JPH025545Y2 - - Google Patents

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Publication number
JPH025545Y2
JPH025545Y2 JP20183283U JP20183283U JPH025545Y2 JP H025545 Y2 JPH025545 Y2 JP H025545Y2 JP 20183283 U JP20183283 U JP 20183283U JP 20183283 U JP20183283 U JP 20183283U JP H025545 Y2 JPH025545 Y2 JP H025545Y2
Authority
JP
Japan
Prior art keywords
case
light
emitting element
receiving element
guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP20183283U
Other languages
Japanese (ja)
Other versions
JPS60109069U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP20183283U priority Critical patent/JPS60109069U/en
Publication of JPS60109069U publication Critical patent/JPS60109069U/en
Application granted granted Critical
Publication of JPH025545Y2 publication Critical patent/JPH025545Y2/ja
Granted legal-status Critical Current

Links

Description

【考案の詳細な説明】 (イ) 考案の分野 この考案は、光電スイツチに関し、特に、発光
素子及び受光素子の取付構造に係るものである。
[Detailed description of the invention] (a) Field of the invention This invention relates to a photoelectric switch, and particularly relates to a mounting structure for a light emitting element and a light receiving element.

(ロ) 従来技術とその問題点 一般に、光電スイツチには透過形や反射形のも
のがある。これら何れの光電スイツチも発光素子
と受光素子とを内蔵している。
(b) Prior art and its problems In general, photoelectric switches include transmissive and reflective types. All of these photoelectric switches incorporate a light emitting element and a light receiving element.

この光電スイツチにおいて、例えば透過形のも
のは、第1図に示すように、ケースa内に発光素
子b、受光素子c及びプリント基板d等が収納さ
れて構成されている。このケースaは、長方形本
体部eの上面中央部に一対の収納凸部f,fが上
方に突出形成されて成り、この凸部f間が検出溝
部gとなつている。そして、本体部eにプリント
基板dが設置される一方、発光素子b及び受光素
子cはプリント基板dに立設されて収納凸部fに
設けられている。
Among these photoelectric switches, for example, a transmissive type is constructed by housing a light emitting element b, a light receiving element c, a printed circuit board d, etc. in a case a, as shown in FIG. This case a has a pair of storage protrusions f, f formed in the center of the upper surface of the rectangular main body part e to protrude upward, and a detection groove g is formed between the protrusions f. A printed circuit board d is installed on the main body part e, while a light emitting element b and a light receiving element c are erected on the printed circuit board d and provided in the storage convex part f.

従つて、発光素子bから発せられた光は溝部g
を通つて受光素子cが受けることになり、この溝
部gに検出物体が位置すると、その光が遮断され
ることになり、検出されることになる。
Therefore, the light emitted from the light emitting element b is transmitted through the groove g.
The light is received by the light receiving element c through the groove g, and when a detection object is located in the groove g, the light is blocked and detected.

この光電センサにおける発光素子b及び受光素
子cは、素子本体h,iより端子j,kが下方に
延長されて成り、この素子本体h,iはリードフ
レームにダイボンデイングやワイヤボンデイング
された後に光透過性のエポキシ樹脂等で被覆して
形成されていた。
The light emitting element b and the light receiving element c in this photoelectric sensor have terminals j and k extending downward from the element bodies h and i, and the element bodies h and i are die-bonded or wire-bonded to a lead frame and then exposed to light. It was formed by coating it with a transparent epoxy resin or the like.

しかし、この発光及び受光素子b,cにおいて
は、従来、単に端子j,kを延長しているのみで
プリント基板dに接続しており、高さが不揃いに
なるという問題があつた。特に、ケースaの溝部
gが所定の深さを有する必要があるので、端子
j,kが長くなつて所謂腰高実装となるため、高
さ調整が難しかつた。更に、発光素子bの投光面
と受光素子cの受光面とを対面させる必要がある
が、光軸が一致しないという問題があつた。その
上、ケースaを挿入する際、素子本体h,iが傾
斜していると、収納凸部fに挿入し難く、端子
j,kが座屈するなどの欠点があつた。
However, in the light emitting and light receiving elements b and c, conventionally, the terminals j and k were simply extended and connected to the printed circuit board d, which caused a problem that the heights were uneven. In particular, since the groove g of the case a needs to have a predetermined depth, the terminals j and k become long, resulting in so-called high-height mounting, making height adjustment difficult. Furthermore, although the light emitting surface of the light emitting element b and the light receiving surface of the light receiving element c need to face each other, there is a problem in that the optical axes do not coincide. Moreover, when inserting the case a, if the element bodies h and i are inclined, it is difficult to insert the case into the housing convex part f, and the terminals j and k may buckle.

つまり、第2図に示すように、発光素子bの端
子jが座屈したり、第3図に示すように、素子本
体h,iが下向きと上向きとに傾いたり、更には
第4図に示すように、素子本体h,iが右側と左
側とに傾いたりし、何れも光軸l,mが一致しな
いという欠点があつた。
In other words, the terminal j of the light emitting element b may buckle as shown in Fig. 2, the element bodies h and i may tilt downward and upward as shown in Fig. Thus, the element bodies h and i were tilted to the right and left sides, and the optical axes l and m did not coincide with each other.

しかも、この光軸l,mのズレが生じると、ケ
ースに収納した後等では矯正できなかつた。そし
て、このズレ発生を防止する必要から、自動組立
化が困難で、手作業に頼らなければならないとい
う問題があつた。
Furthermore, if the optical axes l and m are misaligned, it cannot be corrected after the optical axis is housed in a case. Since it is necessary to prevent this misalignment, there is a problem in that automatic assembly is difficult and manual assembly is required.

(ハ) 考案の目的 この考案は、斯かる点に鑑みてなされたもの
で、発光素子及び受光素子の端子が貫通するサブ
ケースを設けることにより、光軸が常に合致する
ようにした光電センサを提供することを目的とす
るものである。
(c) Purpose of the invention This invention was made in view of the above points, and is a photoelectric sensor in which the optical axes are always aligned by providing a sub-case through which the terminals of the light-emitting element and the light-receiving element pass. The purpose is to provide

(ニ) 考案の構成と効果 この考案は、上述した目的を達成するために、
ケース内にサブケースがプリント基板に設置して
設けられ、このサブケースに前記収納凸部に嵌合
自在なガイド凸部が形成され、このガイド凸部上
面には前記発光素子及び受光素子の素子本体を位
置決めする位置決め部が形成されると共に、前記
発光素子及び受光素子の端子が貫通するガイド孔
がガイド凸部の上面から下面に亘つて形成され、
前記発光素子及び受光素子を所定箇所に位置させ
るように構成されている。
(d) Structure and effect of the invention In order to achieve the above-mentioned purpose, this invention
A sub-case is installed on a printed circuit board within the case, and a guide protrusion that can be fitted into the storage protrusion is formed in this sub-case, and the light emitting element and light receiving element are mounted on the upper surface of the guide protrusion. A positioning part for positioning the main body is formed, and a guide hole through which the terminals of the light emitting element and the light receiving element pass is formed from the upper surface to the lower surface of the guide convex part,
The light emitting element and the light receiving element are arranged at predetermined positions.

したがつて、この考案の光電センサによれば、
サブケースの位置決め部に位置決めされることに
よつて発光素子と受光素子との高さが常に一定に
なると同時に、素子本体が上下左右等に傾くこと
がないので、光軸を正確に合致させることができ
る。
Therefore, according to the photoelectric sensor of this invention,
By being positioned in the positioning part of the sub-case, the height of the light emitting element and the light receiving element is always constant, and at the same time, the element body does not tilt vertically, horizontally, etc., so the optical axes can be aligned accurately. Can be done.

また、端子はサブケースで被われるので座屈等
も確実に防止することができ、その上、端子をプ
リント基板に挿入接続するのみで、光軸を合致さ
せることができる。
Furthermore, since the terminals are covered by the sub-case, buckling and the like can be reliably prevented, and furthermore, the optical axes can be aligned simply by inserting and connecting the terminals to the printed circuit board.

また、ケースの挿入も簡易となるから、組立の
自動化を促進することができる。そして、商品の
特性も安定して確保することができるので、信頼
性を向上させることができる。
Further, since the case can be easily inserted, automation of assembly can be promoted. In addition, since the characteristics of the product can be stably ensured, reliability can be improved.

(ホ) 実施例の説明 以下、この考案の実施例を図面に基づいて詳細
に説明する。
(E) Description of Embodiments Hereinafter, embodiments of this invention will be described in detail based on the drawings.

第5図及び第6図に示すように、1は透過形の
光電スイツチであつて、発光素子2と受光素子3
とを対峙して設け、両素子2,3間に物体等が位
置するとその物体を検知するようになつている。
As shown in FIGS. 5 and 6, 1 is a transmission type photoelectric switch, which includes a light emitting element 2 and a light receiving element 3.
are provided facing each other, and when an object or the like is located between both elements 2 and 3, the object is detected.

この発光素子2及び受光素子3はケース4に収
納されると共に、プリント基板5に接続されてい
る。このケース4は、ほぼ長方形の本体部4aの
上面中央部に2つの収納凸部4b,4bが上方に
突出形成されて成り、両凸部4b,4bの相対向
面には透過窓4c,4cが形成され、かつ凸部4
b間が検出溝部4dとなつている。尚、4eはパ
ネル等への取付孔、4fは裏蓋4gのカシメ用ボ
スである。
The light emitting element 2 and the light receiving element 3 are housed in a case 4 and are connected to a printed circuit board 5. This case 4 has two storage convex portions 4b, 4b formed in the center of the upper surface of a substantially rectangular main body portion 4a, projecting upwardly, and transparent windows 4c, 4c formed on opposing surfaces of both convex portions 4b, 4b. is formed, and the convex portion 4
The area between b is a detection groove portion 4d. In addition, 4e is a mounting hole for a panel etc., and 4f is a boss for caulking the back cover 4g.

前記プリント基板5はケース本体部4aに収納
され、各種電子部品6が実装されると共に、外部
端子7が接続されている。
The printed circuit board 5 is housed in the case main body 4a, various electronic components 6 are mounted thereon, and external terminals 7 are connected.

前記発光素子2及び受光素子3は、素子本体2
a,3aより端子2b,3bが下方に延長されて
構成されている。この素子本体2a,3aは、図
示しないが、リードフレームにチツプがダイボン
デイング及びワイヤボンデイングされると共に、
光透過性のエポキシ樹脂等で被覆されて構成され
ている。この素子本体2a,3aはケース収納凸
部4b内の頂部に設置され、各端子2b,3bの
下端はプリント基板5に挿入接続されている。
The light emitting element 2 and the light receiving element 3 include an element main body 2
Terminals 2b and 3b are configured to extend downward from a and 3a. Although not shown, the element bodies 2a and 3a are formed by die bonding and wire bonding a chip to a lead frame.
It is coated with a light-transmissive epoxy resin or the like. The element bodies 2a, 3a are installed at the top of the case storage convex portion 4b, and the lower ends of the respective terminals 2b, 3b are inserted and connected to the printed circuit board 5.

前記ケース4にはサブケース8が収納されてお
り、このサブケース8は2つのガイド凸部8a,
8aと両凸部8a,8aを下端部で連結する連結
部8bとが樹脂で一体成形されて構成されてい
る。このサブケース8はプリント基板5上に設置
されるようになつており、連結部8bには電子部
品6の収納凹部8cが形成されている。
A sub-case 8 is housed in the case 4, and this sub-case 8 has two guide protrusions 8a,
8a and a connecting portion 8b that connects both convex portions 8a, 8a at their lower ends are integrally molded from resin. This sub-case 8 is designed to be installed on the printed circuit board 5, and a recess 8c for storing the electronic component 6 is formed in the connecting portion 8b.

前記ガイド凸部8aは収納凸部4bに嵌合自在
に形成され、前面上部は先細に傾斜する傾斜ガイ
ド面8dが形成され、下部は収納凸部4bの水平
断面とほぼ同形状に形成されている。このガイド
面8dは収納凸部4bの下端隅角部が接してガイ
ド凸部8aを収納凸部4bに案内する一方、ガイ
ド凸部8aの背面と前面下部とが収納凸部4bに
嵌合して位置決め部となつている。
The guide convex portion 8a is formed to be able to fit into the storage convex portion 4b, and the upper front surface is formed with a tapered inclined guide surface 8d, and the lower portion is formed in approximately the same shape as the horizontal cross section of the storage convex portion 4b. There is. This guide surface 8d is in contact with the lower end corner of the storage projection 4b and guides the guide projection 8a to the storage projection 4b, while the back and front lower portions of the guide projection 8a are fitted into the storage projection 4b. This is the positioning part.

更に、ガイド凸部8aには上面から下面に亘る
端子2b,3bのガイド孔8eが穿設されてい
る。このガイド孔8eは、上端より素子本体2
a,3aが挿入される位置決め部8f、下端に向
つて断面が細くなる傾斜部8g及び端子2b,3
bとほぼ同形断面の嵌挿部8hが順に形成されて
成り、各端子2b,3bの下端が若干突出するよ
うになつている。
Furthermore, a guide hole 8e for the terminals 2b, 3b is formed in the guide protrusion 8a from the upper surface to the lower surface. This guide hole 8e is inserted into the element body 2 from the upper end.
a, a positioning part 8f into which 3a is inserted, an inclined part 8g whose cross section becomes narrower toward the lower end, and terminals 2b, 3.
Fitting portions 8h having a cross section substantially the same as that of the terminals b are formed in sequence, and the lower ends of the terminals 2b and 3b protrude slightly.

次に、この光電センサ1の組立動作について説
明する。
Next, the assembly operation of this photoelectric sensor 1 will be explained.

先ず、発光素子2及び受光素子3の他、ケース
4、プリント基板5及びサブケース8が別個に形
成される。
First, in addition to the light emitting element 2 and the light receiving element 3, a case 4, a printed circuit board 5, and a subcase 8 are formed separately.

この発光及び受光素子2,3の各端子2b,3
bをサブケース8のガイド孔8eに挿入し、下端
部を若干突出する。その際、素子本体2a,3b
は位置決め部8fに嵌合する。
Each terminal 2b, 3 of the light emitting and light receiving elements 2, 3
b into the guide hole 8e of the sub-case 8, and the lower end protrudes slightly. At that time, the element bodies 2a, 3b
fits into the positioning portion 8f.

そして、このサブケース8をプリント基板5上
に設置すると同時に、突出した端子2b,3bの
下端をプリント基板5に挿入し、裏面よりハンダ
付けされる。これによつて、両素子2,3は高さ
が一致して対面し、両者の光軸が合致する。
Then, at the same time as this sub-case 8 is installed on the printed circuit board 5, the lower ends of the protruding terminals 2b and 3b are inserted into the printed circuit board 5 and soldered from the back side. As a result, both elements 2 and 3 face each other with the same height, and their optical axes match.

続いて、このプリント基板5をケース4に挿入
すると、収納凸部4bの下端隅角部がガイド面8
dに接してガイド凸部8aが収納凸部4bに案内
される。その際、素子本体2a,3bは位置決め
部8fで位置決めされているので、傾き等の発生
が防止される。
Subsequently, when this printed circuit board 5 is inserted into the case 4, the lower end corner of the storage convex portion 4b is aligned with the guide surface 8.
The guide convex portion 8a is guided to the storage convex portion 4b in contact with d. At this time, since the element bodies 2a and 3b are positioned by the positioning portion 8f, the occurrence of tilting or the like is prevented.

そして、ケース4にプリント基板5を完全に挿
入すると、ガイド凸部8aが収納凸部4bに嵌合
して発光素子2と受光素子3とが収納凸部4b内
の所定位置に設置される。
When the printed circuit board 5 is completely inserted into the case 4, the guide convex portion 8a fits into the housing convex portion 4b, and the light emitting element 2 and the light receiving element 3 are installed at predetermined positions within the housing convex portion 4b.

最後に、裏蓋4fが取付けられて組立てが完了
する。
Finally, the back cover 4f is attached to complete the assembly.

尚、この実施例は発光素子2と受光素子3とを
対峙させた透過形光電センサ1について説明した
が、両素子2,3を共に前方に向けて並設する反
射形光電センサにこの考案を適用してもよい。
In this embodiment, a transmission type photoelectric sensor 1 was explained in which a light emitting element 2 and a light receiving element 3 were placed facing each other. However, this invention can be applied to a reflection type photoelectric sensor in which both elements 2 and 3 are arranged side by side with both elements 2 and 3 facing forward. May be applied.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の光電センサの縦断面図、第2図
乃至第4図は従来の発光素子及び受光素子の設置
状態を示し、第2図及び第3図は両素子の概略側
面図、第4図は同概略平面図、第5図及び第6図
はこの考案の実施例を示し、第5図は光電センサ
の縦断面図、第6図は一部断面にして示す同分解
側面図である。 1……光電センサ、2……発光素子、3……受
光素子、2a,3a……素子本体、2b,3b…
…端子、4……ケース、4a……本体部、4b…
…収納凸部、5……プリント基板、8……サブケ
ース、8a……ガイド凸部、8d……ガイド面、
8e……ガイド孔。
FIG. 1 is a vertical cross-sectional view of a conventional photoelectric sensor, FIGS. 2 to 4 show the installation state of a conventional light emitting element and light receiving element, and FIGS. 2 and 3 are schematic side views of both elements, and FIGS. 4 is a schematic plan view of the same, FIGS. 5 and 6 show an embodiment of the invention, FIG. 5 is a longitudinal sectional view of the photoelectric sensor, and FIG. 6 is an exploded side view of the photoelectric sensor partially shown in section. be. 1... Photoelectric sensor, 2... Light emitting element, 3... Light receiving element, 2a, 3a... Element body, 2b, 3b...
...Terminal, 4...Case, 4a...Main body, 4b...
...Storage protrusion, 5...Printed circuit board, 8...Sub case, 8a...Guide protrusion, 8d...Guide surface,
8e...Guide hole.

Claims (1)

【実用新案登録請求の範囲】 (1) ケース内に発光素子並びに受光素子及びプリ
ント基板が収納され、この発光素子及び受光素
子が素子本体より端子を延長して構成され、こ
の素子本体が前記ケースの収納凸部に設置され
る一方、各端子が前記プリント基板に接続され
て成る光電センサにおいて、 前記ケース内にサブケースがプリント基板に
設置して設けられ、このサブケースに前記収納
凸部に嵌合自在なガイド凸部が形成され、この
ガイド凸部上面には、前記発光素子及び受光素
子の素子本体を位置決めする位置決め部が形成
されると共に、前記発光素子及び受光素子の端
子が貫通するガイド孔がガイド凸部の上面から
下面に亘つて形成され、前記発光素子及び受光
素子を所定箇所に位置させることを特徴とする
光電センサ。 (2) 前記ガイド凸部は、傾斜ガイド面が形成され
ており、このガイド面にケースにおける収納凸
部の隅角部が接する実用新案登録請求の範囲第
1項記載の光電センサ。
[Claims for Utility Model Registration] (1) A light-emitting element, a light-receiving element, and a printed circuit board are housed in a case, and the light-emitting element and light-receiving element are configured by extending terminals from the element body, and the element body is connected to the case. In the photoelectric sensor, each terminal is connected to the printed circuit board, and a sub-case is installed in the printed circuit board within the case, and the sub-case is installed in the storage convex part. A guide convex part that can be freely fitted is formed, and a positioning part for positioning the element bodies of the light emitting element and the light receiving element is formed on the upper surface of the guide convex part, and the terminals of the light emitting element and the light receiving element pass through. A photoelectric sensor characterized in that a guide hole is formed from the upper surface to the lower surface of the guide convex portion, and the light emitting element and the light receiving element are positioned at predetermined positions. (2) The photoelectric sensor according to claim 1, wherein the guide convex portion is formed with an inclined guide surface, and a corner portion of the storage convex portion of the case is in contact with the guide surface.
JP20183283U 1983-12-28 1983-12-28 photoelectric sensor Granted JPS60109069U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20183283U JPS60109069U (en) 1983-12-28 1983-12-28 photoelectric sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20183283U JPS60109069U (en) 1983-12-28 1983-12-28 photoelectric sensor

Publications (2)

Publication Number Publication Date
JPS60109069U JPS60109069U (en) 1985-07-24
JPH025545Y2 true JPH025545Y2 (en) 1990-02-09

Family

ID=30763981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20183283U Granted JPS60109069U (en) 1983-12-28 1983-12-28 photoelectric sensor

Country Status (1)

Country Link
JP (1) JPS60109069U (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0541425Y2 (en) * 1986-01-10 1993-10-20
JP4664531B2 (en) * 2001-06-06 2011-04-06 株式会社東芝 Manufacturing method of optical coupling device
JP5177100B2 (en) * 2009-09-10 2013-04-03 パナソニック株式会社 Equipment transparency detector

Also Published As

Publication number Publication date
JPS60109069U (en) 1985-07-24

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