JP2577053Y2 - Heat dissipation device - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiator for radiating heat generated in a semiconductor device incorporated in a stabilized power supply or the like to the outside.

[0002]

2. Description of the Related Art In many cases, a direct current is stabilized and used as a power source of an electronic circuit, but an alternating current is sometimes used. In such a power supply, many semiconductor elements such as transistors are incorporated in the stabilization circuit in order to supply a constant voltage or current regardless of a change in load regardless of a change in ambient temperature. Since a large amount of high heat is generated at the joint, it is necessary to radiate and cool them.

FIG. 4 shows an example of the configuration of such a conventional forced air cooling type radiator. Here, reference numeral 10 denotes an air-cooled radiator, and the radiator 10 is a combination of four extruded members 10B having a substantially square cross-sectional shape in which a plurality of fins 10A are formed in a tree branch shape toward the inside. It is composed of The member 10B is formed of aluminum or an aluminum alloy. By joining these members 10B with the connecting member 10C using the screw 11, a large number of radially branched air passages 10D are obtained inside the member 10B. I am trying to be. Reference numeral 10E denotes a heat transfer portion formed on each of the molded members 10B and provided for removing heat from a semiconductor element (not shown) attached thereto.

With respect to the radiator 10 configured as described above,
A fan 13 having a substantially rectangular outer shape is attached to one end of the formed air passage 10D via a fixing member 12, and functions as a forced air-cooling type radiator. By the way, the weight of the radiator 10 according to this conventional example is 3.8 kg,
The cross-sectional area perpendicular to the air passage 10D is 6380 mm
² , and the fan 13 was 120 mm square.

Therefore, in such a forced air cooling type heat radiating device,
The air passage 10 on one side of the radiator 10 is
Air can be forcibly sent from D, and heat can be removed from the radiator 10 through the radially formed fins 10A, and the heat is generated in the semiconductor element (not shown) through the heat transfer unit 10E according to the heat radiation. The generated heat can be wasted to the outside.

[0006]

However, since the conventional forced air-cooled radiator as described above is configured so as to obtain a heat radiating effect by sufficiently securing the surface area of the fin 10A, the air-cooled radiator is required. Fin 10A of vessel 10
The forming structure is complicated, the weight is heavy due to assembling the four molded members, and the four molded members 10B are assembled with the screws 11 via the coupling member 10C, which is troublesome. In addition, since each heat transfer portion 10E is in a state of extending laterally from each molding member 10B, the radiator 10 itself, particularly the space volume occupied in the width direction thereof, becomes large, and accordingly, the device as a whole becomes bulky. Become. Furthermore, cooling is not performed efficiently for a large heat radiation area. Furthermore, it is troublesome to fix the semiconductor elements to the heat transfer portions 10E formed at four locations by bolts or the like.

An object of the present invention is to pay attention to such a conventional problem. To solve the problem, a compact and light-weight, efficient cooling effect can be obtained, and it is inexpensive and suitable for a stabilized power supply. A heat radiating device is provided.

[0008]

In order to achieve the above object, the present invention has an air passage to which air for heat dissipation is supplied by a blowing means, and heat transfer of an outer shell in which the air passage is formed. In a heat radiator configured to remove heat generated from a semiconductor element provided in a heat transfer unit through a heat dissipating device, a heat dissipator including a comb-shaped molding block is provided. One of the adjacent tooth molds and the other tooth between the tooth tip of one of the tooth molds and the base of the other tooth mold so as to interpose the space between the tooth dies of the molding block. An air passage communicating with a space between the mold and the mold is formed so as to be close to the heat transfer portion, so that air from the blowing means is concentrated and distributed to the air passage.

[0009]

According to the heat dissipating device of the present invention, the heat dissipating device including the comb-shaped molding block is provided so that the tooth of one molding block is interposed in the space between the teeth of the other molding block. Combined in opposition to each other, heat is transferred between the tip of one tooth form and the root of the other tooth form through an air passage communicating with the space between the adjacent one tooth form and the other tooth form. Is formed so as to be close to the air passage, and the air from the air blowing means is configured to be intensively distributed to the air passage. Will be efficiently taken away by the air.

[0010]

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings.

FIG. 1 shows a configuration of an example of a heat radiating device according to the present invention. Here, reference numeral 1 denotes an example of the heat radiating device according to the present invention in a state of being integrally assembled.

That is, the air-cooled radiator 1 according to this embodiment
Are members (hereinafter referred to as forming blocks) 1B and 1 which have a pair of upper and lower substantially comb-shaped cross sections as shown in FIG.
It is configured by a combination with B. In addition, all of these molding blocks 1B, 1B can be extruded and molded to have the same cross section and the same shape using the same mold material. FIG. 2 shows a state in which the molded blocks 1B and 1B according to the present embodiment are assembled upside down.

Thus, each molding block 1
As shown in FIG. 1, B and 1B each have a plate-shaped heat transfer portion 1E to which a semiconductor element 2 such as a transistor is attached for heat radiation, and a predetermined distance P is provided on one surface of the heat transfer portion 1E. The radiation fins 1A having a predetermined thickness T are provided in a plurality of rows so as to maintain the thickness. Of these fins 1A, the outermost one (hereinafter referred to as an outer wall forming part) is fitted with a mating block so as to be able to engage with a counterpart forming block assembled in a vertical shape. The engaging portions 1F and 1G are formed along the longitudinal direction of the radiator 1.

The feature of the radiator 1 of the present embodiment is that it is located between the root of the heat transfer portion 1E on the back side of the comb-shaped radiating fin 1A and the tip of the other radiating fin 1A. That is, an air passage 1H wider than the others is provided. This means that in the other radiator 1, the radiating fin 1A of one member 1B and the radiating fin 1A of the other member are arranged in parallel with each other so as to keep a predetermined narrow interval therebetween, and both fins 1A A narrow air passage 1K is formed therebetween, whereas the air passage 1H does not include the heat radiation fins 1A. Therefore, the air resistance is smaller than that of the air passage 1K, so that a sufficient amount of air can flow.

When assembling such an air-cooled radiator 1, in the case of the present embodiment, for example, two identically shaped molding blocks 1B, 1B are kept upright and mutually engaged, and the engaging portions 1G and 1F are attached. The engagement positions in the up and down direction are made to coincide with each other, and as shown in FIG.
F and each other as shown by white arrows.

After the fitting and assembly, the engaging portion 1
Both ends of the F and 1G may be fixed with scissors with a punch or the like, or the entire length may be scissors, or both sides may be bonded with metal.

Returning to FIG. 1, the overall configuration of the forced air cooling type heat radiating device according to the present embodiment will be described. A fan 3 is mounted on one surface of the radiator 1 assembled as described above, and a semiconductor element 2 such as a transistor is connected to a connection terminal 2A of a heat transfer portion 1E which is an upper and lower part in FIG. It is installed with the outside facing. Reference numeral 4 denotes a pressing member (hereinafter referred to as a spring pressing member) formed by a springy leaf spring for pressing one surface of the semiconductor element 2 against the heat transfer portion 1E of the radiator 1 for heat radiation. Is a fixing screw for fixing to the heat transfer section 1E.

Here, the spring holding member 4 and the fixing screw 5 will be described in detail.

Semiconductor element 2 provided on heat transfer section 1E
Since the connection terminals 2A are fixed to the wiring board 6 as will be described later, their relative positions are determined in advance. Therefore, the relative position of the claw portion 4A that contacts the upper surface of each of the semiconductor elements 2 of the spring holding member 4 is formed in accordance therewith. In the case of this example, the semiconductor elements 2 having substantially the same shape are arranged at symmetrical positions with respect to the longitudinal axis of the radiator 1. Therefore, the spring holding member 4 is also formed symmetrically, and the central portion thereof is fixed by a fixing screw 5 in FIG.
By screwing into the screw holes 7 provided in the heat transfer surface 1E as shown in FIG.

When the semiconductor element 2 is attached to the heat transfer section 1E, the semiconductor element 2 is previously set on each of the heat transfer sections 1E formed on the upper and lower surfaces of the radiator 1 so as to occupy the position shown in FIG. Each semiconductor element 2 is positioned using a jig (not shown). The connection terminals 2A are connected to the upper and lower rows of the semiconductor elements 2 via the wiring board 6 and through holes (not shown) provided at predetermined positions on the circuit.

Thus, the rows of the semiconductor elements 2 connected in advance to the substrate 6 are arranged in the upper and lower heat transfer portions 1E of the radiator 1, and are fixed by the spring holding member 4 and the fixing screw 5. Is what you do. In FIG. 3, parts related to the wiring board 6 and a fan are omitted for easy understanding of the contents of assembly.

In the forced air-cooling type radiator constructed as described above, the radiator 1 and the fan 3 are housed and fixed in, for example, a case (not shown). Further, the wiring board 6 can be held by a frame provided in connection with the case via a holder member (not shown). And fan 3
The air is forcibly sent into the air passages 1H and 1K by the above, but the highest temperature of the heat transmitted from the semiconductor element 2 is a portion of the heat transfer section 1E in contact with the semiconductor element 2.

The radiator, the device for fixing the semiconductor element to the radiator, and the entire configuration of the radiator according to the present invention have been described above. The case where the semiconductor element 2 is mounted will be described with reference to FIG. 5 as a comparative example.

Also in the case of this embodiment, the relative position on the heat transfer surface 1E of the radiator 1 of the semiconductor element 2 to which the connection terminals 2A are respectively attached to the wiring board 6 is set in advance. It is necessary to fix each semiconductor element 2 in a state where each semiconductor element 2 is pressed at each position. Therefore, in the case of the present example, the heat transfer surface 1E is provided with one hole in the heat transfer surface in accordance with the fixing hole 2B of each semiconductor element 2 disposed at the fixed position.
It is necessary to drill a screw hole 8 in E and attach it with the fixing screw 9 in a state where the fixing hole 2B and the screw hole 8 are accurately aligned with each other, which requires a great deal of labor.

In comparison with such a conventional semiconductor fixing method, in the semiconductor fixing device applied to an example of the heat radiating device according to the present invention, each semiconductor element 2 positioned on the heat transfer surface 1E is held by a spring pressing member. At 4, it can be easily crimped using the fixing screw 5.

Now, the semiconductor element 2 is fixed by a semiconductor fixing device applied to an example of the heat dissipation device according to the present invention,
Further, in the forced air cooling type heat radiating device assembled as described above, the amount of air blown from the fan 3 is increased in the air passage 1H having the lowest air resistance on the back side of the heat transfer portion 1E, and the amount of air is increased. As a result, the most heat is dissipated from this vicinity, and the air passage 1K formed by the fins 1A having a relatively low temperature due to such air cooling has a large air resistance, so that the air passage 1K has a higher air resistance than the air passage 1H. As a result, the air volume is suppressed.

As described above, since the heat is efficiently removed from the high temperature portion and the waste heat is discharged to the outside, the heat radiation waste heat can be effectively discharged by the light and compact radiator as compared with the related art. In addition, since each semiconductor element can be easily mounted on the heat transfer surface, it is easy to assemble and can contribute to the provision of an inexpensive forced air cooling type heat radiating device.

[0029]

[0030]

As described above, according to the present invention, the radiator composed of a comb-shaped molding block is formed by disposing the radiator of one molding block in the space between the molding dies of the other molding block. Combine with each other so as to be interposed between them and communicate with the space between the adjacent one tooth type and the other tooth type between the tip of one tooth type and the base of the other tooth type. The air passage is formed so as to be close to the heat transfer portion, and the air from the blower is configured to be intensively distributed to the air passage, so that the transfer generated from the semiconductor element disposed in the heat transfer portion is generated. Heat is efficiently removed by the air in the air passage.
As a result, it is possible to provide an efficient cooling effect that is compact and light in weight, provides an efficient cooling effect, is inexpensive and is suitable for a stabilized power supply, and is configured by simply opposing a conventional comb-shaped radiator. There is an advantage that a more efficient heat dissipation device can be provided as compared with the heat dissipation device described above.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration of an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a radiator suitable for applying the present invention.

FIG. 3 is an exploded view showing an exploded view of a main part according to the present invention;

FIG. 4 is a perspective view illustrating a configuration example of a heat dissipation device according to a conventional example.

FIG. 5 is a perspective view showing a state in which the semiconductor element is fixed by a fixing device of a conventional system instead of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 radiator 1A radiating fin 1B assembly member 1E heat transfer portion 1F, 1G engaging portion 1H, 1K air passage 2 semiconductor element (transistor) 2A connection terminal 3 fan 4 spring holding member 4A claw portion 5 fixing screw 6 wiring board 7 screw Hole

Claims (1)

(57) [Scope of request for utility model registration] 1. A semiconductor device having an air passage through which air for heat radiation is supplied by a blowing means, and disposed in the heat transfer portion via a heat transfer portion of an outer shell in which the air passage is formed. In a heat radiator configured to remove heat generated from a radiator, a radiator composed of a comb-shaped molding block is disposed such that the tooth of one molding block is interposed in the space between the teeth of the other molding block. Air that is combined in opposition to each other and communicates with the space between the adjacent one tooth form and the other tooth form between the tip of the one tooth form and the base of the other tooth form A heat dissipation device, wherein a passage is formed so as to be close to the heat transfer portion, and air from the blower is intensively distributed to the air passage.