磨装置で、
前記うねり状の凹凸は、ラップ盤を載置する機械架台
の四隅を細長いアンカーボルトで支えることによって形
成された前記記載のセラミックスの真球研磨装置で、
前記ないしの真球研磨装置に、砥材を含むラップ
液をラップ液供給管で供給し真球研磨するに際し、ラッ
プ液流量調整弁の下部に配設したＴ字管で、ラップ液タ
ンクから供給ポンプによってラップ液供給管に供給され
たラップ液の余剰分をラップ液タンクに戻し、ラップ液
供給管、ラップ液流量調整弁の詰まりを防止し、かつラ
ップ液タンク内の砥材とラップ液とを効果的に混合する
ことを特徴とするセラミックスの真球研磨方法である。That is, the present invention relates to a lapping machine comprising a lower lapping disc in which a V-groove or a U-groove is formed in an outer peripheral side and a circumferential direction, and an upper lapping disc in which the aforementioned groove is not formed. And a plurality of recessed grooves having a rectangular cross section in the diameter direction of the lower lap disk are formed in a V-groove or a U-groove formed in an outer peripheral side and a circumferential direction of the lower lap disk. A lapping machine comprising a lower lapping disc having a V-groove or a U-groove formed in the outer peripheral side and the circumferential direction, and an upper lapping disc having no such groove. A spherical polisher for ceramics in which undulating irregularities are formed in the circumferential direction of the lower wrap disk on the surface of a V-groove or U groove formed on the outer peripheral side and circumferential direction of the lower wrap disk, Undulating irregularities generate vibrations due to rotational force during lap polishing. In emitted thereby, a sphere polishing apparatus ceramics of the described formed by the vibration,
The undulating unevenness is a ceramic true sphere polishing apparatus according to the above description, which is formed by supporting four corners of a machine base on which a lapping machine is mounted with elongated anchor bolts.
When the lapping liquid containing the abrasive is supplied by the lapping liquid supply pipe to the above-mentioned sphere liquid polishing apparatus and the sphere liquid is polished, the lapping liquid is supplied from the lapping liquid tank by a T-tube arranged below the lapping liquid flow rate control valve. The excess amount of the lapping liquid supplied to the lapping liquid supply pipe by the pump is returned to the lapping liquid tank to prevent clogging of the lapping liquid supply pipe and the lapping liquid flow control valve, and that the abrasive material and the lapping liquid in the lapping liquid tank are not clogged. Is a method for polishing a true sphere of ceramics, which is characterized by effectively mixing.
【０００９】[0009]
【作 用】一般に、ラップ研磨は次のように行われる。
すなわち、溝などを穿設した下部ラップ円盤の上に研磨
されるセラミックス球を配置し、その上部に平盤の上部
ラップ円盤を荷重を加えて載置し、セラミックス球を上
部、下部ラップ円盤で挟み込みながらラップ研磨する。
その際上部ラップ円盤は回転させず、下部ラップ円盤の
みを回転する。ラップ液は、上部ラップ円盤の開口部か
ら連続的に上部、下部ラップ円盤の間に供給される。[Operation] Generally, lap polishing is performed as follows.
That is, a ceramic ball to be polished is placed on a lower lap disk having a groove or the like, and an upper lap disk of a flat plate is placed thereon with a load applied thereon, and the ceramic sphere is placed on the upper and lower lap disks. Lapping while sandwiching.
At that time, the upper lap disk is not rotated, and only the lower lap disk is rotated. The lap liquid is supplied between the upper and lower lap disks continuously from the opening of the upper lap disk.
【００１０】本発明の作用を以下に図面にしたがって説
明する。上部、下部ラップ円盤からなるラップ盤で、下
部ラップ円盤１の外周側・円周方向にＶ溝またはＵ溝２
を穿設し、さらにその溝に下部ラップ円盤の直径方向に
凹溝３を数個以上例えば数十個穿設する（図１参照）。
したがってＶ溝またはＵ溝の外側と内側の周速度の差に
より転動するセラミックス球の位相を、凹溝の部分で研
磨力の変化を利用して、積極的に変化させることがで
き、セラミックス球を真球に研磨することができる。The operation of the present invention will be described below with reference to the drawings. A lapping machine composed of upper and lower lapping discs, and a V-groove or a U-groove 2 on the outer circumferential side and circumferential direction of the lower lapping disc 1
, And several or more, for example, several tens of the grooves 3 are formed in the groove in the diameter direction of the lower lap disk (see FIG. 1).
Therefore, the phase of the ceramic sphere rolling due to the difference between the outer peripheral speed and the inner peripheral speed of the V-groove or U-groove can be positively changed by utilizing the change in the polishing force at the concave groove portion. Can be polished into a true sphere.
【００１１】ここで凹溝は、Ｖ溝またはＵ溝の全幅（直
径方向長さ）に亘って、対象セラミックス球の大きさに
応じた幅に切断砥石、エンドミル等の加工機で切削、加
工されている。Ｖ溝またはＵ溝の表面に下部ラップ円盤
の円周方向に、前記凹溝に代えてうねり状の凹凸４を形
成した場合も（図２参照）このうねり状の凹凸は凹溝と
同様な作用をし、転動するセラミックス球の位相を積極
的に変化させ、セラミックス球を真球に研磨することが
できる。Here, the concave groove is cut and processed by a processing machine such as a cutting grindstone or an end mill into a width corresponding to the size of the target ceramic sphere over the entire width (length in the diameter direction) of the V groove or the U groove. ing. In the case where the undulations 4 are formed on the surface of the V-groove or the U-groove in the circumferential direction of the lower lap disk instead of the above-mentioned depressions (see FIG. 2), the undulations have the same effect as the depressions. By positively changing the phase of the rolling ceramic sphere, the ceramic sphere can be polished into a true sphere.
【００１２】Ｖ溝またはＵ溝のみを穿設した下部ラップ
円盤と上部ラップ円盤との間にセラミックス球を配置し
てラップ研磨を行って、そのラップ研磨中に回転力で振
動を誘発させると、その振動によってＶ溝またはＵ溝の
表面に下部ラップ円盤の円周方向にうねり状の凹凸を形
成することができる。図３に示すようにラップ盤を載置
する機械架台10の四隅を、通常の機械装置のように頑強
なアンカーボルトで固定せず細長いアンカーボルト９に
よりフリーの状態で支えると、振動が誘発され易く、前
記うねり状の凹凸を容易に形成することができる。When a ceramic ball is arranged between a lower lap disk and an upper lap disk in which only a V-groove or a U-groove is formed and lap polishing is performed, and vibration is induced by a rotational force during the lap polishing, Due to the vibration, undulating irregularities can be formed on the surface of the V-groove or U-groove in the circumferential direction of the lower lap disk. As shown in FIG. 3, if the four corners of the machine base 10 on which the lapping machine is mounted are not fixed with the robust anchor bolts as in the case of the ordinary mechanical device but are supported by the elongated anchor bolts 9 in a free state, vibration is induced. The undulations can be easily formed.
【００１３】また、従来、長時間を要して真球研磨を行
っていたものを、１８時間以内で高精度、高能率に真球
研磨するためには、研磨材を含有したラップ液17を連続
的に、適量を供給する必要がある。通常は、流量調整弁
12で調整して必要量だけ供給するが砥材を含有したラッ
プ液は、流量調整弁で流量、流速を調整すると、流量調
整弁やその下のラップ液供給管11(2) に砥材が濃縮さ
れ、詰まりを生じる。これを防止するため、従来はラッ
プ液タンク15からラップ液を供給する供給ポンプ14の他
に、流量調整弁の部分にもポンプを配置して対処してい
たので、装置も複雑化していた。ここで図３、図４に示
すように流量調整弁の下部にＴ字管13を配設し、ラップ
液タンク15から供給ポンプ14により供給されたラップ液
の余剰分を、Ｔ字管の一方からラップ液タンクに戻す方
式にし、ラップ液の詰まりを防止して、さらに戻された
ラップ液の液流により、タンク内の砥材と液が攪拌さ
れ、常時、分離しないで混合状態となる。以上によりラ
ップ液を微量から大容量まで調整でき、ラップ液を長時
間に亘り連続的に適量を供給することができる。[0013] In addition, in order to accurately and efficiently perform a true spherical polishing within 18 hours, a lapping liquid 17 containing an abrasive is required. It is necessary to supply an appropriate amount continuously. Usually, a flow control valve
After adjusting the flow rate and flow rate of the lapping liquid containing abrasive material by adjusting the flow rate and adjusting the flow rate and flow rate of the lapping liquid containing the abrasive material, adjust the flow rate control valve and the lapping liquid supply pipe 11 (2) underneath. Concentrates and causes clogging. In order to prevent this, conventionally, in addition to the supply pump 14 for supplying the lapping liquid from the lapping liquid tank 15, a pump is also disposed at the flow rate adjusting valve to cope with the problem. Here, as shown in FIGS. 3 and 4, a T-shaped pipe 13 is provided below the flow control valve, and the excess amount of the lapping liquid supplied from the lapping liquid tank 15 by the supply pump 14 is supplied to one side of the T-shaped pipe. The lapping liquid is returned to the lapping liquid tank to prevent clogging of the lapping liquid, and further, the abrasive material and the liquid in the tank are agitated by the liquid flow of the returned lapping liquid. As described above, the lapping liquid can be adjusted from a very small amount to a large volume, and an appropriate amount of the lapping liquid can be continuously supplied for a long time.
【００１４】[0014]
（実施例１）本発明に係る下記寸法の図１に示す下部ラ
ップ円盤（材質 FC20）を用いて、表１の研磨条件でセ
ラミックス球の研磨を行った。 記 円盤 直径： 100 m/m，厚み： 16 m/m Ｖ溝 内径（Ｒ1 ）： 60 m/m ，外径（Ｒ2 ）： 89 m/m ， 深さ（Ｄ）： 6 m/m 凹溝 深さ（Ｄ）： 6 m/m，幅（Ｌ1 ）： 2 m/m， 個数： 8 個(Example 1) Ceramic balls were polished under the polishing conditions shown in Table 1 using a lower lap disk (material FC20) shown in FIG. Note Disk Diameter: 100 m / m, Thickness: 16 m / m V-groove Inner diameter (R 1 ): 60 m / m, Outer diameter (R 2 ): 89 m / m, Depth (D): 6 m / m Groove depth (D): 6 m / m, width (L 1 ): 2 m / m, quantity: 8
【００１５】[0015]
【表１】 [Table 1]
【００１６】ここで被研磨セラミックス球は、ＺｒＯ2
が主成分で直径14m/m であり、１６個を同時に研磨し
た。真球度（μｍ）0.5 の真球を得るために従来複雑な
工程を経て約１週間も要していたが、本実施例による
と、10〜13時間で真球を得ることができた。Here, the ceramic sphere to be polished is ZrO 2
Is a main component and has a diameter of 14 m / m, and 16 pieces were polished at the same time. Conventionally, it took about one week through a complicated process to obtain a sphere having a sphericity (μm) of 0.5. According to the present embodiment, a sphere could be obtained in 10 to 13 hours.
【００１７】（実施例２）本発明に係る下記寸法の図２
に示す下部ラップ円盤（材質 FC20）を用いて、表１の
研磨条件（但し中仕上以降) でセラミックス球の研磨を
行った。 記 円盤 直径： 100 m/m，厚み： 16 m/m Ｖ溝 内径（Ｒ1 ）： 60 m/m ，外径（Ｒ2 ）： 89 m/m ， 深さ（Ｄ）： 6 m/m うねり状の凹凸 深さ（Ｆ1 ）： 0.5 m/m，幅（Ｆ2 ）：Ｆ3/2 ， 個数： 32 個 被研磨セラミックス球は、実施例１と同様で１６個を同
時に研磨した。このときの研磨時間（ｈ）と真球度（μ
ｍ）との関係を図５に示したが（実施例２以降）、約８
時間で真球度0.5 μｍの真球を研磨加工できた。(Embodiment 2) FIG. 2 of the following dimensions according to the present invention
The ceramic balls were polished using the lower lap disk (material FC20) shown in Table 1 under the polishing conditions shown in Table 1 (however, after the medium finish). Note Disk Diameter: 100 m / m, Thickness: 16 m / m V-groove Inner diameter (R 1 ): 60 m / m, Outer diameter (R 2 ): 89 m / m, Depth (D): 6 m / m wavy concavo-convex depth (F 1): 0.5 m / m, the width (F 2): F 3/ 2, the number: 32 polished ceramic balls were polished 16 the same as in example 1 at the same time. The polishing time (h) and the sphericity (μ
5) is shown in FIG. 5 (from Example 2 onward).
A sphere with a sphericity of 0.5 μm could be polished in a short time.
【００１８】表面粗さＲmax （μｍ）、研磨量（μｍ、
直径方向）を図６、図７にそれぞれ示したが（実施例２
以降）、表面粗さＲmax 0.1 μｍ以下の鏡面研磨ができ
た。 （実施例３）うねり状の凹凸のない実施例２と同じ寸
法、形状の下部ラップ円盤を用いて、機械架台の四隅を
細長いアンカーボルト（12 m/mφ×120m/m）によってフ
リーの状態で支え、ラップ研磨中に回転力で振動させ
て、表１の研磨条件で実施例２と同じセラミックス球の
研磨を行った。Surface roughness Rmax (μm), polishing amount (μm,
(Diameter direction) are shown in FIGS. 6 and 7, respectively (Example 2).
Thereafter, mirror polishing with a surface roughness Rmax of 0.1 μm or less was achieved. (Embodiment 3) Using a lower lap disk having the same dimensions and shape as in Embodiment 2 without undulating irregularities, the four corners of the machine stand are freed by elongated anchor bolts (12 m / mφ × 120 m / m). Under the polishing conditions shown in Table 1, the same ceramic spheres as in Example 2 were polished by supporting and oscillating by rotational force during lap polishing.
【００１９】このときの研磨時間（ｈ）と真球度（μ
ｍ）、表面粗さＲmax （μｍ）、研磨量（μｍ）との関
係をそれぞれ図５、図６、図７に示した。図から明らか
なように１８時間経過した時点で真球度0.5 μｍ、表面
粗さＲmax 0.1 μｍ以下の鏡面研磨ができ、直径14m/m
に対し直径方向 500μｍの研磨量であった。At this time, the polishing time (h) and the sphericity (μ
m), surface roughness Rmax (μm) and polishing amount (μm) are shown in FIGS. 5, 6 and 7, respectively. As can be seen from the figure, after 18 hours, mirror polishing with a sphericity of 0.5 μm and a surface roughness Rmax of 0.1 μm or less was achieved, and the diameter was 14 m / m.
The polishing amount was 500 μm in the diameter direction.
【００２０】上記研磨開始後、約10時間経過した時点で
下部ラップ円盤を観察したところ、実施例２で用いた下
部ラップ円盤のように、うねり状の凹凸がＶ溝に形成さ
れていた。以上の実施例１、２、３はいづれも、図３に
示すようにラップ液17を、上部ラップ円盤の開口部から
連続的に適量を上部、下部ラップ円盤の間に供給しなが
ら行った。その際、砥材を含んだラップ液によるラップ
液流量調節弁12、ラップ液供給管11(1) 、(2) の詰まり
を防止するため、ラップ液流量調節弁12の下部にＴ字管
13を配設し、ラップ液タンク15から供給ポンプ14によっ
て供給されるラップ液の余剰分を、Ｔ字管13の一方から
ラップ液タンク15に戻す方式にしてラップ液の詰まりを
防止した。さらに戻り液による攪拌16によって、タンク
内の砥材と液とが攪拌混合され、常時、分離しないで混
合状態を保つことができた。When the lower lap disk was observed about 10 hours after the start of the above polishing, undulating irregularities were formed in the V-groove as in the lower lap disk used in Example 2. In each of the above Examples 1, 2 and 3, as shown in FIG. 3, the lapping liquid 17 was supplied from the opening of the upper lap disk while continuously supplying an appropriate amount between the upper and lower lap disks. At this time, in order to prevent clogging of the lap liquid flow control valve 12 and the lap liquid supply pipes 11 (1) and 11 (2) by the lap liquid containing abrasive material, a T-shaped pipe is provided below the lap liquid flow control valve 12.
The lap liquid 13 is provided, and the excess lap liquid supplied from the lap liquid tank 15 by the supply pump 14 is returned to the lap liquid tank 15 from one side of the T-shaped tube 13 to prevent the lap liquid from being clogged. Further, the abrasive 16 and the liquid in the tank were stirred and mixed by the agitation 16 using the return liquid, and the mixing state could be maintained without separation at all times.
【００２１】[0021]
【発明の効果】本発明によると、以上説明したように精
度よく、かつ能率的にセラミックス球の真球研磨ができ
た。すなわち、従来１週間位かかっていたセラミックス
球の真球研磨時間を１８時間以内と大幅に短縮でき、か
つ真球度も良好である。According to the present invention, as described above, the true spherical polishing of the ceramic sphere can be performed accurately and efficiently. In other words, the time required for polishing the ceramic sphere, which conventionally took about one week, can be greatly reduced to 18 hours or less, and the sphericity is good.
【００２２】したがって、本発明によるとセラミックス
球の低コスト化、量産化、用途拡大、高級化が図られ、
各産業界への寄与度が大きい。Therefore, according to the present invention, the ceramic balls can be reduced in cost, mass-produced, expanded in use, and upgraded.
Large contribution to each industry.
【図１】本発明に係る凹溝を穿設した下部ラップ盤であ
り、（ａ）は平面図、（ｂ）はＡ−Ａ視断面図である。FIG. 1 is a lower lapping machine in which a concave groove according to the present invention is formed, (a) is a plan view, and (b) is a cross-sectional view along AA.
【図２】本発明に係るうねり状の凹凸を形成した下部ラ
ップ盤であり、（ａ）は平面図、（ｂ）はＢ−Ｂ視断面
図である。FIG. 2 is a lower lapping machine according to the present invention in which undulating irregularities are formed, (a) is a plan view, and (b) is a cross-sectional view along BB.
【図３】ラップ盤の全体説明図。FIG. 3 is an overall explanatory view of a lapping machine.
【図４】Ｔ字管を配置したラップ液供給配管図。FIG. 4 is a lap liquid supply piping diagram in which a T-tube is arranged.
【図５】セラミックス球の研磨時間と真球度との関係を
示す特性図。FIG. 5 is a characteristic diagram showing a relationship between polishing time of a ceramic ball and sphericity.
【図６】セラミックス球の研磨時間と表面粗さとの関係
を示す特性図。FIG. 6 is a characteristic diagram showing a relationship between a polishing time and a surface roughness of a ceramic ball.
【図７】セラミックス球の研磨時間と研磨量との関係を
示す特性図。FIG. 7 is a characteristic diagram showing a relationship between a polishing time and a polishing amount of a ceramic ball.
【図８】従来法によるセラミックス球の研磨時間と真球
度との関係を示す特性図。FIG. 8 is a characteristic diagram showing a relationship between a polishing time of a ceramic sphere and a sphericity according to a conventional method.
１ 下部ラップ円盤 ２ Ｖ溝またはＵ溝 ３ 凹溝 ４ うねり状の凹凸 ５ セラミックス（球） ６ 上部ラップ円盤 ７ 上部ラップ円盤回転用モーター ８ 下部ラップ円盤回転用モーター ９ 細長いアンカーボルト 10 機械架台 11(1),(2) ラップ液供給管 12 ラップ液流量調整弁 13 Ｔ字管 14 供給ポンプ 15 ラップ液タンク 16 戻り液による攪拌 17 ラップ液 Reference Signs List 1 lower lap disk 2 V groove or U groove 3 concave groove 4 undulating irregularities 5 ceramics (sphere) 6 upper lap disk 7 upper lap disk rotation motor 8 lower lap disk rotation motor 9 slender anchor bolt 10 machine base 11 ( 1), (2) Lapping liquid supply pipe 12 Lapping liquid flow control valve 13 T-tube 14 Supply pump 15 Lapping liquid tank 16 Stirring with return liquid 17 Lapping liquid
Claims (5)
設されている下部ラップ円盤と、前記の溝が穿設されて
いない上部ラップ円盤とからなるラップ盤であって、下
部ラップ円盤の外周側・円周方向に穿設されたＶ溝また
はＵ溝に、下部ラップ円盤の直径方向に断面が矩形の凹
溝を数個以上穿設したことを特徴とするセラミックスの
真球研磨装置。1. A lapping machine comprising a lower lapping disc having a V-groove or a U-groove formed in the outer peripheral side and the circumferential direction, and an upper lapping disc having no such groove. A true sphere of ceramics, characterized in that several or more concave grooves having a rectangular cross section in the diameter direction of the lower lap disk are formed in a V-groove or a U-groove formed in the outer peripheral side and in the circumferential direction of the lap disk. Polishing equipment.
設されている下部ラップ円盤と、前記の溝が穿設されて
いない上部ラップ円盤とからなるラップ盤であって、下
部ラップ円盤の外周側・円周方向に穿設されたＶ溝また
はＵ溝の表面に、下部ラップ円盤の円周方向にうねり状
の凹凸が形成されたセラミックスの真球研磨装置。2. A lapping machine comprising: a lower lapping disc having a V-groove or a U-groove formed on the outer peripheral side and the circumferential direction; and an upper lapping disc having no such groove. A true spherical polishing device for ceramics, in which undulating irregularities are formed in the circumferential direction of a lower lap disc on the surface of a V-groove or a U-groove formed on the outer peripheral side and in the circumferential direction of the lap disc.
回転力で振動を誘発させ、その振動により形成された請
求項２記載のセラミックスの真球研磨装置。3. The apparatus for polishing a true sphere of ceramics according to claim 2, wherein said waviness-like irregularities induce vibration by a rotational force during lap polishing, and are formed by the vibration.
する機械架台の四隅を細長いアンカーボルトで支えるこ
とによって形成された請求項２記載のセラミックスの真
球研磨装置。4. The apparatus for polishing a ceramic true sphere according to claim 2, wherein the undulating irregularities are formed by supporting four corners of a machine base on which a lapping machine is mounted with elongated anchor bolts.
を含むラップ液をラップ液供給管で供給し真球研磨する
に際し、 ラップ液流量調整弁の下部に配設したＴ字管で、ラップ
液タンクから供給ポンプによってラップ液供給管に供給
されたラップ液の余剰分をラップ液タンクに戻し、ラッ
プ液供給管、ラップ液流量調整弁の詰まりを防止し、か
つラップ液タンク内の砥材とラップ液とを効果的に混合
することを特徴とするセラミックスの真球研磨方法。5. A T-tube disposed below a lap liquid flow control valve when a lap liquid containing an abrasive is supplied to a true sphere polishing apparatus according to claim 1 through a lap liquid supply pipe for polishing the sphere. The excess amount of the lapping liquid supplied from the lapping liquid tank to the lapping liquid supply pipe by the supply pump is returned to the lapping liquid tank to prevent clogging of the lapping liquid supply pipe and the lapping liquid flow control valve, and to prevent the lapping liquid tank from being clogged. A true spherical polishing method for ceramics, wherein the abrasive material and the lapping liquid are effectively mixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20911193A JP2584945B2 (en) | 1993-08-24 | 1993-08-24 | Apparatus and method for polishing true sphere of ceramics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20911193A JP2584945B2 (en) | 1993-08-24 | 1993-08-24 | Apparatus and method for polishing true sphere of ceramics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0760636A JPH0760636A (en) | 1995-03-07 |
| JP2584945B2 true JP2584945B2 (en) | 1997-02-26 |
Family
ID=16567474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20911193A Expired - Fee Related JP2584945B2 (en) | 1993-08-24 | 1993-08-24 | Apparatus and method for polishing true sphere of ceramics |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2584945B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7003553B2 (en) * | 2017-10-11 | 2022-01-20 | 株式会社ジェイテクト | Polishing machine, sphere polishing device and sphere polishing method |
| CN117102981B (en) * | 2023-10-23 | 2024-02-23 | 奇精机械股份有限公司 | Rolling body grinding and polishing equipment for ceramic ball bearing of washing machine |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2202098A1 (en) * | 1972-01-18 | 1973-07-26 | Messerschmidt Sebastian | METHOD AND DEVICE FOR MACHINING THE SURFACE OF BALLS |
-
1993
- 1993-08-24 JP JP20911193A patent/JP2584945B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0760636A (en) | 1995-03-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201049437Y (en) | Polishing pad adjuster and chemical machinery device with the same | |
| US6102777A (en) | Lapping apparatus and method for high speed lapping with a rotatable abrasive platen | |
| JP2008507855A (en) | Method and apparatus for conditioning a polishing pad | |
| CN102170999A (en) | Apparatus for polishing spherical body, method for polishing spherical body and method for manufacturing spherical member | |
| JP2584945B2 (en) | Apparatus and method for polishing true sphere of ceramics | |
| JPH0761604B2 (en) | Non-contact spherical processing method | |
| Kang et al. | A novel eccentric lapping machine for finishing advanced ceramic balls | |
| EP1700670A2 (en) | Super-abrasive machining tool and method of use | |
| Xiong et al. | Processing performance of vitrified bonded fixed-abrasive lapping plates for sapphire wafers | |
| US6306013B1 (en) | Method of producing polishing cloth for a texturing process | |
| Tsai et al. | Polishing characteristics of hydrophilic pad in chemical mechanical polishing process | |
| CN114905368A (en) | Processing device and processing method for fixed abrasive particles in discontinuous region of precise sphere | |
| JPH0584656A (en) | Magnetic fluid polishing method | |
| JP2001025948A (en) | Spherical grinding wheel | |
| JPH08257897A (en) | Method and device for polishing sphere provided with float having hole in center and circulating device of magnetic fluid containing abrasive grain | |
| JPH0541394B2 (en) | ||
| JP2000210862A (en) | Spherical body posishing method and spherical body polishing device | |
| JPH0111415Y2 (en) | ||
| JPH09280253A (en) | Rolling element for ceramic bearing, and method and device for working its surface | |
| JP2000254858A (en) | Spherical body grinding method | |
| JPH05253822A (en) | Chamfering method of rare earth magnet | |
| JP2003334754A (en) | Padless polishing device and method | |
| JP3577097B2 (en) | Processing method of cylindrical roller for cylindrical roller bearing | |
| JPH03117558A (en) | Ceramic ball machining method and device | |
| TW509611B (en) | A novel linear CMP tool design with closed loop slurry distribution |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |