JP2527665Y2 - 光送信器と光ファイバとの結合装置及び光受信器と光ファイバとの結合装置 - Google Patents

光送信器と光ファイバとの結合装置及び光受信器と光ファイバとの結合装置

Info

Publication number
JP2527665Y2
JP2527665Y2 JP1990040496U JP4049690U JP2527665Y2 JP 2527665 Y2 JP2527665 Y2 JP 2527665Y2 JP 1990040496 U JP1990040496 U JP 1990040496U JP 4049690 U JP4049690 U JP 4049690U JP 2527665 Y2 JP2527665 Y2 JP 2527665Y2
Authority
JP
Japan
Prior art keywords
optical fiber
optical
light
photodiode
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990040496U
Other languages
English (en)
Japanese (ja)
Other versions
JPH041504U (OSRAM
Inventor
孝行 青木
文男 石川
哲生 山本
力 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP1990040496U priority Critical patent/JP2527665Y2/ja
Publication of JPH041504U publication Critical patent/JPH041504U/ja
Application granted granted Critical
Publication of JP2527665Y2 publication Critical patent/JP2527665Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Optical Couplings Of Light Guides (AREA)
JP1990040496U 1990-04-16 1990-04-16 光送信器と光ファイバとの結合装置及び光受信器と光ファイバとの結合装置 Expired - Lifetime JP2527665Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990040496U JP2527665Y2 (ja) 1990-04-16 1990-04-16 光送信器と光ファイバとの結合装置及び光受信器と光ファイバとの結合装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990040496U JP2527665Y2 (ja) 1990-04-16 1990-04-16 光送信器と光ファイバとの結合装置及び光受信器と光ファイバとの結合装置

Publications (2)

Publication Number Publication Date
JPH041504U JPH041504U (OSRAM) 1992-01-08
JP2527665Y2 true JP2527665Y2 (ja) 1997-03-05

Family

ID=31550334

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990040496U Expired - Lifetime JP2527665Y2 (ja) 1990-04-16 1990-04-16 光送信器と光ファイバとの結合装置及び光受信器と光ファイバとの結合装置

Country Status (1)

Country Link
JP (1) JP2527665Y2 (OSRAM)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54130825A (en) * 1978-03-31 1979-10-11 Canon Inc Image scanner

Also Published As

Publication number Publication date
JPH041504U (OSRAM) 1992-01-08

Similar Documents

Publication Publication Date Title
CA1075057A (en) Remote control light transmitting lens system
JP3819893B2 (ja) 二重キャップ構造の双方向光通信器モジュール
EP1296169A2 (en) Bidirectional optical transmission device
KR20180042600A (ko) 광학모듈
US11705691B2 (en) Light source device
US20080187315A1 (en) Bi-directional optical module with improved optical crosstalk
US6990262B2 (en) Optical module
US6876682B2 (en) Light generating module
EP1513006A3 (en) Light wavelength converting system
EP0508613B1 (en) Multichip system and method of supplying clock signal therefor
US20030151121A1 (en) Optical transmission module
US8303194B2 (en) Transceiver and bi-directional signal transmission system thereof
US20060261258A1 (en) Optical assembly with optical transmitting and receiving functions
US4833318A (en) Reflection-type photosensor
CN110320615A (zh) 光学模块和光学设备
CN112904493B (zh) 一种光模块
JPS5858824B2 (ja) 光結合半導体装置
EP4485024A1 (en) Optical waveguide substrate, optical waveguide package, and light source module
CN223898804U (zh) 一种基于cob工艺贴装的多模激光器组件
KR102239822B1 (ko) 다채널 구동 표면실장 타입 레이저 다이오드
JPH0821931A (ja) Ｌｄモジュールおよびその駆動方法並びにｌｄモジュールを用いた漏光監視システム
JPH0745859A (ja) 光センサー
JP4475726B2 (ja) フォトカプラ
KR20240067465A (ko) 표면 실장형 포토인터럽터
CN108093104B (zh) 电子装置

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term