JPS6471656A - Mirror polishing device for wafer - Google Patents

Mirror polishing device for wafer

Info

Publication number
JPS6471656A
JPS6471656A JP23039887A JP23039887A JPS6471656A JP S6471656 A JPS6471656 A JP S6471656A JP 23039887 A JP23039887 A JP 23039887A JP 23039887 A JP23039887 A JP 23039887A JP S6471656 A JPS6471656 A JP S6471656A
Authority
JP
Japan
Prior art keywords
wafer
drum
chamfering
polishing
chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23039887A
Other languages
Japanese (ja)
Other versions
JPH0761601B2 (en
Inventor
Seiichi Maeda
Isao Nagahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SpeedFam Co Ltd
Original Assignee
SpeedFam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SpeedFam Co Ltd filed Critical SpeedFam Co Ltd
Priority to JP62230398A priority Critical patent/JPH0761601B2/en
Publication of JPS6471656A publication Critical patent/JPS6471656A/en
Publication of JPH0761601B2 publication Critical patent/JPH0761601B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

PURPOSE:To enable a wafer to be easily mirror polished at the chamfered part by adapting a polishing drum to the chamfered part while rotating the wafer about an axial line by a chuck table. CONSTITUTION:When a wafer 1 is supplied onto a chuck table 17 of the first chamfering mechanism 6 from a loader part 3 by a conveying arm 84, holding the wafer 1 to be sucked onto the table 17 by a chuck means, the table 17 starts rotating around a tilt axial line, and also a polishing drum 32 simultaneously starts rotating. Subsequently, advancing a slide table 25 by a cylinder 24, the drum 32 is adapted to a chamfering part 1a of the wafer 1, performing mirror polishing. Here advancing the table 25, immediately before it reaches the final end part, the drum 32 is adapted to the wafer 1, and because a mounting member 27, while drawing up a weight 38, relatively retracts to the table 25 by an air slide mechanism 26, the drum 32 is pressed to the chamfering part 1a by acting force corresponding to the gravitational force of the weight 38 acting on the member 27.
JP62230398A 1987-09-14 1987-09-14 Wafer mirror surface processing method Expired - Fee Related JPH0761601B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62230398A JPH0761601B2 (en) 1987-09-14 1987-09-14 Wafer mirror surface processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62230398A JPH0761601B2 (en) 1987-09-14 1987-09-14 Wafer mirror surface processing method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP4489795A Division JP2651479B2 (en) 1995-02-09 1995-02-09 Wafer mirror finishing equipment

Publications (2)

Publication Number Publication Date
JPS6471656A true JPS6471656A (en) 1989-03-16
JPH0761601B2 JPH0761601B2 (en) 1995-07-05

Family

ID=16907253

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62230398A Expired - Fee Related JPH0761601B2 (en) 1987-09-14 1987-09-14 Wafer mirror surface processing method

Country Status (1)

Country Link
JP (1) JPH0761601B2 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02139165A (en) * 1988-08-12 1990-05-29 Shin Etsu Handotai Co Ltd Method and device for automatic beveling of wafer
JPH02303759A (en) * 1989-05-16 1990-12-17 Toshiba Ceramics Co Ltd Polishing of peripheral edge part of wafer
DE4031163A1 (en) * 1989-10-03 1991-04-11 Speedfam Corp EDGE POLISHER
JPH0513388A (en) * 1991-06-29 1993-01-22 Toshiba Corp Manufacture of semiconductor wafer
JPH0615957U (en) * 1992-07-31 1994-03-01 信越半導体株式会社 Rotary indexing wafer chamfer polishing machine
US6227945B1 (en) 1997-12-05 2001-05-08 Kyokuei Kenmakako Kabushiki Kaisha Method and apparatus for polishing the outer periphery of disc-shaped workpiece
US6261160B1 (en) 1997-09-11 2001-07-17 Speedfam Co., Ltd. Method and apparatus for specular-polishing of work edges
WO2001062436A1 (en) * 2000-02-23 2001-08-30 Shin-Etsu Handotai Co., Ltd. Method and apparatus for polishing outer peripheral chamfered part of wafer
WO2006112532A1 (en) * 2005-04-19 2006-10-26 Ebara Corporation Substrate processing apparatus
US7250365B2 (en) 2001-04-17 2007-07-31 Renesas Technology Corp. Fabrication method of semiconductor integrated circuit device
JP2009027198A (en) * 2008-10-31 2009-02-05 Renesas Technology Corp Manufacturing method of semiconductor integrated circuit device
CN113814832A (en) * 2021-11-23 2021-12-21 杭州中欣晶圆半导体股份有限公司 Device for improving epitaxial thickness uniformity of large-size silicon single crystal and operation method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11245151A (en) * 1998-02-27 1999-09-14 Speedfam Co Ltd Work periphery polishing device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501112U (en) * 1972-02-14 1975-01-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501112U (en) * 1972-02-14 1975-01-08

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02139165A (en) * 1988-08-12 1990-05-29 Shin Etsu Handotai Co Ltd Method and device for automatic beveling of wafer
JPH02303759A (en) * 1989-05-16 1990-12-17 Toshiba Ceramics Co Ltd Polishing of peripheral edge part of wafer
DE4031163A1 (en) * 1989-10-03 1991-04-11 Speedfam Corp EDGE POLISHER
JPH0513388A (en) * 1991-06-29 1993-01-22 Toshiba Corp Manufacture of semiconductor wafer
JPH0615957U (en) * 1992-07-31 1994-03-01 信越半導体株式会社 Rotary indexing wafer chamfer polishing machine
US6261160B1 (en) 1997-09-11 2001-07-17 Speedfam Co., Ltd. Method and apparatus for specular-polishing of work edges
US6227945B1 (en) 1997-12-05 2001-05-08 Kyokuei Kenmakako Kabushiki Kaisha Method and apparatus for polishing the outer periphery of disc-shaped workpiece
WO2001062436A1 (en) * 2000-02-23 2001-08-30 Shin-Etsu Handotai Co., Ltd. Method and apparatus for polishing outer peripheral chamfered part of wafer
US7718526B2 (en) 2001-04-17 2010-05-18 Renesas Technology Corporation Fabrication method of semiconductor integrated circuit device
US7250365B2 (en) 2001-04-17 2007-07-31 Renesas Technology Corp. Fabrication method of semiconductor integrated circuit device
US7977234B2 (en) 2001-04-17 2011-07-12 Renesas Electronics Corporation Fabrication method of semiconductor integrated circuit device
JP2008537317A (en) * 2005-04-19 2008-09-11 株式会社荏原製作所 Substrate processing equipment
WO2006112532A1 (en) * 2005-04-19 2006-10-26 Ebara Corporation Substrate processing apparatus
TWI462169B (en) * 2005-04-19 2014-11-21 Ebara Corp Substrate processing apparatus
JP2009027198A (en) * 2008-10-31 2009-02-05 Renesas Technology Corp Manufacturing method of semiconductor integrated circuit device
CN113814832A (en) * 2021-11-23 2021-12-21 杭州中欣晶圆半导体股份有限公司 Device for improving epitaxial thickness uniformity of large-size silicon single crystal and operation method

Also Published As

Publication number Publication date
JPH0761601B2 (en) 1995-07-05

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