JP2531642Y2 - Ultra-fine material testing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application field] The present invention relates to an ultra-fine material testing apparatus suitable for measuring the strength of a thin film formed on the surface of a test object, particularly the peeling load of the thin film.

[Prior Art] Conventionally, in order to measure a peeling load of a thin film sample, a microhardness meter including an indenter, a load device for applying a test load to the indenter, and an optical device for observing an indentation is used. . That is, the indenter is pressed into the thin film to apply deformation, the deformation is observed with a microscope, the test load is increased as needed until peeling occurs, and the test load when peeling occurs is measured as the peeling load.

[Problem to be Solved by the Invention] However, in the above-described conventional microhardness tester, the load is discontinuous because the load mechanism uses a weight to apply a test load to the indenter. There was a problem that measurement was not possible. In addition, there is another problem that it takes a long time to perform the test because the peeling is determined by observing the sample surface using a microscope. Further, the conventional microhardness meter has a problem that the load cannot be measured for a thin film having a large load.

Therefore, an object of the present invention is to provide an ultra-fine material testing apparatus capable of continuously applying a small test load and automatically grasping the load at the time when the thin film is peeled off.

[Means for Solving the Problems] The present invention employs the following configuration in order to solve the above problems.

That is, the ultra-fine material test apparatus according to the present invention is an ultra-fine material test apparatus that measures the peeling load when a thin film formed on the sample surface is peeled off from the sample surface by pushing the indenter into the sample surface. A load generating means for electrically generating a test load applied to the indenter, a displacement detecting means for detecting a displacement amount of the indenter displaced by a load applied by the load generating means, and a displacement from the displacement detecting means A load measuring means for reading a detection output, detecting a change point of the displacement output, and measuring a peeling load of the thin film from a load value at the time of the displacement.

[Operation] When peeling occurs between the thin film and the base material when the indenter is pushed into the sample surface, a change such as an increase or decrease in displacement change of the indenter occurs. The displacement of the indenter is detected by the displacement detecting means, and when the displacement output from the displacement detecting means changes, the load measuring means measures the test load applied to the indenter at the time of the change as a peeling load, and The test load at the time of peeling can be known.

[Embodiment] Fig. 1 is a view showing the configuration of an embodiment of the present invention, in which a load device 1 in a frame 20 has a knife edge 3 at the center.
An indenter 5 is provided at one end of a balance 2 supported by an electronic balance, and an iron balance 7 that generates an electromagnetic force in cooperation with an electromagnetic coil 6 is provided at the other end. The indenter 5 is attached to the tip of the balance rod 8 of the balance 2, and a differential transformer type displacement detector 10 for detecting the displacement of the indenter 5 is provided above the indenter 5.

The load device 1 includes a load current supply device 16 and an electromagnetic coil 6.
With the load current supplied to the sample, the load is added or reduced by the electromagnetic force of the electromagnetic coil 6, and the load on the sample 14 placed on the sample table 13 via the indenter 5 is arbitrarily increased, decreased, or stopped. be able to. Therefore, the load at the time of loading can be measured by measuring the load current supplied when the balance is broken and the indenter 5 is pushed into the sample surface.

While the load is being applied, the displacement on the surface of the sample 14 pressed by the indenter 5 is detected by the displacement detector 10. The displacement amount detected by the displacement detector 10, that is, the movement amount detection signal of the indenter 5 is transmitted to the superamplifier 15 and the A / D converter 17.
Is sent to the displacement information processing unit 21 in the measurement control device 19 via the. An operation command to the load current supply device 16 is also given by the measurement control device 19. The determination at the time when the indenter 5 comes into contact with the surface of the sample 14 is performed by detecting a changing point of the indenter descending speed based on the measured value of the displacement of the indenter 5.

The measurement control device 19 serving as the load measuring means detects the load when the indenter 5 is pushed into the sample 14 by the load current supplied to the load device 1 as described above, and detects the load data and the displacement detector 10. From the displacement data
The displacement under a certain load is measured in real time, and the measurement result is recorded by the recorder 23 as a load-displacement curve.

In the case where the peeling load of the thin film is measured by the above-described apparatus, the displacement change point Q in the load-displacement curve recorded by the recorder 23 as shown in FIG. Is detected, and the load value at this time is detected by the supplied load current. That is, as shown in FIGS.
When the separation occurs between the base material 25 and the base material 26, a change such as an increase or decrease of the displacement of the indenter occurs. Therefore, in the displacement detection of the indenter, it is necessary to detect a change point of the displacement as shown in FIG. Become. Therefore, the load at which this displacement change point occurs is measured as the peeling load.

As described above, according to the embodiment of the present invention, it is not necessary to determine the peeling time by observing the sample surface with a microscope as in the related art, thereby improving the test efficiency and accurately measuring the peeling load of the thin film. Can be. Also,
The test load can be set continuously and arbitrarily by adjusting the load current, and can be applied to a thin film having a small thickness, thereby enabling measurement of a peeling load.

[Effects of the Invention] As is clear from the above description, according to the ultrafine material testing apparatus of the present invention, the peeling load of the thin film sample can be accurately and efficiently measured.

[Brief description of the drawings]

FIG. 1 is a view showing a configuration of an embodiment of the present invention, FIG. 2 is a view showing load-displacement characteristics, and FIGS. 3 (a) and 3 (b) are views showing a state in which a thin film is separated from a base material. . DESCRIPTION OF SYMBOLS 1 ... Load device, 2 ... Balance 5 ... Indenter, 6 ... Electromagnetic coil (load generating means) 7 ... Iron core (load generating means), 10 ... Displacement detector 19 ... Measurement control device (load measurement Means) 21 Displacement information processing unit

Claims (1)

(57) [Scope of request for utility model registration] (1) By pressing an indenter into a sample surface,
An ultra-fine material testing device for measuring a peeling load when a thin film formed on a sample surface peels off from the sample surface, comprising: a load generating means for electrically generating a test load applied to an indenter; Means for detecting the amount of displacement of the indenter displaced by the load applied by the means, and reading the displacement detection output from the displacement detection means to detect a change point in the displacement output, and from the load value at the time of the displacement, An ultra-fine material testing apparatus, comprising: a load measuring means for measuring a peeling load.