JP2583978B2 - Annealing method for resin parts assembly - Google Patents
Annealing method for resin parts assemblyInfo
- Publication number
- JP2583978B2 JP2583978B2 JP15524388A JP15524388A JP2583978B2 JP 2583978 B2 JP2583978 B2 JP 2583978B2 JP 15524388 A JP15524388 A JP 15524388A JP 15524388 A JP15524388 A JP 15524388A JP 2583978 B2 JP2583978 B2 JP 2583978B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- annealing
- component assembly
- resin component
- resin molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
- B29C71/02—Thermal after-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0855—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using microwave
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
- B29C71/02—Thermal after-treatment
- B29C2071/022—Annealing
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は樹脂成形部品の内部応力を除去するために行
なう熱処理である樹脂部品集合体のアニール方法に関す
るものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of annealing a resin component assembly, which is a heat treatment for removing internal stress of a resin molded component.
従来の技術 近年、樹脂成形部品は、製品の小形化，軽量化，低コ
スト化のため多量に使用されており、また、樹脂成形部
品に対する信頼性の要求も一段の厳しくなってきてい
る。2. Description of the Related Art In recent years, resin molded parts have been used in large quantities for miniaturization, weight reduction, and cost reduction of products, and requirements for reliability of resin molded parts have become more severe.
樹脂成形部品は、成形の際に生じる内部応力や、結晶
性の樹脂では成形後の結晶化率の上昇により、クラック
や寸法変化を生じることがある。これを防止するため樹
脂成形部品を、その樹脂材料の熱変形温度より５〜10℃
低い温風炉や油浴，水浴中で数十分から数時間加熱する
アニールが行なわれている。The resin molded part may cause cracks and dimensional changes due to internal stress generated during molding and, for a crystalline resin, an increase in crystallization rate after molding. In order to prevent this, the temperature of the resin molded part should be 5 to 10 ° C higher than the thermal deformation temperature of the resin material.
Annealing by heating for several tens of minutes to several hours in a low temperature air oven, oil bath, or water bath is performed.
第５図は従来の樹脂成形部品のアニール方法を模式的
に示したものである。第５図において、１は樹脂成形部
品であり、２は水、３は水槽であり、この水槽は外部加
熱手段４で加熱される。樹脂成形部品１は、加熱された
水２により間接的に、樹脂部品の表面から加熱され、ア
ニールされる。FIG. 5 schematically shows a conventional method of annealing a resin molded part. In FIG. 5, reference numeral 1 denotes a resin molded part, reference numeral 2 denotes water, and reference numeral 3 denotes a water tank, which is heated by an external heating means 4. The resin molded component 1 is indirectly heated from the surface of the resin component by the heated water 2 and annealed.
発明が解決しようとする課題 しかしながら上記のような方法では、次のような問題
点を有していた。Problems to be Solved by the Invention However, the above method has the following problems.
樹脂部品がばらばらであるため、自動化がしにく
い。Since resin parts are separated, automation is difficult.
樹脂部品の表面から加熱するため、アニールに長時
間を要する。Since heating is performed from the surface of the resin component, a long time is required for annealing.
樹脂部品の水槽中における位置により、アニール温
度の差が大きくなりやすい。The difference in annealing temperature tends to increase depending on the position of the resin component in the water tank.
本発明は上記問題点に鑑み、自動化が容易で、短時間
に、アニール温度の差が少ない樹脂部品集合体のアニー
ル方法を提供するものである。The present invention has been made in view of the above problems, and provides an annealing method for a resin component assembly that can be easily automated and has a small difference in annealing temperature in a short time.
課題を解決するための手段 上記課題を解決するために本発明の樹脂部品集合体の
アニール方法は、あらかじめテーピングされた樹脂部品
集合体をそのままマイクロ波誘電加熱する方法である。Means for Solving the Problems In order to solve the above-mentioned problems, a method for annealing a resin component assembly according to the present invention is a method of directly heating a resin component assembly that has been taped in advance by microwave dielectric heating.
作用 本発明は上記した方法により、テーピングされた樹脂
部品集合体のままで、樹脂成形部品がマイクロ波により
内部から発熱するので、短時間にアニールできる。ま
た、テーピングされた状態なので自動化が容易であり、
位置による温度差が少なくなる。Operation According to the present invention, the resin molded component generates heat from the inside by the microwaves in the state of the taped resin component aggregate by the above method, so that the annealing can be performed in a short time. In addition, automation is easy because it is in a taped state,
The temperature difference depending on the position is reduced.
実 施 例 以下本発明の一実施例の樹脂部品集合体のアニール方
法について、図面を参照しながら説明する。Embodiment Hereinafter, a method for annealing a resin component assembly according to an embodiment of the present invention will be described with reference to the drawings.
第１図は、本発明の一実施例における樹脂部品集合体
のアニール方法を示すものである。第１図において、５
はポリアセタール樹脂成形部品、６は凹状の収納部７を
もつポリエチレン製帯状長尺基材部で、８はこの上面に
凹状の収納部７を密封するよう密着しているポリエチレ
ン製カバーテープである。９は樹脂部品集合体である。
10はマグネトロン発振器であり、2450MHzのマイクロ波
を発生する。11は導波管であり、12はアプリケータであ
り、内部に樹脂部品集合体９を通せるようになってい
る。FIG. 1 shows a method of annealing a resin component assembly in one embodiment of the present invention. In FIG. 1, 5
Is a molded part of a polyacetal resin, 6 is a long strip-shaped base member made of polyethylene having a concave storage portion 7, and 8 is a polyethylene cover tape adhered to the upper surface so as to seal the concave storage portion 7. Reference numeral 9 denotes a resin component assembly.
Reference numeral 10 denotes a magnetron oscillator that generates a microwave of 2450 MHz. Reference numeral 11 denotes a waveguide, and 12 denotes an applicator, through which the resin component assembly 9 can pass.
次に、本実施例における作用を説明する。マグネトロ
ン発振器10で発生したマイクロ波は、導波管11により導
かれ、アプリケータ12内に強電界を生じる。電界内に樹
脂部品集合体９を送り込む。電界内にある誘電体は、そ
の物質の誘電損ε・tanδに比例して発熱する。ここで
εは誘電率,tanδは誘電正接である。ポリアセタール樹
脂の誘電率εは3.7で、誘電正接tanδは0.007,誘電損ε
・tanδは0.0259である。ポリエチレン樹脂の誘電率ε
は2.3であり、誘電正接tanδは0.0005,誘電損ε・tanδ
は0.00115である。樹脂部品集合体９は誘電体であるの
で電界内で発熱するが、ポリエチレン樹脂の誘電損はポ
リアセタール樹脂の誘電損23分の１であるので、ポリア
セタール樹脂成形品が主に加熱されることとなる。また
マイクロ波誘電加熱であるため、樹脂成形部品内部から
発熱するので、短時間にアニールできる。Next, the operation of this embodiment will be described. The microwave generated by the magnetron oscillator 10 is guided by the waveguide 11, and generates a strong electric field in the applicator 12. The resin component assembly 9 is sent into the electric field. A dielectric in an electric field generates heat in proportion to the dielectric loss ε · tanδ of the substance. Here, ε is a dielectric constant, and tanδ is a dielectric tangent. Dielectric constant ε of polyacetal resin is 3.7, dielectric loss tangent tanδ is 0.007, dielectric loss ε
• tan δ is 0.0259. Dielectric constant ε of polyethylene resin
Is 2.3, the dielectric loss tangent tanδ is 0.0005, and the dielectric loss εtan δ
Is 0.00115. Since the resin component assembly 9 is a dielectric, it generates heat in an electric field. However, since the dielectric loss of the polyethylene resin is 1/23 of that of the polyacetal resin, the polyacetal resin molded product is mainly heated. . In addition, since microwave dielectric heating is used, heat is generated from the inside of the resin molded part, so that annealing can be performed in a short time.
以上のように本実施例によれば、樹脂部品集合体９を
アプリケータ12内に送り込み、マイクロ波による誘電加
熱により、樹脂成形部品５をアニールするので、短時間
に均一な温度でアニールでき、また自動化も容易とな
る。As described above, according to the present embodiment, the resin component assembly 9 is fed into the applicator 12, and the resin molded component 5 is annealed by dielectric heating using microwaves. Also, automation becomes easy.
なお、本実施例において樹脂部品集合体は、第１図お
よび第２図に示すように樹脂成形部品５と凹状の収納部
７をもつ帯状長尺部材部６とカバーテープ９とからなる
ものとしたが、第３図と第４図に示すように紙テープ13
と、粘着テープ14と、樹脂成形部品15とからなる樹脂部
品集合体16であってもよい。なお、17は紙テープ13にあ
けた抜穴であり、18は紙テープにあけた送り穴である。In this embodiment, the resin component assembly includes a resin molded component 5, a strip-shaped long member portion 6 having a concave storage portion 7, and a cover tape 9 as shown in FIGS. 1 and 2. However, as shown in FIG. 3 and FIG.
, A resin component assembly 16 composed of an adhesive tape 14 and a resin molded component 15. Reference numeral 17 denotes a hole formed in the paper tape 13, and reference numeral 18 denotes a feed hole formed in the paper tape.
発明の効果 以上のように本発明は、あらかじめテーピングされな
樹脂部品集合体を、そのままマイクロ波誘電加熱するこ
とにより、短時間に均一な温度で樹脂成形部品をアニー
ルすることができ、また自動化も容易となる。Effect of the Invention As described above, the present invention can anneal a resin molded part at a uniform temperature in a short time by directly heating a pre-taped resin part assembly by microwave dielectric heating, and also achieve automation. It will be easier.
第１図は本発明の一実施例における樹脂部品集合体のア
ニール装置の概略模式図、第２図は樹脂部品集合体の斜
視図、第３図は他の樹脂部品集合体の平面図、第４図は
同断面図、第５図は従来の樹脂成形部品のアニール装置
の概略模式図である。 ９……樹脂部品集合体、10……マグネトロン、 12……アプリケータ。FIG. 1 is a schematic diagram of a resin component assembly annealing apparatus according to one embodiment of the present invention, FIG. 2 is a perspective view of the resin component assembly, FIG. 3 is a plan view of another resin component assembly, and FIG. FIG. 4 is a sectional view of the same, and FIG. 5 is a schematic diagram of a conventional resin-molded component annealing apparatus. 9 ... resin parts assembly, 10 ... magnetron, 12 ... applicator.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 青木 勝 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 昭64−87334（ＪＰ，Ａ) ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Masaru Aoki 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-64-87334 (JP, A)
Claims (3)
品集合体を形成し、この樹脂部品集合体を誘電加熱して
なる樹脂部品集合体のアニール方法。1. A method for annealing a resin component assembly, comprising forming a resin component assembly by taping a resin molded component in advance, and dielectrically heating the resin component assembly.
プもしくはキャリアテープは誘電正接の小さい材料であ
ることを特徴とする特許請求の範囲第１項記載の樹脂部
品集合体のアニール方法。2. The method for annealing a resin component assembly according to claim 1, wherein the cover tape or the carrier tape for taping the resin molded component is made of a material having a small dielectric loss tangent.
リエチレン樹脂であることを特徴とする特許請求の範囲
第１項記載の樹脂部品集合体のアニール方法。3. The method of claim 1, wherein the cover tape or the carrier tape is made of polyethylene resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15524388A JP2583978B2 (en) | 1988-06-23 | 1988-06-23 | Annealing method for resin parts assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15524388A JP2583978B2 (en) | 1988-06-23 | 1988-06-23 | Annealing method for resin parts assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01320140A JPH01320140A (en) | 1989-12-26 |
| JP2583978B2 true JP2583978B2 (en) | 1997-02-19 |
Family
ID=15601662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15524388A Expired - Fee Related JP2583978B2 (en) | 1988-06-23 | 1988-06-23 | Annealing method for resin parts assembly |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2583978B2 (en) |
-
1988
- 1988-06-23 JP JP15524388A patent/JP2583978B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01320140A (en) | 1989-12-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |