JP2529436C - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a non-contact type IC card, particularly a coil, which is resistant to a dirt and dusty environment.
The present invention relates to an electromagnetic induction type using the above method. [Prior Art] Here, among the IC cards, an 8-bit (N = 8) of the IC card in which the effect of the present invention is great is described.
An IC memory card that transfers data in parallel will be described. As described on page 24 of "IC card" issued by Ohmsha, edited by the Institute of Electronics, Information and Communication Engineers, an IC memory card (hereinafter referred to as an IC card) is connected to a terminal device.
Therefore, it is classified into (1) multi-pin type and (2) non-contact type. The multi-pin method uses 8-bit
Between the IC card and the terminal device by parallel or 16-bit parallel data transfer.
Data can be transferred between, and currently, high-speed reading / writing of about 200 nsec (nanosecond)
Injection is possible. The non-contact method has no contact parts,
Troubles can be avoided and the FA (factory)
・ Automation) can be used in places where the use environment is poor. Non-contact
The method solves the problem of the connection method of the multi-pin type IC card as shown below.
There is a great merit as a means to (1) Changes in internal data or internal I
Destruction of C (2) Data error due to poor contact of terminal and incapability of transmission / reception (3) Unable to connect card to terminal device due to deformation (spread) of terminal (4) Large number of pins This increases the insertion / extraction force and requires an ejector mechanism.
Means for supplying power and transmitting and receiving data without contact include light, electromagnetic induction and
And microwaves, etc., but non-contact IC cars currently in practical use
In consideration of portability, power consumption and performance as a card,
A conduction method is adopted, and is generally called a sheet coil method. FIG. 13 shows a mounting state of internal components of a conventional sheet coil type IC card.
FIG. In the figure, the printed board (1) has a large sheet coil (2) and three
Small sheet coil (3), control IC (4), memory IC (5) and battery (6)
Is implemented. The large sheet coil (2) is used to supply power from the terminal device to the IC card.
And a clock signal (hereinafter referred to as a power coil). Small seat
The coil (3) includes, for example, a data receiving coil (3a), a data transmitting coil (3b), and the like.
And a command signal receiving coil (3c). These sheet carp
(2) and (3) are the same as those for forming a conventional printed circuit board pattern (not shown in particular).
Formed by the method. The memory IC (5) is an IC for storing data, and the control IC (4) is a memo based on a command signal received by the sheet coil (3c).
This is an IC for controlling reading or writing of data of the re-IC (5).
. The battery (6) is a built-in battery for retaining data in the memory IC (5).
You. FIG. 14 is a block diagram showing the electrical connection of the IC card shown in FIG.
You. Part of the signal obtained from the power coil (2) is clocked through the clock signal line (7).
The signal supplied to the control IC (4) as a lock signal and rectified by the rectifier circuit (8)
Are supplied as DC power (9) to the control IC (4) and the memory IC (5). Two
Is a power source for DC current from the rectifier circuit (8) and the battery (6).
Prevent backflow to the side. The reception data line (11) receives the reception data from the reception coil (3a).
To the control IC (4). The transmission data line (12) is the transmission data from the control IC (4).
To the transmission coil (3b). The command signal line (13) is connected to the command signal receiving coil (3).
The command signal obtained from c) is led to the control IC (4). Card and this card
Signal transfer to and from a terminal device (not shown) is performed by serial signals.
The transfer of data between the control IC (4) and the memory IC (5) is performed by the control IC (4).
If it has a function to convert between real data and parallel data, the serial data
The data is converted to 8-bit parallel data, and is converted to an 8-bit data bus (14).
It is done. Also, of course, the terminal device side is the same as the sheet coils (2) and (3).
Sheet coil (both not shown) is provided, and the card is connected to the terminal device.
Is provided at a position that is close to and opposes each sheet coil on the card side when
I have. Each sheet coil on the IC card side is induced by electromagnetic induction of the sheet coil on the terminal device side.
The induced current generated in the il is of a differential waveform. Each signal line (7) (11) in FIG.
(12) A small-capacity capacitor (not shown) is added to (13),
The induced current is integrated and converted into a signal that can be handled by the control IC (4). This species
The IC card generally has several control signal lines, address lines, etc. in addition to those shown in FIG.
However, detailed description is omitted. The conventional sheet coils (2) and (3) shown in FIG. 13 and FIG.
Are formed in the same manner as the printed circuit board pattern. That is, by plating
The part where the copper foil is formed on the substrate and the copper foil layer is left, that is, a single-stroke pattern spiral
A resist is applied to a portion to be a coil winding in the shape of a coil, etching is performed, and then the resist is removed. The dimensions of these sheet coils are, for example, that of the power coil (2).
Large, about 20mm in diameter (about 20 turns), receiving coil (3a) and transmitting coil
The coil (3b) and the command signal receiving coil (3c) are both small and have a diameter of about 10 mm (winding).
The number is about 5 turns). In addition, this electromagnetic induction type non-contact type IC card uses serial data as described above.
Perform a transfer. Its data transfer speed is 500Kbit / sec (2μsec / bit), other non-contact
Byte transfer that transfers data of 8 bits in parallel, although it is faster than the system
Is converted to about 60Kbyte / sec (16μsec / byte).
Quite slow compared to 5Mbyte / sec (200nsec / byte) of multi-pin IC card
It is not suitable for transmitting and receiving data of a large capacity IC card of several hundred Kbytes. FIG. 15 is an enlarged plan view of one of the sheet coils shown in FIG.
FIG. 16 (a) shows an IC when the IC card is combined with the terminal device without shifting.
The line of magnetic force when the sheet coil facing the card and the terminal device side is electromagnetically inductively coupled
The perspective side view shown, (b) is an electromagnetic induction coupling at a position where both sheet coils are slightly shifted.
FIG. 5 is a perspective side view showing the magnetic lines of force at the time of doing. As shown in FIG.
Pads or lands (20) for electrical connection are provided at both ends of (18).
It is. Then, as shown in FIG. 16 (a), the IC card is shifted to the terminal device.
When placed without, the magnetic field lines (22) generated by the sheet coil (22) on the terminal device side
Most of 26) link the sheet coil (24) on the IC card side that is close and opposed.
, An induced current is generated in the sheet coil (24) based on "Lenz's law",
Propagated by contact. However, as shown in FIG. 16 (b), the IC card is not in the terminal device.
Example of magnetic field lines (26) generated by sheet coil (22) of terminal device when placed
For example, only 3/4 will be linked with the sheet coil (24) on the IC card side.
The induced electromotive force generated in the auto coil 24 is reduced to 3/4, and the induced current is also reduced to 3/3.
4, the degree of coupling and reliability of the data propagation force due to non-contact decrease. [Problem to be Solved by the Invention] The conventional electromagnetic induction type non-contact type IC card is configured as described above.
Sheet coil for transmitting signals by contact occupies a large area on printed circuit board
This has been an obstacle to the development of a large-capacity IC card in which many memory ICs are mounted on a printed circuit board. Also, in order to perform higher-speed data transfer, the current serial
For example, a parallel data transfer that transfers 8-bit data in parallel in parallel
To transfer data, it is necessary to arrange more coils side by side.
It was difficult to transfer data. Furthermore, the position between the terminal device and the IC card
The misalignment easily reduces the degree of coupling of electromagnetic induction, and the sheet on the opposite side
The magnitude of the current induced in the coil changed, and a stable constant current could not be obtained.
If the reliability of data transferred between the terminal device and the IC card decreases,
There was also a problem. The conventional non-contact type IC card has the above problems.
. SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and is intended for data transfer.
The coil occupies less space on the printed circuit board by making the coil smaller and thinner.
And perform parallel data transfer between the terminal device and the IC card.
Electromagnetic induction type non-contact IC card that performs high-speed and highly reliable data transfer
The purpose is to obtain. [Means for Solving the Problems] In view of the above objects, the present invention relates to a non-contact type IC card using an electromagnetic induction method.
The terminal device that reads and writes data from the IC card.
On the IC card that is close to the above, on an insulating base separate from the printed circuit board.
N coils are provided side by side, and the insulating base is mounted on the printed circuit board.
Non-contact type that transfers N-bit parallel data of the above data with the terminal device
It is on the IC card. In still another embodiment of the present invention, the N coils are respectively connected to the center of the coil winding.
Core, which has a pot core having an E-shaped cross-section surrounding the portion, the outer peripheral portion and the bottom portion.
Formed as a coil. In yet another embodiment of the present invention, an adjacent coil of N pot core coils is used.
In each case, a shield wall was provided to block the lines of magnetic force. In yet another embodiment of the invention, the pot core coil and shield wall are eliminated.
It was formed as one coil module by exterior molding with a rim material. Further, in another embodiment of the present invention, the coil, the pot core coil, the shield wall, and the coil module are formed by a thin film technology based on a semiconductor manufacturing technology. [Operation] In the non-contact type IC card according to the present invention, a circuit pattern is formed on a normal printed circuit board.
Technology that can form minute coils, such as thin-film technology,
And form N coils side by side on an insulating base separate from the printed circuit board of the card.
By mounting this insulating base on the printed circuit board of the card,
N coils can be provided in a narrow space on the
N-bit parallel data transfer was performed between them, thereby speeding up data transfer. Further
In another embodiment of the present invention, the N coils are wound around the center of the coil,
A pot core and a core formed in a pot core having an E-shaped cross section surrounding the periphery and the bottom.
To prevent leakage of magnetic field lines even if the IC card and the terminal device are misaligned.
To stabilize the signal. In yet another embodiment of the present invention, N pots
Shield walls between adjacent coils of the core coil to block magnetic flux lines
And coils adjacent to each other on the terminal device side or IC card side
This prevents interference of the coils, thereby enabling the coils to be arranged at high density. More
In another embodiment of the invention, the pot core coil and shield wall are sheathed with insulating material.
It was molded to form a single coil module to simplify handling. Sa
In another embodiment of the present invention, a coil, a pot core coil, a shield wall and
And coil modules are formed by thin-film technology based on semiconductor manufacturing technology.
Downsized. An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows one embodiment of the present invention.
FIG. 3 is a schematic diagram showing a mounting state of internal components of a non-contact type IC card according to an example,
The figure shows an example in which parallel data transfer of N = 8 bits is performed. The conventional one shown in FIG.
The portions indicated by the same reference numerals as those in the above indicate the same or corresponding portions. Thin film coil module
(15) is for transmitting and receiving eight data for performing 8-bit parallel data transfer.
Thin film coils (15a) to (15h) and a command signal receiving thin film for receiving command signals
A total of 9 coils (15i) are arranged in 3x3, and this is covered with an insulating material.
Module. These nine thin film coils (15a) to (15i) may be integrally formed as a thin film coil module (15) or may be individually formed.
May be formed. The arrangement of each coil (15a) to (15i) is also shown in FIG.
The arrangement is not limited to this, and may be appropriately arranged according to the mounting space. Control IC (
41) is a control IC capable of controlling transmission and reception of 8-bit parallel data. Also
FIG. 2 is a block diagram showing the electrical connection of the IC card of FIG. Thin film coil
(15a) to (15h) and the transmission / reception data lines (16a) to (16h) are 8-bit parallel data
Shared so that bidirectional transfer of data reception and transmission is possible. Control IC (41) lives
The command received from the command signal line (13) is a data write command or a read command.
Is determined, and the two-way control of the 8-bit parallel data is performed in accordance with the command. control
The input stage of the IC (41) includes, for example, a general-purpose gate IC “74HC245” or
What has the same function should just be used. FIGS. 3 and 4 show one of the thin-film coil modules (15) shown in FIG.
It is an enlarged view of the coil element. FIG. 3 shows a single-layer spiral coil winding.
Thin film coil with wires, FIG. 4 shows a thin film coil with stacked spiral coil windings
(A) is a side sectional view, and (b) is a coil viewed from above.
It is the top view which showed only a winding. The thin-film coil of FIGS.
Manufacture of thin-film coils for thin-film magnetic heads currently used in fixed hard disks
It is formed by technology (hereinafter referred to as thin film technology). In addition, both ends of the coil winding (18)
Is also formed with a pad (20) for connection to a circuit. Uses current thin film technology
Then, a spiral coil of 48 turns is 0.2-0.3mm in length and width, and 0.01mm in thickness.
It is possible to make with. Here, a 10-turn spiral coil is a few mm in length and width.
If a coil is formed by this thin film technology, multiple
Even if the coils are arranged, it is possible to form a product that occupies a smaller area than conventional products.
is there. The following equation shows the inductance used in the inductance design and the winding of the coil winding.
The relationship between the number, the inner diameter and the length of the outer diameter is shown. L = 20.32a ^Two n ^Two / (6a + 10c) [nH] where a = (d _o + D _i ) / 4 c = (d _o -d _i ) / 2 d _o = Outer diameter (μm) d _i = Inner diameter (μm) n = Number of turns That is, the spiral coil has a large number of turns and an outer diameter,
Becomes larger when the outer diameter is made as equal as possible. Therefore, limited printed circuit boards
Many spiral coils with a certain amount of inductance are prepared within the area
In order to achieve this, make the inner diameter close to the outer diameter, and
Is to form a number of spiral patterns. As before, the print base
In the method of forming a coil winding by etching a copper foil on a board, an etching pattern is used.
The pattern and pattern spacing is limited to about 100μm, but thin film technology can be several μm
And can be laminated very thinly, so that the diameter of the thin film coil is small.
The area for mounting the thin-film coil on the printed circuit board can be reduced accordingly.
You. FIG. 5 shows the steps of a method of manufacturing a thin-film coil by thin-film technology, which will be briefly described.
Just explain. First, (b) is shown on the entire upper surface of the insulating base (17) shown in (a).
Sputter copper underlayer as described above, and cover the entire surface of the insulating base (17) with copper with a thickness of about 0.1 μm.
The formation (18a) is formed. Next, as shown in FIG.
Therefore, the portion where the coil winding (18) is not formed is covered with the resist (18b). Ie
The pattern of the resist (18b) is a pattern opposite to the coil pattern. Next, in (d)
As shown in the figure, copper coil pattern plating is applied and the surface of the coil winding (18) is plated.
Form a hook portion (18c). The thickness of the plated portion (18c) is about 2 to 4 μm. Next
Then, as shown in (e), the resist (18b) is removed and copper is removed by sputter etching.
Unnecessary portions of the underlayer (18a) are removed, and thus the coil is placed on the insulating base (17).
A winding (18) is formed. Then, as shown in (f), the coil winding (18) is disconnected.
Cover with edge layer (19). This is performed by a process of forming a photoresist insulating layer and baking.
You. Also, as shown in FIG. 6, an end into which the IC card (100) of the present invention is inserted (coupled).
In the connector (50a) of the terminal device (50), a thin-film coil module (
Each coil is arranged so as to face the corresponding coil on the IC card side.
) Is provided. The coil provided in this connector (50a)
Module is inserted when the IC card (100) is inserted into the connector (50a).
The coil portion (150b) is provided in the coil portion (150b) which is close to and opposes the coil portion (150a) of the card (100). Data transfer speed of non-contact type IC card by electromagnetic induction method using this thin film coil
Since the transmission / reception of 8-bit data is performed in parallel, 500 Kbyte / sec (2 μsec
/ byte), which is eight times faster than the conventional bit serial type. Contact type
One order of magnitude slower than the pin method, but the IC card and terminal device are completely sealed.
Therefore, there is an advantage that it can be used in the FA field under adverse effects. Also
, Smaller coil occupation area, and faster data transfer speed
This increases the number of memory ICs (5) as shown in FIGS.
Also, it is easy to increase the memory capacity. In addition, even when the card and the terminal device are displaced and combined, a more stable
Pot each thin-film coil of the thin-film coil module so that electromagnetic induction coupling can be obtained.
A coil provided with a core may be used. FIG. 7 shows the outside of such a pot core coil.
It is the perspective view which expanded and showed one before being mounted and molded. Also in FIG.
(a) shows the relationship between the IC card side when the IC card is connected to the terminal device without shifting.
Lines of magnetic force when both opposing pot core coils on the terminal device side are electromagnetically inductively coupled
(B) shows a position shift between the IC card and the terminal device,
Side showing magnetic lines of force when electromagnetic induction coupling is performed at a slightly shifted position of pot core coil
It is a perspective view. As shown in FIG. 7, a pot formed on an insulating base (35)
The pot core (33) of the core coil (30) is located at the center and the outer periphery of the coil winding (31).
And a cross section surrounding the bottom and having an E-shape. Outer circumference of pot core (33)
In some parts, both ends of the coil winding (31) are pulled out of the pot core (33).
A gap portion (33d) is formed. The surface of the coil winding (31) is an insulating layer (
34), and pads (32) are attached to both ends of the coil winding (31).
Have been. This pot core coil (30) is also formed by the thin film technology described above.
. Therefore, each pot core coil, and more than one pot core coil
The overall size of the coil module stored is also significantly smaller than the conventional one
Can be formed. The manufacturing process of the pot core / coil will be described later.
. In the case of an IC card using such a pot core coil, as shown in FIG. 8 (a), the IC card is connected to the terminal device without shifting, and both pot cores are connected.
When the centers of the coils (30a) and (30b) coincide, naturally, as shown in FIG.
In the case where the IC card is displaced and coupled to the terminal device,
Most of the magnetic field lines (38) generated by the side pot core coil (30a) have more magnetic resistance.
The pot core coil (3
Assemble in the pot core of 0b). Therefore, the magnetic flux leakage is small, and the pot core coil (
A constant electromagnetic induction current similar to that shown in FIG. (A) is generated in the coil winding (31) of (30b).
. In this way, the center part, the outer peripheral part of the coil winding and the bottom part connecting them are connected to the
Pot core core surrounded by a core made of a material with high relative permeability such as ferrite
If the file is used, a data transfer failure occurs due to the misalignment between the terminal device and the IC card.
You won't be nervous. For the pot core, use a material with high relative permeability, such as ferrite.
For use, compared to conventional sheet coils formed on printed circuit boards,
Fewer turns, shorter diameter and smaller coil current produce equivalent electromagnetic induction current
Is possible. Further, as described above, a plurality of coils are respectively provided on the IC card side and the terminal device side.
When the terminals are arranged adjacent to each other, not between the opposing coils between the terminal device and the IC card
For example, lines of magnetic force leak from each other between adjacent coils in the same IC card.
Data may not be transmitted / received correctly due to interference. So next door
A shield wall may be provided between the contacting pot core coils. Figure 9 shows the shield
A part of the pot core coil module with wall
FIG. 10 is a perspective view showing the state, and FIG. 10 is an IC card side provided with a shield wall and a terminal, respectively.
FIG. 3 is a side perspective view showing magnetic lines of force when a pot core coil on the device side is electromagnetically coupled.
. Thus, the magnetic force generated by the pot core coil (30a) on the terminal device side
The line (38) is linked to the almost opposing pot core coil (30b) on the IC card side.
Magnetic force lines (38) generated from the outer periphery of the pot core coil (30b) on the IC card side
Of the magnetic flux lines of the magnetic field impinges on the shield wall (39) and loses energy therein.
, The adjacent pot core coil or another set of pot core coils of the opposite terminal
Is very unlikely to be reached. Therefore, interference between adjacent coils is prevented.
In addition, the coils can be mounted at a high density at a small interval, and the occupied area of the coil portion can be reduced. This shield wall (39) is formed of a conductive nine material such as aluminum.
What is necessary is just to be higher than the core and have a width that is a fraction of the outer circumference of the core.
Then, it can be formed by thin-film technology like the pot core, coil winding, and insulating layer.
No. Next, the manufacturing process of the pot core coil will be described with reference to FIGS. 11 and 12.
Will be explained. FIG. 11 is a plan view of the pot core coil as viewed from directly above, and FIG.
It is a side sectional view. First, in step (a) of both figures, glass or ceramic
A magnetic material (preferably a foil) is placed on an insulating base (substrate) (35) made of
Ferrite or permalloy, etc.)
A pot core bottom (33a) is formed. However, the coil winding (31) is pulled out to the outside.
Gap portion (33d) is provided. Next, in step (b), the photo
A resist insulating layer (34a) is formed, and a baking process is performed. Next, in the step (c), the pattern
A spiral conductive pattern, for example, a copper coil is generated by plating to produce a coil.
A pad (32) is formed on the winding (31) and one end thereof. Of this coil winding (31)
The manufacturing method is the same as that described with reference to FIG. Next, in step (d),
Except for the inner end of the coil winding (31), the same process as in the step (b) is performed to form a donut as shown in the drawing.
A photoresist insulating layer (34b) is formed and a baking process is performed. Next, in the step (e), the step (c)
In the same manner as described above, the lead wire (3
1a) and pads (32) are formed. Then, in the step (f), the strength is as high as in the step (a).
Pattern the magnetic material at the center and the outer periphery, and use the pot core center (33b) and
And an outer peripheral portion (33c) of the pot core. When providing a shield wall (39)
In step (g), a conductive material such as aluminum is deposited or sputtered.
This forms a shield wall (39). One formed in this way or
The plurality of pot core coils (30) and the shield wall (39) are entirely made of insulating material.
Externally molded and used, for example, in the form of a thin film coil module (15) shown in FIG.
Is done. In the above embodiment, the coil winding in the pot core coil is a one-stage spatula.
It was an spiral pattern, but a spiral pattern (No.
(See FIG. 4). The manufacturing process in this case includes, for example, a process (b) to a process (d).
Is repeated a plurality of times, and in this case, both ends of the coil winding may be connected so that the coil winding has a one-stroke pattern. If pot cores and coils are formed by the thin film technology described above,
This makes it possible to form thin and small-sized cores and coils.
Thin and small thin-film coil modules containing multiple cores and coils
be able to. Also, since this pot core coil can be formed thin and small, it has a thickness of 0.76 mm.
It is also possible to carry out with an IC microcomputer card of ISO specification.
The concard can be easily made into a non-contact type. In the above embodiment, the case where 8-bit data is transferred in parallel has been described.
However, the present invention is not limited to this, and N (N is a positive integer) data is considered in consideration of the mounting area.
If a transmitter / receiver coil is provided, N-bit data can be transferred in parallel.
Needless to say. In addition, the memory IC (5) requires a battery (6) for holding data,
A non-volatile ROM that does not require a battery 6 is shown in FIG.
The same effect can be obtained. [Effects of the Invention] As described above, according to the present invention, a non-contact type IC card using an electromagnetic induction method is provided.
To read and write data from the IC card
Place N cores on an insulating base, separate from the printed circuit board, at a location on the IC card that is nearby.
The insulating base is mounted on a printed circuit board, and
, So that N-bit (8-bit in the embodiment) parallel data transfer is performed.
Faster data transfer is possible compared to the conventional serial data transfer method
. Each of the thin film coils surrounds the center, the outer periphery and the bottom of the winding coil and has a cross section of E.
By adopting a structure with a mold-shaped pot core, between the terminal device and the IC card
The data transfer can be performed with high reliability even if the position shift occurs. Furthermore, the end
Provide a shield wall between adjacent thin-film coils on the device side or IC card side
As a result, interference between adjacent coils can be prevented, and coils must be
High-density mounting, and consequently the area occupied by the coil can be reduced.
Was.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram showing a mounting state of internal components of a non-contact type IC card according to the present invention, FIG. 2 is a block diagram showing an electrical connection of the IC card of FIG. FIG. 3 is a side sectional view and a plan view of a thin film coil having a single-layer spiral coil winding;
FIG. 5 is a side sectional view and a plan view of a thin-film coil having stacked spiral coil windings. FIG. 5 is a view for explaining a manufacturing process of the thin-film coil shown in FIG.
FIG. 7 is a perspective view showing the relationship between an IC card according to the present invention and a terminal device, FIG. 7 is an enlarged perspective view of one pot core coil according to the present invention, and FIG. FIG. 9 is a side perspective view showing magnetic lines of force generated when one opposing pot core coil is electromagnetically inductively coupled, FIG. 9 is a perspective view showing a state in which a shield wall is provided between the pot core coil according to the present invention, and FIG. FIG. 11 is a side perspective view showing magnetic lines of force generated when the opposing pot core coils on both the IC card side and the terminal device side are provided with electromagnetic induction coupling when the shield wall shown in FIG. 9 is provided. Is a plan view and a sectional view, respectively, for explaining a manufacturing process of a pot core coil according to the present invention. FIG. 13 is an internal part of a non-contact type IC card using a conventional sheet coil. FIG. 14 is a block diagram showing the electrical connection of the IC card shown in FIG. 13, and FIG. 15 is an enlarged plan view showing one of the sheet coils shown in FIG. FIG. 16 is a side perspective view showing lines of magnetic force generated when a conventional sheet coil on the IC card side and the terminal sheet side facing each other are electromagnetically inductively coupled. In the figure, (1) is a printed circuit board, (2) is a power coil, (5) is a memory IC,
(6) is a battery, (7) is a clock signal line, (8) is a rectifier circuit, (9) is DC power, (
10) a diode, (13) a command signal line, (14) a data bus, (15) a thin-film coil module, (15a) to (15h) thin-film coils for data transmission and reception, and (15i) a command signal reception (16a) to (16h) are transmission / reception data lines, (17) and (35) are insulation bases, (18) and (31) are coil windings, (19) and (34) are insulation layers, 20) and (32)
Is a pad, (30) is a pot core coil, (33) is a pot core, (38) is a magnetic field line, (39) is a shield wall, (50) is a terminal device, (50a) is a connector, and (100) is an IC card. is there. In the drawings, the same reference numerals indicate the same or corresponding parts.

Claims (1)

Claims: (1) A non-contact type IC card using an electromagnetic induction method, wherein a print is made at a position on the IC card which is in close proximity to a terminal device for reading and writing data of the IC card. N coils are provided side by side on an insulating base separate from the board,
A non-contact type IC card having the insulating base mounted on the printed circuit board and performing N-bit parallel data transfer of the data with the terminal device. (2) The non-contact coil according to claim 1, wherein the N coils are pot core coils each surrounding a central portion, an outer peripheral portion, and a bottom portion of the coil winding and provided with a pot core having an E-shaped cross section. Type IC card. (3) The non-contact type IC card according to claim 2, wherein a shield wall for blocking magnetic lines of force is provided between adjacent coils of the N pot core coils. (4) The pot core / coil and the shield wall are externally molded with an insulating material and
The non-contact type I according to claim 3 formed as one coil module.
C card. (5) A method according to claim 1, wherein one of the coil, the pot core coil, the shield wall and the coil module is formed by a thin film technique.
A non-contact type IC card according to any one of claims 4 to 4.