JP2557845B2 - Electronic component device - Google Patents

Description

The present invention relates to an electronic component device in which an electronic circuit element is mounted in a package, and more particularly to improvement of a cooling means thereof.

(Prior Art) Electronic devices such as electronic calculators, which are composed of a huge number of electronic circuit elements, are equipped with a large number of electronic circuit packages in which electronic components are mounted on a printed circuit board. It is configured. In such an electronic component device, since the package is accompanied by heat generation, the package on the printed circuit board is usually subjected to forced air cooling by a blower.
If the heat generation density on the printed circuit board is almost uniform, if each electronic component package is cooled at a predetermined wind speed,
For the time being, it can be cooled efficiently.

However, recently, due to high integration of logic elements and high-density mounting of electronic components, variations in the amount of heat generated between the packages are increasing even on the same printed circuit board. In such a case, in order to keep the electronic components with high heat generation below the specified temperature, a large wind velocity must be supplied to the entire electronic component package. This requires a large amount of air flow, and supercools the parts that generate a small amount of heat, resulting in poor cooling efficiency. In addition, the loss of wind is large for a printed circuit board with a complicated structure, and in cooling, it is necessary to supply a larger air volume than the cooling air volume in consideration of this loss, and for this purpose the blower must be enlarged. No
Along with this, problems such as noise occur.

As a countermeasure against this, a structure in which a cooling fin is attached to an electronic component to reduce its thermal resistance is generally adopted. However, the size of the cooling fin cannot be made too large because it is restricted by the requirement for high-density mounting and the structure of electronic components. There is also a method of arranging electronic components with high heat generation and selectively introducing the air volume from a blower into the electronic component arrangement portion with high heat generation using a flat plate or the like (Japanese Patent Publication No. 60-11840). However, this method still requires a large blower. In addition, since electronic components that generate a large amount of heat must be arranged, the degree of freedom in arranging the components on the printed circuit board is limited.

(Problems to be Solved by the Invention) The present invention has been made in view of the above points, and an object thereof is to provide an electronic component device that effectively cools an electronic component package that generates a large amount of heat. .

[Structure of Invention]

(Means for Solving Problems) The present invention, in an electronic component device in which an electronic circuit element is mounted in a package, includes a piezoelectric element and a vibration plate connected to resonate with the vibration of the piezoelectric element, In the electronic component device, the cooling means having a smaller installation area than the package and the package are integrated.

(Operation) As is well known, a piezoelectric element refers to a plate-shaped piezoelectric body made of a piezoelectric ceramic material or a piezoelectric polymer material and provided with electrodes on both main surfaces.

As shown in FIG. 20, the piezoelectric element (20) may be overlapped to form a bimorph structure. In this case, a negative potential is applied to the electrodes (22a) and (22c) and a positive potential is applied to the electrode (22b) with respect to the piezoelectric bodies (21a) and (21b) having polarization directions in the direction of the arrow in the figure. The piezoelectric body is curved as shown by the dotted line. Further, when the electrodes (22a), (22c) and (22b) are applied with electric potentials opposite thereto, the electrodes (22a), (22c) and (22b) bend in the opposite directions.

The present invention utilizes this property to apply an AC voltage to the electrodes to vibrate the piezoelectric element, and generate cooling air by the diaphragm vibrating in resonance with this vibration, thereby being used as the cooling means.

According to the present invention, since this cooling means is integrated with the electronic component device, the electronic component device can be individually cooled. Therefore, when mounting a large number of electronic components on a printed circuit board, if the present invention is applied to electronic components that generate a large amount of heat,
The whole can be efficiently cooled without sending a large amount of air using a large blower. This is preferable also in terms of energy saving, and the noise problem is improved. In addition, if the bimorph oscillator is used, the mounting density of the electronic circuit board does not decrease because it is small. Furthermore, compared to the method that considers the placement on the board depending on the heat generation amount of the electronic component,
The degree of freedom in arranging electronic components is high, which facilitates design and improves packaging density.

(Examples) Examples of the present invention will be described below.

Example 1 FIGS. 1 (a) and 1 (b) are a plan view and an AA sectional view of the electronic component device of the first example, and FIG. 1 (c).
Is a perspective view thereof. As shown in FIG. 1 (b), the package body (1) consists of a ceramic base (1 ₁ ) and a ceramic cap (1 ₂ ), and the semiconductor element (2) is mounted on the ceramic base (1 ₁ ). Then, these are sealed by the low melting point glass (9) to form an electronic component. The ceramic base (1 ₁ ) and the ceramic cap (1 ₂ ) are ceramic materials having excellent thermal conductivity such as AlN or Al ₂ O ₃ . The terminals of the semiconductor element (2) are led out of the package (1) via a bonding wire (3) made of Au, for example, and a lead frame (4). An inverted L-shaped ceramic support base (5) is provided on the outside of the ceramic base (1 ₁ ) with an adhesive such as an epoxy resin so as to have a good thermal conductivity. (5), the vibration plate piezoelectric element ₍₇₁₎ on both sides of (6), (7 ₂₎ attached to bond the cooling fan configured bimorph vibrator (8) are two packages (1) package from the top ( It is fixed so as to cool 1).

In this embodiment, of the electrodes of the piezoelectric elements (7 ₁ ) and (7 ₂ ), the electrode on the side not holding the diaphragm (6), that is, the outer surface of the piezoelectric elements (7 ₁ ) and (7 ₂ ) is formed. Electrode (not shown)
Is electrically connected by a lead wire (30a) and is a piezoelectric element (7 ₂ )
The electrodes described above are connected to the pattern wiring (31a) by soldering or the like, and the pattern wiring (31a) is a through hole (32a) led out on the package (1) as shown in FIG. 1 (a). It is electrically connected to the terminal of the part.
The through hole (32a) connects the lead frame (4a) and the terminal of the through hole (32a) using a conductive material, and is provided by being pre-drilled in the ceramic base (1 ₁ ). There is.

As in this embodiment, the package (1) and the support base (5)
In order to form a pattern wiring on a ceramic material such as, for example, the material of the desired pattern wiring (31a) may be metallized using W, M ₀ or the like during sintering, as is well known.

Moreover, the aforementioned piezoelectric element _(71), the electrode and the opposite electrode, i.e. two electrodes bonded to the vibration plate (6) is patterned wiring via a lead wire (30b) from a common terminal (7 ₂₎ (31b)
It is connected to the. It is connected to this pattern wiring (31b). This pattern wiring (31b) is connected to the lead frame (4b) through the through hole (32b) in the same manner as above.
connected with b).

Here, the electrodes of the piezoelectric elements (7 ₁ ) and (7 ₂ ) are connected to the two cooling fans (8) separately using four lead frames, and of course, to these two cooling fans. It is also possible to use two lead frames by forming a pattern wiring commonly for the positive electrode and the negative electrode. If the pitch between the lead frames is narrow, the pattern wirings (31a) and (31b) are formed along the package side wall without using the through holes and are connected to the lead frame (4) by a method such as soldering. Good.

With this structure, the lead frames (4a), (4b)
By applying an AC voltage to the bimorph oscillator via the, the tip of the cooling fan (8) vibrates as indicated by the arrow in FIG. 1 (b). For example, for a 1-inch square package, 100 μm thick, 5 mm wide and 6 mm long ceramic piezoelectric elements (7 ₁ ) and (7 ₂ ) and a 50 μm thick, 5 mm wide and 7 mm long brass diaphragm (6 When driven with an applied voltage of 10 V using a bimorph oscillator combined with), an amplitude of about 1 mm at the tip of the cooling fan and an average velocity of the vibration of about 14 m / sec are obtained. This effectively cools the surface of the ceramic base (1 ₁ ).

Second Embodiment FIGS. 2A and 2B are plan views showing an electronic component device of a second embodiment, which is a modification of the first embodiment, and A- thereof.
It is A sectional drawing. Parts corresponding to those in FIGS. 1A and 1B are designated by the same reference numerals as those in FIGS. 1A and 1B, and detailed description thereof will be omitted.

Wiring for applying a voltage to the piezoelectric elements (7 ₁ ) and (7 ₂ ) is omitted in the drawing, but the wiring method is the same as in the first embodiment.
It may be performed in the same manner as described in. In this embodiment, two cooling fans (8) composed of bimorph oscillators are fixed not in parallel but in a divergent state.

Also in this embodiment, the same effect as the previous embodiment can be obtained.

Example 3 FIGS. 3 (a) and 3 (b) are a plan view and an AA sectional view of an electronic component device of a third example. Portions corresponding to FIGS. 1 (a) and 1 (b) are denoted by the same reference numerals as those in FIGS. 1 (a) and 1 (b), and detailed description thereof will be omitted.

In this embodiment, as shown in FIG. 3, a ceramic support (5a) is fixed to the end of the package body (1) on the ceramic base (1 ₁ ) with an adhesive such as epoxy resin. Two cooling fans (8a) as cooling means are provided in parallel on the table (5a).

FIG. 22, a support (5a) is a piezoelectric element ₍₇₁₎ is an enlarged plan view of a portion supporting the (7 _2).

The piezoelectric element _(71), (7 ₂₎ of the diaphragm (6) and joined to that electrode (34a) faces the piezoelectric element _(71), write turn the part on the opposite side (7 ₂₎ In this way, each is bonded to the piezoelectric element. These two electrodes (34a) are electrically connected to a conductive metal film (35a) formed by a well-known pattern wiring technique on the wall surface of the support (5a) as a positive (+) electrode by a solder (36a) or the like. Are commonly connected. The metal film (35a) is connected to the terminal (37a) of the through hole connected to the lead frame by the method described in the first embodiment.

Further, the piezoelectric element _(71), a negative to form an outer surface (7 ₂₎ (-) electrode (34b) is insulating layers and the positive electrode (34a) (3
8) Insulated through.

These two electrodes (34b) are connected via a solder (36b) to a metal film (35b) formed on the wall surface of the support base (5a) opposite to the wall surface on which the metal film (35a) is formed. The two solders (36b) are electrically connected by the lead wire (39). The metal film (35b) is connected to the terminal (37b) of another lead frame in the same manner as the metal film (35a).

Here, the same parts as those in FIG. 3 are designated by the same reference numerals. The piezoelectric elements (7 ₁ ) and (7 ₂ ) are connected to the lead frame by forming pattern wiring on the side wall of the package instead of through holes, as described in the first embodiment. May be. Cooling fan (8
a) The third diagram (piezoelectric element (7 ₁ to pinching the diaphragm (6) as shown in a)), (7 ₂₎ in the metal film that is connected to the aforementioned lead frame (41a), (41b), etc. A voltage is applied to the vibrating plate (6), and the Y-shaped sub-vibrating plate (6a) forming a part of the vibrating plate (6) vibrates in the direction of the arrow in the figure to operate as a fan. The effect of this embodiment will be described together with the following embodiment 4.

Embodiment 4 FIGS. 4 (a) and 4 (b) show a cooling fan (8b) having a diaphragm (6) without an auxiliary diaphragm (6a) to show the effect of the third embodiment. It is a 4th Example as a comparative example of the electronic component apparatus of this invention which integrated the electronic component package (1). The configuration is the same as that of FIGS. 3 (a) and 3 (b) except that the sub-vibration plate (6b) is not provided. The same components are denoted by the same reference numerals and detailed description thereof is omitted. To do. Further, the piezoelectric element _(71), (7 ₂₎ wiring for applying a voltage to the drawings on is omitted, the wiring method is exactly the same as in Example 3.

Table 1 below shows a comparison of the measured thermal resistances of the fourth and third embodiments. However, the drive frequencies of both piezoelectric elements were set to be the same.

From Table 1, in the comparative example, which is the fourth embodiment of the present invention, the thermal resistance is sufficiently reduced as compared with the package alone in which the cooling fan (8b) is not integrated with the package (1).
Although the package is cooled by the cooling fan (8b), it can be seen that the cooling effect is further promoted by the third embodiment provided with the sub-vibration plate (6a) as shown in FIG.

Example 5 FIGS. 5 (a) and 5 (b) show a fifth example which is a modification of the third example. The same parts as those in FIGS. 3A and 3B cited in the third embodiment are designated by the same reference numerals,
Detailed description is omitted.

Further, the piezoelectric element _(71), (7 ₂₎ wiring for applying a voltage to is the drawing is omitted, the wiring method may be performed in a manner similar to that described in Example 3. In this embodiment, a large number of sub-vibration plates 6a (five in this embodiment) are attached to the vibration plate (6) to form a cooling fan (8c), which is effective for a large-area package. .

Sixth Embodiment FIG. 6 (a) is a perspective view showing a sixth embodiment of the electronic component device according to the present invention, and FIG. 6 (b) is a plan view thereof.

_{2 at} the corner of the upper surface of the package body (1) made of a ceramic material having excellent thermal conductivity such as AlN or Al ₂ O _3.
One support base (5b) is fixed with an adhesive such as epoxy resin, and a pair of plate-shaped piezoelectric elements (7 ₁ ) and (7 ₂ ) and this piezoelectric element (7 ₁ ) are fixed to the support base (5b). A cooling fan (8) composed of a vibration plate (6) held between (7 ₂ ) is arranged facing each other. The same parts as those in FIG. 1 are designated by the same reference numerals, and detailed description thereof will be omitted. Further, the piezoelectric element (7 _1),
Wiring for applying a voltage to (7 ₂ ) may be performed by the same method as described in the third embodiment, and the positive and negative electrodes of the piezoelectric elements (7 ₁ ) and (7 ₂ ) of the _two cooling fans may be used. May be connected in parallel.

By applying an AC voltage to the piezoelectric element having such a structure, the diaphragm (6) vibrates as shown by an arrow in FIG. 6 (b), and induces an air flow. For example, applied voltage 10V,
When the cooling fan (8) is driven at a frequency of 1 KHz, 1.2 m / sec of air flow is obtained at the tip of the diaphragm (6), and the effects are obtained as shown in Table 2 below.

That is, Table 2 compares the comparison data used in Example 4 with the sixth example according to the present invention.

From this table, it can be seen that the package (1) is efficiently cooled by disposing the cooling fans (8) facing each other as in the sixth embodiment. It is considered that this is because the semiconductor element is embedded and the airflow can be induced in the central portion of the package (1) having a relatively large amount of heat generation for cooling.

Seventh Embodiment FIG. 7 is a plan view showing a seventh embodiment which is a modification of the embodiment shown in FIG. The same parts as those in FIG. 6 are designated by the same reference numerals, and detailed description thereof will be omitted. Although the drawing is omitted piezoelectric element _(71), (7 ₂₎ wiring for applying a voltage to the may be performed in a manner similar to that described in Example 6.

In this embodiment, the support base (5b) is attached to each of the four corners of the upper surface of the package body (1) with an adhesive such as an epoxy resin.
Is fixed, and the cooling fan (8) is arranged facing the support (5b) toward the center of the package (1).

As shown in this embodiment, the cooling effect is further enhanced by increasing the number of cooling fans (8) or adjusting the direction of the cooling fan (8) as compared with the sixth embodiment, so that the cooling is effective even for a large area package. The effect can be obtained.

Example 8 Next, an eighth example according to the present invention is shown in FIG.
A description will be given by citing (b). Since the basic configuration of the electronic component device is exactly the same as that of the fourth embodiment, detailed description will be omitted.

Further, the piezoelectric element _(71), (7 ₂₎ wiring for applying a voltage to the drawings on may be carried out in the same manner as has been omitted as described in Example 3 method.

In this electronic component device, by applying an AC voltage to the bimorph oscillator composed of the diaphragm (6) and the piezoelectric elements (7 ₁ ) and (7 ₂ ), the cooling fan (8b) is moved as shown in FIG. 4 (a). Although the tip of the vibrating plate (6) vibrates as indicated by the arrow in FIG. 2, in this embodiment, two or more high-order resonance frequencies are applied to drive the cooling fan (8b). Figure 21 shows
It is a conceptual diagram for demonstrating the order of the resonance frequency of a bimorph oscillator.

As described above, the vibrating plate (6) vibrates when a voltage is applied to the piezoelectric element (7), but the manner of this vibration changes depending on the applied resonance frequency. That is, by increasing the resonance frequency, the diaphragm (6) becomes a first-order vibration mode with a large amplitude as shown in FIG. 24 (a). When the resonance frequency is further increased, as shown in Fig. 24 (b), 2
It becomes the next vibration mode.

For example, in this embodiment, the piezoelectric element (7 ₁ ) (7 ₂ ) (length: 6 mm) and the vibrating plate (6) (the length from the tip of the piezoelectric element that is not held by the piezoelectric element; 9 mm) are used. The bimorph oscillator was driven at a secondary resonance frequency of 1.8 KHz with an applied voltage of 10 V. The effects of this embodiment will be described below.

In other words, the wind speed is 0.8m / sec when driven at the primary resonance frequency (316Hz), while the wind speed is 1.4m / sec when driven at the secondary resonance frequency (1.8KHz). It was The present invention is not limited to the above embodiment. The maximum wind speed of the wind induced by the cooling fan (8b) is proportional to the product of the displacement amount of the diaphragm (6) and the driving frequency. Therefore 2
When driven at a higher resonance frequency than the next higher order, the wind speed decreases but the drive frequency increases compared to when driven at the first resonance frequency due to the change in the drive mode and the reduction in the displacement of the diaphragm. Since the amount is large, it is possible to obtain a large wind speed as a whole by appropriately selecting the dimensions and the like of the cooling fan (8b).

In addition to the piezoelectric element, a magnetic effect or the like can be used as a driving source of the piezoelectric element.

Embodiment 9 FIGS. 8 (a) and 8 (b) are a perspective view and a plan view for explaining a ninth embodiment of the present invention.

This embodiment has the same basic configuration as that of the embodiment 4 described above.
The detailed description is omitted because it is exactly the same as that used in FIG. Although not shown in the drawing, the piezoelectric elements (7 ₁ ) and (7 ₂ )
Wiring for applying a voltage to can be performed by the same method as described in the third embodiment. Here, as shown in FIG. 8 (b), a cooling fan (8b
₁ ) is characterized in that the ratio of the effective lengths l ₁ and l ₂ of the vibration plate (6) and the piezoelectric elements (7 ₁ ) and (7 ₂ ) is set to, for example, l ₂ : l ₁ = 4: 6. . The same parts as those in FIG. 4 are designated by the same reference numerals. Here, the effective length of the piezoelectric elements (7 ₁ ) and (7 ₂ ) is the length of the portion not held by the support base (5a),
l ₁ and the effective length of the diaphragm (6) is the piezoelectric element (7 ₁ )
It refers to the length of the part that is not held in (7 ₂ ), l ₂ . The effective length of the bimorph oscillator is the length l _{0 of the} part not held by the support (5a), that is, l ₀ = l ₁ +
pointing to l ₂ .

With such a configuration, the bimorph oscillator (6) vibrates and the surface of the package body (1) is effectively cooled.

Figure 9 shows the effect of the composition ratio of the bimorph oscillator. The vertical axis shows the measured wind speed at a certain point in front of the cooling fan (8b ₁ ) alone, and the horizontal axis shows the composition ratio. . Measurements were performed by changing the effective length l ₀ of the bimorph oscillator, but all were l ₂ : l ₁ = 4: 6, that is, l ₁ / l ₁ + l ₂ = l ₁ /
It can be seen that the maximum wind speed is obtained at l ₀ = 0.6. The vibration mode in this case is the first order.

Therefore, by forming the cooling fan (8b ₁ ) with this composition ratio, it is possible to obtain the agent first wind speed at that size, that is, the maximum cooling effect.

Further, although l ₁ / l ₁ + l ₂ = 0.6 is set in the embodiment, the present invention is not limited to this value. For example 0.5 ≦ l ₁ / l ₁
Within the range of about + l ₂ ≦ 0.7, the lengths of l ₁ and l ₂ can be appropriately changed to obtain a sufficient cooling effect.

10th Embodiment FIGS. 10 (a), (b), (c), and (d) are a plan view and an AA sectional view of a tenth embodiment of an electronic component device according to the present invention.
It is a side view and a perspective view.

The basic configuration is almost the same as that of the electronic component device shown in FIG. 4 of the above-described fourth embodiment, and therefore detailed description thereof is omitted, and the same components are designated by the same reference numerals. Although not shown in the drawing, wiring for applying the voltage to the piezoelectric elements (7 ₁ ) and (7 ₂ ) may be performed by the same method as described in the third embodiment. In this embodiment, the cooling means is a cooling fan (8).
And a cooling fin (10) provided so as to face the cooling fan (8). That is,
In order to cool the package (1) efficiently by the flow of wind induced by the cooling fan (8), a cooling fin (10) made of, for example, aluminum is placed facing the cooling fan (8) with an adhesive such as an epoxy resin. By disposing, the heat generated from the electronic component package (1) can be effectively dissipated mainly from the vertical surface (11) of the cooling fin (10).

Eleventh Embodiment FIGS. 11 (a), (b) and (c) are a plan view, an AA sectional view and a side view showing an eleventh embodiment which is a modified example of the tenth embodiment. Portions corresponding to FIGS. 10 (a), (b), and (c) are designated by the same reference numerals, and detailed description thereof will be omitted. Although the drawing is omitted piezoelectric element ₍₇₁₎ may be carried out by (7 ₂₎ of wiring for applying a voltage is described in Example 3 to the same method.

This embodiment is characterized in that the height of the cooling fin (10a) is made lower than that of the cooling fin (8). For example, by making it half height, the vertical surface (11
Since a) and the horizontal plane (13a) can be cooled, it is effective when there is no space for the cooling fins.

Embodiment 12 FIGS. 12 (a), (b) and (c) are a plan view, an AA sectional view and a side view showing a twelfth embodiment which is still another modification of the tenth embodiment. The parts corresponding to those in FIGS. 12 (a), (b) and (c) are designated by the same reference numerals, and detailed description thereof will be omitted.

Further, the piezoelectric element _(71), (7 ₂₎ wiring for applying a voltage to the drawings on may be performed in the same manner as has been omitted Example 10.

This embodiment is characterized in that the shape of the cooling fin (10b) is uneven. For example, as shown in FIG. 12, a pleated cooling fin (10b) is used to increase the surface area of the portion to be cooled, and the cooling effect is further enhanced as compared with the embodiments 10 and 11.

Example 13 Example 13 of the present invention will be described with reference to the drawings.

FIGS. 13 (a) and 13 (b) are a plan view and an AA sectional view of an electronic component device showing a thirteenth embodiment of the present invention, and FIGS. 13 (c) and 13 (d) are bimorph vibrations. It is the top view and sectional view which expanded the child part.

The same parts as those in FIG. 1 shown in the first embodiment are designated by the same reference numerals and detailed description thereof will be omitted.

In this embodiment, a piezoelectric element that holds a diaphragm (6) outside the ceramic base ( ₁₁ ) forming a part of the package body (1) as shown in FIGS. 13 (c) and (d). (7 ₁₎ is fixed (7 ₂₎ cooling fan consists (8d) is fixed upright by an adhesive (13), as especially the good conductivity thermally. As is well known, the piezoelectric elements (7 ₁ ) and (7 ₂ ) are piezoelectric bodies (40), respectively.
And the electrodes (41) bonded to both sides of the piezoelectric body (40).
a) and (41b), the electrode (41a) that holds the diaphragm (6) here is the positive electrode and the electrode (41b) that is on the opposite side is (41a).
b) is the negative electrode. In this embodiment, 15 cooling fans (8d) are two-dimensionally arranged like a sword as shown in FIGS. 13 (a) and 13 (b) to form a cooling means.

The diaphragm of the cooling fan (8) (6), terminal connected to the positive electrode (6 ₁₎ is provided in the piezoelectric element, wherein the terminals (6 ₁₎ is as shown in Figure 13 (a) They are connected in parallel by a lead wire (42a), and one end of this lead wire (42a) is provided in the ceramic base (1 ₁ ) from the lead frame (4a) to a through hole in which a conductive material is embedded. (Not shown) is attached and electrically connected to the terminal (43a) led out from this through hole. The piezoelectric element _(71), one end another through hole (Figure from the lead frame (4b) of the connected lead (42b) in parallel by the negative electrode also leads to each other (42b) of (7 ₂₎ It is connected to a terminal (43b) derived from (not shown).

This wiring method is not limited to this embodiment, and wiring may be performed using, for example, pattern wiring. The piezoelectric element of each of the cooling fan (8d) (7 _1), it has become (7 ₂₎ a lead frame (4a) in such a voltage via a wire as described above such as (4b).

If such a configuration, the piezoelectric element _(71), the tip of the applying an alternating voltage (7 _2), as indicated by the arrows in FIG. 13 (b) each diaphragm (6) The part vibrates. For example, with an applied voltage of 10 V, the amplitude of the tip of the diaphragm (6) is about 1 mm,
The average wind speed is about 1.3 m / sec, which effectively cools the surface of the ceramic base (1 ₁ ). Further, the same effect can be obtained even if three cooling fans arranged in the vertical direction are continuously formed integrally and vibrated as five vertically long cooling fans.

14th Embodiment FIGS. 14 (a) and 14 (b) are a plan view and an AA sectional view of an electronic component device showing a 14th embodiment which is a modification of the 13th embodiment according to the present invention. . Portions corresponding to FIGS. 13 (a) and 13 (b) are designated by the same reference numerals as those in FIG. 13 and detailed description thereof will be omitted.

In this embodiment, the ceramic cap (1 ₂₎ is constituted by a metal plate joined to expose the through-hole terminals to be described later on the ceramic ring (13) (14), ceramic ring The metal plate (14) is bonded to the metal plate (14) with a low melting point glass (15). Further, the vibrating plate (6) is vertically fixed to the metal plate (14) with a brazing material (not shown), and the piezoelectric element (7a) is fixed to the metal plate (14) with the vibrating plate (6). The metal plate (14), the piezoelectric element (7a), and the vibrating plate (6) are bonded to the side opposite to the surface on which the cooling plate (8e) is attached by soldering or welding. In this embodiment, 15 cooling fans (8e) constitute a cooling means.

The metal plate (14) is attached from the lead frame (4) through the through hole (50) to the above-mentioned terminal (50a) provided outside the ceramic cap (1 ₂ ) by means such as soldering when assembled. It is electrically joined.

On the other hand, the surface of the piezoelectric element (7a) which is not adhered to the metal plate (14) is electrically contacted with the lead frame by a conductive plate-shaped spring (51) adhered to the lead frame by soldering or the like. To keep.

Further, the electrical connection between the lead frame (4) and the metal plate (14) is not performed through the through hole (50), but a ring made of, for example, Kovar (highest mark by Westinghouse; iron-nickel-cobalt alloy) is used. (13) and metal plate (14)
Through the brazing material, eg silver braze, leadframe (4)
It may be welded by the well-known seam weld method. Alternatively, laser welding or soldering may be used.

In such an embodiment, by applying an AC voltage to the electrode surface of the piezoelectric element (7a) which is not joined to the metal plate (14) and the metal plate (14), as shown in 14 (b), The plate (14) vibrates in the vertical direction of the arrow, and the vibration induced by this vibration is generated as left and right vibrations in the vibrating plate (6) (the direction of the arrow in FIG. 14B). Needless to say, the piezoelectric element (7a) is provided with electrodes on both sides thereof, and the electrode on one surface thereof is bonded to the metal plate (14). This example is
Since only one piezoelectric element (7a) is required, there is an advantage that it is easy to drive, and the effect is almost the same as that of the thirteenth embodiment.

Fifteenth Embodiment FIGS. 15 (a) and 15 (b) are a plan view of an electronic component device showing a fifteenth embodiment, which is a modification of the above-described fourteenth embodiment according to the present invention, and a sectional view taken along the line AA. Is. Portions corresponding to those in FIG. 14 are designated by the same reference numerals as those in FIG. 14 and detailed description thereof will be omitted, but the piezoelectric element (7b) will be described in detail in FIG. 15 (b) for explanation of wiring described later. Indicated.

In this embodiment, the slip-type piezoelectric element (7b) seals the package (1) with a ceramic ring (13) and a low-melting glass (15). The slip-type piezoelectric element (7b) has a diaphragm (6). Are directly fixed upright with an adhesive or the like, and the sliding piezoelectric element (7b) and the vibrating plate (6) form a cooling fan (8f) that constitutes a cooling means. Here, the piezoelectric element (7b) was arranged so as to have a polarization in the horizontal direction, and when a voltage was applied to the electrodes (62a) and (62b), the piezoelectric element (7b) vibrated in the horizontal direction.

The electrode surface (62a) of the piezoelectric element (7b) to which the vibration plate (6) is attached is different from the lead frame (4) to which the bonding wire (3) from the semiconductor element (2) is connected. Is electrically connected to the outside of the package via a metal film (60) attached to the side surface of the ceramic cap (1 ₂ ) by soldering or the like. At this time, the metal film (60) is not in contact with the electrode (62b) on the opposite side. The electrode surface (62b) on the opposite side of the piezoelectric element (7b) is kept in electrical contact with the lead frame (4) by a conductive plate-like spring (61) adhered by soldering or the like. It has become.

Further, the method of applying the voltage to the piezoelectric element is not limited to the above embodiment, and for example, the electrode surface (62b) and the lead frame are connected by providing a through hole or the like in the ceramic cap (1 ₂ ). May be.

Generally, the vibration direction of the piezoelectric element is determined by the polarization direction of the piezoelectric body and the voltage application direction. In this embodiment, the polarization direction of the piezoelectric body is horizontal and the voltage application direction is vertical. When an AC voltage is applied to 7b), vibration of the sliding piezoelectric element (7b) is generated in the left and right direction of the arrow as shown in Fig. 15 (b), and this vibration causes the vibrating plate (6) to vibrate in the left and right directions. (The direction of the arrow in FIG. 15 (b)).

Therefore, in this embodiment, the same effect as that of the above-mentioned fifteenth embodiment can be obtained, and since the sliding piezoelectric element (7b) is used, the vibration conversion efficiency is good, and it is composed of one element. Therefore, there are effects such as easy manufacture.

16th Embodiment Hereinafter, a 16th embodiment of the present invention will be described with reference to the drawings.

16 (a) and 16 (b) are a perspective view showing a sixteenth embodiment of an electronic component device according to the present invention and a side view of the perspective view seen from the direction B.

The basic structure of this embodiment is the same as the first embodiment shown in the first embodiment.
Since it is exactly the same as the figure, the same components are denoted by the same reference numerals, and detailed description thereof will be omitted. Further, the piezoelectric element _(71), (7 ₂₎ to the wiring for applying a voltage is omitted on the drawing, the wiring method may be performed in a manner similar to that described in Example 1.

The package body (1) is made of Al ₂ O ₃ and is composed of a diaphragm (6b) on its upper surface and a pair of piezoelectric elements (7 ₁ ) and (7 ₂ ) that hold a part of this diaphragm from both sides. The cooling fan (8j) is fixed upright with an adhesive such as epoxy resin. The vibrating plate (6b) is a T-shaped vibrating part (6b ₁ ) partially held by the piezoelectric elements (7 ₁ ) and (7 ₂ ) and both shoulders of the T-shaped vibrating part (6b ₁ ). It is composed of a vibrating part (6b ₂ ) which is integrally formed on the part and vertically arranged. A lead frame (4) connected to a semiconductor element (not shown) in the package (1) is led out from the package (1).

If such a structure the piezoelectric element _(71), (7 ₂₎ cooling fan by applying an AC voltage to the vibration plate (8j) (6b) as is shown by broken lines in FIG. 18 (b) And induces a wind flow toward the surface of the package (1).

 The effect of this embodiment will be described using a comparative example.

That is, the case of a single package without a cooling fan is set as Comparative Example 1, and the single package (1) shown in FIG.
A comparative example 2 in which a cooling fan (8l) is fixed laterally via a support base (5d) adhered to the case to induce a flow parallel to the package (1) surface, and an inverted L-shape as shown in FIG. Comparative Example 3 is a case in which the cooling fan (8 m) is fixed vertically through the support base (5 l) and the flow is induced toward the package (1) surface.

Table 3 shows the thermal resistance of the packages of the 19th embodiment and the comparative examples 1 to 3 and the minimum required mounting height of the cooling fan. However, the capabilities of the piezoelectric element alone were the same here. Also, the mounting height is 10 in Comparative Example 2 which is fixed sideways.
It is compared as 0%.

From Table 3, it can be seen that in the sixteenth embodiment, the package is cooled efficiently and the mounting space can be made relatively small.

Although the electronic component devices of FIGS. 18 and 19 cited in Comparative Examples 2 and 3 are included in the present invention, they can be sufficiently implemented if desired in consideration of a space or thermal resistance.

Seventeenth Embodiment Hereinafter, a seventeenth embodiment of the present invention will be described with reference to the drawings. 17 (a) and 17 (b) are a perspective view showing a seventeenth embodiment and a side view of the perspective view seen from the direction B.

Since the basic structure of this embodiment is exactly the same as that of the first embodiment, the same parts are designated by the same reference numerals and detailed description thereof will be omitted. Further, the piezoelectric element _(71), (7 ₂₎ wiring for applying a voltage to the drawings on the wiring method has been omitted may be performed in a manner similar to that described in Example 1.

In addition, in this embodiment, the package base (1) is attached to the support base (5
The cooling fan (8k) is attached parallel to the package (1) surface via the c). The cooling fan (8k) is composed of a vibrating plate (6c) whose vibrating part is L-shaped, and piezoelectric elements (7 ₁ ) and (7 ₂ ) that sandwich the vibrating plate (6c) from both sides. The L-shaped portion of the diaphragm is provided downward so that the flow is efficiently induced toward the package surface.
A lead frame (4) connected to a semiconductor element (not shown) in the package (1) is led out from the package (1).

According to this embodiment, the same cooling effect as that of the above-mentioned embodiments can be obtained, and the mounting space can be made smaller. Although the lead frame for applying voltage to the piezoelectric element and the lead frame of the semiconductor element are commonly used in FIGS. 1, 14, 15, and 16 for convenience,
It goes without saying that a lead frame is generally dedicated to the piezoelectric element.

The present invention is not limited to the first to seventeenth embodiments described above, and various modifications can be made without departing from the scope of the present invention.

〔The invention's effect〕

As described above, according to the present invention, the electronic component devices can be individually cooled, so that efficient cooling is possible.

[Brief description of drawings]

1 to 3 are explanatory views of the first to third embodiments of the present invention, FIG. 4 is an explanatory view of the fourth and eighth embodiments of the present invention, and FIGS. 5 to 7 are Explanatory diagrams of the fifth to seventh embodiments according to the present invention, FIGS. 8 and 9 are explanatory diagrams of the ninth embodiment according to the present invention, and FIGS. 10 to 20 are the tenth to tenth aspects of the present invention. 17 is an explanatory view of an embodiment, FIGS. 18 and 19 are explanatory views showing an embodiment according to the present invention for comparison with the conventional art, FIG. 20 is an explanatory view of the operation of a piezoelectric element, and FIG. 21 is a resonance FIG. 22 is a conceptual view of the order of frequency, and FIG. 22 is an enlarged plan view of a mounting portion of the cooling fan of the third embodiment on the support base. 1 ... Package body, 1 ₁ ... Ceramic base, 1 ₂ ... Ceramic cap, 2 ... Semiconductor element, 3 ... Bonding wire, 4 ... Lead frame, 5, 5a-5e ... Supporting base, 6, 6a to 6c …… Vibration plate, 7 _{1 to} 7 ₄ , 7a to 7c …… Piezoelectric element, 8,8a to 8m …… Cooling fan, 9 …… Low melting glass, 10,10a, 10b …… Cooling fin, 13 ...... Ceramic cap, 14 …… Metal plate, 16 …… Supporting part, 17,17a, 17b …… Vibration plate, 20 …… Piezoelectric element, 21a, 21b …… Piezoelectric body, 22a, 22b, 22c …… Electrode, 30a, 30b, 45 …… lead wire, 31a, 31b …… wiring pattern, 34a, 34b …… electrode, 35a, 35b …… metal film, 40 …… piezoelectric material, 42a, 42b …… lead wire, 43a, 43b ...... Terminal, 50 ...... Through hole, 50a ...... Terminal, 60,70 ...... Metal film, 61 ...... Spring, 81a, 81b ...... Lead wire, 83 ...... Pattern wiring.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tomio Ono 1 Komukai Toshiba-cho, Sachi-ku, Kawasaki-shi Toshiba Research Institute Ltd. (72) Inventor Kazutaka Saito 1 Komu-shi Toshiba-cho, Kawasaki-shi, Toshiba Research Institute In-house (72) Inventor Yu Kondo 1 Komukai Toshiba-cho, Sachi-ku, Kawasaki-shi Toshiba Research Institute Co., Ltd. (72) Inventor Kazuhiro Itami Komu-shi Toshiba-cho, Kawasaki-shi 1 Komatsu Mukai Toshiba Co., Ltd. (56) References JP-A-59-15854 (JP, A)

Claims (19)

(57) [Claims] 1. An electronic component device in which an electronic circuit element is mounted in a package, comprising a piezoelectric element and a vibration plate connected so as to resonate with the vibration of the piezoelectric element, and having a smaller installation area than the package. An electronic component device in which the means and the package are integrated. 2. The bimorph oscillator comprising a pair of plate-shaped piezoelectric elements and a diaphragm sandwiched between the pair of piezoelectric elements and arranged so as to project from the plate-shaped piezoelectric elements. The electronic component device according to claim 1, wherein: 3. The electronic component device according to claim 2, further comprising a plurality of the vibrators. 4. The electronic component device according to claim 2, wherein the cooling means is installed on a support base provided in the package. 5. The electronic component device according to claim 4, wherein the support base has an inverted L shape. 6. The electronic component device according to claim 2, wherein the bimorph oscillator is composed of a plurality of sub-vibration plates joined to the vibration plate. 7. The electronic component device according to claim 2, wherein the cooling means is arranged so that the diaphragms face each other. 8. The electronic component device according to claim 2, wherein the ratio of the effective length of the piezoelectric element to the effective length of the bimorph oscillator is 0.5 to 0.7. 9. The electronic component device according to claim 2, wherein the package is provided with a cooling fin, and the cooling means is arranged at a position facing the cooling fin. 10. The electronic component device according to claim 9, wherein the cooling fin is lower than the height of the cooling means. 11. The electronic component device according to claim 9, wherein the cooling fin has an uneven shape. 12. An electronic component device according to claim 2, wherein one or a plurality of the cooling means are provided upright in a package. 13. The cooling means forms a part of the package and seals the package with a metal plate, a piezoelectric element fixed on the metal plate in the package, and the piezoelectric element opposed to the piezoelectric element via the metal plate. The electronic component device according to claim 1, characterized in that the electronic component device comprises a plurality of diaphragms provided upright on the side. 14. The cooling means comprises a piezoelectric element which forms a part of the package and seals the package, and a vibration plate which is provided upright on the piezoelectric element. The electronic component device according to item 1. 15. The electronic component device according to claim 2, wherein a part of the diaphragm is vertically provided on the package surface. 16. The vibrating plate according to claim 2, wherein a portion protruding from the vibrator is bent.
The electronic component device according to the item. 17. The electronic component device according to claim 1, wherein the electrode of the piezoelectric element is electrically connected to the lead frame of the package. 18. The electronic component device according to claim 17, wherein the piezoelectric element and the lead frame are connected by forming a pattern wiring on the package. 19. The electronic component device according to claim 18, wherein the plurality of piezoelectric elements are connected in parallel.