JP2544415B2 - Method for producing photosensitive resin plate - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an improvement in a method for producing a printing plate using a photosensitive resin. More specifically, the present invention includes a step of dissolving and removing an unnecessary portion, that is, an unexposed portion with a solvent after imagewise exposing a printing plate material composed of a photosensitive resin layer and a support, with a small amount of solvent used. Moreover, the present invention relates to an improved method for performing it quickly.

2. Description of the Related Art In recent years, in the printing technology field, a printing plate manufacturing method using a photosensitive resin has been developed. According to this method, printing is speeded up, the printing surface is beautiful, the economy is excellent, and the working environment is improved. As an alternative to conventional paper-type lead plates, metal plates, rubber plates, etc., it produces newspapers, business form printing, page printing (magazines, books), stickers, label printing, catalogs, posters, etc. Commercial printing,
It is widely used for flexographic printing and impression on cardboard and rubber stamps.

By the way, in order to manufacture a printing plate using this photosensitive resin plate material, first, an image carrier is formed on the plate material surface through an image carrier, and then the unexposed portion is appropriately exposed to a solvent such as an organic solvent or an alkaline aqueous solution. The method is such that a developing treatment for dissolution and removal is carried out, followed by drying and post-exposure treatment. When such a method is carried out, a part of the unexposed portion is often cut and removed in advance in order to speed up the melting operation and save the amount of the solvent, prior to the dissolution and removal with the solvent. This cutting is usually performed using a cutter, knife, scissors, etc., but the unexposed part of the photosensitive resin layer is a raw rubber-like elastic material that repels even when pressed by a cutting blade, and It is difficult to cut, and even if it can be cut, a film adheres to the surface of the blade and the sharpness becomes dull. This tendency becomes more remarkable as the photosensitive resin layer becomes thicker.

In order to improve such a defect, it has been proposed to use a fusing by heat or a rotary blade, but in addition to requiring a special device, there are problems such as fusing waste, which is not always satisfactory. Not a thing.

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention The present invention is an improved method for easily and quickly cutting an unexposed portion prior to development processing when a printing plate is produced using a photosensitive resin plate material. It is made for the purpose of providing.

Means for Solving the Problems The inventors of the present invention have conducted extensive studies on a method for easily and quickly cutting an unexposed portion of a photosensitive resin plate material, and as a result, have determined that the blade portion of a jig used for cutting is The present invention was founded based on this finding based on the finding that when heated to 60 ° C. or higher, cutting and cutting were surprisingly smoothly performed and a film was not attached to the surface of the blade portion.

That is, in the present invention, in producing a photosensitive resin plate using a printing plate material composed of a support of a photosensitive resin layer, at least a part of the unexposed portion is dissolved prior to dissolution and removal. The present invention provides a method for producing a photosensitive resin plate, which comprises removing by using a cutting tool heated to 60 ° C or higher.

The printing plate material used in the present invention can be arbitrarily selected from the materials composed of a photosensitive resin layer and a support which are usually used for producing a printing plate, and is not particularly limited. As the resin forming the photosensitive resin layer, a composition containing a photopolymerizable monomer and a sensitizer, a composition containing a photocrosslinkable polymer and a sensitizer, a linear polymer and a divinyl compound And a composition containing a sensitizer (Japanese Examined Patent Publication No. 48-6188, No. 51-37320, No. 52-7761, No. 52-364).
44, 52-7363, 55-34930, etc.).

Next, as the support on which the photosensitive resin layer is provided, for example, a metal plate made of iron, stainless steel, copper, zinc, aluminum or the like, a rubber sheet made of natural rubber or synthetic rubber, or celluloid, cellulose acetate, polyethylene, Polypropylene, polyvinyl chloride, polymethylmethacrylate, polystyrene, polycarbonate,
Examples thereof include plastic sheets or films such as polyethylene terephthalate and polyamide.
The surface of these supports is generally provided with an antihalation layer and an adhesive layer.

In the present invention, a printing plate material composed of such a photosensitive resin layer and a support is subjected to image forming exposure treatment according to a conventional method. This image forming exposure treatment is carried out by irradiating the surface of the photosensitive resin layer of the printing plate material with active light through an image carrier such as a negative film. A carbon arc lamp, an ultra-high pressure mercury lamp, a high pressure mercury lamp, a xenon lamp, an ultraviolet fluorescent lamp, a metal halide lamp, sunlight, etc. are used as a light source of this active light.

By this exposure treatment, the exposed portion of the photosensitive resin layer is insolubilized, so the unexposed portion is treated with a suitable solvent, for example, organic solvent such as trichlene, perkrene, chlorocene, acetone, methyl ethyl ketone, ethyl acetate, alkaline aqueous solution, water and the like. Dissolve and remove.

In the present invention, it is necessary to remove at least a part of the unexposed portion by cutting prior to the step of removing the solvent with this solvent. By removing at least a part of the unexposed portion in this manner, the amount of solvent required for dissolution and the time required for dissolution can be reduced.

This cutting removal is performed using a cutting tool heated to 60 ° C. or higher. It is preferable that the cutting tool has a pointed tip such as a cutter, knife, scissors blade, and tip of an electric iron, but it is preferable that the blade has an appropriate thickness. If this blade portion is too thin, the temperature of the blade decreases during cutting, and smooth cutting cannot be performed. On the other hand, if it is too thick, the amount of resin that melts during cutting becomes large and the resin becomes bulging, which hinders the work. Therefore, the thickness of the blade is appropriately in the range of 1 to 10 mm.

The material of the cutting tool can be arbitrarily selected from those having thermal conductivity, but those having large thermal conductivity such as stainless steel, iron and copper are preferable.

In the method of the present invention, the surface of such a cutting tool is heated at 60 ° C. or higher by an electric heating means, preferably 100 to 200.
Use by heating to a temperature in the range of ° C. If this temperature is less than 60 ° C, smooth cutting cannot be performed, and if it is too high, it becomes difficult to secure safety during work.

The pressure applied during cutting is usually 0.5 to 2.0.
It is Kg, and the cutting speed of 2.0 to 20 mm / sec is suitable.

Effects of the Invention According to the method of the present invention, in producing a photosensitive resin plate,
Cutting of the unexposed area prior to the development process can be performed extremely easily, and there is almost no resin film adhered to the blade during cutting, which significantly shortens the printing plate manufacturing process. There is an advantage that

EXAMPLES Next, the present invention will be described in more detail by way of examples.

Example 1 100 parts by weight of 1,2-polybutadiene having an average molecular weight of about 130,000 (RB810, manufactured by Nippon Synthetic Rubber Co., Ltd.) Liquid 1,2-polybutadiene having an average molecular weight of 1000 (Nitsuso PB
-1000, manufactured by Nippon Soda Co., Ltd.) 80% by weight and end group modified liquid polybutadiene (poly bdR45HT manufactured by Idemitsu Petrochemical Co., Ltd.) 20% by weight 65 parts by weight Urethane modified polybutylene (Nitporan 4042, manufactured by Nippon Polyurethane Industry Co., Ltd.) 5 Parts by weight trimethylolpropane triacrylate 5 parts by weight methoxyphenyl astophenone 3 parts by weight butylated hydroxytoluene 0.05 parts by weight A photosensitive composition consisting of 80 parts by weight of toluene and 20% by weight of methyl ethyl ketone was dissolved in a mixed solvent. By press-fitting the product into the extruder with a high-viscosity pump and forming a sheet with a T-type die while desolvating under reduced pressure in the extruder, by laminating a 0.1 mm thick polyester sheet as a protective cover on both sides, 2.5 A mm thick photosensitive resin plate was obtained.

This photosensitive resin plate is used as the lower layer, and the upper layer is 3.5 m
Eraslon (trade name, manufactured by Tokyo Ohka Kogyo Co., Ltd.) having a thickness of m was used, and both were superposed and pressure-bonded to obtain a two-layer structure printing plate material having a photosensitive layer having a thickness of 6 mm.

Next, in order to form a base layer, back exposure was performed for 2 minutes from the lower layer side with a 20 W-chemical lamp (Toshiba FL-20BL) through a polyester film as a support. Then, the polyester film on the upper layer side is peeled off, the negative film is brought into vacuum contact with the exposed photosensitive layer, and after exposing for 6 minutes using the above lamp, the photosensitive layer surface is lightly rinsed with methyl ethyl ketone. The surface of the unexposed area was dissolved and removed, and the negative pattern (exposed area) was exposed. Then, along the negative pattern,
The pieces were separated by 5 mm and cut with a cutter so that the cutting depth was 5 mm.

A heat cutter with a 40 W ceramic heater was used as the cutter at this time, and it was connected to a 100 V AC power source, and the temperature of the cutter part could be adjusted by the applied voltage.

Then, after setting the slider disk to a predetermined voltage,
The heat cutter was left for about 15 minutes to confirm that the surface temperature was constant, and then a cutting test was performed. 5
The surface temperature of the heat cutter was measured immediately after the resin plate was continuously cut for a minute, and the suitable temperature range for cutting was determined from the relationship with the cutting state at this time.

 The results are shown in the table below.

When the set voltage was 20 V, the cutting was impossible in about 2 minutes, and when the set voltage was 100 V, the separated resin surfaces were fused and could not be cut.

From this table, it can be seen that the surface temperature of the heat cutter must be 60 ° C. or higher, and that if it exceeds 200 ° C., the workability is reduced.

Example 2 The same printing plate material as in Example 1 was used, and the cutting speed was 3.5 to 4.0.
The relationship between the cutting temperature in mm / sec and the load required for cutting was obtained. The results are shown in the drawing as a graph.

As is clear from this graph, at a cutting temperature of 60 ° C or higher, cutting is possible with a small load of 1.5 kg or more.

Example 3 Polyglycerin [Sakamoto Yakuhin Kogyo Co., Ltd., hydroxyl value 96
0, viscosity 20,000 cP (30 ° C)] 100 g, N-methylol acrylamide 100 g, phosphoric acid 0.5 g and methylhydroquinone 25
After mixing mg and heating at 80 degreeC for 2 hours, blowing in air, 40 g of water was added. Then, this was added to 2,000 g of acetone, and the reaction product (II) thus obtained was separated by not stiring vigorously and leaving it to stand.

Next, the following component composition: polyvinyl alcohol (saponification degree: 75 mol%, polymerization degree: 500) 100 parts by weight Reactant (II) 70 parts by weight Polyethylene glycol diacrylate 20 parts by weight Benzoin isopropyl ether 4 parts by weight Methylhydroquinone 0.05 parts by weight Water A photosensitive resin solution containing 200 parts by weight is mixed well, this is provided with an anti-halation layer, cast on a polyester film, and then dried at 40 ° C for 15 hours to have a photosensitive layer with a thickness of 0.7 mm. I got a printing plate.

When this was cut into a predetermined size using a cutter heated to 100 ° C., it could be easily cut.

[Brief description of drawings]

The drawing is a graph showing the relationship between the cutter temperature and the load required for cutting in the method of the present invention.

Claims (1)

(57) [Claims] 1. When a photosensitive resin plate is produced using a printing plate material composed of a support of a photosensitive resin layer, at least a part of the unexposed portion is dissolved prior to dissolution and removal.
A method for producing a photosensitive resin plate, which comprises cutting and removing using a cutting tool heated to 60 ° C. or higher.