JP2544152Y2 - Optical semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an optical semiconductor device used for various electronic devices, and particularly to a light-receiving device for a remote controller that requires a wide directivity and high sensitivity.

<Prior Art> A conventional optical semiconductor device (light-receiving device for remote control) is
As shown in the figure, it is not possible to perform positioning in the height direction, and it is easy to shift in the left-right direction when mounting to the printed wiring board 1 or the like. (Hereinafter referred to as conventional technology 1).

As shown in FIG. 8, a resin or metal holder 2 is provided.
Are separately prepared and attached (hereinafter referred to as prior art 2).

In FIGS. 7 and 8, reference numeral 3 denotes an outer case (light-transmitting case) for housing a light-transmitting resin body formed by sealing a light-receiving element with a light-transmitting resin, 4 denotes a lead terminal, and 5 denotes a stopper.

<Problems to be Solved by the Invention> However, when the positioning is performed using a jig when the semiconductor device is mounted on the substrate 1 or the like as in the related art 1, there are the following problems.

The jig becomes complicated.

It takes time to set the jig, which leads to cost increase.

The position after mounting (such as soldering) becomes unstable.

On the other hand, the method using the holder 2 as in the prior art 2 has the following problems.

Since the holder 2 is prepared separately, the cost of the holder 2 is separately required, which leads to an increase in cost, and the size of the apparatus itself also increases.

Since the step of attaching the holder 2 to the light receiving device is added, the number of steps is increased.

In view of the above, an object of the present invention is to provide an optical semiconductor device that can have a positioning function (holder function) for a component to be mounted without increasing the shape of the device itself and without increasing the cost. .

<Means for Solving the Problem> The problem solving means according to the present invention is, as shown in FIGS.
An optical semiconductor element 11 mounted on the lead terminal 17 and a light-transmitting resin body 13 having the optical semiconductor element 11 sealed with a light-transmitting resin and having a first condenser lens 12 thereon.
And an outer case 15 that houses and holds the light-transmitting resin body 13 and has a second condenser lens 14 on the upper part thereof, and the second condenser lens 14 has an outer peripheral surface 14a having a convex shape. The inner peripheral surface 14b that is formed and that faces the light-transmitting resin body 13 is formed in a concave shape, and on the bottom surface of the outer case 15, for positioning and supporting the attached component 10 at a constant interval. The positioning means 16 is formed so as to protrude toward the part to be mounted 10.

<Operation> In the means for solving the above problems, the first condenser lens 12 of the light-transmitting resin body 13 is a concave inner peripheral surface 14b of the second condenser lens 14.
The light-transmitting resin body 13 is inserted into and stored in the outer case 15 to the back so that the optical semiconductor device is completed. This optical semiconductor device has a double lens structure including the first and second condenser lenses 12, 14, and has high light-collecting characteristics.

If the optical semiconductor device is displaced when it is mounted on the component 10 such as a substrate of a device, the high light-collecting characteristics cannot be effectively utilized. Even if a complicated jig for providing the case with a positioning function (holder function) or a separate holder is not provided, the case can be reliably positioned at a fixed interval D with respect to the component 10 to be mounted. Moreover, the external case 15 is not supported by the lead terminals 17 alone with respect to the attached component 10 but is also supported by the positioning means 16,
A firm attachment can be performed, and the above characteristics can be reliably obtained.

<Example> Hereinafter, an example of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view of an optical semiconductor device according to a first embodiment of the present invention.
FIG. 2 is a side view of the same, FIG. 3 is a front view of the same, and FIG. 4 is a view showing a state of attachment to a part to be attached.

As shown, the optical semiconductor device (light receiving device for remote control) of the present embodiment is mounted on the printed wiring board 10 with a constant interval D, and has a double lens structure in order to obtain high light-collecting characteristics.

That is, the light-receiving element 11, the light-receiving element 11 is sealed with a light-transmitting resin, the light-transmitting resin body 13 having the first condenser lens 12 on the upper part thereof, and the light-transmitting resin body 13 is stored and held on the upper part. And an outer case (light-transmitting case) 15 having a second condenser lens 14. The outer case 15 is provided with positioning means 16 for positioning the printed wiring board 10 at a fixed interval D. Is provided.

The light receiving element 11 uses a phototransistor or the like, and is mounted on a lead terminal 17 as shown in FIG. The lead terminal 17 is bent in an L shape so as to be electrically connected to the printed wiring board 10, and a stopper 18 for preventing the lead terminal 17 from coming off from the printed wiring board 10 is provided at an end thereof. ing.

The translucent resin body 13 is formed by transfer molding using a translucent epoxy resin, and the first condenser lens 12 of the translucent resin body 13 has a hemispherical shape as shown in FIGS. Is provided.

The outer case 15 is injection-molded using polycarbonate, and as shown in FIG.
It has a storage room 19 in which 13 is stored. In the upper opening of the storage chamber 19, a second condenser lens 14 is arranged.

The second condenser lens 14 is formed in a convex lens shape, and its outer peripheral surface 14a is formed in a convex shape so that the light-transmitting resin body 13 can be inserted deep into the outer case 15, and the inner peripheral surface is formed. 14b is formed in a concave shape. Thereby, the size of the outer case 15 can be reduced. The second condenser lens 14 is disposed on the same central axis as the first condenser lens 12, and a gap S is provided between the second condenser lens 12 and the condenser lenses 12, 14. Thereby, the direction of refraction of the incident light passing through the second condenser lens 14 is adjusted, the efficiency of condensing the incident light on the light receiving element 11 is improved, and the light-transmitting resin body is increased without increasing the size of the light receiving element 11. Light receiving element that can not receive light with only 13
The light can be guided to eleven light receiving surfaces, and a characteristic almost close to an ideal directional characteristic can be obtained.

As shown in FIGS. 2 and 3, the positioning means 16 is a pair of cylindrical positioning pins, and protrudes from the bottom surface of the exterior case 15 facing the lead terminals 17 toward the printed wiring board 10 to the exterior case 15. It is integrally molded.

In the optical semiconductor device, the light receiving element 11 is mounted on the lead terminal 17, and these are formed into a light transmitting resin body 13 by transfer molding using a light transmitting resin. Store and complete.

Then, as shown in FIG.
Lead terminal insertion hole of printed wiring board 10 until 18
20 and soldered with solder 21.

At this time, since positioning means (positioning pins) 16 for positioning the outer case 15 at a fixed interval D with respect to the printed wiring board 10 is provided, the positioning function ( The optical semiconductor device can be reliably positioned at a fixed interval D with respect to the printed wiring board 10 without providing a complicated jig for providing a holder function) or a separate holder.

Therefore, without enlarging the shape of the device itself,
Further, a function of positioning the printed wiring board 10 can be provided without increasing the cost.

[Second embodiment] Fig. 5 is a diagram showing a state of attachment of the optical semiconductor device of the second embodiment of the present invention to a part to be attached.

As shown in the figure, the optical semiconductor device of the present embodiment is provided with a pin insertion hole 22 in which a positioning pin as the positioning means 16 is inserted in the printed wiring board 10, and the tip of the positioning pin as the positioning means 16 is provided with the pin insertion hole 22. The configuration is such that it can be inserted into the insertion hole 22, and the other configuration is the same as that of the first embodiment.

In the above configuration, the pin insertion hole is formed in the printed wiring board 10.
22 is provided, and the tip of the positioning pin as the positioning means 16 has a shape that can be inserted into the insertion hole 22, so that in addition to the vertical positioning, the horizontal position can also be fixed, and the mounting and fixing can be accurately performed. Will be able to

[Third Embodiment] FIG. 6 is a diagram showing a state of attachment of the optical semiconductor device of the third embodiment of the present invention to a part to be attached.

As shown, the optical semiconductor device of the present embodiment has an outer case.
Positioning pins as positioning means 16 are provided at the four corners of 15 and other configurations are the same as those of the first embodiment.

In the above configuration, since positioning pins as positioning means 16 are provided at four positions of the outer case 15, the height can be determined regardless of the position of the stopper 18 of the lead terminal 17.

It should be noted that the present invention is not limited to the above embodiment, and it is needless to say that many modifications and changes can be made to the above embodiment within the scope of the present invention.

For example, in the above embodiment, the outer case 15 is injection-molded. At this time, the pin component as the positioning means 16 of the molding die is block-formed so that it can be rearranged, or it can be replaced with a slide core. By stroke
If the length of the pin can be changed, the height of the pin can be freely set with one mold, and it is possible to respond to many requests for the height, and the product is versatile.

Further, the shape of the positioning pin is not limited to a cylindrical shape, and may be any shape.

Furthermore, in addition to the remote control light-receiving device, the present invention uses a photodiode, a phototransistor, an OPIC with a built-in IC,
Of course, the present invention can be applied to all optical semiconductor devices such as a light emitting device having a light emitting diode.

<Effects of the Invention> As is clear from the above description, the optical semiconductor device of the present invention has a second light-collecting characteristic for obtaining high light-collecting characteristics including the first light-collecting lens of the transparent resin body and the second light-collecting lens of the outer case. It has a heavy lens structure, and positioning means for positioning and supporting the mounting part at a constant interval is formed on the bottom surface of the outer case so as to protrude toward the mounting part. When mounting to components, it is possible to accurately perform positioning during mounting and fix the optical semiconductor device after mounting without preparing complicated jigs and separate holders as in the past, and effective high light collection characteristics It can be used for

In addition, since the outer peripheral surface of the second condensing lens is formed in a convex shape, and the inner peripheral surface facing the light transmitting resin body is formed in a concave shape, high light condensing characteristics can be ensured and the light transmitting resin can be secured. The body can be inserted all the way into the outer case, and the size of the outer case can be reduced.

Therefore, without enlarging the shape of the device itself,
There is an excellent effect that an optical semiconductor device with high cost advantage can be provided.

[Brief description of the drawings]

FIG. 1 is a sectional view of an optical semiconductor device according to a first embodiment of the present invention, FIG. 2 is a side view thereof, FIG.
FIG. 5 is a view showing a state of attachment to a part to be mounted, FIG. 5 is a view showing a state of attachment of the optical semiconductor device of the second embodiment of the present invention to a part to be mounted, and FIG. 6 is a view of a third embodiment of the present invention. FIG. 7 is a diagram showing a state of attachment of the optical semiconductor device to a part to be attached, FIG. 7 is a diagram showing a state of attachment of the optical semiconductor device of the prior art 1 to the part to be attached, and FIG.
The figure shows the state of attachment of the optical semiconductor device of the prior art 2 to the part to be attached. 10: component to be mounted (printed wiring board), 11: optical semiconductor element (light receiving element), 13: translucent resin, 15: outer case, 16: positioning means, D: fixed interval.

Claims (1)

(57) [Scope of request for utility model registration] 1. An optical semiconductor device which is mounted on a component to be mounted at regular intervals by lead terminals, wherein the optical semiconductor element mounted on the lead terminal and the optical semiconductor element are sealed with a translucent resin. A light-transmitting resin body having a first light-collecting lens at an upper part thereof, and an outer case having a light-transmitting resin body housed therein and having a second light-collecting lens at an upper part thereof; The outer peripheral surface is formed in a convex shape, and the inner peripheral surface facing the light-transmitting resin body is formed in a concave shape. An optical semiconductor device, wherein positioning means for positioning and supporting is formed so as to protrude toward the mounted component.