JP2540064Y2 - Optical semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an optical semiconductor device used for a remote control light receiving unit or the like.

<Prior Art> FIGS. 8 to 14 show a conventional optical semiconductor device.

Generally, an optical semiconductor device used for a remote control light receiving unit receives infrared light from a transmitter (not shown) by a light receiving element 1, converts the infrared light into an electric signal, and then converts the electric signal to an electric signal.
Amplifies the tiny current of tens of thousands of times, performs various waveform processing,
A digital output similar to the transmitter output is obtained.

As described above, since the semiconductor device amplifies a minute current by tens of thousands of times, it is susceptible to disturbance noise (electrical / electromagnetic noise). As a countermeasure, as shown in FIGS. Plate (cold rolled steel plate: SPCC, electric plating:
The shield case 2 is formed by bending the SPTE etc.
This surrounds a circuit board 4 (hereinafter, referred to as a signal processing circuit component 5) to which an electric component 3 such as an electrolytic capacitor is soldered, and obtains a shielding effect against disturbance noise.

Conventionally, as a procedure for accommodating the signal processing circuit component 5 in the shield case 2, as shown in FIG. 13, the signal processing circuit component 5 is first inserted through the upper opening 6 of the shield case, and then the metal shield case is inserted. The back cover 7 is folded downward to close the opening 6 of the shield case, and the signal processing circuit component 5
From six directions to secure the shielding effect.

<Problem to be Solved by the Invention> However, in the conventional optical semiconductor device, since it is necessary to shield the signal processing circuit component 5 with the metal plate shield case 2, the signal processing circuit component Inserting the cable into the shield case 2.

A step of fitting the back cover 7 of the shield case 2 into the opening 6.

2 assembly processes.

In view of the above problems, an object of the present invention is to provide an optical semiconductor device that can secure a shielding effect only by one-step assembly of inserting a signal processing circuit component into a shield case and improve assembling workability during an assembling operation. And

<Means for Solving the Problems> As shown in FIGS. 1 to 7, the problem solving means according to the present invention includes a light receiving element 11, an electrolytic capacitor 12, a circuit board 13 on which the light receiving element 11 and the electrolytic capacitor 12 are mounted. , The circuit board
An optical semiconductor device comprising a shield case for accommodating the shield case and blocking disturbance noise.
An insertion opening 22 into which the circuit board 13 is inserted is formed on a side surface (rear wall 18) opposite to the light receiving surface (front wall 20) of the circuit board.
13 the light receiving element 1
1.On the rear side, the cylindrical electrolytic capacitor 12 is mounted such that the side surface of the column is substantially parallel to the circuit board 13, and the end face 17 of the electrolytic capacitor 12 is a shield case 14.
The end face 17 is formed of a shielding material.

<Operation> In the means for solving the above problems, first, one metal plate is bent into a box shape in advance to form the shield case 14. At this time, an insertion port 22 is formed in the rear wall 18 of the shield case 14.

On the other hand, on the circuit board 13, the light receiving element 11 is mounted on the front side with respect to the insertion direction, and the electrolytic capacitor 12 is mounted on the rear side with respect to the insertion direction.

Then, at the time of assembly, the circuit board 13 is inserted into the insertion opening 22 of the shield case 14 from the front side, and the assembly work of the optical semiconductor device is completed.

As described above, the insertion port 21 is provided in the rear wall 18 facing the front wall 20 which is the light receiving surface of the shield case 14 in advance, and the assembly of the optical semiconductor device is completed only by inserting the circuit board 13 into the shield case 14. Simplifies assembly work,
Work efficiency is improved.

Moreover, since the surface of the end face 17 of the electrolytic capacitor 12 is formed of a shield material and the end face 17 is disposed in the insertion opening 22 of the shield case 14, even if the insertion opening 22 is provided, the shielding effect is not adversely affected. .

Therefore, a sufficient shielding effect similar to the conventional one can be obtained only by inserting the circuit board into the shield case in one step.

<Embodiment> An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a rear view showing an optical semiconductor device according to an embodiment of the present invention, FIG. 2 is a side view thereof, FIG. 3 is a plan view thereof, FIG. FIG. 5 is a rear view of the same, FIG. 6 is a plan view of the same, and FIG. 7 is a side view showing a state where the circuit board is similarly inserted into the shield case.

As shown in the figure, the optical semiconductor device of this embodiment is used as a remote control light receiving unit.
A light receiving element 11, an aluminum electrolytic capacitor 12 having an aluminum surface, and a circuit board 13 for mounting these on a lower surface.
And a shield case 14 for accommodating the circuit board 13 and blocking disturbance noise.

The light receiving element 11 uses a photodiode, a phototransistor, or the like, and is suspended and mounted on a front portion of the circuit board 13 via an arm 15.

The aluminum electrolytic capacitor 12 is formed in a cylindrical shape, and its outer peripheral portion is made of aluminum. The aluminum electrolytic capacitor 12 is suspended from a central portion of the circuit board 13 via an L-shaped arm 16 and pulled rearward. ing. Thereby, the end face 17 of the aluminum electrolytic capacitor 12 is arranged so as to be flush with the rear wall 18 of the shield case 14.

At the rear of the circuit board 13, an external connection terminal 19 bent and formed in an L-shape is mounted so as to project rearward.

As shown in FIGS. 4 to 7, the shield case 14 is made of a single metal plate (cold rolled steel plate: SPCC, electric plating: SPTE).
) Are bent in a box shape having walls on six sides, and a light-transmitting window 21 for transmitting light to the light receiving element 11 is formed in the center of the front wall 20.

Further, an insertion port 22 into which the circuit board 12 is inserted is formed in the rear wall 18 of the shield case 14. The insertion slot
22 is formed so that the open area thereof is as small as possible according to the mounting shape of the circuit board 12, the light receiving element 11, the electrolytic capacitor 12, the external connection terminal 19 and the like mounted below.

In the drawing, 23 is a mounting piece for mounting the circuit board 12 formed by cutting and raising a part of the shield case 14, 24 is a presser piece for preventing the wobble of the circuit board 12 upward, and 25 is Similarly, it is an elastic detachment preventing piece for preventing the circuit board 12 from coming off from the insertion opening 22.

 The optical semiconductor device having the above configuration is manufactured as follows.

First, one metal plate is bent into a box shape and a shield case
Form 14. At this time, a light-transmitting window 21 is formed in the front wall 20 of the shield case 14, an insertion opening 22 is formed in the rear wall 18, and the mounting piece 23, the holding piece 24, and the detachment preventing piece 25 are respectively provided at desired positions. Cut it up.

On the other hand, the circuit board 13 has a light receiving element 11, an electrolytic capacitor
12 and the external connection electrode 19 are respectively mounted.

Then, the circuit board 13 is inserted into the insertion opening 22 of the shield case 14, and the manufacturing process of the optical semiconductor device is completed.

Thus, instead of shielding the case 14 by opening the upper surface and closing it with the back cover as in the conventional case, the insertion port 22 is provided in advance on one side of the shield case 14, and the circuit board 13 is attached to the shield case 14. Since the assembly of the optical semiconductor device can be completed only by inserting the optical semiconductor device into the optical semiconductor device, the assembly operation can be simplified to one step. Therefore,
The assembling process for insertion is reduced to half of the conventional process, and the working efficiency is improved.

Here, since the insertion port 22 is provided in the rear wall 18 of the shield case 14, the shielding property of the rear part of the shield case 14 becomes a problem compared to the related art. However, the end face 17 of the aluminum electrolytic capacitor 12 whose surface is made of aluminum is shielded
14 is located at the insertion opening 22, the end face 17 of the aluminum electrolytic capacitor 12 functions as a shielding material,
Even if 22 is provided, the attenuation of the shielding effect can be prevented.

In addition, among the insertion holes 22, aluminum electrolytic capacitors
Although the portion other than the end face 17 of the 12 is open, the rear portion of the optical semiconductor device is different from the light receiving surface which is most susceptible to electromagnetic noise. Therefore, there is little effect on the opening area for inserting the circuit board, and in this case, the shield is not conventionally shielded.

Therefore, a sufficient shielding effect similar to the conventional one can be obtained only by inserting the circuit board into the shield case in one step.

It should be noted that the present invention is not limited to the above embodiment, and it is needless to say that many modifications and changes can be made to the above embodiment within the scope of the present invention.

For example, in the above-described embodiment, an aluminum electrolytic capacitor is used to provide a shielding effect. However, a metal material such as aluminum may be simply adhered to only the end face 17 to provide a shielding function.

<Effects of the Invention> As is clear from the above description, according to the present invention, a cylindrical electrolytic capacitor is provided on the rear side with respect to the insertion direction on the same surface of the circuit board so that the side surface is substantially parallel to the circuit board. Since the end surface of the electrolytic capacitor is placed in the insertion opening of the shield case and the surface of the end surface is made of shield material, the assembly of the optical semiconductor device can be completed simply by inserting the circuit board into the shield case. Can be. Therefore, the assembling work is simplified, and the working efficiency is improved.

In addition, since an insertion opening with an opening area as small as possible is formed on a side surface facing the light receiving surface of the shield case, this can be shielded by the end surface of the electrolytic capacitor without providing a shield member such as a back cover. It is possible,
Providing the insertion port does not adversely affect the shielding effect. Therefore, there is an excellent effect that it is possible to obtain a sufficient shielding effect as in the related art by simply inserting the circuit board into the shield case in one step.

[Brief description of the drawings]

FIG. 1 is a rear view showing an optical semiconductor device according to an embodiment of the present invention, FIG. 2 is a side view thereof, FIG. 3 is a plan view thereof, FIG. 5 is a rear view of the same, FIG. 6 is a plan view of the same, FIG. 7 is a side view showing a state where the circuit board is similarly inserted into the shield case, and FIG. 8 is a rear view of a conventional optical semiconductor device. Figure 9, Figure 9 is a side view of the same, Figure 10 is a plan view of the same, Figure 11 is a rear perspective view of the same shield case, Figure 12 is a rear view of the same, and Figure 13 is a circuit board of the same shield FIG. 14 is a side view showing a state of being inserted into the case, and FIG. 14 is a plan view of the same shield case. 11: light receiving element, 12: electrolytic capacitor, 13: circuit board, 14: shield case, 17: end face, 22: insertion slot.

Claims (1)

(57) [Scope of request for utility model registration] 1. An optical semiconductor device comprising: a light receiving element; a column-shaped electrolytic capacitor; a circuit board on which the light receiving element and the electrolytic capacitor are mounted; and a shield case that houses the circuit board and blocks disturbance noise. , An insertion opening into which a circuit board is inserted is formed on a side surface facing the light receiving surface of the shield case, the light receiving element is provided on the front side with respect to the insertion direction on the same surface of the circuit board, and the electrolytic The capacitor is mounted such that the side surface of the column is substantially parallel to the circuit board, the end surface of the electrolytic capacitor is disposed in an insertion opening of the shield case, and the surface of the end surface is formed of a shield material. Optical semiconductor device.