JPH0147772B2 - - Google Patents

Info

Publication number
JPH0147772B2
JPH0147772B2 JP56108464A JP10846481A JPH0147772B2 JP H0147772 B2 JPH0147772 B2 JP H0147772B2 JP 56108464 A JP56108464 A JP 56108464A JP 10846481 A JP10846481 A JP 10846481A JP H0147772 B2 JPH0147772 B2 JP H0147772B2
Authority
JP
Japan
Prior art keywords
cover film
photosensitive layer
layer
film
photosensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56108464A
Other languages
Japanese (ja)
Other versions
JPS5810734A (en
Inventor
Masaru Nanhei
Hajime Koda
Toshiaki Fujimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyobo Co Ltd
Original Assignee
Toyobo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyobo Co Ltd filed Critical Toyobo Co Ltd
Priority to JP10846481A priority Critical patent/JPS5810734A/en
Publication of JPS5810734A publication Critical patent/JPS5810734A/en
Publication of JPH0147772B2 publication Critical patent/JPH0147772B2/ja
Granted legal-status Critical Current

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/092Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by backside coating or layers, by lubricating-slip layers or means, by oxygen barrier layers or by stripping-release layers or means

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

本発明は製版性の改良された、固形状レリーフ
型作成用感光性樹脂積層体(以下樹脂原板と称す
る)に関するものである。通常樹脂原版には感光
性樹脂層(以下感光層と称する)表面の損傷(た
とえば物理的な衝撃による傷の生成)、ほこり・
ごみの付着、汚れ、斜気の吸着等を防止し、該感
光層の表面保護のためフイルムまたはシート(通
常カバーフイルムと称する)が密着被覆されてい
る。樹脂原板の製版の場合は、上記カバーフイル
ムを剥離し、感光層表面にネガフイルムを完全に
密着させた後、活性光線により露光焼付けによ
り、露光部の感光性樹脂を硬化・不溶化させた
後、ネガフイルムを剥離し、未露光部の感光性樹
脂を溶解除去(以下現像と称する)することによ
つてレリーフ型を得る。 しかるに通例感光層表面は多少粘着性を有する
ために、ネガフイルムの密着時に、空気が部分的
に排除されずに界面に残存するため、その部分に
おいて感光層表面とネガフイルムとの密着不良に
よる焼きボケが生じやすい。そのための対策とし
て、(1)乳剤面のマツト化されたネガフイルムを用
いる方法、(2)感光層表面に微粉末を塗布する方
法、(3)カバーフイルムとして適当な方法により表
面を微多孔化したフイルムを使用し、その微多孔
を感光層表面に転写することにより、該表面を微
多孔化する方法等により、感光層とネガフイルム
との間にある程度の空気流通を可能にすることに
よつて、均一密着する方法(特公昭50−31488号
公封)や、あるいは(4)感光層にネガフイルムを重
ね合せて、ロール等により一端から他端まで連続
的に線状に圧力を加えて、該感光層とネガフイル
ムとを加圧密着させる方法(特公昭48−29727号
公報)等が考案されているが、上記(1)のマツト化
ネガフイルムは通常リスフイルムに比して価格が
2倍近く、また(2)の微粉末の塗布は感光層の表面
の粘着性のための塗布むらを生じやすく、微粉末
の付着量が多すぎると、活性光線の透過をさまた
げる結果感光層の硬化不良となる等の欠点を有す
る。また(3)の方法も感光層表面の粘着性が強い場
合や、積層体の面積が大きい場合は、必ずしも有
効ではなく、またカバーフイルムの微多孔化がコ
スト的に高くつくなどの問題点がある。また(4)の
方法は、ネガラミネーターが必要であり、また感
光層表面の粘着性が強い場合は、露光後のネガフ
イルムの剥離が困難である等の欠点を有する等、
それぞれ欠点を有し、充分に満足できる方法はま
だ見い出されていない。 本発明者等は、かかる欠点を改良すべく鋭意研
究の結果、粘着性を有する感光層と、カバーフイ
ルムとの間に非粘着性の粘着防止層を介在させる
ことにより、ネガフイルムと感光層との均一密着
が容易となり、製版性が大巾に改良されること、
また更には該粘着防止層として酸素遮断性の高い
物質を用いた場合、感度の経時的低下度合が少な
くなり、安定した製版性能の保持が可能なこと、
更には粘着防止層との接触面が、コロナ放電処理
によつて表面張力の向上したカバーフイルムを使
用することによつて、カバーフイルムと粘着防止
層との剥離強度を向上し、樹脂原板の裁断時のカ
バーフイルムと粘着防止層との界面の剥離を防止
可能なことを見い出し、本発明を完成するに到つ
た。 すなわち本発明は、少なくとも上層より、(1)カ
バーフイルム、(2)感光層および(3)支持体とからな
る固形状レリーフ型作成用感光性樹脂積層体にお
いて、(1)カバーフイルムがコロナ放電処理され、
該(1)カバーフイルムと(2)感光層との間に、感光層
の現像液に可溶性であり、感光層との剥離強度
が、カバーフイルムとの剥離強度より少なくとも
50g/cm以上高く、かつカバーフイルムとの剥離
強度が30g/cm以上である粘着防止層を介在させ
ることを特徴とする固形状レリーフ型作成用感光
性樹脂積層体である。 本発明において、粘着防止層は、カバーフイル
ムと感光層表面との間に介在するものであるが、
樹脂原板の裁断時には、両界面とも剥離すること
なく、また、製版時のカバーフイルムの剥離時に
は、カバーフイルムと粘着防止層との界面におい
て再現性よく剥離することが必要であり、粘着防
止層と感光層表面との界面で剥離してはならな
い。そのためにはカバーフイルムとの親和力より
も、感光層との親和力の方が大きい物質を、粘着
防止層として選択することが必要である。粘着防
止層を構成する物質は、系の感光特性を抵下させ
るものでない限り、特に制限はなく、単一物質で
もまた混合物でもさしつかえない。またカバーフ
イルムを剥離した粘着防止層表面に、ネガフイル
ムを均一に密着しうるためには、粘着防止層表面
は非粘着性である必要がある。ここにいう〓非粘
着性〓とは後述する初期剥離強度が5g/cm(5
回繰り返し平均値)未満のものを指し、それ以上
の値のものを〓粘着性を有する〓とする。 また粘着防止層はネガフイルムを通しての活性
光線の露光後の現像時には、感光層の現像液によ
つて速やかに溶解除去されることが重要である。
現像液に対する溶解性が充分でないと感光層の現
像ムラの原因となる。 以上のような条件を満たす粘着防止層を構成す
る物質としては、例えばセルロース、ポリビニル
アルコール、ポリビニルピロリドン、ポリアクリ
ル酸、ポリアクリルアミド、ポリエチレンオキシ
ド、ポリ塩化ビニリデン、ポリエチレンイミンお
よびそれらの誘導体が挙げられるが、この中で酸
素透過性が50c.c./cm・24hr・atm以下、望ましく
は30c.c./cm2・24hr・atm以下の物質が好ましく、
酸素透過性の小さい物質としては、例えばポリビ
ニルアルコールおよびその共重合体、ポリ塩化ビ
ニリデンおよびその共重合体が挙げられる。 また粘着防止層の厚みは、あまり厚すぎるとネ
ガフイルムに対する再現性が低下するため好まし
くなく、0.05〜20μ、特に望ましくは0.1〜5μが適
当である。さらに当然ながら粘着防止層は活性光
線に対して透明であることが要求される。 粘着防止層をカバーフイルムと感光層表面との
間に介在させる方法は特に制限はなく、任意の方
法に従つておこなうことができる。たとえば感光
層表面に粘着防止層の成分を塗布した後に、カバ
ーフイルムをラミネートする方法、あらかじめ粘
着防止層を塗布したカバーフイルムを感光層表面
にラミネートする方法、あるいはカバーフイル
ム、粘着防止層、感光層等を同時にラミネートす
る方法などがある。 上記のようにカバーフイルムは、感光層表面の
損傷、ほこり・ごみの付着、汚れ、湿気の吸着等
を防止し、感光層表面の保護を目的とするもので
あり、公知のもの、たとえばポリエステルフイル
ム等が使用可能であり、本発明では厚さ10μ以上
のポリエステルフイルムが好ましい。 樹脂原板の裁断時のカバーフイルムと粘着防止
層との界面での剥離を防止するため、カバーフイ
ルムと粘着防止層との剥離強度を30g/cm以上に
しておく必要があり、30g/cm未満ではカバーフ
イルムが剥れてしまい実用的でない。そのためコ
ロナ放電処理等によつて剥離強度を向上させてお
く必要である。ただし本発明において、前記粘着
防止層と感光層との間の剥離強度は、粘着防止層
とカバーフイルムとの間の剥離強度より50g/cm
以上高いことが必要であり、その差が50g/cm未
満の場合はカバーフイルムの剥離時に、粘着防止
層がカバーフイルムと共に感光層より剥離してし
まう不都合なことが起こりうるため、たとえばカ
バーフイルムとしてポリエステルフイルムを使用
する場合には、粘着防止層との接触面の表面張力
が42ダイン/cm以上、望ましくは45ダイン/cm以
上が特に好ましい。 一般に感光層を構成する成分は、充填ポリマ
ー、光硬化剤、光増感剤、重合防止剤、その他の
添加剤などであるが、その主成分である充填ポリ
マーの種類によつて、たとえばポリアミド系、ポ
リウレタン系、ポリビニルアコール系、ポリエス
テル系、ポリ酢酸ビニル系などと称されている。
本発明は公知のいずれの感光層へ適応してもよ
く、特に制限はない。 本発明において、感光層と支持体とを接着する
ために接着層を設けなくてもよく、その接着性が
ハレーシヨン防止機能をも兼有していてもよい。 また支持体としては、スチール、アルミニウ
ム、プラスチツクフイルム、ガラス等任意のもの
が使用できる。 また樹脂原板の製造は従来公知の方法が適応可
能である。たとえば熱プレス法、注型法、溶液キ
ヤスト法、溶融押出し法などがある。 以上述べたように本発明の積層体は新規な粘着
防止層を有するために、次のような種々の特長を
有している。すなわち、非粘着性の粘着防止層を
感光層表面にラミネートしているために、ネガフ
イルムの密着が容易で、均一にムラなく空気が除
去できる。特に、フレキソ印刷用感光性樹脂版の
ごとき未硬化の樹脂版の表面硬度が極めて低い場
合には、ネガフイルムを密着させるための加圧操
作時に、樹脂表面の変形(局所的な凹凸、厚みむ
らなど)が起こりやすいが、本発明積層体におい
ては、ネガフイルムの密着には、特に強く加圧す
る必要もなく、樹脂版表面を損傷することがな
い。また粘着性を有する感光層表面にネガフイル
ムが直接接触していないため、露光後のネガフイ
ルムの剥離が容易でかつ、ネガフイルムの汚れも
ない。またプリンターの真空時の押え用カバーシ
ートの汚れもない。更にはコロナ放電処理によつ
て表面活性の向上したカバーフイルムを使用する
ことによつて、樹脂原板の裁断時のカバーフイル
ムの剥離を有効に防止することが可能である。ま
た粘着防止層の成分として酸素透過性の小さい物
質を使用することによつて、感度が高く、感度の
経時的低下度合が少なくなり、安定した製版性能
の保持が可能なこと、および感光層底部での露光
による硬化性が向上し、現像ラチチユードが広く
なり、またカバーフイルム剥離後も長時間感度低
下しないなどである。 なお本発明の積層体は、印刷用レリーフ版、装
飾用図柄、ネームプレート、デイスプレー、成型
品など各種用途に有効に利用できる。 次に本発明を実施例を用いて具体的に説明する
が、本発明はこれらに限定されるものではない。 なお、表面粘着性、剥離強度および表面張力
は、以下の方法によつて測定した。 表面粘着性:ネガフイルムを表面に加圧密着させ
た試験片(横巾3cm)を試験台に水平にとりつ
け、試験片の一端から1cmの巾でネガフイルム
をあらかじめ剥し直角に折り目を付けておく。
次にこの一端に荷重を加え、密着させたフイル
ムが剥れだすに必要な重さ(初期剥離強度、)
を粘着性として表示する。 剥離強度:試験片(横巾1cm)を試験台に水平に
取り付け、試験片の一端から1cmの巾で粘着防
止層をあらかじめ剥し、直角に折り目を付けて
おく。次にこの一端に荷重を加え、粘着防止層
がカバーフイルムまたは感光層表面から剥れだ
すに必要な重さを剥離強度として表示する。 表面張力:JIG−K−6768の方法による。 実施例 1 感光層がポリアミド樹脂ベースの水現像性感光
性樹脂凸版材、〓東洋紡プリンタイト〓(SF−95
タイプ:カバーフイルム:125μ、ポリエステル
フイルム、感光層厚み:742μ、接着兼ハレーシ
ヨン防止層:20μ、ベースフイルム:188μポリエ
ステルフイルム)について以下の比較試験を実施
した。ここにサンプル(A)は通常ルート品、サンプ
ル(B)はカバーフイルムと感光層との間に、厚さ
1μのゴーセノール AH−26〔日本合成化学工業
(株)製ケン化度97.0〜98.8mol%のポリビニルアル
コール〕の層を介在させたもの、サンプル(C)はカ
バーフイルムとして、ゴーセノール AH−26の
層との接触面をコロナ放電処理したポリエステル
フイルムを用いた以外はサンプル(B)と同じであ
る。サンプル(D)は粘着防止層としてメチルセロー
スを用いた他はサンプル(C)と同じであり、サンプ
ル(E)はコロナ放電処理の程度を弱くした他はサン
プル(D)と同じである。表1にサンプルの条件と試
験結果を示す。
The present invention relates to a photosensitive resin laminate for making solid relief molds (hereinafter referred to as a resin master plate) with improved plate-making properties. Normally, resin master plates have damage to the surface of the photosensitive resin layer (hereinafter referred to as photosensitive layer) (for example, scratches caused by physical impact), dust, etc.
A film or sheet (usually referred to as a cover film) is tightly coated to prevent the adhesion of dust, dirt, adsorption of oblique air, etc., and to protect the surface of the photosensitive layer. In the case of plate making of a resin master plate, the cover film is peeled off, a negative film is completely adhered to the surface of the photosensitive layer, and the photosensitive resin in the exposed area is cured and insolubilized by exposure baking with actinic rays. A relief mold is obtained by peeling off the negative film and dissolving and removing the photosensitive resin in the unexposed areas (hereinafter referred to as development). However, since the surface of the photosensitive layer is usually somewhat sticky, when the negative film is brought into close contact with the film, air is not partially removed and remains at the interface. Blur tends to occur. As a countermeasure for this, (1) a method using a negative film with a matted emulsion surface, (2) a method of applying fine powder to the surface of the photosensitive layer, and (3) a method of making the surface microporous using an appropriate method as a cover film. By using a method of making the surface microporous by transferring the microporous film onto the surface of the photosensitive layer, a certain degree of air circulation is enabled between the photosensitive layer and the negative film. (4) Layer negative film on the photosensitive layer and apply continuous linear pressure from one end to the other using a roll or the like. , a method of bringing the photosensitive layer and a negative film into close contact under pressure (Japanese Patent Publication No. 48-29727) has been devised, but the matte negative film described in (1) above is usually more expensive than lithographic film. In addition, application of the fine powder in (2) tends to cause uneven coating due to the adhesiveness of the surface of the photosensitive layer, and if the amount of fine powder attached is too large, it will block the transmission of actinic rays, resulting in damage to the photosensitive layer. It has drawbacks such as poor curing. In addition, method (3) is not necessarily effective when the surface of the photosensitive layer is highly adhesive or when the area of the laminate is large, and there are also problems such as making the cover film microporous expensive. be. In addition, method (4) requires a negative laminator, and also has drawbacks such as difficulty in peeling off the negative film after exposure if the surface of the photosensitive layer is highly adhesive.
Each has its own drawbacks, and no fully satisfactory method has yet been found. As a result of intensive research in order to improve this drawback, the present inventors have found that by interposing a non-adhesive anti-adhesive layer between the adhesive photosensitive layer and the cover film, the negative film and the photosensitive layer can be separated. uniform adhesion becomes easier, and plate-making properties are greatly improved.
Furthermore, when a substance with high oxygen barrier properties is used as the anti-adhesion layer, the degree of decrease in sensitivity over time is reduced, and stable plate-making performance can be maintained;
Furthermore, by using a cover film whose surface in contact with the anti-adhesive layer has improved surface tension through corona discharge treatment, the peel strength between the cover film and the anti-adhesive layer is improved, making it easier to cut the resin base plate. The present inventors have discovered that it is possible to prevent peeling at the interface between the cover film and the anti-adhesive layer, and have completed the present invention. That is, the present invention provides a photosensitive resin laminate for making a solid relief mold, which is composed of (1) a cover film, (2) a photosensitive layer, and (3) a support, at least from the upper layer. processed,
Between the (1) cover film and (2) photosensitive layer, there is a layer that is soluble in the developer of the photosensitive layer and has a peel strength with the photosensitive layer that is at least as strong as the peel strength with the cover film.
This is a photosensitive resin laminate for making solid relief molds, characterized by interposing an anti-adhesive layer having a peel strength of 50 g/cm or more and a peel strength of 30 g/cm or more with respect to a cover film. In the present invention, the anti-adhesive layer is interposed between the cover film and the surface of the photosensitive layer,
When cutting the resin base plate, it is necessary that both interfaces do not peel off, and when peeling off the cover film during plate making, it is necessary to peel off with good reproducibility at the interface between the cover film and the anti-adhesive layer. It must not peel off at the interface with the photosensitive layer surface. To this end, it is necessary to select a substance for the anti-adhesion layer that has greater affinity with the photosensitive layer than with the cover film. The substance constituting the anti-adhesive layer is not particularly limited as long as it does not impair the photosensitive properties of the system, and it may be a single substance or a mixture. Further, in order to uniformly adhere the negative film to the surface of the anti-adhesion layer from which the cover film has been peeled off, the surface of the anti-adhesion layer must be non-adhesive. The term "non-adhesive" here means that the initial peel strength described later is 5 g/cm (5 g/cm).
A value less than 100 times repeated average value is considered to be ``adhesive.'' Furthermore, it is important that the anti-adhesive layer be quickly dissolved and removed by a developing solution for the photosensitive layer during development after exposure to actinic rays through the negative film.
Insufficient solubility in the developer may cause uneven development of the photosensitive layer. Examples of substances constituting the anti-adhesive layer that satisfy the above conditions include cellulose, polyvinyl alcohol, polyvinylpyrrolidone, polyacrylic acid, polyacrylamide, polyethylene oxide, polyvinylidene chloride, polyethyleneimine, and derivatives thereof. Among these, materials with oxygen permeability of 50 c.c./cm2.24 hr.atm or less, preferably 30 c.c./cm2.24 hr.atm or less are preferred,
Examples of substances with low oxygen permeability include polyvinyl alcohol and copolymers thereof, polyvinylidene chloride and copolymers thereof. Further, the thickness of the anti-adhesive layer is not preferable because if it is too thick, the reproducibility with negative film will deteriorate, and the appropriate thickness is 0.05 to 20 .mu.m, particularly preferably 0.1 to 5 .mu.m. Furthermore, it is a matter of course that the anti-adhesive layer is required to be transparent to actinic rays. The method for interposing the anti-adhesive layer between the cover film and the surface of the photosensitive layer is not particularly limited, and any method can be used. For example, a method in which a cover film is laminated after coating the anti-adhesive layer components on the surface of the photosensitive layer, a method in which a cover film coated with an anti-adhesive layer in advance is laminated on the surface of the photosensitive layer, or a method in which the cover film, the anti-adhesive layer, and the photosensitive layer are laminated on the surface of the photosensitive layer. There is a method to laminate both at the same time. As mentioned above, the cover film is intended to protect the surface of the photosensitive layer by preventing damage to the surface of the photosensitive layer, adhesion of dust and dirt, adsorption of dirt, moisture, etc., and can be made of well-known materials such as polyester film. In the present invention, a polyester film having a thickness of 10 μm or more is preferable. In order to prevent peeling at the interface between the cover film and the anti-adhesive layer when cutting the resin base plate, the peel strength between the cover film and the anti-adhesive layer must be 30 g/cm or more, and less than 30 g/cm The cover film peels off, making it impractical. Therefore, it is necessary to improve the peel strength by corona discharge treatment or the like. However, in the present invention, the peel strength between the anti-adhesive layer and the photosensitive layer is 50 g/cm higher than the peel strength between the anti-adhesive layer and the cover film.
If the difference is less than 50 g/cm, there may be an inconvenience that the anti-adhesive layer will peel off from the photosensitive layer together with the cover film when the cover film is peeled off. When a polyester film is used, it is particularly preferable that the surface tension of the surface in contact with the anti-adhesive layer is 42 dynes/cm or more, preferably 45 dynes/cm or more. In general, the components that make up the photosensitive layer include a filled polymer, a photocuring agent, a photosensitizer, a polymerization inhibitor, and other additives. , polyurethane type, polyvinyl alcohol type, polyester type, polyvinyl acetate type, etc.
The present invention may be applied to any known photosensitive layer and is not particularly limited. In the present invention, it is not necessary to provide an adhesive layer for adhering the photosensitive layer and the support, and the adhesive property thereof may also have an antihalation function. Further, as the support, any material such as steel, aluminum, plastic film, glass, etc. can be used. Furthermore, conventionally known methods can be applied to the production of the resin base plate. Examples include a hot press method, a casting method, a solution casting method, and a melt extrusion method. As described above, since the laminate of the present invention has a novel anti-adhesive layer, it has the following various features. That is, since a non-adhesive anti-adhesion layer is laminated on the surface of the photosensitive layer, the negative film can be easily adhered to the photosensitive layer, and air can be removed evenly and evenly. In particular, when the surface hardness of an uncured resin plate, such as a photosensitive resin plate for flexographic printing, is extremely low, deformation of the resin surface (local irregularities, uneven thickness, However, in the laminate of the present invention, there is no need to apply particularly strong pressure to adhere the negative film, and the surface of the resin plate is not damaged. Further, since the negative film is not in direct contact with the surface of the photosensitive layer having adhesive properties, the negative film can be easily peeled off after exposure, and there is no staining of the negative film. Also, there is no dirt on the cover sheet for the presser foot when the printer is vacuumed. Furthermore, by using a cover film whose surface activity has been improved by corona discharge treatment, it is possible to effectively prevent the cover film from peeling off when cutting the resin base plate. In addition, by using a substance with low oxygen permeability as a component of the anti-adhesion layer, the sensitivity is high, the degree of decrease in sensitivity over time is reduced, and stable plate-making performance can be maintained. The curability upon exposure to light is improved, the development latitude is widened, and the sensitivity does not decrease for a long time even after the cover film is peeled off. The laminate of the present invention can be effectively used for various purposes such as relief plates for printing, decorative designs, name plates, displays, and molded products. Next, the present invention will be specifically explained using Examples, but the present invention is not limited thereto. Note that surface tackiness, peel strength, and surface tension were measured by the following methods. Surface adhesion: A test piece (width 3 cm) with a negative film adhered to the surface under pressure is mounted horizontally on the test stand, and the negative film is peeled off in advance at a width of 1 cm from one end of the test piece and a crease is made at right angles. .
Next, a load is applied to one end, and the weight required for the tightly attached film to peel off (initial peel strength)
is displayed as sticky. Peel strength: Mount a test piece (width 1 cm) horizontally on a test stand, peel off the anti-adhesive layer in a 1 cm width from one end of the test piece, and make a crease at a right angle. Next, a load is applied to this one end, and the weight required for the anti-adhesive layer to peel off from the cover film or the surface of the photosensitive layer is expressed as the peel strength. Surface tension: According to the method of JIG-K-6768. Example 1 Water-developable photosensitive resin letterpress material whose photosensitive layer is based on polyamide resin, Toyobo Printite (SF-95)
The following comparative tests were conducted on types: cover film: 125μ, polyester film, photosensitive layer thickness: 742μ, adhesive and antihalation layer: 20μ, base film: 188μ polyester film. Here, sample (A) is the normal route product, sample (B) is the thickness between the cover film and the photosensitive layer.
1μ Gohsenol AH-26 [Nippon Gosei Chemical Industry Co., Ltd.
Co., Ltd. with a layer of polyvinyl alcohol with a degree of saponification of 97.0 to 98.8 mol%. Sample (C) is a polyester film whose contact surface with the layer of Gohsenol AH-26 has been treated with corona discharge as a cover film. Same as sample (B) except that . Sample (D) was the same as sample (C) except that methylcellose was used as the anti-adhesive layer, and sample (E) was the same as sample (D) except that the degree of corona discharge treatment was weakened. Table 1 shows the sample conditions and test results.

【表】 表1より明らかなように、本発明積層体である
サンプル(B)、(C)はレリーフの網点ムラのない画像
が得られ、また経時安定性も優れていた。粘着防
止層のないサンプル(A)は感光層とネガフイルムと
の間の空気が抜けずにレリーフの網点ムラとなつ
た。またサンプル(D)はカバーフイルム剥離時にカ
バーフイルムと共に粘着防止層が樹脂表面より部
分的に剥離してしまつてレリーフの網点ムラとな
つた。サンプル(E)はサンプル(B)と同様に裁断時に
カバーフイルムが剥れてしまつた。 実施例 2 ε−カプロラクタム120部、ヘキサメチレンジ
アンモニウムアジペート90部、ヘキサメチレンジ
アンモニウムセバケート120部を重縮合して得ら
れた共重合ポリアミド100部、グリシジルメタク
リレート85.2部とグリセリン18.4部との反応生成
物80部、ベンゾインメチエーテル2部、ハイドロ
キノンモノメチルエーテル0.2部をメタノール400
部に加熱溶解し、室温にて暗室内でメタノールを
風乾除去後、更に40℃で一昼夜減圧乾燥して均一
透明な感光性組成物のシートを得た。この一部を
接着剤を塗布した鋼鈑とポリエステルフイルムと
の間にはさみ、3者を加熱ラミネートして感光性
原板(サンプル(F)とする)を得た。また別にコロ
ナ放電処理によつて塗布面の表面張力を
46.1dyne/cmとしたポリエステルフイルムにアル
コール可溶性の共重合ポリアミド〓UItvamid−
IC〓(BASF社製)を約2μ塗布したカバーフイル
ム(塗布面が感光層と接するように)と、接着剤
を塗布した鋼鈑との間に上記感光性樹脂のシート
の残りをはさみ加熱ラミネートして感光性原板
(サンプル(G)とする)を作成した。次にサンプル
(F)、(G)共カバーフイルムであるポリエステルフイ
ルムを剥離し感光層表面((G)の場合ポリアミド
層)にネガフイルムを真空密着し、ケミカルラン
プで5分間露光した。ついでブラシ式現像機より
3分間メノールでウオシユアウトして、レリーフ
版を得た。このレリーフ版の網点部分はサンプル
(G)の場合均一でネガフイルムを忠実に再現してい
たが、サンプル(F)においては密着ムラによる焼ム
ラが発生し、ネガフイルムに対する再現性は不良
であつた。尚ネガフイルムを密着前の表面の粘着
性は、サンプル(F)が145g/cm、サンプル(G)が2
g/cmであつた。またサンプル(G)の粘着防止層と
カバーフイルムとの剥離強度は85g/cm、感光層
とのそれは180g/cm以上であつた。
[Table] As is clear from Table 1, samples (B) and (C), which are the laminates of the present invention, provided images with no uneven relief halftone dots, and also had excellent stability over time. In the sample (A) without an anti-adhesion layer, the air between the photosensitive layer and the negative film did not escape, resulting in uneven halftone dots in relief. In addition, in sample (D), when the cover film was peeled off, the anti-adhesion layer was partially peeled off from the resin surface together with the cover film, resulting in uneven halftone dots in relief. Similar to sample (B), the cover film of sample (E) peeled off during cutting. Example 2 Reaction of 100 parts of copolyamide obtained by polycondensing 120 parts of ε-caprolactam, 90 parts of hexamethylene diammonium adipate, and 120 parts of hexamethylene diammonium sebacate, 85.2 parts of glycidyl methacrylate, and 18.4 parts of glycerin. 80 parts of product, 2 parts of benzoin methiether, 0.2 parts of hydroquinone monomethyl ether and 400 parts of methanol
After removing methanol by air-drying in a dark room at room temperature, the mixture was further dried under reduced pressure at 40°C overnight to obtain a uniform transparent sheet of the photosensitive composition. A portion of this was sandwiched between a steel plate coated with an adhesive and a polyester film, and the three were heated and laminated to obtain a photosensitive original plate (referred to as sample (F)). Separately, the surface tension of the coated surface is reduced by corona discharge treatment.
46.1 dyne/cm polyester film with alcohol-soluble copolyamide polyamide〓UItvamid−
The rest of the photosensitive resin sheet was sandwiched between a cover film coated with approximately 2μ of IC (manufactured by BASF) (so that the coated surface was in contact with the photosensitive layer) and a steel plate coated with adhesive, and heated and laminated. A photosensitive original plate (referred to as sample (G)) was prepared. Next sample
The polyester film serving as the cover film for both (F) and (G) was peeled off, a negative film was vacuum-adhered to the surface of the photosensitive layer (the polyamide layer in the case of (G)), and the film was exposed to light using a chemical lamp for 5 minutes. Then, it was washed out with menol in a brush developing machine for 3 minutes to obtain a relief plate. The halftone area of this relief version is a sample.
In the case of (G), it was uniform and faithfully reproduced the negative film, but in sample (F), uneven printing occurred due to uneven adhesion, and the reproducibility with respect to the negative film was poor. The adhesiveness of the surface before applying the negative film is 145 g/cm for sample (F) and 2 for sample (G).
g/cm. Further, the peel strength between the anti-adhesive layer and the cover film of sample (G) was 85 g/cm, and that between the photosensitive layer was 180 g/cm or more.

Claims (1)

【特許請求の範囲】[Claims] 1 少なくとも上層より、(1)カバーフイルム、(2)
感光層および(3)支持体とからなる固形状レリーフ
型作成用感光性樹脂積層体において、(1)カバーフ
イルムがコロナ放電処理され、該(1)カバーフイル
ムと(2)感光層との間に、感光層の現像液に可溶性
であり、感光層との剥離強度が、カバーフイルム
との隔離強度より少なくとも50g/cm以上高く、
かつカバーフイルムとの剥離強度が30g/cm以上
である粘着防止層を介在させることを特徴とする
固形状レリーフ型作成用感光性樹脂積層体。
1 At least from the upper layer: (1) cover film, (2)
In a photosensitive resin laminate for making a solid relief mold, which is composed of a photosensitive layer and (3) a support, (1) a cover film is subjected to a corona discharge treatment, and the gap between the (1) cover film and (2) the photosensitive layer is is soluble in the developer of the photosensitive layer, and has a peel strength with the photosensitive layer that is at least 50 g/cm higher than an isolation strength with the cover film;
A photosensitive resin laminate for making a solid relief mold, characterized by interposing an anti-adhesive layer having a peel strength of 30 g/cm or more with respect to a cover film.
JP10846481A 1981-07-10 1981-07-10 Photosensitive resin laminated body for forming solid relief mold Granted JPS5810734A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10846481A JPS5810734A (en) 1981-07-10 1981-07-10 Photosensitive resin laminated body for forming solid relief mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10846481A JPS5810734A (en) 1981-07-10 1981-07-10 Photosensitive resin laminated body for forming solid relief mold

Publications (2)

Publication Number Publication Date
JPS5810734A JPS5810734A (en) 1983-01-21
JPH0147772B2 true JPH0147772B2 (en) 1989-10-16

Family

ID=14485422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10846481A Granted JPS5810734A (en) 1981-07-10 1981-07-10 Photosensitive resin laminated body for forming solid relief mold

Country Status (1)

Country Link
JP (1) JPS5810734A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6055335A (en) * 1983-09-07 1985-03-30 Toyobo Co Ltd Manufacture of photosensitive resin laminate
JPH0619559B2 (en) * 1986-03-11 1994-03-16 富士写真フイルム株式会社 Photosensitive material for heat development
JPH0623845B2 (en) * 1986-06-23 1994-03-30 富士写真フイルム株式会社 Photosensitive image-receiving sheet material and image transfer method
DE3715790A1 (en) * 1987-05-12 1988-11-24 Hoechst Ag RADIATION-SENSITIVE RECORDING MATERIAL
EP0356954A3 (en) * 1988-08-30 1991-05-08 E.I. Du Pont De Nemours And Company A plasticized polyvinyl alcohol release layer for a flexographic printing plate
JP2593355B2 (en) * 1989-11-28 1997-03-26 東京応化工業株式会社 Photosensitive resin plate
JP6111521B2 (en) * 2012-02-29 2017-04-12 東洋紡株式会社 Photosensitive relief letterpress printing plate
CN105452960B (en) * 2013-06-14 2019-11-01 富林特集团德国有限公司 It can digital imagery and the flexographic printing element with the ultra-thin barrier layer of polarity
JP7036536B2 (en) * 2016-12-01 2022-03-15 旭化成株式会社 Flexographic printing original
CN113583445A (en) * 2021-09-02 2021-11-02 大同共聚(西安)科技有限公司 Preparation method of polyimide circuit protection film

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5149803A (en) * 1974-10-28 1976-04-30 Unitika Ltd KANKOSEIJUSHISOSEIBUTSUNO NENCHAKUSEIBOSHIHOHO
JPS5468224A (en) * 1977-11-10 1979-06-01 Unitika Ltd Method of preventing adhesive of photosensitive resin

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5149803A (en) * 1974-10-28 1976-04-30 Unitika Ltd KANKOSEIJUSHISOSEIBUTSUNO NENCHAKUSEIBOSHIHOHO
JPS5468224A (en) * 1977-11-10 1979-06-01 Unitika Ltd Method of preventing adhesive of photosensitive resin

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