JPS5999471U - Copper paste with solder powder - Google Patents

Copper paste with solder powder

Info

Publication number
JPS5999471U
JPS5999471U JP8294883U JP8294883U JPS5999471U JP S5999471 U JPS5999471 U JP S5999471U JP 8294883 U JP8294883 U JP 8294883U JP 8294883 U JP8294883 U JP 8294883U JP S5999471 U JPS5999471 U JP S5999471U
Authority
JP
Japan
Prior art keywords
solder powder
copper paste
copper
powder
recorded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8294883U
Other languages
Japanese (ja)
Inventor
松浦　真
Original Assignee
アイワ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アイワ株式会社 filed Critical アイワ株式会社
Priority to JP8294883U priority Critical patent/JPS5999471U/en
Publication of JPS5999471U publication Critical patent/JPS5999471U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図、第２図は実施例要部断面図である。 符号の説明、２・・・・・・ハンダ粉末、３・・・・・
・銅ペースト。FIGS. 1 and 2 are sectional views of essential parts of the embodiment. Explanation of symbols, 2...Solder powder, 3...
・Copper paste.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 銅ペースト中に脈絡導体を形成すべくハンダ粉末を混入
してなることを特徴＆するハンダ粉末入り銅ペースト。A copper paste containing solder powder, characterized in that it is made by mixing solder powder into the copper paste to form a wire conductor.
JP8294883U 1983-06-02 1983-06-02 Copper paste with solder powder Pending JPS5999471U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8294883U JPS5999471U (en) 1983-06-02 1983-06-02 Copper paste with solder powder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8294883U JPS5999471U (en) 1983-06-02 1983-06-02 Copper paste with solder powder

Publications (1)

Publication Number Publication Date
JPS5999471U true JPS5999471U (en) 1984-07-05

Family

ID=30212905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8294883U Pending JPS5999471U (en) 1983-06-02 1983-06-02 Copper paste with solder powder

Country Status (1)

Country Link
JP (1) JPS5999471U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01148487A (en) * 1987-12-01 1989-06-09 Uchihashi Estec Co Ltd Cream solder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01148487A (en) * 1987-12-01 1989-06-09 Uchihashi Estec Co Ltd Cream solder

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