JP2568164Y2 - Multiple optical coupling device - Google Patents

Multiple optical coupling device

Info

Publication number
JP2568164Y2
JP2568164Y2 JP1990107099U JP10709990U JP2568164Y2 JP 2568164 Y2 JP2568164 Y2 JP 2568164Y2 JP 1990107099 U JP1990107099 U JP 1990107099U JP 10709990 U JP10709990 U JP 10709990U JP 2568164 Y2 JP2568164 Y2 JP 2568164Y2
Authority
JP
Japan
Prior art keywords
light receiving
light
optical coupling
receiving element
coupling device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990107099U
Other languages
Japanese (ja)
Other versions
JPH0463656U (en
Inventor
勝則 真喜屋
一夫 楠田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1990107099U priority Critical patent/JP2568164Y2/en
Priority to US07/772,883 priority patent/US5245198A/en
Priority to DE4133773A priority patent/DE4133773C2/en
Publication of JPH0463656U publication Critical patent/JPH0463656U/ja
Priority to US08/063,699 priority patent/US5285076A/en
Application granted granted Critical
Publication of JP2568164Y2 publication Critical patent/JP2568164Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【考案の詳細な説明】 <産業上の利用分野> 本考案は、光結合装置(フオトカプラ)に関し、特
に、複数の受光素子を有する多連式の光結合装置に係
る。
DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an optical coupler (photocoupler), and more particularly to a multiple optical coupler having a plurality of light receiving elements.

<従来技術> 近年の市場の要望として、光結合装置(フオトカプ
ラ)の小型化、すなわち、実装密度の向上のため、ピン
数を減らした多連型光結合装置が必要となりつつある。
例えば、プログラマブルコントローラにおける入出力間
のアイソレーシヨンには64あるいはそれ以上の光結合装
置が必要とされる。
<Prior Art> In recent years, there has been a demand in the market for a multiple-type optical coupling device with a reduced number of pins in order to reduce the size of an optical coupling device (photocoupler), that is, to improve the mounting density.
For example, isolation between input and output in a programmable controller requires 64 or more optical coupling devices.

しかし、第3図に示すように、通常に対向配置された
発光素子1および受光素子2を四個づつ連ねたとして、
その端子数は20個になつてしまう。特に、受光素子2側
の端子数は12個となり、故に、光結合装置全体の実装密
度をあげるのに故障をきたしてしまう。
However, as shown in FIG. 3, assuming that four light-emitting elements 1 and four light-receiving elements 2 which are normally opposed to each other are connected,
The number of terminals will be 20. In particular, the number of terminals on the light receiving element 2 side is twelve. Therefore, a failure occurs in increasing the mounting density of the entire optical coupling device.

そこで、複数の受光素子2を有するものにおいて、共
通リードを用いて端子数を減らすことが考えられる。す
なわち、標準DIP(パツケージ)のサイズと受光素子の
サイズから、第4図の如く、二連のオプテイカルICであ
る受光素子2の電源端子Vccとグランド端子GNDとを夫々
共通リードにして端子本数を減らし、出力端子Voを二個
有するものがある。
Therefore, in a device having a plurality of light receiving elements 2, it is conceivable to reduce the number of terminals by using a common lead. In other words, as shown in FIG. 4, the power supply terminal Vcc and the ground terminal GND of the light receiving element 2 which is a double optical IC are made common leads and the number of terminals is determined based on the size of the standard DIP (package) and the size of the light receiving element. Some have two output terminals Vo.

なお、第4図中、3はボンデイングワイヤ、4はリー
ド端子Vcc,GND,Vo1,Vo2の折曲部を示している。
In FIG. 4, 3 indicates a bonding wire, and 4 indicates a bent portion of the lead terminals Vcc, GND, Vo1, Vo2.

<考案が解決しようとする課題> 第4図のリードフレームの場合、電源端子Vccとグラ
ンド端子GNDを共通リードとして複数の受光素子2から
のワイヤボンデイングを可能とするような形状が必要と
なる。
<Problem to be Solved by the Invention> In the case of the lead frame shown in FIG. 4, a shape that enables wire bonding from a plurality of light receiving elements 2 using the power supply terminal Vcc and the ground terminal GND as common leads is required.

しかしながら、光結合装置においては、IC等のリード
フレームと異なり、受発光距離を確保するためリードフ
レームに折曲部4(オフセツト)を必要とし、リード端
子Vcc,GNDの折曲部4の折り曲げ精度が光結合装置の精
度に大きく影響を与える。すなわち、折曲部4の曲げ寸
法に誤差を生じると、受光素子搭載片(ヘツダー部)7a
および接続片7bが夫々一本のリード端子GND,Vccのみに
より支持されているので、対向配置された受発光素子間
の対向距離がくるいやすく、受光素子2の光検出精度や
絶縁耐圧が変化しやすい。そして、リード端子Vcc,GND
の先端部5が基端部6より離れれば離れる程、先端部5
の受発光間の対向距離の変化は大となつてしまい、故
に、光結合装置の正常動作を確保しようとすれば、共通
リードVcc,GNDをこれ以上伸ばすのは困難となる。
However, unlike a lead frame such as an IC, the optical coupling device requires a bent portion 4 (offset) in the lead frame to secure a light receiving / emitting distance, and the bending accuracy of the bent portion 4 of the lead terminals Vcc and GND. Greatly affects the accuracy of the optical coupling device. That is, if an error occurs in the bending dimension of the bent portion 4, the light receiving element mounting piece (header portion) 7a
And the connection piece 7b is supported by only one lead terminal GND and Vcc, respectively, so that the facing distance between the opposed light receiving and light emitting elements is easily increased, and the light detection accuracy and the withstand voltage of the light receiving element 2 change. It's easy to do. And lead terminals Vcc, GND
The farther the distal end portion 5 is from the proximal end portion 6, the more the distal end portion 5
The change of the facing distance between the light receiving and the light emitting becomes large, so that it is difficult to extend the common leads Vcc and GND any longer in order to ensure the normal operation of the optical coupling device.

また、第4図の場合、受光素子2をマウントするグラ
ンド端子GNDのヘツダー部7aにGNDワイヤ3aをうつ必要が
あり、Agペーストが付着する受光素子2の周辺ではワイ
ヤボンデイングが困難なため、グランド端子GNDの結線
部8との間に隙間をあけて受光素子からひき離す必要が
あるので、リード端子Vcc,GNDの先端部5が基端部6よ
りさらに離間してしまい、これ以上共通リードVcc,GND
を伸ばすのはさらに一層困難である。
In addition, in the case of FIG. 4, the ground wire 3a needs to be attached to the header 7a of the ground terminal GND for mounting the light receiving element 2, and the wire bonding is difficult around the light receiving element 2 to which the Ag paste is attached. It is necessary to separate the lead terminal Vcc from the light receiving element by leaving a gap between the terminal GND connection portion 8 and the lead terminal Vcc, and the tip 5 of the GND is further separated from the base 6 so that the common lead Vcc is no longer provided. , GND
Is even more difficult to extend.

以上の制約下において、光結合装置の小型化を実現す
るために、二連より多くの受光素子2を同時に封止して
光結合素子を構成するのは困難であった。
Under the above-described restrictions, it is difficult to form an optical coupling element by simultaneously sealing more than two light receiving elements 2 in order to realize a downsized optical coupling device.

なお、端子数を減らすために、第4図に示す回路を二
つ以上並置させて合計四個以上の受光素子2を同一軸上
に並べる方式も考えられるが、モールド時において二以
上の回路をモールド金型にセツトする作業が非常に煩雑
となり作業効率が低下すると同時に、依然として精度の
向上を図り得ないといつた欠点がある。
In order to reduce the number of terminals, a method in which two or more circuits shown in FIG. 4 are juxtaposed and a total of four or more light receiving elements 2 are arranged on the same axis can be considered. The work of setting the mold is very complicated, and the work efficiency is reduced. At the same time, there is a drawback that the accuracy cannot be improved.

本考案は、上記課題に鑑み、端子数を減少させて小型
化を図り得、かつ、受発光間の対向距離を一定として安
定した構造を得る光結合装置の提供を目的とする。
The present invention has been made in view of the above problems, and has as its object to provide an optical coupling device that can be reduced in size by reducing the number of terminals and that has a stable structure with a constant facing distance between light receiving and emitting.

<課題を解決するための手段> 本考案による課題解決手段は、第1,2図の如く、折曲
部19を備えた発光側リードフレームに搭載された複数個
の発光素子11と、折曲部19を備えた受光側リードフレー
ム14に搭載された複数個の受光素子12とが対向配置さ
れ、これらが多連式に光学的に結合された多連式光結合
装置において、前記受光側リードフレーム14は、前記受
光素子12が多連式に搭載される共通の受光素子搭載片14
eと、前記折曲部19を備えたグランド端子14aとを有し、
該グランド端子14aは、前記受光素子搭載片14eを前記受
光素子12が並置される方向の左右二点で支持して共通リ
ードとされたものである。
<Means for Solving the Problem> As shown in FIGS. 1 and 2, the problem solving means according to the present invention comprises a plurality of light emitting elements 11 mounted on a light emitting side lead frame having a bent portion 19, In a multiple optical coupling device in which a plurality of light receiving elements 12 mounted on a light receiving side lead frame 14 having a portion 19 are arranged oppositely and optically coupled in a multiple way, the light receiving side lead The frame 14 is a common light receiving element mounting piece 14 on which the light receiving elements 12 are mounted in a multiple
e, a ground terminal 14a having the bent portion 19,
The ground terminal 14a supports the light receiving element mounting piece 14e at two points on the left and right sides in the direction in which the light receiving elements 12 are juxtaposed and serves as a common lead.

<作用> 上記課題解決手段において、光結合装置の製造時に
は、発光側リードフレーム上に発光素子11を搭載すると
ともに、受光側リードフレーム14上に複数の受光素子12
を多連式に搭載し、夫々を内部結線した後、発光素子11
と受光素子12とを対向配置させて樹脂封止する。
<Operation> In the above-mentioned means for solving the problems, in manufacturing the optical coupling device, the light emitting element 11 is mounted on the light emitting side lead frame and the plurality of light receiving elements 12 are mounted on the light receiving side lead frame 14.
Are mounted in a multiple connection, and after each is internally connected, the light emitting element 11
And the light receiving element 12 are opposed to each other and are sealed with a resin.

このとき、グランド端子14aを、受光素子搭載片14eを
左右二点で支持する共通リードとしているので、受光素
子12を三連以上の多連式とする際にも、受光素子搭載片
を一点のみで支持する従来例に比べて、受光側リードフ
レーム14の折り曲げ精度の誤差が生じにくくなる。そう
すると、発光素子11との間の受発光距離を容易に一定に
保つことができ、受光素子12の光検出精度や、光結合装
置の絶縁耐圧を安定化させることができる。
At this time, since the ground terminal 14a is a common lead that supports the light-receiving element mounting piece 14e at two points on the left and right, even when the light-receiving element 12 is a multiple type of three or more, only one light-receiving element mounting piece is required. The bending accuracy of the light-receiving-side lead frame 14 is less likely to cause an error than in the conventional example supported by the above. This makes it possible to easily maintain a constant light receiving / emitting distance between the light emitting element 11 and stabilize the light detection accuracy of the light receiving element 12 and the withstand voltage of the optical coupling device.

したがって、端子数を減らして高密度実装が可能とな
り、パツケージサイズの小型化を図り得るのみならず、
安定した構造を得ることができる。
Therefore, the number of terminals can be reduced and high-density mounting becomes possible, and not only can the package size be reduced,
A stable structure can be obtained.

<実施例> 以下、本考案の一実施例を図面に基づき説明する。<Embodiment> An embodiment of the present invention will be described below with reference to the drawings.

第1図は本考案の一実施例の光結合装置におけるリー
ドフレームの形状を示す平面図、第2図は同じく光結合
装置の結線図である。
FIG. 1 is a plan view showing the shape of a lead frame in an optical coupling device according to an embodiment of the present invention, and FIG. 2 is a connection diagram of the optical coupling device.

一般に、プログラマブルコントローラのI/O部に使用
される光結合装置(フオトカプラ)は、発光素子側の入
力にメカニカルリレーを用いるため、発生するチヤタリ
ングを出力側の受光素子でキヤンセルするよう、受光素
子は、受光用フオトダイオードと遅延回路とを1チツプ
に集積化して構成されている。
In general, an optical coupling device (photocoupler) used for an I / O section of a programmable controller uses a mechanical relay for an input on a light emitting element side, so that a light receiving element is set so that generated chattering is canceled by a light receiving element on an output side. The light receiving photodiode and the delay circuit are integrated into one chip.

そして、同一パツケージ内に発光部と受光部とを有
し、電気信号を発光部にて一旦光に変換し、この光を受
光部にて再び電気信号に変換するものである。
A light emitting unit and a light receiving unit are provided in the same package. The light emitting unit temporarily converts the electric signal into light, and the light receiving unit converts the light into an electric signal again.

図示の如く、本実施例の光結合装置は、発光側リード
フレーム(図示せず)に搭載された複数個(四個)の発
光素子11(発光ダイオード)と、受光側リードフレーム
14に搭載された複数個(四個)の受光素子12とが対向配
置され、これらが多連式にて光学的に結合されたもので
ある。
As shown, the optical coupling device of the present embodiment includes a plurality of (four) light emitting elements 11 (light emitting diodes) mounted on a light emitting side lead frame (not shown) and a light receiving side lead frame.
A plurality (four) of light receiving elements 12 mounted on 14 are arranged to face each other, and these are optically coupled in a multiple system.

前記受光側リードフレーム14は、第1図の如く、受光
素子12が搭載される一対のグランド端子(GND)14aと、
受光素子12の出力電極とボンデイングワイヤ18を介して
連結される四個の出力端子(Vo1〜Vo4)14bと、両端に
一対に配された電源端子(Vcc)14cと、これらリード端
子14a,14b,14cを片持ち支持するタイバー14dとから構成
されている。
As shown in FIG. 1, the light receiving side lead frame 14 includes a pair of ground terminals (GND) 14a on which the light receiving element 12 is mounted,
Four output terminals (Vo1 to Vo4) 14b connected to the output electrode of the light receiving element 12 via a bonding wire 18, a pair of power terminals (Vcc) 14c at both ends, and these lead terminals 14a and 14b. , And a tie bar 14d that cantileverly supports 14c.

前記グランド端子14aは、一枚の共通の受光素子搭載
片14eを左右二点で支持して共通リードとされ、前記電
源端子14cは、搭載片14eを回避して引回しされた接続片
14fを左右二点で支持して共通リードとされている。
The ground terminal 14a is a common lead that supports one common light receiving element mounting piece 14e at two points on the left and right, and the power terminal 14c is a connection piece that is routed around the mounting piece 14e.
14f is supported at two points on the left and right sides and is a common lead.

前記受光素子搭載片14eは、四個の受光素子12がダイ
ボンドされ、かつ共通リードとして細長く、面積が大き
く形成されることから、熱膨張によるリードの収縮が問
題となるが、収縮をおさえるよう、受光素子12をダイボ
ンドするエリア以外の部分に収縮防止用孔16が形成され
ている。
The light-receiving element mounting piece 14e, the four light-receiving elements 12 are die-bonded, and since the common lead is elongated and formed to have a large area, shrinkage of the lead due to thermal expansion becomes a problem. A hole 16 for preventing shrinkage is formed in a portion other than the area where the light receiving element 12 is die-bonded.

そして、搭載片14eは、ボンデイングワイヤ18より受
光素子12の接地電極部に内部結線され、電源端子14c
は、ボンデイングワイヤ18により受光素子12の入力電極
部に内部結線されている。これにより、第2図のような
回路が構成されることになる。
The mounting piece 14e is internally connected to the ground electrode portion of the light receiving element 12 via the bonding wire 18, and the power supply terminal 14c
Are internally connected to an input electrode portion of the light receiving element 12 by a bonding wire 18. Thus, a circuit as shown in FIG. 2 is formed.

なお、図中19は受発光距離を確保するため各リード端
子14a,14b,14cに設けられた折曲部であつて、第1図の
リード端子番号〜は、第2図のそれと対応させてい
る。
In the drawing, reference numeral 19 denotes a bent portion provided on each of the lead terminals 14a, 14b, 14c in order to secure a light receiving / emitting distance, and the lead terminal numbers in FIG. 1 correspond to those in FIG. I have.

上記光結合装置は次のように製造される。 The optical coupling device is manufactured as follows.

まず、発光側リードフレーム上に発光素子11を搭載す
るとともに、受光側リードフレーム14上に受光素子12を
搭載する。
First, the light emitting element 11 is mounted on the light emitting side lead frame, and the light receiving element 12 is mounted on the light receiving side lead frame 14.

次に、第1図の如く、受光素子12の電極部と受光側リ
ードフレーム14の各リード端子14a,14b,14cとをボンデ
イングワイヤ18を用いて夫々内部結線を施す。
Next, as shown in FIG. 1, an internal connection is made between the electrode portion of the light receiving element 12 and each lead terminal 14a, 14b, 14c of the light receiving side lead frame 14 by using a bonding wire 18.

このとき、一枚の受光素子搭載片14eをグランド端子1
4aにて左右二点で支持して共通リードとし、接続片14f
を電源端子14cにて左右二点で支持して共通リードとし
ているので、第1図の如く、四つの受光素子12を、Vcc,
GNDを共通としたワイヤレイアウトが可能となる。
At this time, one light receiving element mounting piece 14e is connected to the ground terminal 1.
At 4a, it is supported at two points on the left and right to form a common lead, and the connection piece 14f
Are supported by the power supply terminal 14c at two points on the left and right sides to form a common lead. As shown in FIG. 1, the four light receiving elements 12 are connected to Vcc,
Wire layout with common GND is possible.

その後、発光素子11および受光素子12が対向するよ
う、両リードフレームをモールド金型にセツトし、発光
素子11および受光素子12を一対とした間に透明シリコー
ン樹脂を充填して光パスを形成し、さらに不透明エポキ
シ樹脂にてトランスフアーモールド成形を行なう。ある
いは発光素子11および受光素子12の各対を半透明エポキ
シ樹脂にて封止し、その後不透明エポキシ樹脂で封止す
る二重トランスフアーモールド成形して光結合装置を完
成させる。
Thereafter, both lead frames are set in a mold so that the light emitting element 11 and the light receiving element 12 face each other, and a transparent silicone resin is filled between the pair of the light emitting element 11 and the light receiving element 12 to form an optical path. Then, transfer molding is performed using an opaque epoxy resin. Alternatively, each pair of the light emitting element 11 and the light receiving element 12 is sealed with a translucent epoxy resin, and then double transfer molded with an opaque epoxy resin to complete the optical coupling device.

このように、グランド端子14aは、受光素子搭載片14e
を左右二点で支持して共通リードとしているので、受光
素子12を三連以上の多連式とする際にも、第4図に示す
受光素子搭載片を一点のみで支持する従来例のように受
光側リードフレーム14の折曲部19の折り曲げ精度の誤差
が生じにくくなり、発光素子11との間の受発光距離を容
易に一定に保つことができ、受光素子12の光検出精度
や、光結合装置の絶縁耐圧を安定化させることができ
る。
As described above, the ground terminal 14a is connected to the light receiving element mounting piece 14e.
Are supported at two points on the left and right sides to form a common lead. Therefore, even when the light receiving element 12 is a multiple type of three or more, the light receiving element mounting piece shown in FIG. 4 is supported at only one point as in the conventional example. The bending accuracy of the bending portion 19 of the light receiving side lead frame 14 is less likely to occur, and the light receiving and emitting distance between the light emitting element 11 and the light receiving element 12 can be easily kept constant. The dielectric strength of the optical coupling device can be stabilized.

したがつて、端子数を減らして高密度実装が可能とな
り、パツケージサイズの小型化を図り得るのみならず、
安定した構造を得ることができる。
Therefore, the number of terminals can be reduced to enable high-density mounting, and not only can the package size be reduced,
A stable structure can be obtained.

なお、本考案は、上記実施例に限定されるものではな
く、本考案の範囲内で上記実施例に多くの修正および変
更を加え得ることは勿論である。
It should be noted that the present invention is not limited to the above embodiment, and it is needless to say that many modifications and changes can be made to the above embodiment within the scope of the present invention.

例えば、上記実施例では、受光素子を四連に設けてい
たが、三連または五連以上であつてもよい。ここで、特
に、受光素子を六連や八連に設ける場合、第4図に示し
た従来の二連式共通リードを複数個使用する場合に比較
して、その端子数が大幅に減少し、パツケージサイズの
飛躍的な小型化を図り得る。
For example, in the above embodiment, four light receiving elements are provided, but three or five or more light receiving elements may be provided. Here, in particular, when the light receiving elements are provided in six or eight stations, the number of terminals is greatly reduced as compared with the case where a plurality of the conventional dual common leads shown in FIG. 4 are used. The size can be dramatically reduced.

<考案の効果> 以上の説明から明らかな通り、本考案によると、受光
側リードフレームは、受光素子が多連式に搭載される共
通の受光素子搭載片と、折曲部を備えたグランド端子と
を有し、グランド端子は、前記受光素子搭載片を前記受
光素子が並置される方向の左右二点で支持して共通リー
ドとされているので、端子数を減らすことができ、しか
も受光素子を三連以上の多連式とする際にも、受光素子
搭載片を一点のみで支持する従来例に比べて、受光側リ
ードフレームの折り曲げ精度の誤差が生じにくくなり、
発光素子との間の受発光距離を容易に一定に保つことが
でき、受光素子の光検出精度や、光結合装置の絶縁耐圧
を安定化させることができる。
<Effects of the Invention> As is apparent from the above description, according to the present invention, the light-receiving-side lead frame includes a common light-receiving element mounting piece on which the light-receiving elements are mounted in a multiple sequence, and a ground terminal having a bent portion. And the ground terminal is used as a common lead by supporting the light-receiving element mounting piece at two points on the left and right sides in the direction in which the light-receiving elements are juxtaposed, so that the number of terminals can be reduced. Also, when a multiple type of three or more is used, errors in bending accuracy of the lead frame on the light receiving side are less likely to occur compared to the conventional example in which the light receiving element mounting piece is supported at only one point,
The light receiving / emitting distance between the light emitting element and the light emitting element can be easily kept constant, and the light detection accuracy of the light receiving element and the withstand voltage of the optical coupling device can be stabilized.

したがつて、多連になればなるほど大幅に端子数を減
らして高密度実装が可能となり、パツケージサイズの飛
躍的な小型化を図り得るのみならず、安定した構造を得
ることができるといつた優れた効果がある。
Therefore, as the number of units increases, the number of terminals can be greatly reduced and high-density mounting becomes possible, and not only can the package size be dramatically reduced, but also a stable structure can be obtained. Has an excellent effect.

【図面の簡単な説明】[Brief description of the drawings]

第1図は本考案の一実施例の光結合装置におけるリード
フレームの形状を示す平面図、第2図は同じく光結合装
置の内部結線図、第3図は従来の光結合装置の内部結線
図、第4図は他の従来例におけるリードフレームの形状
を示す平面図である。 11:発光素子、12:受光素子、14:受光側リードフレー
ム、14a:グランド端子、14e:受光素子搭載片。
FIG. 1 is a plan view showing the shape of a lead frame in an optical coupling device according to an embodiment of the present invention, FIG. 2 is an internal connection diagram of the optical coupling device, and FIG. 3 is an internal connection diagram of a conventional optical coupling device. FIG. 4 is a plan view showing the shape of a lead frame in another conventional example. 11: light emitting element, 12: light receiving element, 14: light receiving side lead frame, 14a: ground terminal, 14e: light receiving element mounting piece.

フロントページの続き (56)参考文献 特開 昭55−44716(JP,A) 特開 昭60−41270(JP,A) 特開 昭59−132176(JP,A) 特開 昭60−68678(JP,A) 実開 昭54−103763(JP,U) 特公 昭56−45303(JP,B2)Continuation of the front page (56) References JP-A-55-44716 (JP, A) JP-A-60-41270 (JP, A) JP-A-59-132176 (JP, A) JP-A-60-68678 (JP) , A) Japanese Utility Model Showa 54-103763 (JP, U) JP-B 56-45303 (JP, B2)

Claims (1)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項1】折曲部を備えた発光側リードフレームに搭
載された複数個の発光素子と、折曲部を備えた受光側リ
ードフレームに搭載された複数個の受光素子とが対向配
置され、これらが多連式に光学的に結合された多連式光
結合装置において、前記受光側リードフレームは、前記
受光素子が多連式に搭載される共通の受光素子搭載片
と、前記折曲部を備えたグランド端子とを有し、該グラ
ンド端子は、前記受光素子搭載片を前記受光素子が並置
される方向の左右二点で支持して共通リードとされたこ
とを特徴とする多連式光結合装置。
1. A plurality of light emitting elements mounted on a light emitting side lead frame having a bent portion and a plurality of light receiving elements mounted on a light receiving side lead frame having a bent portion are arranged opposite to each other. In the multiple optical coupling device in which these are optically coupled in a multiple system, the light receiving side lead frame includes a common light receiving element mounting piece on which the light receiving elements are mounted in a multiple system, and the bending. And a ground terminal provided with a portion, the ground terminal supporting the light receiving element mounting piece at two right and left points in the direction in which the light receiving elements are juxtaposed and serving as a common lead. Optical coupling device.
JP1990107099U 1990-10-12 1990-10-12 Multiple optical coupling device Expired - Lifetime JP2568164Y2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1990107099U JP2568164Y2 (en) 1990-10-12 1990-10-12 Multiple optical coupling device
US07/772,883 US5245198A (en) 1990-10-12 1991-10-08 Optoelectronic device, metal mold for manufacturing the device and manufacturing method of the device using the metal mold
DE4133773A DE4133773C2 (en) 1990-10-12 1991-10-11 Optoelectronic device
US08/063,699 US5285076A (en) 1990-10-12 1993-05-20 Optoelectronic device, metal mold for manufacturing the device and manufacturing method of the device using the metal mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990107099U JP2568164Y2 (en) 1990-10-12 1990-10-12 Multiple optical coupling device

Publications (2)

Publication Number Publication Date
JPH0463656U JPH0463656U (en) 1992-05-29
JP2568164Y2 true JP2568164Y2 (en) 1998-04-08

Family

ID=31853455

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990107099U Expired - Lifetime JP2568164Y2 (en) 1990-10-12 1990-10-12 Multiple optical coupling device

Country Status (1)

Country Link
JP (1) JP2568164Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6402091B2 (en) * 2015-12-17 2018-10-10 株式会社東芝 Optical coupling device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58168284A (en) * 1982-03-30 1983-10-04 Nec Corp Multiple series photocoupler
JPS6068678A (en) * 1983-09-26 1985-04-19 Oki Electric Ind Co Ltd Photocoupling semiconductor device

Also Published As

Publication number Publication date
JPH0463656U (en) 1992-05-29

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