JP2559253B2 - Molded substrate and mold - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a molded substrate and a molding die used for a circuit board or the like that is partially plated.

(Prior Art) As a plastic molded product G partially plated as shown in FIGS. 8 and 9, the applicant has made a circuit in which a primary molded product G1 having a roughened entire surface is projected from the surface. It has been proposed that only the projecting portion Ga is exposed and covered with plastic P, and the exposed surface of the above-mentioned circuit projecting portion is plated to form a plated portion M (Japanese Patent Application No. 61-273035-Patent Publication 06-). No. 60414).
And this plastic molded product is manufactured by first roughening the entire surface of the primary molded product G1 on which the circuit projections Ga are molded, and then molding this primary molded product into molds K1, K2 as shown in FIG. Set in the cavity of, the liquid K is filled from the nozzle on the mold K1 side into the cavity, the surface of the primary molded product is covered except for the above-mentioned protrusion for the circuit, and the secondary molded product is formed. After that, the secondary molded product is dipped in a plating tank to plate only the circuit protrusion Ga to form a plated portion M.

(Problems to be Solved by the Invention) Although the above-mentioned plastic molded product can be manufactured very easily and has good quality, an improvement point for further improving the quality is to improve the circuit protrusion. The etching surface Ga1 on the upper surface of the portion Ga is pressed against the surface Ka1 of the mold K2 by the injection pressure from the nozzle on the mold K1 side, and the etching surface is crushed as shown in FIG. 10, and therefore the etching surface is a smooth surface. Therefore, the anchor effect of the plating is reduced, and the adhesion strength of the plating is reduced.

An object of the present invention is to prevent the adhesive strength of plating from being reduced in the projection for the plating part of the molded substrate.

(Means for Solving the Problems) In the molded substrate of the present invention, the plated portion projections 11 and the pressure receiving projections 12 are respectively provided on the surface of the molded substrate body 1 whose entire surface is roughened. .

The mold of the present invention comprises a molded substrate body 1 whose entire surface is roughened.
On the surface 2a1 facing the projection side of the molded substrate on which the projection 11 for the plating portion and the pressure receiving projection 12a having a lower projection height than the projection for the plating portion are respectively provided on the surface of, A stopper protrusion 21a that abuts the pressure receiving protrusion is provided in a protruding manner, and the protrusion height of the stopper protrusion is set so as not to press the plated portion protrusion.

(Example) In FIGS. 1 and 2, a primary molded product 1 serving as a molded substrate body.
Is made of plastic, and the circuit projections 11 that are the projections for the plating section are provided on the surface, and the pressure receiving projections 12 are also provided between the respective circuit projections. is there. The height of the pressure receiving projection 12 is set higher than that of the circuit projection 11 by a predetermined height H. The height H is obtained by adding the crushing allowance h1 and the safety allowance h2. The entire surface of the primary molded product 1 is roughened with an etching solution.

Here, a method for manufacturing a circuit board using the primary molded product 1 will be described.

After immersing the primary molded product 1 as shown in FIG. 1 in an etching solution to roughen the entire surface, for example, palladium, gold,
The primary molded product is pretreated by applying a catalyst such as silver or platinum. Then, using the pre-processed primary molded product 1 as a base, molds 2 and 2a (FIG. 4) are used to cover the upper surface of the circuit projection 11 and the pressure receiving projection 12 of the primary molded product with the plastic 3 remaining. . That is, the primary molded product 1 is inserted into the cavities of the molds 2 and 2a, and the liquid plastic 3 as a filler is filled in the cavities from the nozzle 4. On this occasion,
The surface 2a1 of the mold 2a comes into contact with the etching surface 121 of the pressure receiving projection 12, and the surface 121 etches the circuit projection 11 by the surface 121.
It prevents the pressure of. By removing the mold, the secondary molded product 5 shown in FIG. 3 is molded. In the secondary molded product 5, the upper surfaces of the circuit projection 11 and the pressure receiving projection 12 are exposed on the surface. Electroless copper plating of the secondary molded product 5 is performed. As a result, the secondary molded product 5 is plated only on the respective surfaces of the circuit projection 11 and the pressure receiving projection 12 as shown by the dotted lines in FIG.
Then, a circuit board having a predetermined pattern formed by the circuit protrusion 11 is obtained.

The height H of the pressure receiving projection 12 may be equal to the crushing margin h1, but by increasing the height H by the safety margin h as in the above example, the position of the surface 2a1 exceeds the crushing margin h1. However, the presence of the safety allowance h2 prevents contact of the etching surface of the circuit projection 11 and more reliably prevents crushing. The material of the primary molded product 1 is not limited to a single synthetic resin material,
It may be a mixture of fillers such as glass fibers and potassium titanate fibers. In the plating process of the secondary molded product, chemical copper plating or chemical nickel plating is usually used, but when the molded product is, for example, a wiring board, copper plating is desirable.

The primary molded product 1 may be three-dimensional (three-dimensional shape) as well as plate-shaped (two-dimensional shape),
In addition to electronic components such as circuit boards, it can be applied to commercialization in the field of decoration such as buttons.

As described above, the pressure receiving protrusion 12 higher than the circuit protrusion 11 is provided on the molded substrate 1 to prevent the etching surface 111 from becoming smooth. The molded substrate 1 as shown in FIG. Type
By using 2,2a, the same purpose as the above example can be achieved.

That is, in FIG. 5, instead of lowering the height of the pressure receiving projection 12a protruding from the primary molded product 1 from that of the circuit projection 11, the surface 2a1 of the upper mold 2a has a pressure receiving projection. A protrusion 21a for a stopper is provided at a position facing the portion 12a,
When the stopper projection 21a is in contact with the pressure receiving projection 12a, the surface 2a1 of the mold 2a is prevented from coming into contact with the circuit projection 11 as shown in a partially enlarged view.

In order to achieve the same purpose as in the first embodiment, in FIG. 6 and FIG. 7, the shape of the molded substrate 1 is kept the same as before, but the surface 2a1 of the mold 2a is located at a position facing the circuit projection 11. Escape grooves 22a and 23a are provided on the surface so that the surface 2a1 does not directly contact the entire etched surface of the circuit projection 11 (main surface in FIG. 7). In addition, in FIG. 7, the width of the escape groove 23a is set to be slightly smaller than the width of the protrusion 11.

As described above, according to the present invention, since the pressure receiving projection and the stopper projection are provided, it is possible to prevent the etching surface of the plated projection of the molded substrate from becoming smooth. It is possible to provide a molded substrate of good quality without lowering the adhesion strength of plating on the projection for the plating part.

[Brief description of drawings]

FIG. 1 is a perspective view showing a part of a primary molded product, FIG. 2 is an enlarged sectional view taken along line II-II of FIG. 1, FIG. 3 is a partially cutaway perspective view showing a part of a circuit board, and FIG. FIG. 5 is an enlarged cross-sectional view showing a process of forming the next molded product, FIG. 5 is a cross-sectional view showing another example of the molding substrate and the mold, and FIGS. 6 and 7 are usage states of the mold of another example. 8 is a perspective view showing a part of a conventional circuit board, FIG. 9 is an enlarged sectional view taken along line IX-IX of FIG. 8, and FIG. 10 shows a process of forming a conventional circuit board. It is an expanded sectional view. 1 ... Molded substrate body (primary molded product), 11 ... Plating part projection (circuit part projection), 12, 12a ... Pressure receiving projection, 111,
121 …… Etched surface, 2,2a …… Mold, 2a1 …… Mold surface, 21
a …… Stopper protrusion, h1 …… Crushing margin.

Claims (3)

(57) [Claims] 1. A molded substrate, characterized in that a plated portion projection and a pressure receiving projection are respectively provided on the surface of a molded substrate body whose entire surface is roughened. 2. The molded substrate according to claim 1, wherein the height of the pressure receiving projection is higher than that of the plating projection by at least a crushing margin due to the injection pressure. 3. A molding in which a projection for a plating section and a pressure receiving projection having a projection height lower than that of the projection for a plating section are provided on the surface of a molded substrate body whose entire surface is roughened. A protrusion for a stopper that abuts the pressure receiving protrusion is provided on the surface of the substrate facing the protrusion side, and the protrusion height of the stopper protrusion does not press the plating protrusion. Molding die characterized by being set to.