JP2558511Y2 - Electronic component structure - Google Patents
Electronic component structureInfo
- Publication number
- JP2558511Y2 JP2558511Y2 JP1992038734U JP3873492U JP2558511Y2 JP 2558511 Y2 JP2558511 Y2 JP 2558511Y2 JP 1992038734 U JP1992038734 U JP 1992038734U JP 3873492 U JP3873492 U JP 3873492U JP 2558511 Y2 JP2558511 Y2 JP 2558511Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead wires
- circuit board
- printed circuit
- light emitting
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本考案は、例えば、発光ダイオー
ド等にように、半導体チップの部分をパッケージするモ
ールド部から前記半導体チップに対する各リード線を突
出した形態の電子部品の構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of an electronic component, such as a light emitting diode, in which each lead wire for a semiconductor chip projects from a molded part for packaging the semiconductor chip. .
【０００２】[0002]
【従来の技術】一般に、発光ダイオード等のように、半
導体チップをパッケージするモールド部から前記半導体
チップに対する各リード線を突出した形態の電子部品を
プリント基板等に対して装着するに際しては、当該電子
部品におけるモールド部がプリント基板から適宜寸法だ
け突出するようにして装着するものである。2. Description of the Related Art In general, when mounting an electronic component such as a light emitting diode, in which each lead wire to a semiconductor chip protrudes from a mold portion for packaging the semiconductor chip, on a printed circuit board or the like, the electronic component is mounted. The component is mounted such that the mold portion of the component protrudes from the printed board by an appropriate dimension.
【０００３】そこで、従来は、図６及び図７に示すよう
に、発光ダイオード１における透明合成樹脂製モールド
部２から突出する各リード線３，４を、モールド部２の
下面から適宜寸法Ｈの位置において互いに反対方向のク
ランク状に曲げ形成して、この各リード線３，４を、プ
リント基板５に穿設した貫通孔５ａ，５ｂに挿入したの
ち、プリント基板５における配線パターン６，７に対し
て各々半田付けすることによって装着したり、或いは、
図８及び図９に示すように、発光ダイオード１における
透明合成樹脂製モールド部２から突出する各リード線
３，４に、モールド部２の下面から適宜寸法Ｈ′の位置
にストッパー片３ａ，４ａを一体的に造形し、この各リ
ード線３，４を、プリント基板５′に穿設した貫通孔５
ａ′，５ｂ′に挿入したのち、プリント基板５′におけ
る配線パターン６′，７′に対して各々半田付けするこ
とによって装着したりするようにしている。Therefore, conventionally, as shown in FIGS. 6 and 7, each of the lead wires 3 and 4 protruding from the transparent synthetic resin mold portion 2 of the light-emitting diode 1 is appropriately sized to have a dimension H from the lower surface of the mold portion 2. Each lead wire 3, 4 is bent into a crank shape in the opposite direction at the position, and these lead wires 3, 4 are inserted into through holes 5 a, 5 b formed in the printed circuit board 5, and then inserted into the wiring patterns 6, 7 on the printed circuit board 5. To each other by soldering, or
As shown in FIGS. 8 and 9, each of the lead wires 3, 4 protruding from the transparent synthetic resin molded part 2 of the light emitting diode 1 is provided with stopper pieces 3 a, 4 a at appropriate positions H ′ from the lower surface of the molded part 2. Are integrally formed, and each of the lead wires 3 and 4 is inserted into a through hole 5 formed in a printed circuit board 5 '.
After being inserted into a 'and 5b', they are mounted by soldering to the wiring patterns 6 'and 7' on the printed circuit board 5 '.
【０００４】[0004]
【考案が解決しようとする課題】しかし、前者のよう
に、各リード線３，４をクランク状に曲げ成形する方法
は、プリント基板５からの突出高さ寸法Ｈを変更するこ
とが容易である利点を有する反面、各リード線３，４を
曲げ形成するときに、当該リード線３，４にストレスが
かかるから、電子部品の性能の低下が多発するばかり
か、各リード線３，４の間隔寸法及び曲げ角度に大きい
バラツキがあって、寸法精度が低いと言う問題がある。However, as in the former method, the method of bending each of the lead wires 3 and 4 into a crank shape can easily change the height H of the protrusion from the printed circuit board 5. On the other hand, when the lead wires 3 and 4 are formed by bending, stress is applied to the lead wires 3 and 4, so that not only the performance of the electronic component is frequently reduced but also the distance between the lead wires 3 and 4 is increased. There is a problem that there is large variation in dimensions and bending angles, and dimensional accuracy is low.
【０００５】また、後者のように、各リード線３，４に
ストッパー片３ａ，４ａを一体的に造形する方法は、各
リード線３，４にストレスを掛けず、且つ、寸法精度が
高い等の利点を有する反面、プリント基板５からの突出
高さ寸法Ｈ′を変更するには、各リード線３，４に一体
的に造形するストッパー片３ａ，４ａの位置を変更しな
ければならず、この各リード線３，４に一体的に造形す
るストッパー片３ａ，４ａの位置を変更するには、発光
ダイオードの製造に際して使用するリードフレームの形
状を変更するようにしなければならないから、プリント
基板５からの突出高さ寸法Ｈ′を変更することが大幅に
コストアップになると言う問題がある。[0005] As in the latter case, the method of integrally forming the stopper pieces 3a, 4a on the respective lead wires 3, 4 does not apply stress to the respective lead wires 3, 4 and has high dimensional accuracy. On the other hand, in order to change the protruding height H 'from the printed circuit board 5, the positions of the stopper pieces 3a and 4a formed integrally with the lead wires 3 and 4 must be changed. In order to change the positions of the stopper pieces 3a and 4a formed integrally with the lead wires 3 and 4, it is necessary to change the shape of the lead frame used in manufacturing the light emitting diode. There is a problem that changing the height H 'of the protrusion from the hole greatly increases the cost.
【０００６】しかも、いずれの方法においても、発光ダ
イオード１においてモールド部２に対して、当該モール
ド部２から突出する各リード線３，４を含む平面と直角
の方向に外力が作用した場合、各リード線３，４はその
方向には容易に変形するので、モールド部２が、各リー
ド線３，４を含む平面と直角の方向、つまり横方向に倒
れ変形し易いと言う問題もあった。Moreover, in any of the methods, when an external force acts on the mold portion 2 of the light emitting diode 1 in a direction perpendicular to a plane including the lead wires 3 and 4 protruding from the mold portion 2, the respective components are Since the lead wires 3 and 4 are easily deformed in that direction, there is also a problem that the mold portion 2 is likely to fall and deform in a direction perpendicular to the plane including the lead wires 3 and 4, that is, in the lateral direction.
【０００７】本考案は、これらの問題を解消できるよう
にした電子部品の構造を提供することを技術的課題とす
るものである。An object of the present invention is to provide a structure of an electronic component which can solve these problems.
【０００８】[0008]
【課題を解決するための手段】この技術的課題を達成す
るため本考案は、半導体チップの部分をパッケージする
モールド部の一側面から前記半導体チップに対する各リ
ード線を突出して成る電子部品において、前記各リード
線における長手方向の途中の部位に、合成樹脂製の受け
座片を、各リード線の相互間を連結するように成形する
と言う構成にした。In order to achieve this technical object, the present invention provides an electronic component comprising: a lead portion for a semiconductor chip projecting from one side surface of a molding portion for packaging a semiconductor chip portion; A receiving seat piece made of synthetic resin is formed at a position in the longitudinal direction of each lead wire so as to connect the lead wires to each other.
【０００９】[0009]
【作 用】このように、各リード線における長手方向
の途中の部位に、合成樹脂製の受け座片を、各リード線
の相互間を連結するように成形すると、電子部品を、プ
リント基板等に対して、当該各リード線をプリント基板
に穿設した貫通孔に挿入するようにして装着したとき、
前記合成樹脂製の受け座片が、プリント基板の上面に対
して接当することになるから、前記受け座片によって、
プリント基板からの突出高さ寸法を規定することができ
るのであり、しかも、電子部品におけるモールド部に対
して各リード線を含む平面と直角の方向に外力が作用し
た場合に、この方向の外力を前記受け座片にて支持する
ことができるから、モールド部の横方向への倒れ変形を
確実に低減できるのである。[Operation] As described above, when a receiving seat piece made of a synthetic resin is formed at a position in the longitudinal direction of each lead wire so as to connect the lead wires to each other, an electronic component can be formed on a printed circuit board or the like. In contrast, when each lead wire is attached by inserting it into a through hole formed in a printed circuit board,
Since the synthetic resin receiving seat piece comes into contact with the upper surface of the printed circuit board, by the receiving seat piece,
When the external force acts on the mold part of the electronic component in a direction perpendicular to the plane containing the lead wires, the external force in this direction can be defined. Since it can be supported by the receiving seat piece, the lateral deformation of the mold portion can be reliably reduced.
【００１０】そして、前記各リード線に対して前記受け
座片を成形する場合において、受け座片の成形用金型に
対して各リード線をその長手方向にずらせることによっ
て、前記受け座片を成形する位置を任意に変更すること
ができるのである。In the case where the receiving seat piece is formed with respect to each of the lead wires, each of the lead wires is displaced in a longitudinal direction with respect to a molding die for forming the receiving seat piece, whereby the receiving seat piece is formed. It is possible to arbitrarily change the position at which is molded.
【００１１】[0011]
【考案の効果】従って、本考案によると、電子部品をプ
リント基板に対して装着する場合に、プリント基板から
の突出高さ寸法を変更することに要するコストを大幅に
低減できると共に、モールド部の倒れ変形を大幅に低減
できると言う効果を有する。Therefore, according to the present invention, when mounting an electronic component on a printed circuit board, the cost required to change the height of the projecting portion from the printed circuit board can be greatly reduced, and the cost of the mold section can be reduced. This has the effect of significantly reducing the falling deformation.
【００１２】[0012]
【実施例】以下、本考案の実施例を発光ダイオードにつ
いて適用した場合の図面（図１〜図５）について説明す
る。この図において符号１０は、発光ダイオード１１の
製造に際して使用するリードフレームを示し、このリー
ドフレーム１０には、一つの発光ダイオード１１を構成
する二本のリード線１２，１３が、当該長手方向に沿っ
て一定のピッチ間隔で一体的に造形されており、この両
リード線１２，１３のうち一方のリード線１２の先端に
カップ部１２ａを設けて、このカップ部１２ａ内に発光
半導体チップ１４をマウントする一方、この発光半導体
チップ１４と、他方のリード線１３との間を金属線１５
にてワイヤーボンディングする。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view of an embodiment of the present invention applied to a light emitting diode. In this figure, reference numeral 10 denotes a lead frame used for manufacturing the light emitting diode 11, and the lead frame 10 has two lead wires 12 and 13 constituting one light emitting diode 11 along the longitudinal direction. The lead 12 is formed integrally at a constant pitch interval. A cup 12a is provided at the tip of one of the two lead wires 12, 13, and the light emitting semiconductor chip 14 is mounted in the cup 12a. On the other hand, a metal wire 15 is provided between the light emitting semiconductor chip 14 and the other lead wire 13.
Wire bonding.
【００１３】そして、前記各発光ダイオード１における
両リード線１２，１３には、その長手方向に沿った途中
の部位に、硬質合成樹脂製の受け座片１６を、両リード
線１２，１３の相互間を連結するように成形する。な
お、この受け座片１６の成形は、リードフレーム１０の
うち各リード線１２，１３の途中の部分を上下一対の成
形用金型にて挟み付けて行う。Each of the lead wires 12 and 13 of each of the light emitting diodes 1 is provided with a receiving seat 16 made of a hard synthetic resin at an intermediate position along the longitudinal direction thereof. It is formed so as to connect the spaces. The receiving seat piece 16 is formed by sandwiching a part of the lead frame 10 in the middle of each of the lead wires 12 and 13 between a pair of upper and lower molding dies.
【００１４】次いで、この受け座片１６を成形すると、
両リード線１２，１３の先端部に、発光半導体チップ１
４をパッケージする透明合成樹脂製のモールド部１７を
成形したのち、各発光ダイオード１０を、リードフレー
ム１０より切り離すようにする。このように構成した発
光ダイオード１０は、図４及び図５に示すように、プリ
ント基板１８に対して、その両リード線１２，１３をプ
リント基板１８に穿設した貫通孔１８ａ，１８ｂに挿入
するようにして装着したとき、その両リード線１２，１
３に成形した合成樹脂製の受け座片１６が、プリント基
板１８の上面に対して接当することになるから、前記受
け座片１６によって、プリント基板１８からのモールド
部１７までの突出高さ寸法Ｈを規定することができるの
である。Next, when the receiving seat piece 16 is formed,
The light emitting semiconductor chip 1 is attached to the distal ends of both the lead wires 12 and 13.
After molding the molded portion 17 made of a transparent synthetic resin for packaging 4, each light emitting diode 10 is separated from the lead frame 10. As shown in FIGS. 4 and 5, the light-emitting diode 10 configured as described above inserts both lead wires 12 and 13 into through holes 18 a and 18 b formed in the printed circuit board 18 with respect to the printed circuit board 18. When mounted in such a manner, the two lead wires 12, 1
Since the receiving seat 16 made of synthetic resin formed into the shape 3 comes into contact with the upper surface of the printed board 18, the projecting height of the receiving seat 16 from the printed board 18 to the mold portion 17 is increased. The dimension H can be defined.
【００１５】また、両リード線１２，１３に成形した合
成樹脂製の受け座片１６がプリント基板１８の上面に対
して接当することにより、発光ダイオード１０における
モールド部１７に対して両リード線１２，１３を含む平
面と直角の方向に外力が作用した場合に、この方向の外
力を前記受け座片１６にて支持することができるから、
モールド部１７の倒れ変形を確実に低減できるのであ
る。The synthetic resin receiving seat 16 formed on both the lead wires 12 and 13 abuts on the upper surface of the printed circuit board 18, so that the molded portion 17 of the light emitting diode 10 can be connected to the both lead wires. When an external force acts in a direction perpendicular to the plane including the planes 12 and 13, the external force in this direction can be supported by the receiving seat piece 16.
The falling deformation of the mold section 17 can be reliably reduced.
【００１６】一方、前記両リード線１２，１３に対して
前記受け座片１６を成形する場合において、受け座片の
成形用金型に対して両リード線１２，１３をその長手方
向にずらせることによって、前記受け座片１６を成形す
る位置を任意に変更することができるから、プリント基
板１８からのモールド部１７までの突出高さ寸法Ｈを変
更することが容易にできる。On the other hand, when the receiving seat piece 16 is formed with respect to the lead wires 12 and 13, the lead wires 12 and 13 are shifted in the longitudinal direction with respect to the receiving die. This makes it possible to arbitrarily change the position at which the receiving seat piece 16 is molded, so that the height H of the protrusion from the printed circuit board 18 to the mold portion 17 can be easily changed.
【００１７】なお、前記受け座片１６には、図３に二点
鎖線で示すように、両リード線１２，１３の方向を表示
する切欠平面部１６ａ又は切欠溝１６ｂを設けても良
く、また、前記受け座片１６の下面には、両リード線１
２，１３をプリント基板１８における配線パターン１
９，２０に対して半田付けする場合に発生するガスを逃
がすためのガス抜き溝１６ｃを設けることもできる。The receiving seat piece 16 may be provided with a notched flat portion 16a or a notched groove 16b for indicating the directions of the two lead wires 12, 13 as shown by a two-dot chain line in FIG. On the lower surface of the receiving seat piece 16, both lead wires 1 are provided.
2 and 13 are wiring patterns 1 on the printed circuit board 18.
It is also possible to provide a gas vent groove 16c for letting out gas generated when soldering is performed on the components 9 and 20.
【００１８】更にまた、前記実施例は、発光ダイオード
１０に対して適用した場合を示したが、本考案は、これ
に限らず、トランジスター等の他の電子部品に対しても
適用できることは言うまでもない。Furthermore, the above-described embodiment shows a case where the present invention is applied to the light-emitting diode 10, but it is needless to say that the present invention is not limited to this and can be applied to other electronic components such as transistors. .
【図１】本考案の実施例におけるリードフレームの平面
図である。FIG. 1 is a plan view of a lead frame according to an embodiment of the present invention.
【図２】前記リードフレームを使用して発光ダイオード
を製造する場合の平面図である。FIG. 2 is a plan view when a light emitting diode is manufactured using the lead frame.
【図３】図２のIII −III 視拡大断面図である。FIG. 3 is an enlarged sectional view taken along line III-III of FIG. 2;
【図４】本考案の実施例による発光ダイオードをプリン
ト基板に装着した状態の縦断正面図である。FIG. 4 is a vertical sectional front view of the light emitting diode according to the embodiment of the present invention mounted on a printed circuit board;
【図５】図４の側面図である。FIG. 5 is a side view of FIG. 4;
【図６】従来における発光ダイオードをプリント基板に
装着した状態の縦断正面図である。FIG. 6 is a vertical sectional front view showing a state in which a conventional light emitting diode is mounted on a printed circuit board.
【図７】図６の側面図である。FIG. 7 is a side view of FIG. 6;
【図８】従来における別の発光ダイオードをプリント基
板に装着した状態の縦断正面図である。FIG. 8 is a longitudinal sectional front view showing a state in which another conventional light emitting diode is mounted on a printed circuit board.
【図９】図８の側面図である。FIG. 9 is a side view of FIG.
１０ 発光ダイオード １２，１３ リード線 １４ 発光半導体チップ １５ 金属線 １６ 受け座片 １７ モールド部 １８ プリント基板 DESCRIPTION OF SYMBOLS 10 Light emitting diode 12, 13 Lead wire 14 Light emitting semiconductor chip 15 Metal wire 16 Receiving piece 17 Mold part 18 Printed circuit board
Claims (1)
ルド部の一側面から前記半導体チップに対する各リード
線を突出して成る電子部品において、前記各リード線に
おける長手方向の途中の部位に、合成樹脂製の受け座片
を、各リード線の相互間を連結するように成形すること
を特徴とする電子部品の構造。1. An electronic component comprising: a lead portion projecting from one side surface of a mold portion for packaging a portion of a semiconductor chip; A structure of an electronic component, wherein a receiving piece is formed so as to connect between respective lead wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1992038734U JP2558511Y2 (en) | 1992-06-08 | 1992-06-08 | Electronic component structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1992038734U JP2558511Y2 (en) | 1992-06-08 | 1992-06-08 | Electronic component structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH062705U JPH062705U (en) | 1994-01-14 |
| JP2558511Y2 true JP2558511Y2 (en) | 1997-12-24 |
Family
ID=12533560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1992038734U Expired - Lifetime JP2558511Y2 (en) | 1992-06-08 | 1992-06-08 | Electronic component structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2558511Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6317246B2 (en) * | 2014-12-19 | 2018-04-25 | 株式会社ホンダロック | Vehicle door mirror |
-
1992
- 1992-06-08 JP JP1992038734U patent/JP2558511Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH062705U (en) | 1994-01-14 |
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