JP2551570Y2 - Chip type capacitors - Google Patents

Description

[Detailed description of the invention] [Industrial application field] The invention relates to an improvement in a capacitor, and particularly relates to a chip-type capacitor in which the sealing inside the capacitor is improved.

[Conventional technology]

In a conventional capacitor, particularly an electrolytic capacitor, a capacitor element formed by winding an electrode foil is impregnated with a liquid electrolyte and stored in an outer case. Therefore, if impurities enter the capacitor, the electrolyte chemically reacts,
It may cause corrosion of the electrode foil. Alternatively, the liquid electrolyte may evaporate from the inside of the capacitor, making it difficult to obtain desired electrical characteristics.

By the way, when a normal capacitor is surface-mounted on a printed circuit board, it has been proposed to cover the outer surface of the capacitor element with a heat-resistant synthetic resin exterior material and bend a lead wire along an end surface of the exterior material. I have.

In the chip type capacitor having such a structure, the step of coating the exterior material is complicated, and the thermal stress in the coating step adversely affects the capacitor element, or depending on the state of coating of the exterior material, the liquid electrolyte may be used. In some cases, it was difficult to prevent transpiration. Therefore, it becomes difficult to maintain desired electric characteristics for a long period of time.

Alternatively, a capacitor element is housed in an outer case, and a normal capacitor sealed with a sealing body such as an elastic rubber is housed in an outer frame conforming to the outer shape of the outer case, and leads protruding from the opening end of the outer frame. A wire that has been bent along the bottom surface has been proposed. In this chip type capacitor, the hermeticity inside the capacitor body is maintained by a sealing body attached to the outer case. Therefore, in a normal use form, desired electrical characteristics can be maintained for a long time.

[Problems to be solved by the invention]

However, chip-type capacitors mounted on electronic devices that require high reliability are required to have high reliability, long life characteristics, and the like. In particular, when the capacitor is used for a long time in a high humidity, moisture enters the inside of the capacitor, which causes deterioration of various electrical characteristics of the capacitor.

Also, after the chip type capacitors are mounted on the surface of the printed circuit board, they may be washed with solvents such as freon or chlorocene to remove the flux used for soldering. In some cases, inconveniences such as corrosion of the capacitor element occur.

Such infiltration of water or solvent most often occurs in the gap between the sealing body attached to the outer case of the capacitor and the lead wire penetrating the sealing body, and the adhesion between the lead wire and the sealing body is reduced. Maintaining is an important issue.

An object of the present invention is to improve the sealing performance of a chip-type capacitor, thereby realizing a longer life, higher humidity resistance, washing resistance, and the like of the chip-type capacitor.

[Means for solving the problem]

This invention has a storage space adapted to the external shape of the capacitor, and an open end face is provided at both ends of the storage space, and at one open end face, from one side to a lead-out part of a capacitor lead wire, An exterior frame having a wall portion having a surface protruding from the opening end surface, and an insulating plate having a plurality of through holes in a central portion, through which the lead wires of the capacitor are respectively inserted, and arranged on the end surface of the capacitor. A capacitor provided with an insulating plate on the end face and a resin layer covering the gap between this insulating plate and the capacitor and a part of the lead wire is stored in the storage space of the outer frame, and the The lead wire is drawn out from an opening end face in which a through hole and a wall portion of the insulating plate are formed, and is bent along the side surface of the exterior frame.

[Action]

As shown in the drawings, in the chip-type capacitor according to the present invention, an insulating plate 6 made of a synthetic resin or the like is arranged on the opening end surface of the outer frame 2. A resin layer 7 covers a gap between the insulating plate 6 and the main body of the capacitor 1 and a part of the lead wire 3 of the capacitor 1. Therefore, the end face of the main body of the capacitor 1 is covered with the insulating plate 6 and the resin layer 7.

Therefore, even in the case of a chip-type capacitor in which the lead wire 3 is bent intricately as in the present invention, the stress is absorbed by the insulating plate 6 and the sealing performance of the capacitor 1 main body is not impaired.

〔Example〕

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG.
The figure is a partial sectional view thereof. FIG. 3 is a perspective view showing an insulating plate used in the embodiment.

In this embodiment, an electrolytic capacitor will be described as an example.

As shown in FIG. 2, the main body of the capacitor 1 accommodates a capacitor element 4 formed by winding an electrode foil (not shown) in a cylindrical outer case 8 having a bottom. The inside is hermetically sealed by mounting a sealing body 5 made of the same. Further, the lead wire 3 electrically connected to the electrode foil of the capacitor element 4 penetrates the sealing body 5 and is led out.

An insulating plate 6 as shown in FIG. 3 is mounted on the end face of the capacitor 1. The insulating plate 6 is made of a heat-resistant synthetic resin,
It is made of a ceramic material or the like, and is formed in a disk shape having substantially the same size as the diameter of the capacitor 1. Also, through holes 9a and 9b are formed near the center, and the lead wire 3 is provided with the through holes 9a and 9b.
Insert 9b. The through holes 9a and 9b correspond to the positions of the lead wires 3 protruding from the end face of the main body of the capacitor 1, and are formed slightly larger in diameter than the outer diameter of the lead wires 3.

As shown in FIG. 2, a resin layer 7 made of a synthetic resin having excellent heat resistance, for example, an epoxy resin, a silicon resin, or the like is formed in a gap between the insulating plate 6 and the capacitor 1. For example, when the insulating plate 6 is disposed on the end surface of the capacitor 1 main body, the resin layer 7 is coated with a synthetic resin in advance on the end surface of the insulating plate 6 and / or the end surface of the capacitor 1 main body. And then solidified to form. Alternatively, after the insulating plate 6 is disposed on the end face of the capacitor 1, a synthetic resin may be injected and solidified with a syringe or the like.

A part of the resin layer 7 fills the gap between the through holes 9a and 9b of the insulating plate 6 and the lead wire 3 due to its viscosity when a synthetic resin or the like is filled in the gap between the capacitor 1 and the insulating plate 6. Is done. Then, after the synthetic resin is solidified, the lead wire 3 is fixed in the through holes 9a and 9b. Alternatively, through-hole 9a,
The resin layer 7 may be formed by directly injecting and solidifying a synthetic resin into 9b.

The outer frame 2 is made of a heat-resistant synthetic resin, and has a storage space inside which conforms to the external shape of the capacitor 1 as shown in FIG. A wall portion 10 covering a part of the portion is formed. In addition, a groove 11 for accommodating the lead wire 3 of the capacitor 1 is formed on the bottom surface.

The capacitor 1 is housed in a housing space of the exterior frame 2 with the insulating plate 6 attached to the end face, and the lead wire 3 is bent from the opening end face of the exterior frame 2 along the bottom face and housed in the groove 11.

In the chip type capacitor according to this embodiment, the end of the main body of the capacitor 1 is covered with the insulating plate 6 and the resin layer 7. Therefore, when this chip-type capacitor is mounted on a printed circuit board and soldered, the heat of the solder is less likely to be conducted to the capacitor 1 main body, and thermal deterioration of the capacitor 1 main body can be reduced.

Further, even when a cleaning agent such as freon for removing the flux in the soldering process adheres, the end surface of the capacitor 1 main body is covered with the insulating plate 6 and the resin layer 7, so that the mixing can be prevented. At the same time, it is possible to suppress infiltration of moisture even in use in an environment with high humidity.

Further, in the manufacturing process, the stress when the lead wire 3 is bent in a complicated manner from the through holes 9a and 9b of the insulating plate 6 and the opening end surface of the exterior frame 2 along the bottom surface is absorbed by the insulating plate 6, and the The adhesion between the sealing body 5 and the lead wire 3 is not impaired. Therefore, it becomes easy to maintain the desired sealing performance of the capacitor 1 main body.

[Effect of the invention]

As described above, in the chip type capacitor according to the present invention, the end face of the capacitor body is covered with the insulating plate and the resin layer, and the adhesion between the lead wire and the sealing body is increased. improves. for that reason,
Scattering of the contents of the capacitor is reduced, and the life characteristics are improved.

Further, intrusion of moisture and impurities from the outside can be prevented, and stable electric characteristics can be maintained for a long time. In particular, the penetration of the cleaning agent in the printed circuit board mounting step can be suppressed, and the cleaning resistance is improved.

Furthermore, in the process of mounting and soldering a chip-type capacitor according to the present invention on a printed circuit board, conduction of solder heat is suppressed by the insulating plate and the resin layer, so that thermal deterioration due to solder heat is reduced and reliability is improved. I do.

In addition, since the resin layer is also filled in the gap between the through hole of the insulating plate and the lead wire of the capacitor body, the lead-out portion of the capacitor will also be covered with the resin layer, and if the lead back is bent However, the effect of the mechanical stress can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 is a partial sectional view thereof. FIG. 3 is a perspective view showing an insulating plate used in the embodiment. DESCRIPTION OF SYMBOLS 1 ... capacitor, 2 ... exterior frame, 3 ... lead wire, 4 ... capacitor element, 5 ... sealing body, 6 ... insulating plate, 7 ... resin layer, 8
... exterior case, 9 ... through-hole, 10 ... wall, 11 ... groove.

Claims (1)

(57) [Scope of request for utility model registration] A storage space adapted to the external shape of the capacitor is provided, and open end faces are provided at both ends of the storage space, and one of the open end faces extends from one side surface to a lead-out portion of a lead wire of the capacitor. An exterior frame provided with a wall having a surface protruding from the opening end surface, an insulating plate provided with a plurality of through holes in the center portion, through which lead wires of the capacitor are respectively inserted, and arranged on the end surface of the capacitor. A capacitor provided with an insulating plate on the end face, and provided with a resin layer that covers a gap between the insulating plate and the capacitor and a part of the lead wire, is stored in a storage space of the outer frame, and is stored in the outer frame. A chip-type capacitor in which the lead wire of (1) is led out from the opening end face in which the through hole and the wall of the insulating plate are formed, and is bent along the side surface of the exterior frame.