JP2542161Y2 - Automatic adjustment device for dust collecting force of printed circuit board processing machine - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is applied to a printed circuit board processing machine, and is suitable for adjusting the dust collecting force of chips attached to the periphery of a tool by processing the printed circuit board. It relates to an automatic force adjusting device.

[0002]

2. Description of the Related Art As shown in FIG. 6, in a printed circuit board processing machine, a plurality of spindles 15 are mounted on a housing 16 and can be moved in a Z direction by a motor 22. The housing 16 is driven by internal driving means (not shown). Column 17
In the Y direction. The column 17 is fixed to a bed 18, and the table 8 provided on the upper surface thereof can be slid in the X direction by a feed shaft and a motor (not shown). The X, Y and Z directions are at right angles to each other, and the spindle 15 is arranged perpendicular to the upper surface of the table 8. At the tip of the spindle 15, a collet chuck is supported, and a tool is detachably gripped. Further, before the tool comes into contact with the printed circuit board, the tool is lowered and a pressure foot for holding the printed circuit board is provided. A printed circuit board 13, which is a workpiece, is fixed on the upper surface of the table 8, and the spindle 15 and the table 8 are relatively moved in the X, Y, and Z directions to perform drilling.
A number of tool posts 20 are mounted on a tool plate 19 installed on the table 8, and tools 14 having various diameters are mounted. In such a printed circuit board processing machine, a dust collecting device as described in, for example, JP-A-59-134635 is used in order to remove chips generated from a processed portion. This dust collecting device is provided with a suction means on the pressure foot to collect chips from the printed circuit board being cut, and the suction means is connected to a vacuum pump or the like via a dust collecting hose to reduce the suction force by vacuum. The dust is collected by suctioning the chips. This suction force may cause a problem of sucking the tool in automatic tool change. Therefore, in automatic tool change, the suction means was completely closed and no chips were sucked at all. For this reason, residual chips remaining in the pressure foot, which is provided at the tip of the spindle and suppresses the movement of the printed circuit board during processing,
In some cases, it fell on the table on which the printed circuit board was placed and near the tool post storing the tools.

[0003]

In a conventional dust collecting apparatus for a printed circuit board processing machine, when automatic tool change is performed, dust collection of cutting chips is stopped, and residual chips are removed from a table, a tool post, or the like. To the tool to be replaced. Therefore, there is a problem that the tool is eccentrically attached to the spindle by the swarf and the tool is damaged by the eccentric rotation.

SUMMARY OF THE INVENTION An object of the present invention is to adjust a dust collecting force for sucking chips, and to collect a chip with a weak dust collecting force even when a tool is automatically changed. An automatic adjustment device is provided.

[0005]

According to the present invention, there is provided a dust collecting force automatic adjusting device for a printed circuit board processing machine, which is inserted and connected in the middle of a dust collecting hose for collecting chips of a printed circuit board cut by a tool.
With a pair of connection ports for
Dust shutter consisting of a shutter freely slidably housed in
And a driving means for moving the shutter in a sliding direction.
The shutter is provided with an inner area of the dust collection hose.
And a communication hole with almost the same opening area as
A small communication hole having a small opening area
Are drilled side by side in the direction of movement and ventilate the small communication holes.
Ventilation holes are formed, and the case is
When the connector slides, the pair of connection ports
Position communicating with both ends of one of the small communication holes
And vents the atmosphere through the vent.
And the driving means is provided for the tool.
At the time of replacement, move the shutter to open the small communication hole
It is configured to communicate with the connection port .

[0006]

According to the present invention, two types of large and small series are connected to the dust collection hose.
Because a dust collection shutter with through holes is connected ,
During the processing of the printed circuit board, the large communication hole of the shutter
Was allowed to communicate with the dust collection hose, chips are sucked by the dust collection by the negative pressure. Then, during the automatic replacement of the tool, the small communicating hole by communicating with the dust collecting hose to drive the shutter, simultaneously with the air is sucked from the through <br/> pores, inhale tool
Dust collection that sucks chips instead of large dust collection power
Weakened by power. Here, as is not sucked tool with the dust collecting force, for example, dust collection force can weakly <br/> Me Rukoto to about 50% or less during processing. In this case, the chips are sucked even during the automatic tool change due to the weak dust collection force, and the residual chips do not drop to the table or the like.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 1 to FIG. 3, chips obtained by cutting a printed circuit board with a tool are sucked by suction means (not shown) provided around the tool, and dust is collected by connecting the suction means to a dust collector such as a vacuum pump. A dust collecting shutter 3 for adjusting the inner area of the dust collecting hose 1 is provided substantially orthogonal to the hose 1, and the dust collecting shutter 3 is communicated with the dust collecting hose 1 substantially orthogonal to the opening, and has substantially the same opening as the inner area thereof. Communication hole 5 having an area, and communication hole 5
The shutter 2 is provided with a small communication hole 7 provided in parallel with the sliding direction and having an opening area smaller than the inner area, a shutter 6 having a ventilation hole 6 substantially perpendicular to the small communication hole 7 and ventilating the atmosphere. The shutter 2 is formed by a case 8 which is movably stored.
And a driving means (cylinder) 4 for sliding the shutter 2 in a direction substantially orthogonal to the dust collection hose 1. When the tool is automatically changed, the driving means 4 is driven to slide the shutter 2.
The small communication hole 7 communicates with the dust collection hose 1, the atmosphere is sucked through the ventilation hole 6, and the inner area of the dust collection hose 1 is reduced by about 5 mm during processing.
In this configuration, the dust collecting force is adjusted to 0% or less. Generally, a tool change command is issued from a CNC device and the tool is replaced with a predetermined tool. When the CNC device recognizes the change command, the drive means is driven by an output signal of the CNC device and the shutter slides. By doing so, the inner area of the dust collection hose can be automatically adjusted.

The operation of this embodiment will be described with reference to FIGS. FIG. 4 shows a state in which the driving means 4 is driven and the shutter 2 is slid to the right in the drawing. The small communication hole 7 communicates with the dust collection hose 1, and the communication hole 5 is closed by the wall surface of the case 8. I have. At the time of automatic tool change, suction is performed via the small communication hole 7 having a smaller inner area than the dust collection hose 1 and the air is suctioned from the ventilation hole 6. The dust collection force is weakened to about 50% or less of the processing to prevent the tool from being sucked, and the chips in the pressure foot are also collected, preventing the residual chips from dropping to the tool post on the table. You. During processing, as shown in FIG. 5, the driving means 4 is driven to slide the shutter 2 to the left in the drawing, and the communication hole 5 is connected to the dust collection hose 1. The swarf is sucked by the negative pressure via the suction means and collected.

[0009]

[Effect of the Invention] According to the automatic dust collecting force adjusting device of the printed circuit board processing machine of the present invention, the weak dust collecting force can be automatically maintained even during the automatic change of the tool, so that the tool post on the table from around the tool can be obtained. The residual chips do not fall to the surface, preventing damage to the tool during machining and improving the precision of automatic tool change.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing an embodiment of the present invention.

FIG. 2 is a plan view showing a main part of FIG.

FIG. 3 is a sectional view taken along line AA of FIG. 2;

FIG. 4 is a sectional view taken along line BB of FIG. 1 for explaining the operation of the present embodiment.

FIG. 5 is a sectional view taken along line BB of FIG. 1 for explaining the operation of the present embodiment.

FIG. 6 is a perspective view illustrating a conventional technique.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Dust collection hose 2 Shutter 3 Dust collection shutter 4 Driving means 5 Communication hole 6 Vent hole 7 Small communication hole

Claims (1)

(57) [Scope of request for utility model registration] 1. A pair of connections for insertion and connection in the middle of a dust collection hose for collecting chips from a printed circuit board cut by a tool.
Case with a mouth and slidably stored in this case
A dust-collecting shutter comprising a shutter
Driving means for moving in the sliding direction, wherein the shutter is substantially the same as the inner area of the dust collection hose.
A communication hole having an opening area and an opening surface smaller than the communication hole
The small communication hole with the product is arranged side by side in the sliding direction of this shutter.
And a ventilation hole for ventilating the small communication hole.
The case is configured such that when the shutter is slid, the pair of the
The connection port may be any one of the communication hole and the small communication hole.
It is formed facing the position communicating with both ends of the through hole, and
The drive unit is formed so as to ventilate the atmosphere through the vent hole, and the drive unit activates the shutter when exchanging the tool.
It moves to communicate the small communication hole with the connection port.
Dust collection force automatic adjustment device of a certain printed circuit board processing machine.