JP2528284Y2 - Chip component alignment mechanism - Google Patents

Description

[Detailed description of the invention] (Industrial application field) This invention is used to arrange chip components on a rotating disk at intervals to continuously select the appearance of chip components. The present invention relates to a chip component alignment mechanism used for correcting a position and an orientation.

(Prior Art) In a conventional appearance sorting device or the like, a mechanism for sequentially transporting chip components one by one is an intermittent transport system using a linear chip transport path. In this case, a simple linear alignment guide is provided to correct the position and orientation of the chip component, and the chip component can be aligned by passing the chip component.

(Problems to be Solved by the Invention) By the way, in the case of a transport mechanism of a chip component using a circumferential transfer path such that the chip component is placed on a continuously rotating disk and transported, the chip component is transported during the transport. There is a dislike that alignment can not be performed by means of a conventional simple alignment guide.

In view of the above, the present invention provides a chip component alignment mechanism that can easily align chip components and transport the chip components while being mounted on a continuous rotating disk, and that has a simple structure. Things.

(Means for Solving the Problems) In the chip component alignment mechanism of the present invention, a disk-shaped alignment rotor connected to a rotating shaft is provided very close to an upper surface of a portion near a peripheral edge of a continuous rotating disk, and The circumferential surface of the aligning rotor located on the outer peripheral side of the continuous rotating disk is in contact with a circumferential transfer path of the chip component mounted on the continuous rotating disk, and the aligning rotor is connected to the continuous rotating disk. A chip component which is rotated in the same direction as the rotating disk, and whose speed on the circumferential surface of the aligned rotor is substantially equal to the transfer speed of the chip component on the continuous rotating disk, and which is in contact with the circumferential surface of the aligned rotor; Is set to a position along the circumferential surface, and the posture of the chip component is aligned in a direction parallel to a tangent to the continuous rotating disk.

(Operation) In the chip component alignment mechanism of the present invention, when the chip components are sequentially supplied from the chip component feeder or the like to the continuous rotating disk and transported to the next processing step, the chip components are disposed on the upper surface of the portion near the peripheral edge of the continuous rotating disk. Providing an aligning rotor that rotates in the same direction in close proximity, and by making the outer peripheral speed of the aligning rotor substantially the same as the transfer speed of the chip component, the position of the chip component that has moved with the rotation of the continuous rotating disk, Even if the orientation is not accurate, the position and orientation are corrected when passing through the alignment rotor. That is, the position of the chip component in contact with the circumferential surface, which is the outer peripheral surface of the alignment rotor, is set as the position along the circumferential surface, and the posture of the chip component is aligned in a direction parallel to the tangent to the continuous rotating disk. can do. As a result, the chip components can be smoothly aligned and transported without stopping, and the chip components can be transported efficiently to the next processing step.

(Embodiment) Hereinafter, an embodiment of the chip component alignment mechanism according to the present invention will be described with reference to the drawings.

In FIGS. 1 to 3, a chip component supply mechanism (not shown) sequentially rotates a chip component 1 at a constant speed on a disk near the periphery of a continuously rotating disk 2 at a constant speed. Supply and placement. The alignment rotor 3 has a disk shape for correcting the position and orientation of the chip component 1 conveyed while being mounted on the rotary disk 2, and a portion near the periphery of the rotary disk 2 as shown in FIG. Are connected and supported by a rotating shaft 4 in a horizontal state very close to the upper surface of the first member. The rotation direction of the rotating disk 2 is indicated by an arrow J in FIG. 1, and the rotation direction of the alignment rotor 3 is also indicated by an arrow K in the same direction. The circumferential surface (outer circumferential surface) of the alignment rotor 3 located on the outer circumferential side of the rotating disk 2 is in contact with a circumferential trajectory (transfer path) to which the chip component 1 is transferred. Further, the speed of the outer peripheral surface of the alignment rotor 3 and the moving speed of the track on the rotating disk 2 on which the chip components are placed, that is, the transfer speed of the chip components, are made substantially equal.

Next, the operation of the embodiment will be described. The chip component 1 conveyed by the rotation of the rotating disk 2 is not always placed in a correct position and orientation (posture) when supplied to the upper surface of the rotating disk 2. When the chip components 1 try to pass one after another in the vicinity of the alignment rotor 3, the chip component 1 whose posture is shifted at the position P as shown in FIG. 3 comes into contact with the alignment rotor 3. In this case, the chip component 1 attempts to move in the tangential direction of the rotating disk 2 at a speed V1 (V1: the moving speed of the chip component by the disk), but since the chip component 1 is in contact with the alignment rotor 3, the chip component 1 A force F in a normal direction of the aligning rotor 3 is received by a speed V2 of the outer circumferential tangent direction of the aligning rotor 3 and a relative speed V3 between the speed V1. Accordingly, the chip component 1 undergoes the correction of the deviation of the position and the posture by the force F, and the position and the orientation are aligned along the outer peripheral surface of the rotor 3 and parallel to the tangent of the rotating disk 2 like the chip component 1 at the position Q. And is further moved forward and away from the aligning rotor 3, and is conveyed by the rotating disk 2 in a correct posture.

(Effects of the Invention) As described above, according to the chip component alignment mechanism of the present invention, by providing the alignment rotor, the position of the chip component that has moved while being placed on the continuously rotating disk can be determined. Even if the orientation is not accurate, the chip components can be easily aligned in the orientation parallel to the tangent line of the continuous rotating disc by using a correction when passing through the alignment rotor without using a conventional guide. Can be transported. In addition, since the transport of the chip components is continuously performed, many chip components can be processed at a high speed, and there is an advantage that the structure is simple.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of a chip component alignment mechanism according to the present invention, FIG. 2 is a sectional view thereof, and FIG. 3 is a partially enlarged plan view thereof. 1. Chip parts, 2. Continuous rotating disk, 3. Aligned rotor.

Claims (1)

(57) [Scope of request for utility model registration] 1. A disk-shaped aligning rotor connected to a rotating shaft is provided very close to an upper surface of a portion near a peripheral edge of a continuous rotating disk, and said aligning rotor is located on an outer peripheral side of said continuous rotating disk. A circumferential surface of the rotor is in contact with a circumferential transfer path of the chip component placed on the continuous rotating disk, and rotates the aligning rotor in the same direction as the continuous rotating disk, and The speed of the circumferential surface of the rotor is substantially equal to the transfer speed of the chip component on the continuous rotating disk, and the position of the chip component in contact with the circumferential surface of the aligned rotor is a position along the circumferential surface, A chip component alignment mechanism, wherein a posture of the chip component is aligned in a direction parallel to a tangent of the continuous rotating disk.