JP2530948Y2 - 樹脂封止用半導体製造装置 - Google Patents

樹脂封止用半導体製造装置

Info

Publication number
JP2530948Y2
JP2530948Y2 JP1990067351U JP6735190U JP2530948Y2 JP 2530948 Y2 JP2530948 Y2 JP 2530948Y2 JP 1990067351 U JP1990067351 U JP 1990067351U JP 6735190 U JP6735190 U JP 6735190U JP 2530948 Y2 JP2530948 Y2 JP 2530948Y2
Authority
JP
Japan
Prior art keywords
resin
semiconductor manufacturing
holding mechanism
semiconductor device
resin encapsulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990067351U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0426536U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
淳 設楽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1990067351U priority Critical patent/JP2530948Y2/ja
Publication of JPH0426536U publication Critical patent/JPH0426536U/ja
Application granted granted Critical
Publication of JP2530948Y2 publication Critical patent/JP2530948Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1990067351U 1990-06-26 1990-06-26 樹脂封止用半導体製造装置 Expired - Lifetime JP2530948Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990067351U JP2530948Y2 (ja) 1990-06-26 1990-06-26 樹脂封止用半導体製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990067351U JP2530948Y2 (ja) 1990-06-26 1990-06-26 樹脂封止用半導体製造装置

Publications (2)

Publication Number Publication Date
JPH0426536U JPH0426536U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-03-03
JP2530948Y2 true JP2530948Y2 (ja) 1997-04-02

Family

ID=31600848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990067351U Expired - Lifetime JP2530948Y2 (ja) 1990-06-26 1990-06-26 樹脂封止用半導体製造装置

Country Status (1)

Country Link
JP (1) JP2530948Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6437041U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1987-08-31 1989-03-06

Also Published As

Publication number Publication date
JPH0426536U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-03-03

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