JP2545086Y2 - Automatic pin polishing machine - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION The present invention relates to an improved automatic pin polishing apparatus.

[0002]

2. Description of the Related Art In a conventional pin polishing apparatus, a polishing pin coated with diamond slurry is mounted on a drilling machine, and a cylindrical work sandwiched between jigs is manually driven up and down to insert and remove the pin from the cylinder. Therefore, there is a problem that the accuracy of the inner diameter of the cylinder does not increase, the work is deformed due to the distorted force applied to the jig, and the roundness after polishing does not increase.

[0003]

SUMMARY OF THE INVENTION The present invention solves these problems, and is an automatic pin polishing apparatus with high finishing accuracy, comprising a set of chucks having V-grooves and holding a work from both sides. An automatic structure is provided in which a substrate, on which a work receiver supporting the lower end of the work is disposed, is movable up and down, front and rear, and left and right, and a polishing pin is rotated to be inserted into and removed from the work inner cylinder by switching. A pin polishing device is provided.

[0004]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 show an embodiment of the present invention. FIG. 1 is a schematic view of an apparatus of the present invention, and FIG. 2 is a schematic view of a state where a work is held between both sides by chucks. In the drawings, the same members are denoted by the same reference numerals, 1 is a work such as a cylindrical zirconia sleeve having an inner diameter of 1 mm to 3 mm, 2 is a work holder for holding an end of the work 1, 3 is a V-groove portion, and the work is provided from both sides. A chuck for sandwiching and holding the work 1 by pressing and holding the work 1 by the air cylinder 4 or separating the work 1 from both sides.
5 is a substrate holding the work receiver 2 and the air cylinder 4;
Reference numeral 6 denotes a bowl for moving the substrate 5 in a seesaw operation with respect to a horizontal plane. The substrate 5 is horizontally held by a relatively weak spring (not shown). Reference numeral 7 denotes a substrate that holds the bowl 6 and horizontally moves the substrate 5 back and forth, 8 denotes a substrate that horizontally moves the substrate 7 left and right, 81 and 82 denote sliding portions, respectively, and 9 denotes a member that holds the members 2 to 8 described above. , Pipe 91 is cylinder 1
Reference numeral 11 denotes a substrate which is slid up and down and moves up and down. Reference numeral 11 denotes a polishing pin having a tapered tip end and a polishing material such as diamond slurry applied to the surface thereof. The movement is controlled to be inverted.

Next, the operation of this embodiment will be described. First, with the work 1 held by the work receiver 2, the substrate 7
Work 1 is coaxial with pin 11
Positioning is performed so as to face the chuck 3. Next, the work 1 is pressed and clamped by the chuck 3 from both sides by the air cylinder 4. In this state, the pin 11 is lowered while rotating, and the inner surface of the cylinder of the work 1 is polished. When the pin 11 descends to the specified position, the switch 13 switches and the pin 11 rises. If the pins 11 bite into the inner surface of the cylinder of the work 1 during operation, stress and displacement are generated on the substrate 5. These are detected by a pressure detector or displacement detector (not shown), and the pins 11 are raised. Thereafter, the substrate 7 is adjusted to a specified position by applying feedback by, for example, a servo system, and then polished again. Further, a slight axis deviation between the work 1 and the pin 11 is absorbed by the inclination displacement of the substrate 5 from the horizontal plane. .

[0006]

According to the configuration of the present invention as described above, since the chuck portion of the apparatus has flexibility,
The inner peripheral surface with good roundness can be polished without being affected by a slight deviation of concentricity, and the work is pressed and clamped by the V-groove surface of the chuck. Has no effect. In addition, since the pin 11 moves up and retreats upon detection of biting, continuous automatic machining is facilitated.

[Brief description of the drawings]

FIG. 1 is a schematic diagram of an embodiment of the present invention.

FIG. 2 is a schematic view of the embodiment of the present invention in which the work is held between both sides by chucks;

[Explanation of symbols]

 Reference Signs List 1 work 2 work receiver 3 chuck 4 air cylinder 6 bowl 5, 7, 8, 9 substrate 10 cylinder 11 pin 12, 13 switch

Claims (1)

(57) [Scope of request for utility model registration] 1. A substrate provided with a set of chucks having a V-groove and holding a work from both sides and holding a work supporting the lower end of the work is movably held up and down, front and rear, and left and right.
An automatic pin polishing apparatus characterized in that a polishing pin is rotated so as to be inserted into and removed from a work inner cylinder by switching.