JP2560191Y2 - Alignment package for electric pins - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an alignment package for electric pins, and more particularly, to an alignment package for electric pins for interconnecting electric pins interconnecting a substrate on which an IC chip is mounted and an external circuit.

[0002]

2. Description of the Related Art In a large computer or the like, a large number of electric pins (I / O pins) are used to interconnect a ceramic substrate on which an IC chip is mounted and an external circuit. A typical example of this electrical pin has the shape shown in FIG. That is, a head 72 is formed at one end of the electric pin 70 to be connected to the conductive pad on the ceramic substrate by brazing. A columnar portion 74 having a diameter smaller than the diameter of the head 72 extends from the head 72. A brazing material 76 such as a gold-tin alloy is attached to the head 72. The other end of the columnar portion 74 forms a male contact that is in electrical contact with a female contact (not shown) provided in an external circuit.

The electric pins 70 are usually produced by a pin manufacturer, and are aligned and accommodated in a Bakelite alignment package having a large number of pin accommodation holes corresponding to the arrangement of conductive pads on a ceramic substrate. Supplied to the manufacturer. The computer manufacturer braces the electrical pins to the ceramic substrate in the next step. That is, first, another alignment jig having pin accommodation holes corresponding to the arrangement of the conductive pads on the ceramic substrate is overlaid on the alignment package. Next, the electric pins are transferred from the alignment package to the alignment jig by vacuum suction. Subsequently, the alignment jig is placed on the carbon jig having the pin accommodating holes corresponding to the arrangement of the conductive pads on the ceramic substrate in a state of vacuum suction. Next, by stopping the vacuum suction, the electric pins in the alignment jig are transferred to a carbon jig. The ceramic substrate is placed on the carbon jig, and the conductive pads and the electric pins on the ceramic substrate are solder-connected in an electric furnace.

[0004] The reason why a carbon jig is used at the time of the brazing of the electric pins is that carbon has excellent heat resistance and a low thermal expansion coefficient causes misalignment of the brazing during the brazing operation. It does not happen. The reason why the pin manufacturer does not directly insert and supply the electric pins into the carbon jig is to prevent generation of carbon powder due to friction between the electric pins and the carbon jig.

[0005]

When the conventional alignment package is used, a step of transferring electric pins from the alignment package to another alignment jig and a step of transferring the electric pins to a carbon jig are required. If there are many transfer steps, there is a high possibility that a state in which the electrical pins have not been transferred occurs, which causes a failure of a computer as a final product. In addition, since a vacuum suction step is required, there is a problem that the vacuum suction equipment becomes indispensable and the process becomes complicated.

Further, the conventional alignment package has a problem that the manufacturing cost is high because thousands of pin receiving holes are formed in the bakelite plate by a drill or the like. When the alignment package is formed by injection molding, problems such as a non-negligible cumulative error in the pitch of the pin accommodation holes and warping of the alignment package are inevitable.

Therefore, the present invention does not require an alignment package that solves the above-mentioned problems, that is, a vacuum suction device,
An object of the present invention is to provide an alignment package that can be manufactured at low cost and with high accuracy while reducing the steps of transferring electric pins.

[0008]

According to the present invention, there is provided an alignment package for electrical pins, comprising: an alignment block for aligning and receiving a predetermined number of electrical pins; a frame for storing a predetermined number of the alignment blocks in a matrix; A lid that is slidably mounted along a guide portion formed on one surface of the body, covers one end of each of the electric pins, and prevents the electric pins from falling off.

[0009]

The alignment package containing the electric pins is placed on the carbon jig with its lid facing the carbon jig. When the lid is removed from the alignment package, the electric pins are sequentially transferred from the pin accommodation holes of the alignment package into the pin accommodation holes of the carbon jig. Vacuum suction equipment is not required, and the step of transferring electric pins from the alignment package to the alignment jig is reduced. Since the blocks accommodating the predetermined number of electric pins are accommodated in the frame, the pitch of the pin accommodating holes in each block can be accurately formed, and the problems of accumulated errors and warpage do not occur. Also, the alignment package can be manufactured at low cost.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is an exploded perspective view showing one embodiment of an alignment package for electric pins of the present invention. FIG. 2 is a diagram illustrating an alignment block (hereinafter, simply referred to as a block). FIG. 3 is a cross-sectional view showing a state where electric pins are accommodated in the alignment package of FIG. 1 (however,
Electrical pins are not cross-sectional. ).

In FIG. 1, the alignment package 1 includes a frame 10 having a large number of block receiving holes 14 formed therein, a block 30 having a predetermined number of pin receiving holes 36, and a lid 60. The frame 10 is formed by processing a sheet metal, and has 144 block receiving holes 14 formed on one surface 12 thereof in a matrix of 12 rows and 12 columns. Two opposing sides of the frame 10 are bent in a U-shape to form guides 16, 16 for guiding and supporting the lid 60. Each guide section 16
Are formed with positioning holes 20 for positioning with the carbon jig. Further, L-shaped ribs 18 are formed on the other two opposite sides to prevent deformation of the frame 10.

In FIG. 2, each block 30 is made of a synthetic resin such as PP (polypropylene), and has an upper surface 3.
60 pin-receiving holes 36 penetrating from 2 to the lower surface 34 are formed in a matrix of 8 rows and 8 columns excluding the center. A step 38 is formed in each of the pin receiving holes 36 near the upper surface 32 to prevent the electric pins 70 from dropping in the direction of the upper surface 32. A flange 40 is formed around the upper surface 32, and abuts on one surface 12 of the frame 10. A chamfered portion 42 is formed at one corner of the upper surface 32 and serves as a mark for determining the direction of the block 30 when the block 30 is mounted on the frame 10. The pitch of each block 30 can be made accurate by aligning the chamfered portions 42 of each block 30 in a predetermined direction. Protrusions 48 are formed on the two side surfaces 44 and 46 distant from the chamfered portion 42, respectively, and come into contact with the edges of the block receiving holes 14 to prevent rattling between the block 30 and the block receiving holes 14. Flexible mounting arms 52, 52 are provided on the opposing side surfaces 46, 50, respectively, and the block 30 is fixed to the frame 10 by the mounting arms 52.

Returning to FIG. 1, the plate-shaped lid 60 is made of a synthetic resin such as PVC (vinyl chloride). Therefore, when the lid body 60 slides along the guide portion 16 of the frame body 10, plating peeling caused by friction with the other end of the electric pin 70 is prevented. The lid 60 is desirably transparent to confirm whether or not the electric pins 70 are accommodated in the predetermined pin accommodation holes 36.

In FIG. 3, electric pins 70 have their heads 72 directed toward the upper surface 32 by vacuum suction or the like from the upper surface 32 in the respective pin receiving holes 36 of the block 30 attached to the frame 10. Will be accommodated. All electrical pins 70
After that, the lid 60 is attached to the frame 10 along the guide portion 16. The electrical pins 70 housed in the alignment package 1 are supplied to the computer manufacturer in the state shown in FIG. At the computer manufacturer, the alignment package 1 is placed on a carbon jig (not shown),
0 in the front of the paper or in the opposite direction to the frame 1
By removing the electric pins 70 from each other, the electric pins 70 are sequentially inserted into the pin receiving holes (not shown) of the carbon jig.

Although the preferred embodiment of the alignment package for electric pins according to the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications and changes can be made. For example, the arrangement of the blocks may be any arrangement corresponding to the arrangement of the IC chips on the ceramic substrate.

[0016]

According to the electric pin alignment package of the present invention, since the lid for preventing the electric pins from dropping is slidably attached to the frame, the electric pins can be directly transferred to the carbon jig. This has the effect of reducing the number of transfer steps. Further, no vacuum suction equipment is required, and a vacuum suction step is not required. Further, since the alignment blocks for aligning and housing a predetermined number of electrical pins are arranged and accommodated in the frame, an alignment package for electrical pins can be manufactured at low cost and with high accuracy, and the arrangement according to the arrangement of IC chips on the ceramic substrate. There is an effect that an alignment package for electric pins in an arbitrary arrangement can be easily manufactured.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing one embodiment of an alignment package for electric pins of the present invention.

2A is a plan view showing an alignment block, FIG.
(B) is a front view with a partial cross section, and (C) is a bottom view.

FIG. 3 is a cross-sectional view illustrating a state where electric pins are accommodated in the alignment package of FIG. 1;

FIG. 4 is a front view showing an electric pin.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Alignment package for electric pins 10 Frame 16 Guide part 30 Alignment block 60 Lid 70 Electric pin

 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-3-212349 (JP, A) JP-A-3-78793 (JP, U) JP-A-3-56587 (JP, U) 32154 (JP, Y2)

Claims (1)

(57) [Scope of request for utility model registration] An alignment block for aligning and housing a predetermined number of electrical pins, a frame for housing a predetermined number of the alignment blocks in a matrix, and sliding along a guide portion formed on one surface of the frame. A lid movably mounted and covering one end of each of the electrical pins to prevent the electrical pins from falling off.