JP2527227Y2 - Screen plate cleaning device for cream solder screen printing machine " - Google Patents

Description

[Detailed description of the invention]

According to the present invention, a solder alloy powder and a high-viscosity liquid flux are kneaded on a printed wiring board through a screen plate having a plurality of openings having a predetermined print pattern to form a cream. The present invention relates to a screen plate cleaning device in a screen printer for printing cream solder. In this type of screen printing, it is repeatedly performed prior to a mounting operation of soldering a chip-shaped electronic component on a conductor pattern of a printed wiring board, and a squeegee is brought into contact with the upper surface of the screen plate. The cream-like solder is forcibly fed into the pattern opening of the screen plate by the linear movement, and the cream-like solder is printed on the printed wiring board through the opening. Leaks from the pattern opening of the screen plate and attaches as solder residue to the lower surface of the screen plate around the lower part of the opening, or attaches to the inner surface of the pattern opening as solder residue and tends to remain. If screen printing is continued with the solder residue attached as described above, creamy solder may protrude from a predetermined printing surface on the conductor pattern of the printed wiring board, or solder attached to the lower surface of the screen plate around the lower part of the opening. Residues or mixtures of these solder residues and creamy solder are mutually bonded to cause troubles such as short circuit and connection of the circuit, or the printed solder pattern is not constant,
In other words, it causes a state of printing failure that has lost its shape, impairs the efficiency of the printing operation, and leads to a decrease in printing accuracy.

[0002]

2. Description of the Related Art Conventionally, the screen plate has been cleaned manually by using paper or cloth, but recently, the screen plate has been cleaned.
For example, there has been proposed a screen plate cleaning apparatus configured to automatically wipe solder residue attached to the lower surface of a screen plate with a cleaning roller wound with a special paper (see, for example, Japanese Patent Publication No. 1-19275). ).

[0003]

In the known solder residue removing operation on the screen plate, although a certain effect can be expected with respect to the removal of the solder residue deposited on the surface of the screen plate, it is difficult to remove the solder residue on the inner surface of the slit. The effect of the solder residue was hardly expected because the slit itself was very small. In addition, since the frequency of the work is high, there is a disadvantage that the cost of the paper or cloth used increases. The present invention has been made in view of the above-mentioned problems of the prior art.Therefore, an object of the present invention is to provide only the solder residue deposited on the surface of the screen plate and the inner surface of the slit without using paper or cloth. In addition, by reliably removing the solder residue deposited on the surface of the scraping plate used to scrape the residue on the surface of the screen plate, it is possible to always maintain the printed state of the solder with high accuracy Another object of the present invention is to provide a novel solder residue scraping device which can improve the economic efficiency.

[0004]

In order to achieve the above object, a screen plate cleaning apparatus according to the present invention has a plurality of apertures (7) having a predetermined print pattern on a printed circuit board. In a screen printing machine for printing creamy solder through a screen plate (6), an exhaust port (8) connected to an external suction device and a horizontally long opening opening toward a lower surface of the screen plate (6). And a drive mechanism for reciprocating the device body along the lower surface of the screen plate, and a reciprocating device body having an upper cover communicating with the exhaust port (8). The scraper (5) reciprocates while contacting the lower surface of the screen plate with the movement, thereby removing the creamy solder residue (9) attached to the lower surface of the screen plate. Consists of a 2 is divided along a transverse length opening in its axial and 該削 technique up plate from the interior of the upper cover slightly is protruded to the upward through said oblong opening,
On both the front and rear sides of the scraping plate, the inner surfaces of the pattern openings (7) of the screen plate and the residue (9) of creamy solder adhered to the scraping plate are respectively removed from the lower surface of the screen plate by the scraping plate. A slit-shaped intake nozzle for sucking together with the scraped solder residue (9) is formed.

[0005]

Next, the present invention will be described with reference to the accompanying drawings showing an embodiment thereof. In FIG. 1, when the main body 3 moves after the solder printing operation, the scraping plate 5, which is fixed at a position where the upper end portion of the two middle plates 2 on the upper part of the main body 3 is in contact with the screen plate 6, becomes It operates to scrape off the solder residue 9 deposited around the slit pattern 7 of the plate 6. At this time, since a strong suction force is applied from the outside of the apparatus through the discharge port 8, the gap between the upper cover 1 and the screen plate 6 and the scraping plate 5 and the upper cover 1
The outside air flows into the apparatus at a high speed and a high pressure through a gap provided between the outside air and the outside air. For this reason, the solder residue 9 scraped off by the scraping plate 5 is instantly taken into the apparatus from the gap provided between the scraping plate 5 and the upper cover 1 by the above air pressure and air flow. Rarely, it is discharged to the outside of the apparatus from the discharge port 8 through the opening of the middle plate 2 and the main body 3. Further, when the portion of the scraping plate 5 that contacts the screen plate 6 passes below the slit pattern 7, air flows into the apparatus from the upper surface of the screen plate 6 through the through holes of the slit pattern 7 itself. The solder residue 9 deposited on the inner surface of the slit pattern 7 is taken into the device. When the scraping plate 5 scrapes the solder residue deposited on the surface of the screen plate 6, the air pressure and the air flow also act on the solder residue to be deposited on the scraping plate 5. In addition, it is apparent that the same function as described above functions even when the main body 3 shown in FIG. 1 is moved in the opposite direction. As described above, one embodiment of the present invention has been described with reference to the drawings. However, the present invention is not limited to the embodiment, and can be implemented with various modifications. For example, the screen plate 6 and the upper cover 1, the scraping plate 5 and the upper cover 1
The upper cover 1 and the scraping plate 5 each having a shape and size to change the size and shape of the space formed by
And an opening 4 formed by the middle plate 2 and the main body 3.
By changing the shape and size of the middle plate 2 and the main body 3 having the shape and size to further change the shape and size of the body, and further preparing an inhalation device having a different air suction force, and combining them to form the device,
Depending on the conditions of use, it is possible to use a device consisting of a combination in which the device functions most effectively. Further, the following mechanism can be added to more effectively remove the solder residue deposited on the scraping plate 5. That is, as shown in FIG. 8, both ends of a seesaw spring 15 attached to the lower side surface of the scraping plate 5 by pins 14 attached to the side surface of a moving portion 13 that moves on a drive rail 12 to drive the main body portion 3. Is fixed, and a portion of the surface of the drive rail 12 on which the moving portion 13 moves is raised to form a moving portion 13 as shown in FIG.
When the moving member 13 passes over the raised portion, the moving direction side of the moving portion 13 is lifted, and at the same time, the scraping plate 1 is attached to the lifted side of the moving portion 13 and the end thereof contacts the scraping plate 5.
6 moves upward on the scraping plate 5 to scrape the solder residue 9 deposited on the scraping plate 5. The scraped-off solder residue is sucked into the main body 3 by the flow of air from outside the device and discharged to the outside of the device as described above. When the moving part 13 returns to the flat part on the drive rail 12 after passing the raised part, the return movement of the seesaw spring 15 causes the scraping plate 16 to return.
Returns to its original state. This operation is the same when the moving unit 13 moves in the opposite direction. Note that the above operation is performed in a state where the main body 3 moves down after the main body 3 has passed below all the slit patterns of the screen plate 6 and the scraping plate 5 is not in contact with the screen plate 6. on the other hand,
As a method for more reliably removing the solder residue, it is also possible to divide the portion located above the middle plate 2 of the scraping plate 5 into two plates as shown in FIG. In this case, the main body 3 is disposed between the scraping plate 10 and the scraping plate 11.
If the opening is formed to a depth reaching the upper surface of the screen, the scraped-off solder residue and the solder residue deposited on the inner surface of the screen plate 6 can be sucked into the main body 3 also from the opening, so that the effect of the operation can be further improved. It is possible to increase. In the apparatus using the two scraping plates, not only the portion located above the middle plate 2 but also the portion sandwiched between the middle plates 2 as shown in FIG. The following effects can be further obtained by adding a function that operates independently in conjunction with each other. That is, in FIG. 11, while the main body 3 is moving, the scraping plate 18 which is not on the movement direction side is lowered slightly below the scraping plate 19, and the solder residue 9 on the screen plate 6 is moved by the scraping plate 19. Scrape off. After the work is completed, when the main body 3 starts to move in the reverse direction to carry out the next work, the scraping plate 19 is lowered as shown in FIG. 6 and scrape off the solder residue 9. By performing a series of these operations, the solder residue deposited on the scraping plate 19 when the scraping plate 19 scrapes the solder residue 9 in FIG.
When the operation 2 is performed, it is possible to prevent the deposition on the screen plate 6 again.

[0006]

The present invention is configured as described above and has the following effects. First, not only the solder residue deposited on the surface of the screen plate and the inner surface of the slit pattern, but also the solder residue deposited on the scraping plate itself can be surely removed in each operation, so that the solder residue is continuously removed. It is possible to always obtain a highly accurate work result in the solder printing work. Secondly, unlike the conventional method, paper and cloth are not used, which contributes to an increase in economical efficiency of work.

[Brief description of the drawings]

FIG. 1 is a sectional view of a device and a screen plate showing the structure and operation of the device.

FIG. 2 is a plan view of the apparatus.

FIG. 3 is a side view of the device and the screen plate.

FIG. 4 is a plan view of the apparatus with an upper cover and a middle plate removed.

FIG. 5 is a plan view of a main body.

FIG. 6 is a plan view of a middle plate.

FIG. 7 is a side view of a scraping plate.

FIG. 8 is a perspective view of a main part showing the structure of the device.

FIG. 9 is a side view of a main part showing the operation of the apparatus.

FIG. 10 is a sectional view of the device and a screen plate showing the structure of the device.

FIG. 11 is a sectional view of the device and a screen plate showing the structure and operation of the device.

FIG. 12 is a sectional view of the device and a screen plate showing the structure and operation of the device.

[Explanation of symbols]

1 top cover 2 intermediate plate 3 air box 4 ventilation holes 5 stripped up plate 6 screen plate 7 opening 8 outlet 9 creamed solder residue 10, 11 scraper plate 12 the drive rail 13 moving unit 14 pin 15 seesaw spring 16 , 17 scraping plate 18,19 scraping plate

Claims (2)

(57) [Scope of request for utility model registration] 1. A screen printing machine for printing creamy solder on a printed wiring board through a screen plate (6) having a plurality of apertures (7) having a predetermined print pattern. An apparatus body including an exhaust port (8) connected to the apparatus, and an upper cover having a horizontally long opening opening toward the lower surface of the screen plate (6) and communicating with the exhaust port (8). A drive mechanism for reciprocating the device main body along the lower surface of the screen plate; and a reciprocating motion while contacting the lower surface of the screen plate with the reciprocation of the device main body, whereby the screen plate A scraping plate (5) capable of scraping off the residue (9) of creamy solder attached to the lower surface, and slightly removing the scraping plate from the inside of the upper cover through the oblong opening to a position above the scraping plate. The oblong opening is divided into two along the axis thereof by projecting, and creamy solders respectively attached to the inner surface of the pattern opening (7) of the screen plate and the shaving plate are provided on both front and rear sides of the shaving plate. Residue (9)
A screen-shaped cleaning device, characterized in that slit-shaped suction nozzles are formed for sucking together with the creamy solder residue (9) scraped off from the lower surface of the screen plate by the scraping plate. 2. A screen printing machine for printing creamy solder on a printed wiring board through a screen plate (6) having a plurality of apertures (7) having a predetermined print pattern. An air box (3) having an exhaust port (8) connected to the apparatus, and a vent (4) communicating with the inside of the air box, and fixed to the upper surface of the air box. A plate (2) fixed to an upper surface of the middle plate, having a horizontally long opening opening toward a lower surface of the screen plate (6), and having a ventilation hole formed in the middle plate through the air hole of the middle plate. An apparatus main body including an upper cover (1) communicating with the inside, a driving mechanism for reciprocating the apparatus main body along a lower surface of the screen plate, and a driving mechanism for reciprocating the apparatus main body. Reciprocating while touching the lower surface And a scraping plate (5) capable of scraping off the residue (9) of creamy solder adhered to the lower surface of the screen plate, thereby removing the scraping plate from the inside of the upper cover (1). The horizontal opening is slightly protruded upward through the horizontal opening to divide the horizontal opening into two along the axis thereof, and the inner surface of the pattern opening (7) of the screen plate and the shaving are provided on both front and rear sides of the shaving plate. Forming slit-shaped intake nozzles for sucking cream-like solder residue (9) adhered to the plate together with cream-like solder residue (9) scraped from the lower surface of the screen plate by the scraping plate; A screen plate cleaning device characterized by the above-mentioned.