JP2538026Y2 - Front and back connection structure of double-sided board - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for connecting circuit wiring between the front and back surfaces of a double-sided substrate having circuit wiring formed on both surfaces in order to improve the mounting density of electronic components.

[0002]

FIG. 4 shows a typical prior art wiring board 1.
It is a perspective view of. The wiring board 1 is provided on both surfaces 2 of the board body 2.
Circuit wirings 3, 4; 5, 6 are formed by printing or the like on a and 2b, respectively. Circuit wiring 3, 5
Are connected to lands 7 and 8, respectively, and terminals and the like of electronic components are soldered to the lands 7 and 8.

On the other hand, circuit wirings 4 and 6 are provided for connecting one surface 2a and the other surface 2b of the substrate body 2, and these circuit wirings 4 and 6 are formed on the outer periphery of the through hole 9. Lands 11 and 12 respectively. The circuit wirings 3 to 6 and the lands 7, 8; 1
1 and 12 are formed by copper etching or the like. The connection conductor 13 is formed on the inner peripheral surface of the through hole 9 by copper plating or the like. The lands 11 and 12 are electrically connected by the connection conductor 13, and the circuit wirings 4 and 6 are thus electrically connected.

FIG. 5 is a perspective view of another prior art wiring board 21, and portions corresponding to the above-described wiring board 1 are denoted by the same reference numerals. In this wiring board 21, circuit wirings 4 and 6 for connecting one surface 22a and the other surface 22b of the substrate body 22 are connected to lands 23 and 24, respectively. The land 23 is formed on the outer periphery of the insertion hole 25, and the land 24 is formed on the outer periphery of the insertion hole 26. The insertion holes 25 and 26 are arranged close to each other. A substantially U-shaped connecting wire 27 is inserted into the insertion holes 25 and 26, and the connecting wire 27 is soldered to the lands 23 and 24, thereby electrically connecting the circuit wires 4 and 6. Can be connected.

[0005]

In the above-described wiring board 1, the through-hole 9 is drilled one by one from the one surface 2a, for example, by a numerically controlled drilling machine, and further from the other surface 2b. In order to prevent burrs and the like, a drill is again formed in contact with the drill. Therefore, in order to form one through hole 9, two steps of drilling work from both surfaces 2a and 2b are necessary,
When the number of through holes 9 increases, the work process becomes drastically complicated. In addition, plating for forming the connection conductor 13 is also required. In the wiring board 1 having the through holes 9 formed as described above, the cost increases to about twice as compared with the wiring board in which the through holes 9 are not formed.

In the wiring board 21, the soldering of the connecting wires 27 is a manual operation. Therefore, when the number of connecting points using the connecting wires 27 increases, the man-hour is increased and the operator forgets the soldering. Failure may occur.

An object of the present invention is to provide a front-back connection structure of a double-sided board which can reduce man-hours and reduce cost.

[0008]

SUMMARY OF THE INVENTION According to the present invention, the one circuit wiring and the other circuit wiring of a double-sided substrate having one circuit wiring formed on one surface and the other circuit wiring formed on the other surface are mutually connected. A first connector mounted on the one surface and having a terminal connected to one circuit wiring by a reflow method, and a first connector mounted on the one surface and having the terminal inserted through the double-sided board and connected to the other circuit wiring. A double-sided board front / back connection structure, comprising: a second connector connected by a dipping method; and a conductor for electrically connecting the first and second connectors to each other.

[0009]

According to the present invention, in order to electrically connect one circuit wiring formed on one surface of the double-sided board to the other circuit wiring formed on the other surface, a first connector is provided on the one surface. And the second connector are mounted. The first connector has its terminal connected to the one circuit wiring by soldering by a reflow method. The second connector has its terminals inserted through the double-sided board and soldered to the other circuit wiring by a dip method.

[0010] These first and second connectors are electrically connected to each other by a conductor such as a flexible printed circuit board or a flat cable. The terminal hole for the second connector can be formed simultaneously with the terminal hole for another electronic component, and the first and second connectors can be collectively formed with the other electronic components by the reflow method and the dip method. Then, soldering is performed.

Therefore, the double-sided substrate can be formed at low cost without special processing and without manual work.

[0012]

FIG. 1 is a perspective view of a wiring board 31 according to one embodiment of the present invention. On one surface 32a of the substrate main body 32 of the wiring substrate 31, a plurality of circuit wirings 33 electrically connected to electronic components 39 such as an integrated circuit are formed and connected to the other surface 32b of the substrate main body 32. To do
One or more circuit wirings 34 are formed. Similarly, a circuit wiring 35 connected to the electronic component 40 and the like is formed on the other surface 32b, and a circuit wiring 36 for connection to the one surface 32a is formed.

The circuit wiring 33 is connected to a land 37 to which a terminal 39a of an electronic component 39 mounted on the one surface 32a is soldered and connected by a reflow method. The circuit wiring 35 is the land 3
The terminal 40a of the electronic component 40 mounted on the one surface 32a side and having the terminal 40a inserted through the terminal hole 41 and protruding toward the other surface 32b side is connected to the land 38 by a dip. Are connected by soldering.

On the other hand, each of the circuit wirings 34 has a land 44.
Each terminal 51a of the first connector 51 is connected to each land 44 together with the terminal 39a of the electronic component 39 by a reflow method.
(See FIG. 2) and connected by soldering. Each of the circuit wirings 36 is connected to a land 46, on which each terminal 61a of the second connector 61 is soldered together with the terminal 40a of the electronic component 40 by a dip method. Connected. The second mounted on one surface 32a of the substrate body 32
As in the case of the terminal hole 41, each terminal 61a of the connector 61 is inserted through a terminal hole 65 formed between both surfaces 32a and 32b of the board main body 32, and as described above, each terminal 46a It is soldered by solder 66 (see FIG. 3).

In the wiring board 31 formed as described above, first, metal plating is performed on both surfaces 32a and 32b of the board main body 32, and then the circuit wirings 33, 34;
An etching process for 36 and lands 37, 44; 38, 46 is performed. Subsequently, the terminal holes 41 and 65 are formed by a numerical control drilling machine or the like, and thus the wiring board 31 is completed.

As shown in FIG. 2, the first connector 51 is made of an electrically insulating material, and has a connector body 53 having a fitting recess 52, and is implanted in the connector body 53. And a resilient contact member 51b made of an integral conductive material. Similarly, as shown in FIG. 3, the second connector 61 is made of an electrically insulating material, and is integrally formed with a connector main body 63 having a fitting recess 62 and each of the terminals 61a by a conductive material. And a resilient contact member 61b.

A fitting projection 54 extends from a surface 53a of the connector body 53 on the board body 32 side. The fitting projection 54 is formed in a fitting hole 32c formed in the board body 32.
Fit inside. Thus, the first connector 51 is positioned at the time of mounting, and it is possible to prevent an excessive stress from being applied to the terminal 51a at the time of attaching and detaching the flexible board 71 described later. The second connector 6
The positioning of 1 is performed by fitting the terminal 61a into the terminal hole 65.

The first and second connectors 51 and 61 thus configured have a flexible substrate 71 as a conductor.
Are inserted into both ends 71a, 71b of the. The flexible substrate 71 is formed by forming a conductive pattern 73 corresponding to each of the contact members 51b and 61b on a flexible substrate main body 72, and further covering the conductive pattern 73 with a coating layer 74. The vicinity of the both ends 71a and 71b of the conductive pattern 73 is exposed from the coating layer 74, and the exposed portion 73a is connected to the contact members 51b and 6b.
By contacting the contact member 1b, the contact members 51b and 61b are electrically connected to each other via the conductive pattern 73.

The connectors 51 and 61 incorporate gripping members 57 and 67, respectively.
7 is the both ends 71a and 71b of the flexible substrate 71,
It is gripped by an operator when attaching and detaching to and from the connectors 51 and 61.

Guide members 58, 68 are formed integrally with the grip members 57, 67.
8, 68 fit into the fitting recesses 52, 62. One surfaces 58a, 68a of the guide members 58, 68 are formed parallel to the substrate body 72, and the other surfaces 58b, 6
8b becomes closer to the front end of the flexible substrate 71,
It is formed so as to separate from the substrate body 72. Therefore, the ends 71a and 71b of the flexible board 71 are fitted into the connectors 51 and 61, respectively,
7 and 67 are moved in the direction of the fitting recesses 52 and 62, the other surfaces 58b and 68b of the guide members 58 and 68 are moved.
Accordingly, the contact members 51b and 61b are bent and displaced toward the conductive pattern 73 against the resilience thereof, and thus the conductive pattern 73 and the contact members 51 and 61 are reliably electrically connected.

As described above, in the wiring board 31 according to the present invention, the special processing such as the formation of the through hole 9 as described in the section of the prior art is not performed, and the connection line 27 is not formed.
It is not necessary to perform a complicated operation such as soldering the first and second connectors 5 together with the electronic components 39 and 40.
1 and 61 are collectively soldered to form the circuit wiring 34 on one surface 32a and the circuit wiring 3 on the other surface 32b.
6 can be electrically connected to the first surface 32.
The wiring board 31 can be manufactured at low cost even when the number of connection points between the “a” and the other surface 32b is large.

The one surface 32a and the other surface 32
The connection point with b can be provided at an arbitrary position, and the degree of freedom in designing the wiring board 31 can be improved.

The first and second connectors 51, 61
The spaces may be connected by another conductor such as a so-called flat cable or a wire harness.

[0024]

As described above, according to the present invention, the first and second connectors are mounted on one surface of the double-sided board, and the one circuit wiring on the one surface and the terminal of the first connector are soldered by a reflow method. Also, the other circuit wiring on the other surface and the terminal of the second connector inserted through the double-sided board are connected by soldering by a dip method, and the first and second connectors are connected by a conductor. , Second
The terminal hole for the connector can be formed simultaneously with the terminal hole of another electronic component, and the first and second connectors can be soldered together with the other electronic component.

Therefore, without any special processing,
Further, the double-sided board can be formed at low cost without manual work.

[Brief description of the drawings]

FIG. 1 is a perspective view of a wiring board 31 according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of the vicinity of a first connector 51.

FIG. 3 is a cross-sectional view of the vicinity of a second connector 61.

FIG. 4 is a perspective view of a typical prior art wiring board 1;

FIG. 5 is a perspective view of another conventional wiring board 21.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 31 Wiring board 32 Board main body 33-36 Circuit wiring 37, 38, 44, 46 Land 39, 40 Electronic components 51 First connector 61 Second connector 71 Flexible board

Claims (1)

(57) [Scope of request for utility model registration] 1. A double-sided substrate having one circuit wiring formed on one surface and the other circuit wiring formed on the other surface, wherein the one circuit wiring and the other circuit wiring are electrically connected to each other. A first connector mounted on one surface and having a terminal connected to one circuit wiring by a reflow method; and a second connector mounted on the one surface and having a terminal inserted through the double-sided board and connected to the other circuit wiring by a dip method. A front-back connection structure for a double-sided board, comprising: a connector; and a conductor that electrically connects the first and second connectors to each other.