JP2534383B2 - Exposure data processing method - Google Patents

Description

[Detailed Description of the Invention] [Table of Contents] Outline Industrial field of application Conventional technology (Figs. 15 and 16) Problems to be solved by the invention (Figs. 1 and 2) Means for solving the problems Action Example One Embodiment of the Present Invention (FIGS. 3 to 14) Effect of the Invention [Overview] Regarding an exposure data processing method, all data for one chip are corrected at one time, and correction processing of a boundary portion of arrangement data is performed. With the object of providing an exposure data processing method that improves the accuracy of the generated exposure pattern data and shortens the processing time, a first pattern is obtained by dividing an arrangement pattern area on a wafer into areas of a predetermined size. In addition to the area, the first area is further divided into areas of a predetermined size to form a second area, which includes data arrangement type information, arrangement information for identifying the data type, the number of arrangements of data, and arrangement. Number, placement range, etc. Data is read out from the data storage means for storing a data group having position information including information, and the arrangement data read out for each second area is corrected by the correction processing means. An exposure data processing method for applying a predetermined process to generate exposure pattern data and providing the exposure pattern data to an exposure apparatus, wherein the data arranging unit of the correction processing means based on the arrangement information stores the second area. When the placement data read out for each is classified into a plurality of single placement pattern data that are individually placed, and a plurality of matrix placement pattern data that is placed in a matrix, and the sorted placement data is the single placement pattern data, In the second area other than the area boundary portion within the single arrangement area, the arrangement data read out for each second area and the arrangement data Adjacent adjacent data is registered in the second area in which the arrangement data exists, and the arrangement data and the adjacent data are extracted for each of the second areas by the data correction unit of the correction means. Correction processing is performed on the basis of the above, and in the second area of the area boundary portion in the single arrangement area, the adjacent data adjacent to the arrangement data read for each second area is changed to a predetermined area other than the second area. The data correction unit extracts each placement data for each second area and adjacent data corresponding to the placement data from the predetermined area, and performs correction processing based on the placement data and the adjacent data. If the classified arrangement data is matrix arrangement pattern data, the matrix of the matrix arrangement pattern data is calculated by the data arrangement unit based on the position information. Set the expansion area,
In the second area belonging to the matrix arrangement pattern data, the arrangement data read for each of the second areas and adjacent data adjacent to the arrangement data are registered in the second area where the arrangement data exists, and the matrix is arranged in the matrix. In the second area in the expansion area other than the area boundary portion, the data correction unit extracts predetermined layout data from the respective layout data in the second area, and performs a correction process on the layout data to obtain the reference pattern data. Then, the reference pattern data is expanded to the area boundary part in the matrix expansion area and the arrangement data is corrected. Part to extract the arrangement data and the adjacent data for each second region,
A correction process is performed based on the arrangement data and the adjacent data.

[Industrial applications]

The present invention relates to an exposure data processing method, and more particularly to an exposure data processing method for creating exposure pattern data for printing with an electron beam on a wafer by an exposure apparatus.

In recent years, for example, in the manufacture of LSI masks, it is common to use an exposure apparatus using an electron beam.

The exposure apparatus prints predetermined exposure pattern data on the exposure area on the wafer with an electron beam. The exposure area on the wafer is, as shown in FIGS.
The field F is further divided into regions of a predetermined size called subfields SF. In addition, the LSI design data is present in the unit of subfield SF, and identifies the data type, that is, a single placement section that is placed independently and a matrix placement section that is placed continuously for each subfield for the same data. The LSI design information is used to obtain the exposure pattern data required for the exposure apparatus from this LSI design data. Many exposure data processing methods for correcting data have been developed.

The correction process is roughly divided into dose correction and dimension correction. When the exposure pattern data was printed on the wafer, the dose correction was performed with the same dose for any size pattern. However, since it is not possible to expose well due to electron scattering such as forward scattering and back scattering, design data is printed according to the pattern size, for example, a low irradiation amount for a large pattern and a high irradiation amount for a small pattern. When the exposure pattern data is printed on the wafer, the pattern is swollen due to the characteristics of the wafer and is burned.Therefore, the swollenness of the pattern is taken into consideration and the pattern is swollen and predetermined. The design data is dimensionally corrected so that the dimensions become. The correction processing such as the irradiation amount correction and the dimension correction is determined in consideration of the surrounding pattern, and is always corrected with reference to the information of the connection partner or the like.

However, with the increase in the capacity and functionality of LSIs, the calculation required for the correction processing of LSI design data is greatly expanded, and the increase of the calculation processing time leads to the extension of the development period.

Therefore, it is required to shorten the calculation time required for the correction process of the LSI design data.

[Conventional technology]

As a conventional exposure data processing method of this kind, there is a method as shown in FIG.

This method makes use of the fact that the LSI design data in the subfield SF has the arrangement information and the position information, and if the arrangement information determines that the data to be corrected is the matrix arrangement portion, the matrix arrangement is made from the position information. Recognizing the range and setting a matrix expansion area (shaded area in the figure) that expands the same multiple data within the matrix arrangement range, and correcting the irradiation amount only for the matrix data in one subfield in this area, Further, correction processing such as dimension correction is performed, and the corrected data is expanded in a matrix expansion area (hereinafter, simply referred to as matrix expansion) to shorten the correction processing time. That is, in the matrix expansion, the correction processing result for one data within a certain matrix arrangement range is the same as the correction processing result for the other data within this matrix arrangement range, so that the number of data arrangements within the matrix arrangement range is the same. This is because the correction processing result within the matrix arrangement range can be obtained only by performing the correction processing on one data without performing the same correction processing on all the data.

However, the matrix expansion is effective only for one data, and when there are multiple data for matrix expansion, only one data can be expanded.
As shown in FIG. 16, in the case of design data having a plurality of layout data such as matrix layout sections A, B, C, D and single layout section E in one chip, the data of the single layout section E is first set. Is corrected and exposed, and then the matrix arrangement part A
Data is developed in a matrix as described above and exposed, and similarly, the data in the matrix arrangement portions B, C and D is developed in a matrix and sequentially exposed.

Thus, when exposing the matrix arrangement portion, 1
The correction processing within the matrix arrangement range is performed in the correction processing time of only one matrix data.

[Problems to be Solved by the Invention]

However, in such a conventional exposure data processing method, when there are a plurality of data to be matrix-developed, only one of the data can generate the exposure pattern data, and the exposure pattern data is overprinted. Therefore, the finer the data pattern, the more difficult the alignment during exposure becomes. That is, for example, if the exposure pattern becomes finer due to the higher density of the LSI, the wiring pattern also becomes finer, and the deviation of each exposure pattern due to overprinting becomes severe. Therefore, there is a problem in that exposure of a high-density pattern of a certain density or more cannot be performed and the yield is deteriorated due to the repeated baking.

Further, in the conventional exposure data processing method, since the correction processing such as the dose correction and the dimension correction is performed only on the data of only the individual arrangement data, each data of the individual arrangement portion and the matrix arrangement portion is processed. In the vicinity of the boundary, there was a problem that exposure could not be performed well and a highly accurate pattern could not be obtained. This is because the correction processing such as the dose correction and the dimension correction was determined in consideration of the surrounding pattern,
This is because the information is always corrected by referring to the information of the connection partner, but in the case of the data boundary portion, the data to be referred to is mainly outside the subfield SF.

Therefore, the present invention corrects all the data for one chip at a time and also corrects the arrangement data boundary portion to improve the accuracy of the generated exposure pattern data and reduce the processing time. It is an object to provide an exposure data processing method.

[Means for solving the problem]

In order to achieve the above object, the exposure data processing method according to the present invention divides an arrangement pattern area on a wafer into areas of a predetermined size to form a first area F as shown in FIGS. 1 area F is further divided into areas of a predetermined size to form a second area SF, which includes data arrangement type information,
In the data of the first area F from the data storage means 1 for storing a data group having arrangement information for identifying the data type and position information including information such as the number of arrangement of data, arrangement number, arrangement range, etc. Data is read out for each of the second areas SF, the arrangement data D read out for each of the second areas SF is subjected to predetermined processing by the correction processing means 2 to generate exposure pattern data, and the exposure pattern data is exposed. The exposure data processing method given to No. 3, wherein the arrangement data D read out for each of the second regions SF by the data arrangement unit 4 of the correction processing means 2 based on the arrangement information is arranged independently into a plurality of individual arrangement patterns. When the data DS and the matrix arrangement pattern data DM arranged in a matrix form are classified and the classified arrangement data D is the single arrangement pattern data DS, In the second area SF other than the area boundary portion within the arrangement area, the arrangement data D read for each second area SF and the adjacent data DN adjacent to the arrangement data D are stored in the second area SF where the arrangement data D exists. The data is registered in the area SF, and the data correction unit 5 of the correction means outputs the second area SF.
The arrangement data D and the adjacent data DN are extracted for each, correction processing is performed based on the arrangement data D and the adjacent data DN, and in the second area SF of the area boundary portion in the single arrangement area, The adjacent data DN adjacent to the arrangement data D read out for every two areas SF is registered in a predetermined area other than the second area SF, and the data correction unit 5 causes the second area SF to be registered.
The arrangement data D is extracted for each of the arrangement data D and the adjacent data DN corresponding to the arrangement data D from the predetermined area.
And a correction process is performed based on the adjacent data DN, and the classified arrangement data D is matrix arrangement pattern data DM, the data arrangement unit 4 calculates the matrix arrangement pattern data DM based on the position information. In the second area SF that belongs to the matrix arrangement pattern data DM by setting a matrix expansion area, the arrangement data D read for each second area SF and the adjacent data DN adjacent to the arrangement data D are arranged in the arrangement data. D is registered in the second area SF where D exists, and in the second area SF other than the area boundary portion in the matrix expansion area, the data correction unit 5 determines a predetermined value from each arrangement data D of the second area SF. Of the arrangement data D is extracted, and the arrangement data D is subjected to a correction process to form reference pattern data, and the reference pattern data is used as an area boundary in the matrix expansion area. The region is expanded to the region and correction processing of the arrangement data D is performed, and in the second area SF of the area boundary portion in the matrix expansion area, the data correction unit 5 causes the arrangement data of each of the second areas SF. D and the adjacent data DN are extracted, and the arrangement data D and the adjacent data are extracted.
The correction process is performed based on the DN.

[Action]

According to the present invention, when the placement data in the second area is subjected to the correction process, the placement data of the placement data is corrected by performing the placement data correction process based on the placement data to be corrected and the adjacent data adjacent to the placement data. The surrounding pattern is considered as a correction factor, and correction processing such as dose correction and dimension correction is performed. That is, the arrangement data boundary portion is corrected, and all the data for one chip is corrected at once.

Therefore, the accuracy of the generated exposure pattern data is improved, and the processing time is shortened.

〔Example〕

 Hereinafter, the present invention will be described with reference to the drawings.

FIGS. 3 to 14 are views showing an embodiment of the exposure data processing method according to the present invention. In FIGS.
2 The same numbers as those given in Fig. 2 indicate the same parts.

FIG. 3 shows a part of the exposure area on the wafer. The exposure area on the wafer is divided into areas of a predetermined size called field F as a first area surrounded by a thick solid line, and field F is further divided into It is divided into areas of a predetermined size called subfields SF as second areas surrounded by broken lines, and the data storage means 1 stores arrangement data D (subfield data) for each subfield SF. In the subfield SF, a single placement section that is placed alone or a plurality of consecutive placements of the same data are placed. Arrangement information for identifying the data type of the matrix arrangement part and position information including information such as the number of arrangements, arrangement number, arrangement range, etc., which is the reference of matrix expansion as arrangement data, are set. , Each subfield SF
There is actual pattern data for each input.

In addition, indicates the field number, and indicates the reading order of the fields by the correction processing means 2, that is, the exposure order. In the example of FIG. 3, the fields ˜ are the individual arrangement patterns set in the respective fields ˜. As with the matrix arrangement section A, the single arrangement section E which is the data DS, the matrix arrangement section A which is the matrix arrangement pattern data DM set in the field, and the matrix arrangement sections B to D which are respectively set in the fields Are arranged, and the subfields SF of the individual arrangement portion E and the subfields SF of the matrix arrangement portions A to D are in a shifted state.

By the way, the deviation of the subfields SF means the state shown in FIG. 4 (a), and the overlap of the subfields SF means the state shown in FIG. 4 (b).

Further, in the scanning direction for reading the arrangement data D by the correction processing means 2 (hereinafter referred to as the scanning direction), as shown by the alternate long and short dash line in FIG. As shown by the chain double-dashed line, there is a Y-scan for scanning in the Y-axis direction. In this embodiment, the case where the X-scan is used will be described as an example.

FIG. 6 is an enlarged view of the fields shown in FIG. 3, in which each field F (field in this case) is arranged by the data arranging unit 4 and each subfield SF is formed by the X scan indicated by the arrow in the drawing. The arrangement data D of FIG.

It should be noted that the sub-fields of the matrix arrangement portion A and the sub-fields of the single arrangement portion E are displaced from each other, and I to VI
I, i to x are the X coordinate number on the field and Y, respectively
The coordinate number is indicated, and the subfield number is indicated by a combination of these numbers.

As shown in FIG. 6, the actual placement data D is not strictly discriminated as a single placement part or a matrix placement part, and based on the placement information in the placement data D read for each subfield SF, The data placement unit 4 distinguishes whether the placement data D is a single placement unit or a matrix placement unit, and the distinct placement data D is arranged in a matrix with a plurality of single placement pattern data DS that are placed individually. It is classified into a plurality of matrix arrangement pattern data DM.

The classified arrangement data D is the individual arrangement pattern data DS
If it is, the classified arrangement data D is registered in the subfield SF in which the arrangement data D exists together with the adjacent data DN adjacent to the arrangement data D. That is, taking subfield II-ii as an example, subfield II-ii
Adjacent to the subfields I-i, II-i, III-i, I-ii, I
The data in the range indicated by ξμm in FIG. 6 of each arrangement data D of II-ii, I-iii, II-iii, and III-iii becomes the adjacent data DN, and this adjacent data DN is the arrangement of the subfield II-ii. It is registered in subfield II-ii together with data D.

Also, taking subfield VII-iii as an example, since this subfield SF is out of the field,
Since the procedure of the data of the protruding portion changes depending on whether or not the field data adjacent to the subfield VII-iii is read, in this case, the data of the protruding portion is stored once and referred to after a predetermined time.

This will be explained in detail. As shown in FIG. 7, when there is a subfield adjacent to the correction processing subfield to be processed, the pattern data included in the region of ξμm shown by the shaded area is the adjacent data DN. It is registered in the correction processing subfield.

Further, when the correction processing subfield exists in contact with the field boundary line, it is checked which field boundary line the position of the correction processing subfield exists in contact with.
It is registered as adjacent data DN in a predetermined file, and is extracted and referred to during the dimension correction process.

On the other hand, when the classified arrangement data D is the matrix arrangement pattern data DM, the data arrangement unit 4 sets and sets the matrix development area of the matrix arrangement pattern data DM based on the position information in the arrangement data D. Each arrangement data D of the subfields SF at the area boundary in the matrix expansion area is registered in the subfield SF in which the arrangement data D exists together with the adjacent data DN adjacent to the arrangement data D. That is, taking the matrix arrangement section A of FIG. 6 as an example, the subfields marked with X in the figure which are the subfields of the area boundary in the matrix expansion area are processed and registered in the same manner as the individual arrangement pattern data DS. It

In this process, as shown in FIG. 8, when the subfields are shifted or overlapped, the pattern data is first registered in the subfield to be processed, the area where the pattern exists is examined, and ξμm is extracted from the area. The single placement subfields and the matrix placement subfields corresponding to the above range are extracted, and only the data within the range of ξμm is registered in the processing subfield. Therefore, this processing enables dimension correction even when subfields are shifted or overlapped, and not only the boundary portion between the single arrangement portion and the matrix arrangement portion but also the single arrangement portion and the single arrangement portion and the matrix arrangement portion. Dimensional correction can be performed in the matrix arrangement section.

If the processing subfield and the adjacent subfield completely overlap, they are not processed as overlapping and
Exceptionally, it is handled as one subfield data.

As a result, each sub-field (area surrounded by a thick solid line in the matrix arrangement portion A in FIG. 6) other than the area boundary portion in the matrix expansion area has a certain matrix arrangement as in the matrix expansion processing of the conventional example. Since the correction processing result for one data in the range is the same as the correction processing result for other data in this matrix arrangement range,
Correction processing such as dose correction and size correction is performed only on the matrix data in one subfield in this area, and the correction processing time is shortened by developing this corrected data in a matrix. .

In addition, as shown in FIG.
The shape of the matrix expansion range that can be processed by is a square such as a square or a rectangle. However, since the actual shape of the matrix expansion range includes shapes other than a square (hereinafter, referred to as special shapes), the matrix in this embodiment is When the expansion range is a special shape, as shown in FIGS. 9B and 9C, dividing lines are generated in the special shape matrix to form a plurality of square-shaped matrices, and the special shape matrix expansion range is an exposure apparatus. 3 is divided into shapes that can be processed.

After the matrix arrangement information is created, as shown in FIG. 6, patterns that can be actually registered in each subfield are extracted, and the patterns are registered / classified. When the pattern registration and classification in each field and each subfield are completed, the data correction unit 5 performs irradiation amount and dimension correction processing, and the matrix is processed and developed only in the subfield serving as the reference in the arrangement unit.

After the dimension correction is completed, the data is corrected according to the format of the exposure device 3, the data is compressed, and the final data is exposed by the exposure device 3.

With the above method, a specific example of the data processing method of the present invention will be described with reference to FIGS.

FIG. 10 is an excerpt of a part of a certain field in input data of a certain one chip. In this example, one independent arrangement part and two matrix arrangement parts are present in a certain part of the field. are doing. In addition, it is assumed that the subfields of the individual arrangement portion and the matrix arrangement portion are displaced and overlap.

First, as shown in FIG. 11, the single placement part and the matrix placement part are automatically classified based on the placement data D,
If there is a matrix development shape that cannot be processed by the exposure apparatus 3 in the matrix arrangement section, the matrix development information is automatically divided again to create matrix development information.

If the scan direction advances to the right in the figure with respect to the column during processing of the matrix expansion range, the subfield marked with X is set as the matrix expansion reference subfield, but the scan direction is left. In the case of (1), the matrix expansion reference subfield is generated at the subfield marked with ◯, and the subfield marked with X is set as the matrix expansion reference subfield after the expansion range is determined. This is because the exposure device 3 processes the left end position in the drawing of the matrix arrangement portion as a reference position for matrix development, and therefore, the exposure device 3 matches the processing of the exposure device 3.

After the matrix expansion information is created, the data is read again from the beginning, and pattern data classification registration processing is performed as shown in FIG. At this time, since the subfields of the single placement section and the matrix placement section do not necessarily match, the shift and overlap of the subfields are considered, and the pattern data is registered / classified in each subfield. At the time of this registration / classification, the pattern data of the subfield SF at the boundary of the field F may or may not be registered depending on the reading order of the fields as described above. When processing the corresponding subfield SF registered in the data correction unit 5 at the time of dimension correction, the correction processing is performed while reading the adjacent field pattern data from this file and referring to it.

FIG. 13 shows the data before the dimension correction processing, and the dimension correction is performed on the individual arrangement and the matrix arrangement based on the matrix arrangement information with this data. Further, at the time of the actual matrix expansion processing, the correction processing is performed only on the matrix expansion reference subfield, and the data is expanded in the matrix expansion range. Note that the single placement unit performs the conventional processing.

The data after the correction processing is subjected to data conversion in accordance with a format suitable for the exposure device 3, data compression, and exposure by the exposure device 3 as final data.

Therefore, as shown in FIG. 14, all the data for one chip is corrected at the same time and simultaneously exposed by the exposure device.

As described above, in the present embodiment, the correction processing of the arrangement data boundary portion can be performed, and the correction processing such as the dose correction and the dimension correction can be performed in consideration of the pattern around the arrangement data as the correction element. Therefore, all the data for one chip can be corrected at one time, the accuracy of the generated exposure pattern data can be improved, and the processing time can be shortened.

In the above embodiment, the scan direction is described as an X scan, but the present invention is not limited to this, and a Y scan can be similarly processed.

〔The invention's effect〕

According to the present invention, it is possible to perform the correction processing of the boundary portion of the arrangement data, and it is possible to perform the correction processing such as the dose correction and the dimension correction in consideration of the pattern around the arrangement data as the correction element.

Therefore, all the data for one chip can be corrected at one time, the accuracy of the generated exposure pattern data can be improved, and the processing time can be shortened.

[Brief description of drawings]

FIG. 1 is a block diagram showing an apparatus configuration for carrying out the exposure data processing method of the present invention, FIG. 2 is a view showing a part of an exposure area on a wafer to which the exposure data processing method of the present invention is applied, and FIGS. FIG. 14 shows an embodiment of the exposure data processing method according to the present invention, FIG. 3 shows a part of the exposure area on the wafer, and FIGS. 4 (a) and 4 (b) show subfield shifts. And FIG. 5 are views for explaining the read scanning direction, FIG. 6 is an enlarged view of the field in FIG. 3, and FIG. 7 is a subfield in FIG. FIG. 8 is an enlarged view of the main part of FIG. 8, FIG. 8 is a view for explaining the processing of subfields protruding from the field, and FIGS. 9A, 9B, and 9C are views for explaining the division processing of the matrix expansion range shape. 10 to 14 are specific examples of the exposure data processing method according to the present invention. FIG. 10 is a diagram showing an exposure region of the field portion, FIGS. 11 and 12 are diagrams for explaining the matrix development procedure, and FIG. 13 is a portion of the exposure region after the processing is completed. FIG. 14, FIG. 14 is a diagram for explaining the exposure procedure, FIG. 15 is a diagram showing a part of an exposure area on a wafer to which the conventional exposure data processing method is applied, and FIG. 16 is a conventional example. It is a figure for demonstrating an exposure procedure. 1 ... data storage means, 2 ... correction processing means, 3 ... exposure device, 4 ... data placement section, 5 ... data correction section, F ... field (first area), SF ... subfield ( Second area), D ... Arrangement data, DN ... Adjacent data, DS ... Single arrangement pattern data, DM ... Matrix arrangement pattern data.

Claims (1)

(57) [Claims] 1. A layout pattern area on a wafer is divided into areas of a predetermined size to form a first area, and the first area is further divided into areas of a predetermined size to form a second area. From the data storage means for storing the data group including the arrangement type information, the arrangement information for identifying the data type, and the position information including the information such as the arrangement number of data, the arrangement number, and the arrangement range. The data is read out for each second area in the area data, the arrangement data read out for each second area is subjected to predetermined processing by the correction processing means to generate exposure pattern data, and the exposure pattern data is exposed. An exposure data processing method applied to an apparatus, wherein a plurality of individual arrangement data read out for each of the second areas by the data arrangement unit of the correction processing unit is arranged based on the arrangement information. And German arrangement pattern data are classified into a matrix arrangement pattern data a plurality arranged in a matrix, when the classified arrangement data were alone arrangement pattern data, second non-region boundary portion in the sole arrangement region
In the area, the arrangement data read out for each of the second areas and the adjacent data adjacent to the arrangement data are registered in the second area in which the arrangement data exists, and the data correcting section of the correction means performs the second area. The arrangement data and the adjacent data are extracted for each, and correction processing is performed based on the arrangement data and the adjacent data.
Adjacent data adjacent to the layout data read out for each area is registered in a predetermined area other than the second area, and the data correction unit sets each layout data for each second area and the layout from the predetermined area. When adjacent data corresponding to the data is extracted, correction processing is performed based on the arrangement data and the adjacent data, and when the classified arrangement data is matrix arrangement pattern data, the data arrangement is performed based on the position information. A matrix expansion area of the matrix arrangement pattern data is set by a unit, and in the second area belonging to the matrix arrangement pattern data, the arrangement data read for each of the second areas and the adjacent data adjacent to the arrangement data are stored in the second area. It is registered in the second area where the arrangement data exists, and in the second area other than the area boundary portion in the matrix expansion area, The data correction unit extracts predetermined arrangement data from the arrangement data of the second area, corrects the arrangement data to form reference pattern data, and the reference pattern data is an area in the matrix expansion area. Boundary part: The arrangement data is expanded in the area and correction processing of the arrangement data is performed, and in the second area of the area boundary part in the matrix expansion area,
An exposure data processing method, wherein the data correction unit extracts the arrangement data and the adjacent data for each of the second areas, and performs a correction process based on the arrangement data and the adjacent data.