JP2534833B2 - Method for separating package of IC and die thereof - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention has a package body of a plurality of ICs formed by resin-sealing a plurality of semiconductor chips mounted vertically and horizontally on a lead frame, and a resin member for connecting the package bodies. In a resin-sealed structure, the resin member is separated to separate into individual package bodies I
The present invention relates to a method for separating a package body of C and its mold.

[0002]

2. Description of the Related Art Conventionally, a semiconductor chip mounted on a lead frame has been resin-sealed by a resin mold. Further, in the resin encapsulation by this resin mold die, a plurality of semiconductor chips are simultaneously encapsuled with resin instead of one semiconductor chip. In this way, a large number of semiconductor chips are separated from the resin-sealed structure of the lead frame, which is resin-sealed, into individual package bodies, and resin burrs of the separated package bodies are removed or lead leads are bent to complete the IC. Was.

In recent years, as one of the developed IC packages, SOP (Small Out-line Pack) is used.
There is an age) type package. The mold for molding this package has a large number of cavities for molding the package that are formed side by side on the mold surface.Each cavity is provided with a gate, which is a gate for injecting molten resin, and a runner, which is a runner. Are connected. For this reason, in the resin-sealed structure after resin sealing, the resin members molded by the gates and the runners between the gates and the package body are alternately connected to each other in a string of beads.

In order to separate the resin-sealed structure from the package in a string of beads, a tie-bar cutting die for cutting a tie-bar for connecting a plurality of leads extending from the IC package has been conventionally used. It was Then, the tie bar is cut and removed, and the resin member is cut to separate the package body.

However, in this tie bar cutting die, the tie bar cutting punch and the resin member cutting punch coexist, which increases the cost of the die, and a plurality of punches coexist, and the tie bar cutting punch is cut a little. There have been various problems such that the resin piece comes into contact with the tie bar cutting blade to damage the cutting blade, or the resin piece rides on the lead and makes a dent mark on the lead when the die is clamped. Therefore, the step of separating the individual package bodies from the resin-sealed structure and the step of cutting the tie bar are performed separately.

FIG. 3A is a view for explaining an example of a conventional IC package body separation die. In this package body separation mold, as shown in FIG. 3A, a bead-shaped resin sealing structure 16 in which the resin member 11 and the package body 10 are alternately connected is placed on the lead frame 15. A lower die 14 having a surface and having a hole 12 corresponding to the resin member 11 and an upper die for embedding a punch 19 that hits and breaks the resin member 11 were provided.

In order to separate the package body 10 by using this package body separation die, first, the lead frame 15 is placed on the lower die 14 and the pins of the lower die 14 are inserted into the sprocket holes for positioning. . Next, as shown in FIGS. 3B and 3C, the punch 19 is lowered to move the punch 19 to the lower position.
Then, the resin member 11 is hit and broken, and dropped into the hole 12 as a resin piece 13. The resin part 11 was removed by the mold having such a simple structure to separate the package 10.

[0008]

SUMMARY OF THE INVENTION The above-mentioned conventional mold for separating a package body has a drawback that a mold is required every time the size of the package body or the interval between the package bodies is different, resulting in a very high equipment cost. . In addition, there is a problem in that it is necessary to prepare a mold to be attached to the press machine every time the type of product is changed, and a great amount of time is wasted in switching the mold and preparing the mold.

Further, as shown in FIGS. 3 (b) and 3 (c), the conventional method for separating the package body is the resin member 1 as shown in FIG.
Since the center of 1 is struck to break and separate from the boundary between the package 10 and the resin member 11, a large bending moment is applied to the base of the resin member, which is the boundary, and the package 10 often breaks. There is a problem in that the appearance of the body is lost. Especially in recent years
This problem has become apparent as the package body becomes thinner.

Therefore, the object of the present invention is to provide a versatile structure which can be separated into individual package bodies without causing chipping or the like in the package bodies and can be applied even if the package bodies of various sizes and the pitch between the package bodies are changed. I
(EN) A method for separating a C package and a mold thereof.

[0011]

A feature of the present invention is that a plurality of IC package bodies formed by resin-sealing a plurality of semiconductor chips mounted vertically and horizontally on a lead frame are connected to each package body. In a method for separating an IC package body in which a resin member is separated into individual package bodies in a resin sealing structure having a resin member, the two package bodies that are adjacent to each other in the extending direction of the resin member are provided. Hold a portion close to the boundary between any one of the package and the resin member, and push the other package in any direction to cause a crack at the boundary between the package and the resin member. Is a method for separating an IC package body, in which a portion of the resin member opposite to the portion where the crack is generated is tapped to remove the resin member by breaking.

Another feature of the present invention is that it has a first groove into which the resin sealing structure in which the package body and the resin member are connected in series is inserted, and a protrusion is provided in the middle of the first groove. An upper die having a portion, a punch protruding a predetermined length from the first groove of the upper die on the rear side of the protrusion in the direction in which the resin sealing structure is inserted, and the resin sealing A second groove corresponding to the first groove is formed on the side where the component is inserted, and is inserted perpendicularly to the second groove in the middle of the second groove to push up the package body by spring pressure. From a rear stage of the clamp claw, which has a push-up pin and a clamp claw that is disposed so as to face the protrusion and that cooperates with the protrusion to clamp the resin member by spring pressure, and in which the resin sealing structure is inserted. A third groove is formed which is shallower than the second groove and has a surface on which the package body slides. One the punch in the middle groove of said 3 is a package of separation mold IC and a lower die having a hole to be inserted. Further, it is desirable to include a position adjusting mechanism that changes the distance between the punch and the protrusion.

[0013]

The present invention will be described below with reference to the drawings.

1 (a) and 1 (b) are sectional views showing an embodiment of a separation mold for an IC package body according to the present invention. As shown in FIG. 1, the separation mold of this package has a groove 1a into which the resin sealing structure 16 is inserted, and the groove 1a.
Upper mold 1 having a protrusion 3 in the middle of a, and resin-sealed structure 1
6, a punch 9 protruding by a predetermined length from the groove 1a of the upper mold 1 on the rear side of the protrusion 3 in the insertion direction, and a groove corresponding to the groove 1a on the side where the resin sealing structure 16 is inserted. 4a is formed and vertically inserted in the middle of the groove 4a.
0 is pushed up by the pressure of the spring 7b and the push-up pin 6 and the protrusion 3
Has a clamp claw 5 which is disposed so as to oppose to each other and cooperates with the protrusion 3 to hold the resin member 11 by the pressure of the spring 7a, and from the rear stage of the clamp claw 5 into which the resin sealing structure 16 is inserted, from the groove 4a The lower mold 4 is provided with a groove 4b having a shallow surface on which the package body 10 slides and having a hole 12 into which the punch 9 is inserted in the groove 4b.

Here, the raising of the clamp claw 5 and the raising pin 6 are performed by the rotation of the cams 8a and 8b.
Further, the punch 9 is fixed to the punch holder 2, and the punch holder 2 moves on the sliding surface of the upper die 1 to move the projection 3
The distance (L) between the punch 9 and the punch 9 can be adjusted. This adjustment
This is performed according to the dimensions of the package 10. On the other hand, the interval (S) between the clamp claw 5 and the push-up pin is set according to the minimum size of the package body 10 to be applied. That is, even if the package body 10 is long, the push-up pin 6
Will push up the package 10.

Since the groove 1a of the upper mold 1 and the groove 4a of the lower mold 4 form a space for wrapping the package body 10 when the mold is clamped, the grooves 1a, 4 are arranged so that the largest package body can be inserted.
It is desirable to form a. The groove 4b after the clamp claw 5 is made shallow, and the package body 10 slides. This allows the impact force of the punch 9 to be applied to the resin member 11 without bending the package 10.

FIGS. 2A to 2C are views for explaining a method for separating the package body using the IC package body separation die of FIG. Next, the operation of the mold for separating the package body in FIG. 1 and the method for separating the package body will be described with reference to FIGS.
Will be described with reference to.

First, as shown in FIG. 1A, in a mold-opened state, the resin sealing structure 16 is inserted from the groove 4a, and the resin member between the first package body 10 and the next package body 10 is inserted. Position 11 as shown in FIG. Next, as shown in FIG. 1B, the mold is clamped and the cam 8a shown in FIG.
The clamp claw 5 compresses the spring 7a and ascends. As a result, the portion of the resin member 11 near the boundary of the package body 10 is sandwiched and held by the protrusion 3 and the clamp claw 5. Next, as shown in FIG. 2B, the cam 8 of FIG.
The push-up pin 6 is lifted by the rotation of b and the package body 10
Push up. As a result, cracks occur at the boundary of the package 10.

Next, the cam 8a and the cam 8b in FIG. 1 are rotated to lower the clamp claw 5 and the push-up pin 6 and open the mold. Then, the resin sealing structure 16 is fed by one pitch by a mechanism for feeding the resin sealing structure using a sprocket hole (not shown) of the lead frame, and the cracked resin member 11 is positioned above the hole 12. At this time,
Inevitably, the next resin member 11 comes on the clamp claw 5.
Next, the mold is clamped again, the punch 9 is lowered, and the portion of the resin member 11 on the opposite side having the crack is tapped to simultaneously break the boundary portion of the resin member having the crack and the boundary portion on the opposite side.
1a is dropped into the hole 12 to complete one cycle.
Then, in parallel with the removal operation of the resin member by the punch 9, the next resin member 1 positioned on the clamp claw 5 is positioned.
Clamping and crack formation of 1 continues.

By punching with the punch 9 aligned with the boundary portion of the package body 10 on the side opposite to the cracked side, the force applied to the package body 10 on the cracked side is reduced and chipping occurs. Disappears. Further, since the punch 9 hits the portion near the boundary portion of the package body 10 on the side without cracks, the hitting portion does not cause overhang from the package body 10 as in the conventional case and does not give bending stress to the package body. As a result, the package body 10 on the side without cracks does not chip.

Here, by determining the width of the punch in accordance with the smallest width of the resin member 11, one punch can cope with the resin member 11 having different sizes. In addition,
In order to make the resin member remaining in the package 10 smaller when cracking and separating, the gripping force on the resin member 11 by the protrusion 3 and the clamp claw 5 is 300 g to 3 kg.
Need the power of. These gripping forces are obtained by adjusting the compression amount of the spring 7a. If this gripping force is weak, the clamp claws 5 escape downward, and cracks are formed outside from the boundary portion, and the amount of the resin member remaining on the package body 10 side increases. Also,
If the gripping force is strong, the sandwiching portion of the resin member 11 will be broken.

The package body 1 using the push-up pins 6
Regarding the inclination direction and angle of 0, since the thickness of the package body 10 connected to the resin member 11 is usually thicker than the resin member 11, the crack tends to occur when the package body 10 is pushed up. . Also, even if the tilt angle is small, 4.
If it is tilted about 7 degrees, cracks will be evenly formed. Of course, as described above, it is desirable to set the width of the clamp claw 5 to be equal to or less than the minimum width of the resin member 11 in consideration of versatility.

[0023]

As described above, according to the present invention, in removing the resin member interposed between the package bodies, the portion near the boundary between the resin member and the package body is held and the package body is moved in either direction. To cause a crack at the boundary between the package body and the held resin member, and then to strike and break the resin member portion on the opposite side to the cracked side, thereby giving bending stress to the package body The resin member can be removed without breaking. As a result, there is an effect of improving the yield of the quality that the chipping of the package body generated by the shearing force due to the bending stress that has occurred conventionally is eliminated.

Also, in a mold for separating the package body by breaking and removing the resin member connecting the package bodies,
For various package bodies with different dimensions, set a gap between the resin member holding mechanism and the pushing-up mechanism so that it can be applied to the smallest size package, and further provide a mechanism for adjusting the punch position for hitting the resin member. Therefore, even one package can be used for various package bodies having different base dimensions, and there is an effect that the equipment cost and the time required for exchanging the die are significantly reduced.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing one embodiment of a separation mold for an IC package body of the present invention.

FIG. 2 is a diagram for explaining a method of separating a package body by using a mold for separating a package body of the IC of FIG.

FIG. 3 is a diagram for explaining an example of a conventional IC package body separation die.

[Explanation of symbols]

 1 Upper mold 1a, 4a, 4b Groove 2 Punch holder 3 Projection part 4,14 Lower mold 5 Clamp claw 6 Push-up pin 7a, 7b Spring 8a, 8b Cam 9 Punch 10 Package body 11 Resin member 11a, 13 Resin piece 12 Hole 15 Lead frame 16 resin sealing structure

Claims (3)

(57) [Claims] 1. A plurality of I's formed by resin-sealing a plurality of semiconductor chips mounted vertically and horizontally on a lead frame.
In a method of separating an IC package body, the resin member in a resin sealing structure having a C package body and a resin member connecting each package body is cut into individual package bodies. A portion of the two package bodies adjacent to each other in the extending direction near the boundary between the package body and the resin member is sandwiched, and the other package body is pushed in either direction in the package body and the resin. A method for separating an IC package body, characterized in that a crack is formed at the boundary with a member, and a portion of the resin member opposite to the portion where the crack is generated is hit to remove the resin member by breaking. 2. An upper mold having a first groove into which the resin-sealed structure in which the package body and the resin member are connected in a string and into which the resin-sealed structure is inserted, and a projection part in the middle of the first groove, A punch that projects by a predetermined length from the first groove of the upper die on the rear side of the protrusion in the direction in which the resin sealing structure is inserted, and a punch into which the resin sealing structure is inserted. A second groove is formed corresponding to the first groove, and is inserted in the middle of the second groove perpendicularly to the second groove so as to face the push-up pin that pushes up the package body with spring pressure and the protrusion. And a clamp claw that cooperates with the protrusion and clamps the resin member by spring pressure and that is shallower than the second groove from the rear stage of the clamp claw into which the resin sealing structure is inserted. A third groove having a surface on which the package body slides is formed, and the groove is formed in the middle of the third groove. And a lower die having a hole into which the punch is inserted. 3. The separation mold for an IC package body according to claim 2, further comprising a position adjusting mechanism that changes a distance between the punch and the protrusion.