JPH0517889Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Field of Application] The present invention is applicable to mounting structures for optical semiconductor elements such as light emitting diodes and phototransistors on substrates, particularly for optical semiconductor elements such as optical detection type coordinate input devices. The present invention relates to a mounting structure for optical semiconductor elements suitable for use in a device in which a large number of optical semiconductor elements are to be arranged in a row with correct mounting position accuracy.

[Prior art]

Among coordinate input devices that are manually entered into a computer, optical detection type devices that allow coordinates to be identified by simply pressing a desired point on the front of the display device with a finger or the like are attracting attention due to their reliability and operability. There is.

This type of photo-detection type coordinate input device includes:
Conventionally, devices as shown in FIGS. 6 to 8 have been known. Here, FIG. 6 is a perspective view showing an example in which the coordinate input device is attached to the front surface of the display device, FIG. 7 is a sectional view of the main part on the light receiving element side, and FIG. FIG.

This coordinate input device includes a frame 1 that is formed into a substantially rectangular shape and has an opening 2 in the center, and a display device 3 that uses a CRT (Cathode, Ray, Tube) or the like on the back side of the frame 1. An optical path 11 is selected from among a set of a plurality of light emitting elements 4 such as LEDs and a light receiving element 5 such as a phototransistor, which are arranged in parallel on opposite sides of the display surface 3a, and a combination of these light emitting elements 4 and light receiving elements 5. It mainly consists of an arithmetic unit 6 that detects the position where the signal is interrupted and inputs the coordinate position to the host computer side. In addition,
The light emitting element 4 and the light receiving element 5 are the former main body 4a.
The light emitting part at the tip of the latter main body 5a and the light receiving part at the tip of the latter main body 5a face each other for each set.
Terminals 4b, 5b protruding from the bottom of a, 5a
is soldered to a board 7 attached to the frame 1.

The opening 2 has a VDT (Visual/Display/
An operation panel 2a consisting of a terminal (terminal) filter is provided and is placed in front of the display surface 3a of the display device 3 to prevent dirt and dust from adhering to the display surface 3a. Further, on the front side of the main body 5a of the light receiving element 5, there is a light shielding plate 8 in which a light transmission hole 8a having a predetermined area and depth is formed so that only the incident light from the light emitting element 4 serving as a pair can be received. It is arranged. Further, an infrared filter 9 as a visible light cut filter is attached to the entire circumference of the opening edge on the front side of the light shielding plate 8 and the opening edge on the front side of the light emitting element 4. Therefore, an invisible optical path 11 is formed through the infrared filter 9 on the front surface of the operation panel 2a, that is, on the side not facing the display surface 3a.

When detecting the coordinate position, for example, the 6th to 8th
As shown in the figure, when you press the position on the display surface 3a where you want to input with your finger 10 from above the operation panel 2a, an optical path 11 is formed along the surface of the operation panel 2a.
Since the light that is supposed to pass through the finger 10 is blocked there, by sequentially causing the light emitting elements 4 to emit light and scanning, the blocked optical path 11 is directed to the light receiving element 5 in both the x direction and the y direction. It can then be detected. This shielded optical path 11 is specified by the arithmetic unit 6, and its coordinate position is output to a host computer (not shown).

[Problem that the invention attempts to solve]

By the way, in such a photo-detection type coordinate input device, in order to prevent malfunction, it is necessary to maintain the light-emitting element 4 and the light-receiving element 5 at right angles to the substrate 7 and at a predetermined height. The mounting structure of these optical semiconductor elements 4 and 5 in the conventional example has a problem in that it is difficult to achieve positioning accuracy. That is, these optical semiconductor elements 4 and 5 have terminals 4b and 5.
Since a part of the main body 4a, 5a is simply soldered and fixed to the board 7 in a cantilevered state, the main bodies 4a, 5a tend to tilt during installation, and the light emitting part or the light receiving part tends to shift from the predetermined direction. Since the bottom surface of 5a was made into a non-flat surface by potting, it was difficult to achieve height accuracy with respect to the substrate 7. As a result, the light emitted from the light-emitting element 4 may deviate from the predetermined optical path 11, or the light-receiving element 5 may receive light that should not be received, that is, light from the light-emitting element 4 that is not paired, or light emitted from the light-emitting element 4 that is not paired. The device detects reflected light from the light source, for example, reflected light from the surface of a visible light cut filter, which tends to cause malfunctions and impede reliability. Furthermore, arranging a large number of these optical semiconductor elements 4 and 5, which are difficult to achieve positioning accuracy, leads to a decrease in work efficiency and makes the assembly work complicated.

The present invention was developed in view of the above points, and its purpose is to provide a light-shielding device that can easily ensure the positioning accuracy of optical semiconductor elements with respect to the substrate, prevent malfunctions, and improve workability. An object of the present invention is to provide a mounting structure for an optical semiconductor element using a holder. Another object of the present invention is to prevent the reliability of the optical semiconductor element from decreasing when the terminal portion of the optical semiconductor element is soldered to the substrate due to the heat trapped in the holder during soldering. The purpose of the present invention is to provide a mounting structure for an optical semiconductor element.

[Means for solving problems]

The above-mentioned object of the present invention is to solder an optical semiconductor element in which a photoelectric conversion surface having a light emitting or light receiving function is formed on the front surface of the main body and a terminal is extended to the rear surface of the main body. The configuration includes a holder that closely contacts the substrate to position the optical semiconductor element with respect to the substrate, and the holder includes a storage portion for storing the main body of the optical semiconductor element, and the optical semiconductor element. This is achieved by forming a light transmission hole facing the photoelectric conversion surface of the main body, and a heat dissipation window communicating with the storage section and facing the side surface of the main body.

[Effect]

That is, in the present invention, by employing the above-mentioned holder, it is possible to provide the function of a light shielding plate used in a conventional coordinate input device and the function of positioning the optical semiconductor element with respect to the substrate. Accurate positioning of the semiconductor element on the substrate and accurate alignment of the photoelectric conversion surface (light emitting surface or hole receiving surface) of the optical semiconductor element with respect to the light transmission hole of the light shielding body can be achieved simultaneously. Therefore, positioning accuracy can be easily and reliably obtained, and workability is also good. Further, since the holder is formed with a window for heat radiation, there is no possibility that heat during dip soldering will be trapped inside the holder and deteriorate the characteristics of the optical semiconductor element.

〔Example〕

The first embodiment of the present invention will be described below in Figures 1 and 2.
This will be explained based on the diagram.

FIG. 1 is a sectional view showing the mounting state of the optical semiconductor element according to the embodiment, and FIG. 2 is a partial perspective view with a part of the holder removed, in which reference numeral 5 denotes a light receiving element, and 7
1 is a substrate, 12 is the entire light-shielding holder, 13 is a lower mold thereof, 14 is an upper mold thereof, and 15 is solder.

In these figures, the holder 12, which is a molded product made of polyacetal or the like, has a lower mold 13 and an upper mold 14 extending in the row direction of the light-receiving elements 5 arranged in rows (in the direction of arrow A in FIG. 2). As shown in FIG. 2, after storing a plurality of light receiving elements 5 in a row at the rear of the lower mold 13, a protrusion 14a on the upper mold 14 side is inserted into a step 13a on the lower mold 13 side. By making a strong fit, these rows of light receiving elements 5 can be fitted together while ensuring light shielding properties. In the state in which the light receiving element 5 is fitted in this way, a light transmitting hole 12a is formed at the tip of the holder 12.
Further, a light transmitting hole 12a is located behind the light transmitting hole 12a.
An incident direction regulating chamber 12b as an enlarged portion formed to have a diameter larger than the diameter of the entrance section of the main body 5a of the light receiving element 5 is defined, and a storage section 12c is defined behind the incident direction regulating chamber 12b. is the storage section 1
2c, and a pressing portion 13b protruding from the lower mold 13 comes into elastic contact with the bottom surface of the main body 5a. That is, since the bottom surface of the main body 5a of the light receiving element 5 fitted in the holder 12 is pressed by the pressing part 13b, when the terminal 5b is soldered 15 to the board 7, the lower end 12f of the holder 12
The height accuracy with respect to the substrate 7 is ensured by simply bringing the main body 5a into close contact with the substrate 7, and since it is fitted into the housing portion 12c which maintains the perpendicularity with the substrate 7, the perpendicularity of the main body 5a with respect to the substrate 7 is also inevitable. The positioning accuracy is significantly improved. Also,
The light transmission hole 12a located in front of the main body 5a of the light receiving element 5 has a predetermined area and depth, and functions in the same manner as the light transmission hole of a light shielding plate used in a conventional coordinate input device. Therefore, the light shielding plate can be made unnecessary.

12d, 12d are storage portions 12c of the holder 12;
The windows 12d, 12d are windows provided on the upper and lower surfaces (that is, the lower mold 13 and the upper mold 14) of the light receiving element 5.
When soldering the terminal 5b and the conductive pattern of the board 7 by dip soldering or the like, the storage part 12c
It acts to release the heat trapped inside to the outside. That is, during the soldering process described above, a considerable amount of heat is transmitted from the soldering surface of the board 7 to the main body 5a of the light receiving element 5 and the housing portion 12c, but this heat is quickly transferred to the outside due to the presence of the windows 12d, 12d. released,
There is no risk that the reliability of the light receiving element 5 (optical semiconductor element) will be impaired due to heating during soldering.

Therefore, when assembling, the light receiving elements 5 are inserted into the holder, and in this state, the terminals 5b of each light receiving element 5 are connected.
are inserted into the board 7, and the holder 12
By simply bringing the lower end 12f of the light-receiving elements 5 into close contact with the substrate 7 and soldering them with dip solder or the like, the positioning accuracy of each light-receiving element 5 arranged in a row with respect to the substrate 7 is automatically ensured, and malfunctions occur. Not only can this be reliably prevented, but also the assembly work can be simplified.
There is no risk of deteriorating the characteristics of the light receiving element due to heat during soldering.

Incidentally, an incident direction regulating chamber 12b is formed as an enlarged part between the light transmission hole 12a and the storage part 12c.
defines a space wider than the light transmission hole 12a, and the incident direction regulating chamber 12b prevents undesired light from entering the light transmission hole 12a, that is, inside the storage portion 12c. Light entering from a light emitting element other than the light emitting element paired with the light receiving element 5 is prevented from reaching the light receiving portion at the tip of the main body 5a of the light receiving element 5. Therefore, the light received by the light-receiving portion of the light-receiving element 5 is severely restricted in its direction of incidence, and only the incident light from the desired light-emitting element can be received, making it possible to more reliably prevent malfunctions. can. In addition, this incident direction regulation chamber 1
If the wall surface of 2b is subjected to a matte finish, the effect of removing undesired incident light will be further increased.

Further, in the above embodiment, a case has been described in which the pressing portion 13b is provided only on the lower mold 13 of the holder 12, but such a pressing portion may be provided on the upper mold 14.

In addition, in the above embodiment, the holder 12 is
The lower mold 13 and the upper mold 14 are divided into two parts and formed separately to form a pair. For example, a hinge part is formed in the shape of the light transmission hole 12a, and the lower mold 13 is inserted through this hinge part.
and an upper mold 14 are integrally formed, and after mounting the optical element in a predetermined position, the optical element is bent through the hinge part and the paired lower mold part and upper mold part are fitted together to form the optical element. A holder may also be formed. In addition, the light transmission hole 12a forming part provided with the incident direction regulation 12b is separately molded as an adapter, and arranged on the front surface of the holder formed by the pair of mold bodies, that is, on the front surface of the light receiving part of the light receiving element 5. You can also.

In addition, in the embodiments shown in the first and second figures,
Although the light receiving element 5 is shown as an optical semiconductor element,
Even if it is a light emitting element, substantially the same structure can be adopted, and this also applies to the following embodiments.

3 and 4 relate to a second embodiment of the present invention, in which FIG. 3 is a sectional front view showing the installed state, FIG. 4 a is a sectional front view of the holder, and FIG. 4 b is a sectional side view of the main part. It is a diagram.

The holder 20 of this embodiment has a structure in which each light receiving element 5 is held one at a time, and the upper surface of the holder 20 has a light transmission hole facing the photoelectric conversion surface of the light receiving element 5. 20a, and heat dissipation windows 20b, 2 are provided on the side surface of the holder 20 that holds the side surface of the main body 5a of the light receiving element 5.
0c is provided. 20d is a step provided on the inner surface of the side surface of the holder 20, and 20e is a protrusion provided on the lower part of the inner surface of the side surface of the holder 20. By inserting the light receiving element 5, the main body 5a of the light receiving element 5 comes to be positioned and held with respect to the holder 20 with its upper and lower surfaces abutting against the stepped portion 20d and the protrusion 20e of the holder 20 in a so-called snap-in fitting. ing.

Then, with the light receiving element 5 housed and held in the holder 20, the terminal 5b of the light receiving element 5 is inserted into the substrate 7, and the lower ends 20f, 20f of the holder 20 are brought into close contact with the substrate 7 as in the above embodiment. Then, by soldering the terminal 5 and the conductive pattern of the board 7, the light receiving element 5 is accurately fixed and connected to the board 7 with the desired height accuracy and perpendicularity, and the window 20
Due to the presence of b and 20c, heat during soldering is quickly released to the outside. In this embodiment, windows 20b and 20 are provided on the four sides of the holder 20.
c is formed, the heat dissipation effect is even higher.

FIG. 5 relates to a third embodiment of the present invention, in which _the light receiving element 5 is The light receiving element 5 is held and positioned in the holder 20' by sandwiching the protrusion 5c and the lower surface of the main body 5a, and the other configurations are the same as those of the second embodiment. This embodiment can also be expected to have the same effects as the embodiments described above.

[Effect of idea]

As described above, according to the present invention, it is possible to easily and reliably ensure the positioning accuracy of the optical semiconductor element with respect to the substrate and the positioning accuracy with respect to the light transmission hole of the light shielding body, and workability is significantly improved, and the heat during soldering can be reduced. This has a remarkable practical effect of being able to dissipate heat without affecting the optical semiconductor element.

[Brief explanation of drawings]

Figures 1 and 2 relate to a mounting structure for an optical semiconductor element according to a first embodiment of the present invention, with Figure 1 being a sectional view of the main parts showing the mounting state, and Figure 2 showing a part of the holder removed. The partial perspective view, FIGS. 3 and 4 relate to the second embodiment of the present invention, FIG. 3 is a sectional front view showing the installed state, FIG. 4a is a sectional front view of the holder,
FIG. 4b is a cross-sectional side view of the holder, FIG. 5 is a cross-sectional view of main parts according to the third embodiment of the present invention, and FIGS. 6 to 8 are for explaining a conventional photodetection type coordinate input device. FIG. 6 is an explanatory diagram showing the state in which it is mounted on the front surface of the display screen, FIG. 7 is a sectional view of the main part on the light receiving element side, and FIG. 8 is a rear view showing the outline of the internal structure. 4...Light emitting element, 4a...Main body, 4b...Terminal, 5...Light receiving element, 5a...Main body, 5b...Terminal, 5c...Protrusion, 12...Holder, 12a...
Light transmission hole, 12b...Incidence direction regulation chamber, 12c...
...Storage section, 12d...Window, 13...Lower mold, 14...
...Upper mold, 15...Solder, 20, 20'...Holder,
20a, 20'a...light transmission hole, 20b, 20'
b, 20c...window.

Claims (1)

[Scope of utility model registration request] A configuration in which an optical semiconductor element, in which a photoelectric conversion surface having a light emitting or light receiving function is formed on the front surface of the main body and terminals are extended on the rear surface of the main body, is attached to a substrate by soldering the terminals,
a holder that is in close contact with the substrate to position the optical semiconductor element with respect to the substrate;
A storage part for storing the main body of the optical semiconductor element, a light transmission hole facing the photoelectric conversion surface of the optical semiconductor element, and a heat dissipation window communicating with the storage part and facing a side surface of the main body. A mounting structure for an optical semiconductor element, characterized in that: