JP2571124Y2 - Work table for tape bonding equipment for semiconductor chips - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus for bonding a semiconductor chip wafer to a tape. More specifically, the present invention relates to a tape bonding apparatus in which the height of a worktable is varied and various tapes having different expansion rates are used. The present invention relates to a semiconductor chip tape bonding apparatus worktable capable of appropriately bonding a semiconductor chip to a work table.

[0002]

2. Description of the Related Art Generally, when manufacturing a semiconductor chip,
A tape is adhered to the wafer of each semiconductor chip, and the semiconductor chips are cut individually.

As shown in FIGS. 7 to 9, a conventional bonding apparatus used for bonding a tape to a wafer of each of these semiconductor chips includes a semiconductor chip bonding apparatus main body (not shown) and a semiconductor chip bonding apparatus. An annular worktable 1 was provided on the bonding apparatus main body so as to be movable in the front-rear, left-right, and horizontal directions. An annular groove having a predetermined width and a predetermined depth is cut out at an upper portion of the inner side groove side of the annular worktable 1, and an annular tape extension table 2 is screwed into the annular groove by a plurality of bolts 3. I was In the upper part of the groove side on the inner side of the tape extension table 2,
An annular ridge 2a is integrally provided, and the adhesive tape 4 transferred to the upper side of the tape extension table 2 is expanded by the annular ridge 2a.

[0004] That is, as shown in FIG. 10, when the adhesive tape 4 is transferred to the upper side of the annular ridge 2 a of the tape expansion table 2, the wafer having a diameter larger than the diameter of the tape expansion table 2. After the frame 5 pushes the adhesive tape from the upper side and the tape 4 is expanded, the wafer having each semiconductor chip abuts on the tape 4 so that the tape 4 is adhered to the bottom surface of the wafer. Had become.

[0005]

In the conventional work table of the semiconductor chip tape bonding apparatus constructed as described above, the work table is formed in an annular shape, and an annular groove is formed at a position above the inner groove side of the work table. Are cut out, and an annular tape extension table is screwed into the annular groove with a bolt, so that the height of the tape extension table is fixed at a constant value. For this reason, only tapes having similar expansion rates can be normally expanded, but various tapes having different expansion rates cannot be normally expanded by the fixed tape expansion table, resulting in an inferior adhesive product. There was a point.

An object of the present invention is to solve the above-mentioned problems,
Tape bonding of semiconductor chips by changing the height of the tape expansion table on the worktable and appropriately expanding various semiconductor chip bonding tapes with different expansion rates so that the semiconductor chip wafer can be bonded well to the tape An object is to provide a work table.

Another object of the present invention is to display a scale on a predetermined portion of the work table, visually check the adjustment height of the tape expansion table, and easily adjust the height of the tape expansion table to the tape expansion rate. An object of the present invention is to provide a work table for a tape bonding apparatus for semiconductor chips, which can be adapted to the following.

[0008]

SUMMARY OF THE INVENTION A semiconductor chip tape bonding apparatus work table of the present invention is an annular work table installed in a tape bonding apparatus body for bonding a tape to a semiconductor chip wafer so as to be movable in the left, right, front and rear directions. An annular tape extension table inserted into the inner groove of the worktable so as to be vertically movable, and an annular ridge projecting upward at an upper portion of the inner groove of the tape extension table. Height variable means formed on or separately from the work table inner side groove wall surface and the tape expansion table outer side wall surface to move the tape expansion table up and down to change the height of the tape expansion table; There are provided fixing means for temporarily fixing the position of the tape extension table, and graduation portions formed at predetermined positions of the work table and the tape extension table, respectively, so that the height of the tape extension table can be visually confirmed.

In one aspect, preferably, the height varying means preferably includes a male screw portion formed on an outer side wall surface of the tape extension table,
It is preferable that the workbench includes a female screw portion formed on the inner groove wall surface corresponding to the male screw portion.

In another aspect, it is preferable that the height changing means be a support plate installed below the inner groove bottom surface of the tape extension table and be connected to the support plate via a rack, a worm gear, and a worm. And a combined motor.

Further, as another preferred example of the height changing means, there is provided a support plate provided below the inner groove bottom of the tape extension table, and a solenoid engaged with the support plate via a shaft. You may.

Preferably, the scale portion includes a scale portion formed on the upper surface of the tape extension table, and a reference scale portion corresponding to the scale portion and formed on a predetermined portion of the upper surface of the worktable.

Further, preferably, the fixing means penetrates and penetrates a screw hole from a predetermined portion of an outer side wall surface of the worktable to an inner groove wall surface of the worktable, and a fixing bolt is screwed into the screw hole to fix the fixing hole. It is preferable to fix the tape extension table with bolts.

[0014]

According to the semiconductor chip tape bonding apparatus work table of the present invention, the height of the tape expansion table of the annular work table is adjusted by variable means in accordance with various expansion rates of the adhesive tape. Expand the tape appropriately,
The tape can be adhered to the bottom surface of the semiconductor chip wafer.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the drawings.

FIGS. 1 and 2 are a plan view and a half-sectional view, respectively, showing the structure of a work table for a semiconductor chip tape bonding apparatus according to the present invention. FIG. 3 is an enlarged view of a portion D of the work table of the tape bonding apparatus shown in FIG.

Referring to FIGS. 1 to 3, in the work table of the tape bonding apparatus for semiconductor chips, an annular work table 1 is installed on the main body of the tape bonding apparatus so as to be movable in the left-right and front-rear directions. An annular tape extension table 2 is inserted into the inner groove so as to be vertically movable, and an annular ridge 2a is integrally formed above the inner groove of the tape extension table 2. In addition, the work table 1 the inner groove wall and the tape expansion table 2
On the outer side wall surface, the height changing means 10 of the tape extension table 2 is provided.
Male screw part 11 and female screw part 1
The tape expansion table 2 is formed, and the tape expansion table 2 is vertically moved by manually turning the tape expansion table 2 in the forward and reverse directions, so that the height of the tape expansion table 2 is variably adjusted.

In this case, as shown in FIG. 5, the height varying means 10 of the tape extension table 2 closes the bottom surface of the inner groove of the tape extension table 2 and supports the tape extension table below the closed section. The plate 31 is installed, and the rack 32, the worm gear 3
The support plate 31 is engaged with a motor 35 via the worm 3 and the worm 34, respectively. The drive of the motor 35 raises and lowers the support plate 31, raises and lowers the tape extension table 2, and raises the height of the tape extension table 2. May be configured to be variably adjusted.

As shown in FIG. 6, a solenoid 43 is engaged with the lower side of the support plate 41 via a shaft 42, and the drive of the solenoid 43 causes the support plate 41 to move up and down, so that the tape extension table 2 Can be raised and lowered to variably adjust the height of the tape extension table 2.

Further, as a fixing means, a screw hole is pierced and penetrated from a predetermined portion of an outer side wall of the work table to an inner groove wall surface of the work table, and a fixing bolt 13 is screwed into the screw hole to expand the tape. After the height of the table 2 is variably adjusted, the tape expansion table 2 is fixed by the fixing bolt 13. A scale portion 20 is formed on the upper surface of the tape extension base 2, and a reference scale portion 21 is formed at a predetermined portion of the worktable 1 corresponding to the tape extension base 2 scale portion 20. The height of the tape expansion table 2 can be variably adjusted in accordance with the expansion rate of the tape while the user visually confirms the height of the tape expansion table 2.

FIG. 4 shows the operation of the work table of the tape bonding apparatus for semiconductor chips according to the present invention thus constructed.
As shown in (2), the height of the tape expansion table 2 is adjusted by the height changing means while checking the scale 20 in accordance with the expansion rate of the adhesive tape 4 transferred to the upper side of the annular ridge 2a of the tape expansion table 2. Adjust the length. Next, when the adhesive tape 4 is transferred to the upper side of the annular ridge 2a of the tape extension table 2, the wafer frame 5 having a diameter larger than the diameter of the tape extension table 2 is lowered, and the tape is pushed from above. The tape is expanded accordingly. Next, the wafer having each semiconductor chip is transferred and abutted on the tape 4, and the tape 4 is appropriately bonded to the bottom surface of the wafer.

[0022]

As described above, in the work table of the semiconductor chip tape bonding apparatus according to the present invention, the annular tape expansion table is inserted inside the work table, and the tape expansion table is controlled by the height variable means. The height is variably adjusted by moving up and down. For this reason, various tapes with different expansion rates are appropriately bonded to the wafer of each semiconductor chip to prevent detachment of the semiconductor chip due to conventional tape bonding failure, improve the work efficiency of the tape bonding apparatus, and reduce costs. There is an effect to get.

[Brief description of the drawings]

FIG. 1 is a plan view showing a configuration of a worktable for a semiconductor chip tape bonding apparatus according to the present invention.

FIG. 2 is a half sectional view showing the configuration of the work table of the semiconductor chip tape bonding apparatus according to the present invention;

FIG. 3 is an enlarged view of a portion D of the work table of the tape bonding apparatus shown in FIG. 2;

FIG. 4 is a diagram illustrating the operation of the work table of the semiconductor chip tape bonding apparatus according to the present invention;

FIG. 5 is a view showing a height varying means using a motor and a power transmission mechanism according to the present invention;

FIG. 6 is a view showing a height varying means using a solenoid according to the present invention.

FIG. 7 is a plan view showing a configuration of a conventional work table for a semiconductor chip tape bonding apparatus.

FIG. 8 is a half sectional view showing a configuration of a conventional work table for a tape bonding apparatus for semiconductor chips.

9 is an enlarged view of a portion B of the work table of the tape bonding apparatus shown in FIG. 8;

FIG. 10 is an operation explanatory view of a conventional work table of a tape bonding apparatus for semiconductor chips.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 work table 2 tape extension table 2a annular ridge 4 tape 10 height varying means 11 male screw section 12 female screw section 13 fixing bolt 20 scale section 21 reference scale section 31, 41 support plate 32 rack 33 worm gear 34 worm 35 motor 42 Shaft 43 solenoid Note that the same reference numerals in the drawings indicate the same or corresponding parts.

Claims (6)

(57) [Scope of request for utility model registration] An annular worktable (1) installed in a tape bonding apparatus main body for bonding a tape to a semiconductor chip wafer so as to be movable in the left, right, front and rear directions, wherein the worktable (1) is provided inside the worktable (1). An annular tape extension table (2) inserted into the side groove so as to be vertically movable; an annular ridge (2a) projecting upward at a position above the inner groove of the tape extension table (2); The work table (1) is formed on the inner groove wall surface and the tape expansion table (2) outer wall surface or separately, and the tape expansion table (2) is moved up and down to move the tape expansion table (2).
Height changing means (10) for changing the height of the tape expansion table (2); fixing means for temporarily fixing the position of the tape expansion table (2); and forming the work table (1) and the tape expansion table (2) at predetermined portions, respectively. A scale part (20) for visually confirming the height of the tape extension table (2); 2. The height changing means includes: a male screw portion (11) formed on an outer side wall surface of the tape extension table (2); and a male screw portion on an inner groove wall surface of the work table (1). (11)
2. The worktable for bonding a semiconductor chip according to claim 1, wherein said work table comprises a female screw portion (12) formed so as to correspond to (1). 3. The height changing means includes: a support plate (31) installed below an inner groove bottom surface of the tape extension table (2); a rack (32) on the support plate (31); (3
3. The workbench of claim 1, further comprising 3) and a motor (35) engaged via a worm (34). 4. The height changing means includes: a support plate (41) installed below an inner groove bottom of the tape extension table (2); and a shaft (42) connected to the support plate (41). 2. The worktable of claim 1, further comprising a solenoid (43) engaged and engaged with the semiconductor chip. 5. The scale section (2) formed on an upper surface of the tape extension table (2).
And a reference scale (21) formed at a predetermined position on an upper surface of the worktable (1) corresponding to the scale (20). . 6. The fixing means, wherein a screw hole is drilled and penetrated from a predetermined portion of an outer side wall surface of the worktable (1) to an inner groove wall surface of the worktable, and a fixing bolt (13) is screwed into the screw hole. 2. A work table for a tape bonding apparatus for semiconductor chips according to claim 1, wherein said tape expansion table (2) is fixed by said fixing bolts (13).