JP2533916B2 - Method and device for winding bonding wire for semiconductor - Google Patents
Method and device for winding bonding wire for semiconductorInfo
- Publication number
- JP2533916B2 JP2533916B2 JP63164191A JP16419188A JP2533916B2 JP 2533916 B2 JP2533916 B2 JP 2533916B2 JP 63164191 A JP63164191 A JP 63164191A JP 16419188 A JP16419188 A JP 16419188A JP 2533916 B2 JP2533916 B2 JP 2533916B2
- Authority
- JP
- Japan
- Prior art keywords
- winding
- wire
- spool
- electric furnace
- jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/43—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は半導体用ボンディングワイヤの巻取り方法お
よびその装置、詳しくは伸線加工されたAu,AlあるいはC
u等のボンディングワイヤをボンディングマシンに装着
使用されるスプールに巻取る方法及び装置に関する。The present invention relates to a method of winding a bonding wire for a semiconductor and an apparatus therefor, more specifically, drawn Au, Al or C.
The present invention relates to a method and an apparatus for winding a bonding wire such as u on a spool used for mounting on a bonding machine.
（従来技術とその技術的課題） 従来のボンディングワイヤの巻取り手段は、伸線加工
されたボンディングワイヤをアニール機により焼なまし
処理を施こした後に、このアニール機に設けた空冷手段
により冷却し、中間スプールに巻取らせており、その後
に中間スプールを巻取機に取付け、該巻取機に設けた巻
取スプールに中間スプールから所定長さ宛引出し巻取ら
せるようにしている。(Prior art and its technical problem) The conventional winding means for a bonding wire is such that after the drawn wire is annealed by an annealing machine, it is cooled by an air cooling means provided in the annealing machine. Then, the intermediate spool is wound up, and then the intermediate spool is attached to the winder so that the take-up spool provided in the winder can draw and wind a predetermined length from the intermediate spool.
しかるに上記従来手段によれば、アニール機と巻取機
との２つの機会を用い最終製品である巻取スプールにボ
ンディングワイヤを巻取るため、２回の類似した巻取り
作業を必要にして作業性の低下が問題であるとともに装
置の大型化，コスト高の原因となっている不具合があ
る。However, according to the above-mentioned conventional means, since the bonding wire is wound on the winding spool which is the final product by using two opportunities of the annealing machine and the winding machine, two similar winding operations are required and workability is improved. Is a problem, and there is a problem that the device is large and the cost is high.
一方、上記従来手段において、アニール機で焼なまし
処理を施こされたボンディングワイヤを直接に最終的な
巻取スプールに巻取るようにすれば、該スプールに巻取
られたワイヤどうしのくっ付き、とくにクロス巻きした
場合のワイヤどうしのくっ付きが顕著にみられて、ボン
ディングマシンに装着使用した場合に、円滑なワイヤ繰
出しが得られないという問題点があり、またスプール交
換の際に電気炉内に停止しているワイヤが焼なまし処理
の特性不良を生ずることになるが、この特性不良の部
分、すなわち次の巻取スプールに巻取られることになる
巻始め部の処置をどうするかという問題点が残る。On the other hand, in the above-mentioned conventional means, if the bonding wire that has been annealed by the annealing machine is directly wound on the final winding spool, the sticking of the wires wound on the spool will occur. , Especially when the wires are cross-wound, the sticking of the wires is noticeable, and there is a problem that when the wire is attached to a bonding machine and used, smooth wire feeding cannot be obtained. The wire stopped inside causes a characteristic defect of the annealing process. What to do with the portion of this characteristic defect, that is, the winding start part to be wound on the next take-up spool? The problem remains.
本発明は斯る従来の問題点を解決して、アニール機で
焼なまし処理を施こされたボンディングワイヤを巻取ス
プールに直接巻取りさせることを可能とし、作業性を高
めるとともに小型かつ安価な巻取り方法及び装置を提供
せんとすることを目的とする。The present invention solves the conventional problems described above, and makes it possible to directly wind a bonding wire that has been annealed by an annealing machine onto a take-up spool, which improves workability and is compact and inexpensive. An object of the present invention is to provide a simple winding method and device.
（課題を達成するための技術的手段） 斯る本発明のボンディングワイヤの巻取り方法は、伸
線加工されたボンディングワイヤを、電気炉内を通して
焼なまし処理を施こし、水冷により冷却させた後に、巻
始め部の所定長さを治具に巻取らせ、続いて巻取スプー
ルに設定された長さを巻取らせることを特徴とする。(Technical Means for Achieving the Object) The bonding wire winding method of the present invention is such that the wire drawing processed bonding wire is annealed through an electric furnace and cooled by water cooling. After that, it is characterized in that a predetermined length of the winding start portion is wound on the jig, and then the set length is wound on the winding spool.
又、本発明のボンディングワイヤの巻取り装置は、伸
線加工されたボンディングワイヤを電気炉へ供給するワ
イヤ供給機構、前記ワイヤが通過する間に該ワイヤに焼
なまし処理を施こす前記電気炉、その電気炉を出たワイ
ヤを冷却させる水冷機構およびワイヤを巻取スプールに
巻取る巻取り機構よりなり、前記巻取り機構が巻取り用
回転軸に始端部巻取治具を備えるとともに該治具に巻取
スプールを着脱自在に取付けてなることを特徴とする。The bonding wire winding device of the present invention includes a wire supply mechanism for supplying a drawn wire to an electric furnace, and the electric furnace for subjecting the wire to an annealing treatment while the wire is passing through. A water cooling mechanism that cools the wire that has exited the electric furnace and a winding mechanism that winds the wire on a winding spool, and the winding mechanism includes a starting end portion winding jig on the winding rotary shaft and It is characterized in that the take-up spool is detachably attached to the tool.
（実施例） 本発明の実施例を図面より説明すれば、第１図におい
て（Ａ）はワイヤ供給機構、（Ｂ）は電気炉、（Ｃ）は
水冷機構、（Ｄ）は巻取り機構であり、それら各機構
（Ａ）（Ｂ）（Ｃ）（Ｄ）は１台の装置機枠（１）に設
置してなる。EXAMPLE An example of the present invention will be described with reference to the drawings. In FIG. 1, (A) is a wire supply mechanism, (B) is an electric furnace, (C) is a water cooling mechanism, and (D) is a winding mechanism. Yes, each of these mechanisms (A), (B), (C), and (D) is installed in one machine frame (1).
ワイヤ供給機構（Ａ）は機枠（１）に設けた支軸
（２）と、該支軸（２）に遊転自在に軸支される供給ス
プール（３）と、ガイドローラ（4a）及び昇降動自在な
テンションローラ（4b）からなる張力設定器（４）とに
より構成され、その供給スプール（３）には前工程であ
る伸線工程において伸縮加工されたボンディングワイヤ
（ａ）が巻込まれている。The wire supply mechanism (A) includes a support shaft (2) provided on the machine frame (1), a supply spool (3) rotatably supported by the support shaft (2), a guide roller (4a), and a guide roller (4a). It is composed of a tension setting device (4) composed of a tension roller (4b) which can be moved up and down, and the supply spool (3) is wound with a bonding wire (a) stretched in a wire drawing process which is a previous process. ing.
供給スプール（３）は前記支軸（２）に着脱自在に取
付けられ、ボンディングワイヤ（ａ）の先端を張力設定
器（４）を介して電気炉（Ｂ），水冷機構（Ｃ），巻取
り機構（Ｄ）へ順次に誘導され、前記巻取り機構（Ｄ）
の駆動力によって所定の線速度でもって供給スプール
（３）から引出され電気炉（Ｂ）へ供給される。電気炉
（Ｂ）は機枠（１）の前面に前記供給機構（Ａ）と隣接
して垂直状に設置され、この電気炉（Ｂ）の中心部直上
にガイドローラ（５）を、電気炉（Ｂ）の下方に水冷機
構（Ｃ）を設置する。The supply spool (3) is detachably attached to the support shaft (2), and the tip of the bonding wire (a) is passed through a tension setting device (4) to an electric furnace (B), a water cooling mechanism (C), and a winding device. The winding mechanism (D) is sequentially guided to the mechanism (D).
With a predetermined linear velocity by the driving force of (3), it is drawn from the supply spool (3) and supplied to the electric furnace (B). The electric furnace (B) is installed vertically on the front surface of the machine frame (1) adjacent to the supply mechanism (A), and the guide roller (5) is installed directly above the center of the electric furnace (B). A water cooling mechanism (C) is installed below (B).
電気炉（Ｂ）内は所定温度、例えば300〜500℃に保持
され、この電気炉（Ｂ）を前記ワイヤ（ａ）が所定の線
速度で通過することにより該ワイヤ（ａ）に焼なまし処
理が施こされ、ボンディング特性に必要なワイヤが付与
されることになる。The electric furnace (B) is maintained at a predetermined temperature, for example, 300 to 500 ° C., and the wire (a) is annealed to the wire (a) by passing through the electric furnace (B) at a predetermined linear velocity. The treatment will be applied to provide the wires required for the bonding properties.
水冷機構（Ｃ）は前記電気炉（Ｂ）の直下に設置され
た冷却水（６）を収容する水槽（6a）及び該水槽内に配
設したガイドローラ（７）により構成され、前記電気炉
（Ｂ）を通過したワイヤ（ａ）をガイドローラ（７）を
介して巻取り機構（Ｄ）方向へ導くようにする。The water cooling mechanism (C) is composed of a water tank (6a) installed immediately below the electric furnace (B) for containing cooling water (6) and a guide roller (7) arranged in the water tank. The wire (a) passing through (B) is guided to the winding mechanism (D) through the guide roller (7).
上記ガイドローラ（７）に沿って移動するワイヤ
（ａ）は冷却水（６）に触れて冷却され、表面の付着力
が減じられる。The wire (a) moving along the guide roller (7) is cooled by touching the cooling water (6), and the adhesive force on the surface is reduced.
上記水槽（6a）には図示しない循環系路を介して水タ
ンク（図示せず）を接続し、それにより水槽（6a）内に
冷却水が液面略一定になるようにして収容され、かつ還
流させるようにする。冷却水（６）は純水のみを使用し
てもよいが、好ましくはワイヤ（ａ）の表面に被膜を形
成させるために安定剤、例えば界面活性剤，潤滑防錆剤
等を純水に添加させておき、それによってワイヤ（ａ）
の表面付着力をさらに減じさせるようにする。A water tank (not shown) is connected to the water tank (6a) via a circulation path (not shown), whereby the cooling water is contained in the water tank (6a) so that the liquid level is substantially constant, and Bring to reflux. As the cooling water (6), pure water alone may be used, but it is preferable to add a stabilizer such as a surfactant or a lubricating rust preventive agent to the pure water in order to form a film on the surface of the wire (a). Let the wire (a)
To further reduce the surface adhesion of.
巻取り機構（Ｄ）はワイヤ供給機構（Ａ）の下方、か
つ電気炉（Ｂ）の下部側方に設置され、回転速度が可変
なモータ及び水平方向へ往復動させるトラバース機構
（図示せず）により駆動される回転軸（８）、該軸に設
けた始端部巻取治具（９）及び回転軸（８）に着脱自在
に取付けされる巻取スプール（10）より構成（第２図，
第３図）。The winding mechanism (D) is installed below the wire supply mechanism (A) and laterally below the electric furnace (B), and has a motor with a variable rotation speed and a traverse mechanism (not shown) that reciprocates in the horizontal direction. A rotary shaft (8) driven by the rotary shaft (8), a start end winding jig (9) provided on the rotary shaft (8), and a winding spool (10) detachably attached to the rotary shaft (8) (Fig. 2,
(Fig. 3).
巻取治具（９）は回転軸（８）の定位置に固定状に取
付けられた溝車形状を有し、その溝（9a）を形成する内
外両側縁（9b）（9b′）の所定位置に切欠部（11）（1
1′）を形成してなる。The winding jig (9) has a grooved wheel shape fixedly attached at a fixed position of the rotary shaft (8), and has predetermined inner and outer side edges (9b) (9b ') forming the groove (9a). Notch in position (11) (1
1 ') is formed.
この巻取治具（９）には前記水冷機構（Ｃ）を通して
引出されたワイヤ（ａ）の先端を前記内側縁（9b）の外
面にテープ（12）により止着した状態で該ワイヤ（ａ）
を切欠部（11）を介して溝（9a）内に導き、回転軸
（８）の回転に伴ってワイヤ（ａ）を溝（9a）に所定長
さ巻取るようにする。On the winding jig (9), the wire (a) drawn out through the water cooling mechanism (C) is fastened to the outer surface of the inner edge (9b) by a tape (12). )
Is guided into the groove (9a) through the notch (11), and the wire (a) is wound around the groove (9a) by a predetermined length as the rotary shaft (8) rotates.
巻取スプール（10）はボンディングマシンに接着使用
されるスプールであり、一端又は両端にフランジ（10
a）（10a′）を有し（実施例図面では両端にフランジを
有する場合を示す）、前記回転軸（８）に挿着し締具
（13）によって巻取治具（９）に近接固定状に取付けさ
れる。The take-up spool (10) is a spool that is used by bonding to a bonding machine, and has a flange (10
a) (10a ') (shown in the drawings of the embodiment having flanges at both ends), inserted into the rotary shaft (8), and fixed close to the winding jig (9) by a fastener (13). Mounted in a shape.
上記スプール（10）はそのフランジ（10a）に切欠部
（14）を有し、該切欠部（14）が巻取治具（９）の前記
切欠部（11′）に近接し対向する状態で回転軸（８）に
取付ける。この巻取スプール（10）には回転軸（８）が
回転しながらトラバース機構によって水平方向へ移動す
る際にワイヤ（ａ）の巻取りが開始する。The spool (10) has a notch (14) on its flange (10a), and in the state where the notch (14) is close to and faces the notch (11 ') of the winding jig (9). Install on rotating shaft (8). The winding spool (10) starts winding the wire (a) when the rotating shaft (8) rotates and moves horizontally by the traverse mechanism.
すなわち、回転軸（８）の水平方向の移動時に巻取治
具（９）及び巻取スプール（10）も同方向へ移動する
が、その際に巻取治具（９）の溝（9a）に巻取られてい
るワイヤ（ａ）が前記切欠部（11′）（14）を通して巻
取スプール（10）の本体部へ移行し、該スプールの回転
及び水平方向移動によりワイヤ（ａ）は巻取スプール
（10）に巻取られる。That is, when the rotating shaft (8) moves in the horizontal direction, the winding jig (9) and the winding spool (10) also move in the same direction, but at that time, the groove (9a) of the winding jig (9). The wire (a) wound around the wire moves to the main body of the take-up spool (10) through the notches (11 ') (14), and the wire (a) is wound by the rotation and horizontal movement of the spool. It is taken up on the take-up spool (10).
尚、図中の（15）は２本のガラス棒で形成されたワイ
ヤ（ａ）のガイドである。而してワイヤ（ａ）の巻取り
作業は、ワイヤ（ａ）の先端を巻取治具（９）の外面に
テープ（12）によって止着し、回転軸（８）に巻取スプ
ール（10）を取付けた後に回転軸（８）の駆動源を起動
させることにより開始するが、最初の所定時間はワイヤ
（ａ）を巻取治具（９）の溝（9a）に巻取らせる。Incidentally, (15) in the figure is a guide of the wire (a) formed by two glass rods. In the winding operation of the wire (a), the tip of the wire (a) is fixed to the outer surface of the winding jig (9) with a tape (12), and the winding spool (10) is attached to the rotating shaft (8). It is started by activating the drive source of the rotating shaft (8) after mounting the wire (a), but the wire (a) is wound into the groove (9a) of the winding jig (9) for the first predetermined time.
すなわち、上記ワイヤ（ａ）先端の止着及びスプール
交換をする準備作業をしている間は供給機構（Ａ）によ
り引出されているワイヤ（ａ）は電気炉（Ｂ）内に停止
した状態にあり、また巻取開始後、電気炉（Ｂ）内を走
行するワイヤ（ａ）が所定の線速度に立上がるまでに時
間を要し、その間に電気炉（Ｂ）を通過したワイヤは所
望のワイヤ特性を付与されていないので、その特性不良
部分に相当する所定長さを巻取治具（９）に巻取らせ
る。That is, the wire (a) drawn out by the supply mechanism (A) is stopped in the electric furnace (B) during the preparatory work for fixing the tip of the wire (a) and replacing the spool. After the start of winding, it takes time for the wire (a) running in the electric furnace (B) to rise to a predetermined linear velocity, and the wire that has passed through the electric furnace (B) during that time is desired. Since the wire characteristics are not given, the winding jig (9) is wound for a predetermined length corresponding to the defective portion.
所定時間後に、回転軸（８）をトラバース機構によっ
て水平移動させてワイヤ（ａ）を巻取治具（９）から巻
取スプール（10）へ移行させ該スプールに設定された所
定長さ（所定時間）を巻取る。After a predetermined time, the rotating shaft (8) is horizontally moved by the traverse mechanism to move the wire (a) from the winding jig (9) to the winding spool (10) and set the predetermined length (predetermined length) set on the spool. Time).
巻取り終了後、ワイヤ（ａ）を切断してその巻取り終
端を巻取スプール（10）のフランジ（10′）にテープ止
めするとともに巻取治具（９）から巻取スプール（10）
へ移行するワイヤ部分を切断し該切断部（巻取り始端）
をフランジ（10a）にテープ止めする。After the winding is completed, the wire (a) is cut, the winding end is taped to the flange (10 ') of the winding spool (10), and the winding jig (9) takes the winding spool (10).
Cut the wire part that moves to the cutting part (the winding start end)
Tape to the flange (10a).
その後に、巻取治具（９）に巻取られたワイヤ（特性
不良部分）を解き外ずし除去し、スプール交換をして前
述の最初の準備作業に入り、以下同様の動作を繰返す。Thereafter, the wire (characteristic defective portion) wound on the winding jig (9) is unwound and removed, the spool is replaced, the above-mentioned first preparatory work is started, and the same operation is repeated thereafter.
尚、巻終り時に線速度が加工して特性不良部分が若干
発生するが、それは線速度の下降（スローダウン）を早
くすることによって解消し得る。It should be noted that the linear velocity is processed at the end of the winding to cause some characteristic defects, which can be eliminated by speeding up the decrease (slow down) of the linear velocity.
又、巻取スプール（10）に巻取られるワイヤ（ａ）は
電気炉（Ｂ）を出た後に水冷機構（ｃ）により冷却され
るので、整列巻き，クロス巻き何れの場合でもワイヤど
うしのくっ付きを生じない。Further, since the wire (a) wound on the take-up spool (10) is cooled by the water cooling mechanism (c) after exiting the electric furnace (B), it is possible to connect the wires with each other regardless of whether they are aligned winding or cross winding. Does not cause sticking.
（効果） 本発明によれば、電気炉により焼なまし処理を施こさ
れたボンディングワイヤを最終製品となる巻取スプール
に直接巻取らせても、特性不良部分の巻込みがないとと
もに水冷機構により冷却されたワイヤはその付着力が減
じられてワイヤどうしのくっ付き現象は生ぜず、使用時
におけるワイヤの繰出し（解きほぐし）を円滑ならしめ
ることができる。従って、従来工程に比べて作業工程数
を少なくし、著しく作業性に優れた巻取り方法を提供す
るとともに従来アニール機と巻取機の２台を必要として
いたものを１台のアニール付き巻取機で作業を行なうこ
とができ、小型にして床面積が少なく、かつ安価な巻取
り装置を提供し得る。(Effect) According to the present invention, even if the bonding wire annealed by the electric furnace is wound directly on the winding spool as the final product, there is no winding of the defective portion and the water cooling mechanism. The adhesive force of the wires cooled by is reduced and sticking phenomenon between the wires does not occur, and the wire can be smoothly unwound (unraveled) during use. Therefore, the number of working steps is reduced as compared with the conventional process, and a winding method having remarkably excellent workability is provided, and at the same time, the conventional annealing machine and the winding machine require one winding machine with annealing. It is possible to provide a winding device which can be operated by a machine, is small in size, has a small floor area, and is inexpensive.
又、請求項第３項によれば、ボンディングワイヤに表
面被膜層を形成するので、ワイヤのくっ付き防止機能が
さらに向上する。Further, according to the third aspect, since the surface coating layer is formed on the bonding wire, the function of preventing sticking of the wire is further improved.
第１図は本発明装置の一部切欠せる正面図、第２図はそ
の（II）−（II）線に沿う拡大断面図、第３図は巻取り
機構の要部を示す斜視図である。 図中、（Ａ）はワイヤ供給機構、（Ｂ）は電気炉、
（Ｃ）は水冷機構、（Ｄ）は巻取り機構、（８）は回転
軸、（９）は巻取治具、（10）は巻取スプール、（ａ）
はボンディングワイヤである。FIG. 1 is a partially cutaway front view of the device of the present invention, FIG. 2 is an enlarged sectional view taken along the line (II)-(II), and FIG. 3 is a perspective view showing a main part of a winding mechanism. . In the figure, (A) is a wire supply mechanism, (B) is an electric furnace,
(C) is a water cooling mechanism, (D) is a winding mechanism, (8) is a rotating shaft, (9) is a winding jig, (10) is a winding spool, and (a).
Is a bonding wire.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭62−30359（ＪＰ，Ａ) 特開 昭62−139217（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP 62-30359 (JP, A) JP 62-139217 (JP, A)
Claims (3)
気炉内を通して焼なまし処理を施こし、水冷により冷却
させた後に、巻始め部の所定長さを治具に巻取らせ、続
いて巻取スプールに設定された長さを巻取らせることを
特徴とする半導体用ボンディングワイヤの巻取り方法。1. A drawn wire is passed through an electric furnace, annealed, cooled with water, and then wound to a jig for a predetermined length at a winding start portion. A method for winding a bonding wire for a semiconductor, comprising winding a set length on a take-up spool.
炉へ供給するワイヤ供給機構、前記ワイヤが通過する間
に該ワイヤに焼なまし処理を施こす前記電気炉、その電
気炉を出たワイヤを冷却させる水冷機構およびワイヤを
巻取スプールに巻取る巻取り機構よりなり、前記巻取り
機構が巻取り用回転軸に始端部巻取治具を備えるととも
に該治具に巻取スプールを着脱自在に取付けてなる半導
体用ボンディングワイヤの巻取り装置。2. A wire supply mechanism for supplying a drawn wire to an electric furnace, an electric furnace for subjecting the wire to an annealing treatment while the wire is passing through, and a wire leaving the electric furnace. It consists of a water-cooling mechanism that cools the wire and a winding mechanism that winds the wire onto the winding spool. The winding mechanism includes a winding end rotary jig and a winding spool that can be attached to and detached from the jig. Winding device for semiconductor bonding wire attached to the.
層を形成させる安定剤を添加してなる請求項第２項記載
の巻取り装置。3. The winding device according to claim 2, wherein the cooling water of the water cooling mechanism is a pure water added with a stabilizer for forming a surface coating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63164191A JP2533916B2 (en) | 1988-06-30 | 1988-06-30 | Method and device for winding bonding wire for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63164191A JP2533916B2 (en) | 1988-06-30 | 1988-06-30 | Method and device for winding bonding wire for semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0212935A JPH0212935A (en) | 1990-01-17 |
| JP2533916B2 true JP2533916B2 (en) | 1996-09-11 |
Family
ID=15788415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63164191A Expired - Fee Related JP2533916B2 (en) | 1988-06-30 | 1988-06-30 | Method and device for winding bonding wire for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2533916B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04363036A (en) * | 1991-01-31 | 1992-12-15 | Mitsubishi Materials Corp | Bonding wire for semiconductor device use and its manufacture |
| JP4947670B2 (en) * | 2009-12-16 | 2012-06-06 | 田中電子工業株式会社 | Heat treatment method for bonding wires for semiconductor devices |
| SG186692A1 (en) * | 2011-06-10 | 2013-03-28 | Tanaka Electronics Ind | High strength and high elongation ratio of au alloy bonding wire |
-
1988
- 1988-06-30 JP JP63164191A patent/JP2533916B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0212935A (en) | 1990-01-17 |
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