JP2535159B2 - Method for exploring radiation absorbers buried in structures - Google Patents
Method for exploring radiation absorbers buried in structuresInfo
- Publication number
- JP2535159B2 JP2535159B2 JP61307988A JP30798886A JP2535159B2 JP 2535159 B2 JP2535159 B2 JP 2535159B2 JP 61307988 A JP61307988 A JP 61307988A JP 30798886 A JP30798886 A JP 30798886A JP 2535159 B2 JP2535159 B2 JP 2535159B2
- Authority
- JP
- Japan
- Prior art keywords
- radiation
- buried
- image
- irradiation
- absorber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Geophysics And Detection Of Objects (AREA)
Description
【発明の詳細な説明】 ＜産業上の利用分野＞ 本発明はコンクリート製の構造物内に埋設された各種
配管や鉄筋などの放射線吸収体（以下「埋設物」とい
う）を、Ｘ線などの放射線を使って埋設物の径や埋設位
置を探査する、埋設物の探査技術に関するものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial field of application> The present invention relates to a radiation absorber (hereinafter referred to as “embedded object”) such as various pipes and rebars embedded in a concrete structure, such as X-ray. The present invention relates to a technique for exploring buried objects, in which the diameter and location of buried objects are searched using radiation.
＜従来の技術＞ 既設コンクリート建築物の耐震強度の保安検査や構築
物の改造に際して、コンクリート製の壁体や床あるいは
柱の内部に埋設されている配管や鉄筋の正確な埋設位置
を事前に把握しておくことは非常に重要なことである。<Prior art> When conducting a safety inspection for seismic resistance of an existing concrete building or remodeling a structure, it is necessary to know in advance the exact location of pipes and reinforcing bars buried inside concrete walls, floors, or columns. It is very important to keep in mind.
このような要求に基づき、一般に行われている探査方
法としては、埋設物の埋設予定場所を破壊して埋設物を
直接目視する方法がとられているが、破壊作業および後
処理に要する労力や時間の問題、あるいは埋設物の露出
位置の正確性の点に問題があるため、現在では構造物を
破壊しないで埋設物の埋設位置を探査する技術が提案さ
れている。Based on such demands, as a commonly used exploration method, a method of destroying the planned buried location of the buried object and directly visually observing the buried object is taken. Since there is a problem of time or accuracy of the exposed position of the buried object, a technique for exploring the buried position of the buried object without destroying the structure is currently proposed.
この非破壊による探査技術は、構造物の一面にフィル
ムを配置し、構造物の反対面から放射線を照射して埋設
物を撮影し、撮影した映像を解析して埋設物の埋設位置
を求めるものである。In this non-destructive exploration technology, a film is placed on one surface of the structure, radiation is irradiated from the opposite surface of the structure to photograph the buried object, and the captured image is analyzed to determine the buried position of the buried object. Is.
＜本発明が解決しようとする問題点＞ 撮影から埋設物の埋設位置を得るまでに要する現像設
備までの移動時間、現像時間および解析時間を合計する
とどうしても一定時間がかかる。<Problems to be Solved by the Present Invention> It takes a certain amount of time to sum up the moving time to the developing equipment, the developing time, and the analyzing time required from the photographing to obtaining the buried position of the buried object.
そのため、埋設位置のデータを瞬時に得たいという現
場の要求を十分に満足させることができない。Therefore, it is not possible to sufficiently satisfy the on-site demand for instantaneously obtaining the data of the buried position.
＜本発明の目的＞ 本発明は、ほぼリアルタイムで埋設物に関するデータ
が得られる、構造物に埋設された放射線吸収体の探査技
術を提供することを目的とする。<Purpose of the present invention> An object of the present invention is to provide a technique for exploring a radiation absorber embedded in a structure, in which data on the embedded object can be obtained in almost real time.
＜本発明の構成＞ 以下図面を参照しながら本発明に係る一実施例につい
て説明する。<Structure of the Present Invention> An embodiment of the present invention will be described below with reference to the drawings.
＜イ＞探査用各種設備とその配置 第１図に構造物１の断面を示す。<a> Various exploration facilities and their layout Fig. 1 shows a cross section of the structure 1.
図中２は鉄筋などの埋設物である。 Reference numeral 2 in the figure denotes an embedded object such as a reinforcing bar.
［放射線照射設備］ この構造物１の一面には、線源31を構造物１の表面か
ら一定距離だけ離れた位置に放射線の照射設備３を配備
する。[Radiation Irradiation Facility] On one surface of the structure 1, the radiation irradiation facility 3 is arranged at a position where the radiation source 31 is separated from the surface of the structure 1 by a predetermined distance.
照射設備３は、構造物１の表面と平行に敷設したレー
ルなどに載置して横移動できるよう構成する。The irradiation equipment 3 is mounted on a rail or the like laid parallel to the surface of the structure 1 so that it can move laterally.
線源31から照射する放射線としては、例えばＸ線、γ
線、中性子線を使用できる。Examples of the radiation emitted from the radiation source 31 include X-rays, γ
Rays and neutron rays can be used.
さらに、構造物１の表面には、線源位置を表示するた
めの標識32と、この標識32の両側に位置し、構造物１の
厚さを求めるための標識33とをそれぞれ配置する。Further, on the surface of the structure 1, a mark 32 for displaying the position of the radiation source and marks 33 on both sides of the mark 32 for determining the thickness of the structure 1 are arranged.
これらの標識32、33は放射線を透過しない鉛などで形
成し、放射線照射設備３の前部の所定の位置に取り付け
ておく。These signs 32 and 33 are made of lead or the like that does not transmit radiation, and are attached to predetermined positions in front of the radiation irradiation equipment 3.
［受象設備］ 他方、埋設物１の反対面には探査範囲にわたって放射
線蛍光増幅装置４を配備する。[Receiving Facility] On the other hand, a radiation fluorescence amplification device 4 is provided on the opposite surface of the buried object 1 over the exploration range.
放射線蛍光増幅装置４は、蛍光板41と光倍増管および
カメラからなる。The radiation fluorescence amplification device 4 includes a fluorescent plate 41, a photomultiplier tube, and a camera.
放射線蛍光倍増装置４は、線源31から照射された放射
線によって、蛍光板41上に写し出された構造物１内の埋
設物２や各標識32、33の透過像を、放射線蛍光倍増装置
５に内蔵の光増幅管によって光増幅した後、カメラを通
してアナログ信号に変換する構造である。The radiation fluorescence doubling device 4 has a transmission fluorescence image of the buried object 2 in the structure 1 and the markers 32 and 33 projected on the phosphor plate 41 by the radiation emitted from the radiation source 31 in the radiation fluorescence doubling device 5. After being optically amplified by the optical amplifying tube, the structure is such that it is converted into an analog signal through the camera.
［解析設備］ 放射線蛍光増幅装置４には画像処理装置５を結線す
る。[Analysis Equipment] The image processing apparatus 5 is connected to the radiation fluorescence amplification apparatus 4.
また、画像処理装置５にはモニター51とビデオレコー
ダー52およびコンピュータ６をそれぞれ結線する。A monitor 51, a video recorder 52, and a computer 6 are connected to the image processing device 5, respectively.
画像処理装置５は、放射線蛍光像倍装置４からのアナ
ログ信号をモニター51に表示するためにデジタル変換す
るための装置であり、またビデオレコーダー52は画像信
号をアナログ信号のまま記憶して再出力に供するための
装置である。The image processing device 5 is a device for converting the analog signal from the radiation fluorescence image multiplying device 4 into a digital signal for displaying on the monitor 51, and the video recorder 52 stores the image signal as an analog signal and re-outputs it. It is a device for use in.
また、コンピュータ６には、解析結果表示用モニター
61とプリンター62および外部記憶装置７をそれぞれ結線
する。In addition, the computer 6 has a monitor for displaying analysis results.
61, the printer 62, and the external storage device 7 are respectively connected.
コンピュータ６は、後述するような計算式を入力して
おき、この計算式に基づいて所定の測定値を算出するこ
とを目的とした装置である。The computer 6 is a device whose purpose is to input a calculation formula to be described later and to calculate a predetermined measurement value based on this calculation formula.
また、コンピュータ６はモニター51の画像を座標化し
て得られるデータを計測値としてコンピュータ６に入力
できるよう構成する。Further, the computer 6 is configured so that data obtained by converting the image of the monitor 51 into coordinates can be input to the computer 6 as a measurement value.
＜ロ＞解析システム（第１、２図） 構造物１内の埋設物２および標識32、33は、線源31よ
り照射された放射線により、放射線蛍光増幅装置４の蛍
光板41上に透過像として写し出される。<B> Analysis system (FIGS. 1 and 2) The buried object 2 and the markers 32 and 33 in the structure 1 are transmitted as a transmission image on the fluorescent plate 41 of the radiation fluorescence amplification device 4 by the radiation emitted from the radiation source 31. Projected.
これらの透過像は、放射線蛍光増幅装置４内で増幅さ
れて画像処理装置５に送られる。These transmission images are amplified in the radiation fluorescence amplification device 4 and sent to the image processing device 5.
モニター51には画像処理装置５の信号を基に埋設物２
と各標識32、33の透過像が映し出される。Based on the signal from the image processing device 5, the monitor 51 is provided with a buried object 2
And a transmission image of each sign 32, 33 is displayed.
モニター51を観察しながら、構造物１の表面に対して
照射設備３を平行移動させ、適当な位置で数回にわたっ
て画面固定処理（フリージング）をして静止画面を作
る。While observing the monitor 51, the irradiation equipment 3 is moved in parallel with respect to the surface of the structure 1, and a fixed screen (freezing) is performed several times at an appropriate position to create a still screen.
画面固定処理をする位置は少なくとも次の三点で行う
ものとする。（第２図右側縦列のモニター51像を参照） 標識32の透過像が埋設物１の透過像の中心に位置する
一地点 標識33の透過像が埋設物２の透過像の左右に位置する
任意の各一地点。At least the following three points should be set for the screen fixing process. (Refer to the monitor 51 image in the right column of FIG. 2) One point where the transmission image of the sign 32 is located at the center of the transmission image of the buried object 1 The transmission image of the sign 33 is located on the left and right of the transmission image of the buried object 2 Each one point.
次にモニター51上にこれらの停止画面を再表示させ、
コンピュータ６を操作してモニター51の画面上で埋設物
２および各標識32、33の透過像の位置座標を読み取ら
せ、外部記憶装置７に記憶させる。Then redisplay these stop screens on monitor 51,
The computer 6 is operated to read the position coordinates of the transmission images of the embedded object 2 and the markers 32, 33 on the screen of the monitor 51, and store them in the external storage device 7.
なお、第２図中のモニター51に表示された黒丸印は標
識32の透過像であり、白丸印は標識33の透過像である。The black circles displayed on the monitor 51 in FIG. 2 are transmission images of the marker 32, and the white circles are transmission images of the marker 33.
つづいて、読み取りデータおよびあらかじめ入力した
諸定数を基にコンピュータ６が演算を行い、演算結果を
プリンター62またはモニター61に表示する。Subsequently, the computer 6 performs a calculation based on the read data and various constants input in advance, and the calculation result is displayed on the printer 62 or the monitor 61.
また、これらの解析結果は必要に応じて外部記憶装置
７に記憶させる。Further, these analysis results are stored in the external storage device 7 as needed.
また、モニター51に映し出される予定の画像をデジタ
ル化しないでビデオレコーダー52に録画して、後に解析
または検討することも可能である。It is also possible to record the image to be displayed on the monitor 51 in the video recorder 52 without digitizing it, and analyze or examine it later.
＜ハ＞解析計算式 モニター51に映し出される各点は次のように座標化さ
れてコンピュータ６に読み取られて記憶される。<C> Analytical Calculation Formula Each point displayed on the monitor 51 is coordinated as follows and read and stored in the computer 6.
a1（x1、y1）、a2（x2、y1）、… a8（x8、y1）、a0（x0、y1） ［入力データ］ F:線源と標識間の距離。（定数） Ga:標識と構造物表面の距離。（定数） Gf:蛍光板から構造物表面間の距離。（定数） L:厚さ測定用の標識間の距離。（定数） d:埋設物の透過像の直径。a 1 (x 1 , y 1 ), a 2 (x 2 , y 1 ), ... a 8 (x 8 , y 1 ), a 0 (x 0 , y 1 ) [Input data] F: Source and marker The distance between. (Constant) Ga: Distance between the sign and the structure surface. (Constant) Gf: Distance from the fluorescent plate to the surface of the structure. (Constant) L: Distance between markers for thickness measurement. (Constant) d: Diameter of the transmission image of the buried object.
（ｄ＝|x5−x4|） S:線源移動によって生じる埋設物の透過像の中心移動距
離。(D = | x 5 −x 4 |) S: The center movement distance of the transmission image of the buried object caused by the movement of the radiation source.
（Ｓ＝|x6−x3|） l:厚さ測定用標識の透過像の標点間の距離。(S = | x 6 −x 3 |) l: The distance between the reference points of the transmission image of the thickness measurement marker.
（ｌ＝|x8−x2|） P:線源の移動距離。（Ｐ＝|x7−x1|） ［出力データ］ X:構造物表面から埋設物の中心までの距離または深さ。(L = | x 8 −x 2 |) P: Moving distance of the radiation source. (P = | x 7 −x 1 |) [Output data] X: Distance or depth from the surface of the structure to the center of the buried object.
D:埋設物の直径。D: Diameter of the buried object.
T:構造物の厚さ。T: Thickness of structure.
［計算式］ ＜本発明の効果＞ 本発明は以上説明したようになるから、次のような効
果を得ることができる。[a formula] <Effects of the Present Invention> Since the present invention is as described above, the following effects can be obtained.
（イ）従来のように現像設備は不要であり、ほとんど測
定と同時に正確な埋設物の径や埋設位置を求めることが
できる。(A) Unlike conventional methods, no developing equipment is required, and it is possible to obtain accurate diameters and positions of buried objects almost simultaneously with measurement.
（ロ）被測定物である構造物の側面上において照射設備
と放射線蛍光増幅装置の移動が簡単であるから、広範囲
にわたる測定が可能となる。(B) Since it is easy to move the irradiation equipment and the radiation fluorescence amplification device on the side surface of the structure to be measured, it is possible to perform measurement over a wide range.
（ハ）経済的に測定作業が行えるので、測定コストを低
減できる。(C) Since the measurement work can be performed economically, the measurement cost can be reduced.
第１図：本発明に係る一実施例の説明図 第２図：解析方法の説明図 FIG. 1: Explanatory diagram of one embodiment according to the present invention FIG. 2: Explanatory diagram of analysis method
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭60−104279（ＪＰ，Ａ) 特開 昭61−193056（ＪＰ，Ａ) 特開 昭61−288187（ＪＰ，Ａ) 特開 昭60−165945（ＪＰ，Ａ) 特公 昭61−20300（ＪＰ，Ｂ２) ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-60-104279 (JP, A) JP-A-61-193056 (JP, A) JP-A-61-288187 (JP, A) JP-A-60- 165945 (JP, A) Japanese Patent Sho 61-20300 (JP, B2)
Claims (1)
法において、 構造物の一面には線源を内蔵した放射線照射設備を配置
し、 放射線照射設備に直線上に少なくとも３個の標識を固定
して配列し、 構造物の他面には放射線蛍光増幅装置を配置し、 放射線照射設備を構造物に対して平行で、標識が配列さ
れた直線に沿う方向に移動させ、 放射線照射設備の線源から放射線を少なくとも３回照射
し、 その中の１回の照射では、中央の標識の像が、埋設され
た放射線吸収体の像の中心に重なるように照射設備を移
動させ、 他の照射は、上記１回の照射位置の両側の位置で行い、 標識と埋設された放射線吸収体の透過像を放射線蛍光増
幅装置に映し出して画面固定処理を行い、 これら座標に関するデータを解析して、構造物に埋設さ
れている放射線吸収体の位置および直径を求めることを
特徴とする、 構造物に埋設された放射線吸収体の探査方法。1. A method for exploring a radiation absorber embedded in a structure, wherein a radiation irradiation equipment having a built-in radiation source is arranged on one surface of the structure, and at least three markers are linearly arranged on the radiation irradiation equipment. They are fixed and arranged, and a radiation fluorescence amplification device is placed on the other side of the structure, and the radiation irradiation equipment is moved in a direction parallel to the structure and along the straight line on which the markers are arranged. Radiation is irradiated from the radiation source at least three times, and in one irradiation, the irradiation equipment is moved so that the image of the central marker overlaps with the center of the image of the buried radiation absorber, and another irradiation is performed. Is performed at positions on both sides of the above-mentioned single irradiation position, the transmission image of the marker and the buried radiation absorber is displayed on the radiation fluorescence amplification device, and screen fixing processing is performed. Buried in a thing And obtaining the position and diameter of the ray absorber, exploration method of the radiation absorber is embedded in the structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61307988A JP2535159B2 (en) | 1986-12-25 | 1986-12-25 | Method for exploring radiation absorbers buried in structures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61307988A JP2535159B2 (en) | 1986-12-25 | 1986-12-25 | Method for exploring radiation absorbers buried in structures |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63163188A JPS63163188A (en) | 1988-07-06 |
| JP2535159B2 true JP2535159B2 (en) | 1996-09-18 |
Family
ID=17975552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61307988A Expired - Fee Related JP2535159B2 (en) | 1986-12-25 | 1986-12-25 | Method for exploring radiation absorbers buried in structures |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2535159B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4729029B2 (en) * | 2007-11-05 | 2011-07-20 | 株式会社ヤナギヤ | Skewering device |
| TWI383147B (en) * | 2009-01-17 | 2013-01-21 | China Steel Corp | Determination of Internal Defects of Concrete Test Specimens |
| CN111561886B (en) * | 2020-06-15 | 2021-09-03 | 江西润洋工程检测有限公司 | Building floor thickness detector |
| WO2023215527A2 (en) * | 2022-05-04 | 2023-11-09 | Michael George Butler | Quickly-deployable automated rapid-slip-form concrete placement system |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60104279A (en) * | 1983-11-11 | 1985-06-08 | Tokyu Constr Co Ltd | Position measuring data processing method of buried object in structure |
| JPS6120300A (en) * | 1984-07-09 | 1986-01-29 | Hitachi Ltd | Semiconductor memory having defect remedying circuit |
| JPS60165945A (en) * | 1984-02-10 | 1985-08-29 | 株式会社日立製作所 | Image processing system |
| JPS6161086A (en) * | 1984-09-03 | 1986-03-28 | Tokyu Constr Co Ltd | Probing method for radiation absorbing body in structure |
| JPS61193056A (en) * | 1985-02-21 | 1986-08-27 | Hitachi Medical Corp | X-ray inspecting device for luggage |
| JPS61288187A (en) * | 1985-06-14 | 1986-12-18 | Nitsukouken Service Kk | Method for radiographic measurement of structure |
-
1986
- 1986-12-25 JP JP61307988A patent/JP2535159B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63163188A (en) | 1988-07-06 |
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| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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| LAPS | Cancellation because of no payment of annual fees |