JP2547048B2 - Cream solder - Google Patents
Cream solderInfo
- Publication number
- JP2547048B2 JP2547048B2 JP62304989A JP30498987A JP2547048B2 JP 2547048 B2 JP2547048 B2 JP 2547048B2 JP 62304989 A JP62304989 A JP 62304989A JP 30498987 A JP30498987 A JP 30498987A JP 2547048 B2 JP2547048 B2 JP 2547048B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- copper
- powder
- cream solder
- cream
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はクリームはんだの改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to improvement of cream solder.
ICやLSI等における電極または端子、あるいはそれら
のメッキには銀パラジウムペーストが多用されている。
しかしながら、銀パラジウムは高価であるばかりかマイ
グレーションの発生がある。すなわち、フラックス残渣
等によるCI-やF-イオンの存在並びに水分の存在下、水
分が電解質溶液化され、電圧印加による通電のために陽
極側では、 Ag→Ag+＋ｅ の反応によりAg+が溶出し、陰極側では放電のために、 Ag+＋ｅ→Ag の反応により金属Agが析出し、これらの反応の連続によ
って、陰極に析出せるAgが陽極に向かって樹枝状に成長
していき、遂には両電極間が短絡するに至るのである。Silver-palladium paste is often used for electrodes or terminals in ICs, LSIs, etc., or for plating them.
However, silver-palladium is not only expensive, but also causes migration. That is, in the presence of CI − and F − ions due to the flux residue and the presence of water, the water becomes an electrolyte solution and Ag + is eluted by the reaction of Ag → Ag + + e on the anode side due to the energization by voltage application. On the cathode side, however, metal Ag is deposited by the reaction of Ag + + e → Ag due to discharge, and the Ag deposited on the cathode grows in a dendritic manner toward the anode due to the continuation of these reactions, and finally Causes a short circuit between both electrodes.
かかる弊害の防止には、上記の銀パラジウムペースト
に代え銅ペーストの使用が考えられる。In order to prevent such an adverse effect, it is conceivable to use a copper paste instead of the above silver palladium paste.
而るに、IC,LSI用のはんだには、耐熱性の点から低融
点のものを使用する必要があり、Pb−Sn系はんだに限定
されてしまう。しかし、かかるはんだにおける銅の溶食
量は大であり、銅ペースト電力あるいはメッキ層のいわ
ゆる『銅食われ』現象が問題となる。Therefore, it is necessary to use a solder having a low melting point in terms of heat resistance as the solder for IC and LSI, and the solder is limited to the Pb—Sn solder. However, the amount of copper corrosion in such solder is large, and the so-called "copper erosion" phenomenon of the copper paste power or the plating layer becomes a problem.
従来、はんだの銅食われ現象を防止するために、はん
だに銅を合金状態で混入して、はんだへの溶解度を低減
することが公知である。しかしながら、はんだを銅合金
化すると、はんだ融点の上昇を免れ得ず、IC,LSI等の電
子部品に対してのはんだの低融点化といった基本的な要
請が阻却されてしまう。Conventionally, in order to prevent the copper erosion phenomenon of the solder, it is known that copper is mixed in the solder in an alloy state to reduce the solubility in the solder. However, if the solder is made of a copper alloy, the melting point of the solder is unavoidably increased, and the basic demand for lowering the melting point of the solder for electronic parts such as IC and LSI is hampered.
本発明の目的は、はんだ融点を実質上、上昇させるこ
となく、銅の電子部品材の銅溶食を充分に軽減できるク
リームはんだを提供することにある。An object of the present invention is to provide a cream solder capable of sufficiently reducing copper corrosion of a copper electronic component material without substantially increasing the solder melting point.
本発明に係るクリームはんだは、ロジンを主成分とす
るフラックスと粉末はんだを含むクリーム状はんだにお
いて、銅食われ防止剤として、はんだ粉末に対する量が
0.2〜５重量％の銅または銅合金粉末を混入したことを
特徴とする構成である。The cream solder according to the present invention, in a creamy solder containing a flux containing rosin as a main component and a powdered solder, as a copper erosion preventive agent, the amount with respect to the solder powder is
The composition is characterized in that 0.2 to 5% by weight of copper or copper alloy powder is mixed.
本発明において使用するはんだ粉末は、低融点はんだ
であり、例えば次の組成のものを使用できる（重量
％）。The solder powder used in the present invention is a low melting point solder, and for example, one having the following composition can be used (% by weight).
本発明において使用するフラックスは、例えば、溶剤
によりペースト状とした非活性化ロジン、弱活性化ロジ
ン、活性化ロジン等であり、必要に応じ活性剤を添加す
ることもできる。活性剤には、有機塩化物（例えばアニ
リン塩酸塩、ヒドラジン塩酸塩）または有機臭化物（例
えば臭化シチルピリジン）を使用できる。 The flux used in the present invention is, for example, a non-activated rosin, a weakly activated rosin, an activated rosin or the like which is made into a paste with a solvent, and an activator can be added if necessary. As the activator, an organic chloride (eg, aniline hydrochloride, hydrazine hydrochloride) or an organic bromide (eg, cytylpyridine bromide) can be used.
はんだ粉末の粒子径は、通常63μｍ以下であり、銅ま
たは銅合金粉末の粒子径も63μｍ以下とすることが好ま
しい。本発明に係るクリームはんだを使用してはんだ付
けを行うと、銅または銅合金粉末が溶融はんだに溶解し
ていき、溶解飽和濃度に達すると、その溶解が停止す
る。而して、この溶融はんだへの銅または銅合金の溶解
量が飽和濃度に近いほど、被はんだ付け導体であるプリ
ント銅導体の銅食われ現象が効果的に抑制される。The particle diameter of the solder powder is usually 63 μm or less, and the particle diameter of the copper or copper alloy powder is also preferably 63 μm or less. When soldering is performed using the cream solder according to the present invention, the copper or copper alloy powder is dissolved in the molten solder, and when the saturated saturation concentration is reached, the dissolution is stopped. Thus, the closer the dissolved amount of copper or copper alloy to the molten solder is to the saturation concentration, the more effectively the copper erosion phenomenon of the printed copper conductor which is the soldered conductor is suppressed.
本発明に係るクリームはんだにおいて、はんだ粉末に
対する銅または銅合金粉末の割合を0.1〜５重量％とし
た理由は、0.1重％以下では、銅食われ現象を満足に防
止できず、また、５重量％以下では、はんだ付け温度の
もとでの銅の溶解飽和濃度からして過剰となり、銅また
は銅合金の非溶解分が多くなってはんだ接続強度を低下
させることになるからである。In the cream solder according to the present invention, the reason why the ratio of copper or copper alloy powder to the solder powder is 0.1 to 5% by weight is that when 0.1% by weight or less, the copper erosion phenomenon cannot be satisfactorily prevented, and 5% by weight. This is because when the content is less than 100%, it becomes excessive in view of the saturated concentration of copper dissolved under the soldering temperature, the amount of non-dissolved copper or copper alloy increases, and the solder connection strength decreases.
本発明のクリームはんだは、銅ペーストにより電極を
構成したIC,LSIあるいは高密度実装のプリント回路板を
対象としてのリフロー法によるはんだ付けに使用する。INDUSTRIAL APPLICABILITY The cream solder of the present invention is used for soldering by the reflow method for an IC, LSI or a printed circuit board on which high density packaging is made by forming electrodes with a copper paste.
この場合、加熱により、まずクリームはんだ中のはん
だ粉末が溶融し、クリームはんだ中の銅粉末または銅合
金粉末が溶融はんだに溶解していく。その結果、溶融は
んだの銅溶解濃度が上昇し、銅ペースト電極材である銅
の溶融はんだへの溶解が阻止される。従って、銅ペース
ト電極のはんだによる銅食われ現象を良く防止できる。
一方、はんだは、はんだ粉末自体の融点で溶融を開始す
るから、銅粉末混合によるはんだ使用温度の上昇を実質
上排除できる。In this case, the heating first melts the solder powder in the cream solder, and the copper powder or the copper alloy powder in the cream solder melts in the molten solder. As a result, the copper dissolution concentration of the molten solder is increased, and the dissolution of copper, which is the copper paste electrode material, into the molten solder is prevented. Therefore, the copper erosion phenomenon due to the solder of the copper paste electrode can be well prevented.
On the other hand, since the solder starts melting at the melting point of the solder powder itself, the rise in the solder use temperature due to the mixing of the copper powder can be substantially eliminated.
このように本発明に係るクリームはんだによれば、は
んだの使用温度を殆ど上昇させることなく銅ペースト電
極等を対象としての銅食われ現象を防止できるから、電
極を銅ペーストで形成したIC,LSIあるいは高密度プリン
ト回路板のはんだ付けに極めて有用である。Thus, according to the cream solder according to the present invention, since it is possible to prevent the copper erosion phenomenon targeting the copper paste electrode or the like without almost raising the use temperature of the solder, IC formed by the copper paste electrode, LSI Alternatively, it is extremely useful for soldering high density printed circuit boards.
Claims (2)
んだを含むクリーム状はんだにおいて、銅食われ防止剤
として、はんだ粉末に対する量が0.2〜５重量％の銅ま
たは銅合金粉末を混入したことを特徴とするクリームは
んだ。1. A creamy solder containing a flux containing rosin as a main component and a powdered solder, wherein a copper or copper alloy powder in an amount of 0.2 to 5% by weight based on the solder powder is mixed as a copper corrosion inhibitor. Characteristic cream solder.
が63μｍ以下である特許請求の範囲第１項記載のクリー
ムはんだ。2. The cream solder according to claim 1, wherein the particle size of the solder powder and the copper or copper alloy powder is 63 μm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62304989A JP2547048B2 (en) | 1987-12-01 | 1987-12-01 | Cream solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62304989A JP2547048B2 (en) | 1987-12-01 | 1987-12-01 | Cream solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01148487A JPH01148487A (en) | 1989-06-09 |
| JP2547048B2 true JP2547048B2 (en) | 1996-10-23 |
Family
ID=17939732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62304989A Expired - Fee Related JP2547048B2 (en) | 1987-12-01 | 1987-12-01 | Cream solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2547048B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3829475B2 (en) * | 1998-05-13 | 2006-10-04 | 株式会社村田製作所 | Solder composition for joining a Cu base material |
| AU2001249378A1 (en) * | 2000-03-24 | 2001-10-08 | Motorola, Inc. | Anti-scavenging solders for silver metallization and method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5999471U (en) * | 1983-06-02 | 1984-07-05 | アイワ株式会社 | Copper paste with solder powder |
| JPS62179889A (en) * | 1986-01-31 | 1987-08-07 | Senjiyu Kinzoku Kogyo Kk | Creamy solder |
| JPH0651238B2 (en) * | 1986-12-25 | 1994-07-06 | 横河電機株式会社 | Solder |
-
1987
- 1987-12-01 JP JP62304989A patent/JP2547048B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01148487A (en) | 1989-06-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |