JP2523540Y2 - Storage case for packaged lead components - Google Patents

Description

[Detailed description of the invention]

[0001]

The present invention relates to DIP, QFP, SI
A package type in which a plurality of packaged lead components such as P are housed as electronic device packaging means, and the lead components housed in the case are individually applied as electronic component supply means by component compressed air. The present invention relates to a lead component storage case.

[0002]

2. Description of the Related Art Conventionally, package-type lead components are placed in a magazine by stacking the package portions one on top of the other or placed on a pallet partitioned by partitions, so that the components are placed on an automatic electronic component supply device at the time of component mounting. It is usually done. However, these electronic component automatic supply devices are effective as long as the components themselves are relatively large, but are not very efficient in terms of storage form for small chip-type lead components. In particular, in the case of using a pallet, it is necessary to change the packaging state at the time of shipping parts from the pallet to the pallet.

[0003] Instead of these storage modes, the present invention is mainly applied to chip-type electronic components. A continuous storage groove for electronic components is formed in a case, and a plurality of electronic components are provided in the storage groove. Disk pack-type storage cases that are arranged and stored have already been proposed (Japanese Utility Model Laid-Open No. 2-111682 and Japanese Utility Model Laid-Open No. 2-111683).

In the electronic component storage case, a large number of electronic components can be efficiently stored, so that the entire case can be formed in a compact size, and the electronic components can be ejected by sending component pressurized air into the storage grooves. It is preferable because it can also be used as a component supply unit that also serves as a component packaging unit.

However, when wrapping or supplying a lead component, entanglement of a lead terminal occurs between successive components,
If the lead components cannot be reliably sent out to the component taking-out port one by one, there is a possibility that supply of the lead components to the mounting head may be hindered.

[0006]

SUMMARY OF THE INVENTION According to the present invention, package-type lead components are stored in a case while preventing entanglement of the lead terminals, and the lead components are surely attached to the mounting head one by one when the lead components are sent out. An object of the present invention is to provide a package-type lead component storage case that can be sent out.

[0007]

According to the present invention, a plurality of package-type lead components are aligned and accommodated in a continuous storage groove in the case. A package-type lead component storage case that is individually sent out of the case from the component outlet by the component pressure air that feeds the components into the groove of the storage groove. The lead components are separated from each other and stored in the case. In addition, a spacer that acts as a resistor for the component pressure air and pushes and moves the lead component in the groove of the storage groove is inserted and inserted between the components. As the spacer, a paper, a plastic plate, or a metal plate can be used.

[0008]

In this package type lead component storage case, a plurality of lead components to be aligned and inserted into the storage groove are separated by a spacer sandwiched between the components, so that the components can be prevented from being entangled with each other by the lead terminals. Not only can it be stored neatly, but the spacers can act as a resistor for the component pressure air and push the lead components in the groove of the storage groove to separate them individually even when removing the lead components from the case. Can be sent to

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The storage case shown is a DIP, QFP, SI
The present invention is applied to housing a chip-type electronic component having a plurality of lead terminals led out to two or four sides in a package shape such as P in a case. As the storage case, Japanese Utility Model Application Laid-Open No. 2-11168 previously proposed by the present applicant has been proposed.
A disk pack type similar to that described in JP-A-2-111683 can be used.

The storage case of the disk pack type has a basic form in which a storage groove for electronic components which are continuous in a spiral or straight line is provided inside the case body.
It is configured by opening a component outlet that is continuous from the storage groove on the side surface of the case body. Also, in this storage case, the component pressurizing air is intermittently fed into the storing groove of the electronic component, and the electronic component is moved in the storing groove by the component pressurizing air, so that it can be individually supplied from the component outlet to the mounting head. It is configured as follows.

FIG. 1 shows a partial arrangement of packaged lead components E, E,... Stored in a case. These lead components E, E,. A plurality of grooves 2 are arranged and stored in front of and behind each other in the groove 2. The lead components E, E,... Are accommodated in the storage groove 2 by separating spacers S by interposing spacers S between the components. As the spacers S, paper, plastic film or metal foil can be used, and a rectangular shape corresponding to the width of the package-type lead components E, 0.1 to 0.1 is used.
One having a thickness of about 0.3 mm is used.

The spacers S are sandwiched between the packaged lead parts E, E,... When the packaged lead parts E, E.
By mounting the components together in the case, the components can be interposed so as to be separated from each other in the case. In addition, the spacers S can be formed by sequentially cutting the strip-shaped foil wound on the reel in accordance with the component feeding timing, or by sandwiching the strip-shaped foil in advance between the components.

In this case for storing packaged lead parts, the successive parts are separated by the spacers S, so that the respective lead parts E, E. Can be neatly inserted. Also, since the storage grooves 2 are formed continuously inside the case body 1, a plurality of the lead components E, E,... Can be housed inside the case body 1 by being aligned and positioned in a predetermined direction.

Therefore, the lead components E can be individually and reliably sent out by the component compressed air which is intermittently sent into the storage groove 2 without being entangled with the lead terminals. Also,
The spacers S... Also act as resistors for receiving the component pressurized air when the component pressurized air is supplied, and the lead components E, E. Can be reliably sent by air.

FIG. 2 shows an example of a storage case for accommodating the above-mentioned lead components. In FIG. 2, a case cover plate portion 1 of a case body 1 formed of a transparent plastic material is shown.
Each part structure is shown including the internal structure which can be seen from a. In this storage case, the above-described component outlet 3 is formed so as to open to the side surface of the case body 1 from the outermost periphery 2n of the storage groove 2 through the linear groove 2p. A shutter 4 for opening and closing the component outlet 3 is mounted near the component outlet 3.

FIG. 3 shows the case main body 1 in a cross section. The case main body 1 is formed of a case cover plate portion 1a and a case substrate portion 1b fitted and fixed to each other. Each of the parts 1a and 1b is formed of a plastic material, and at least the case cover plate part 1a is formed of a transparent plastic material that can be seen through. A continuous spiral groove is formed in the case substrate portion 1b, and the concave groove is covered with the case cover plate portion 1b to form a storage groove 2 for electronic components.

In this storage case, air supply holes 5a... 5n communicating from the outer surface of the case to the inside of the storage groove 2 are provided in the case substrate portion 1b so as to correspond to the respective circumferences 2a. I have. Similarly, case lid plate 1
a is provided with air vent holes 6a... 6n for discharging the component compressed air sent into the storage groove 2 for electronic components.

The air feed holes 5a... 5n send the component pressurized air from the respective holes to the respective circumferences 2a... 2n of the storage grooves 2 in a relative direction. The electronic components are provided in two rows by being positioned at the lower side of the case main body 1 and opening a predetermined angle from the center of the case so that the electronic components can be sent efficiently. The air inlet 5a ...
5n is covered with a coupling for feeding the component pressurized air into the storage groove 2 as described later. A coupling is fitted and fixed on the outer surface of the case substrate 1b.
A ring-shaped rising rib is formed so as to protrude so as to surround the air inlet holes 5a to 5n.

The air discharge holes 6a... 6n are respectively provided on the upper side of the case body 1 in correspondence with the respective air feed holes 5a. Also, a plurality of rows are provided so that the component pumping air can be efficiently discharged so that each of the electronic components that are turned upward while facing each other from the relative direction by the feeding of the component pumping air is prevented from receiving an extreme impact.

The shutter 4 has a substantially middle side pivotally supported by a support shaft 4a and is assembled and arranged inside a concave groove 1c provided on the upper side plate thick surface of the case main body 1, so that the outermost periphery 2n of the storage groove 2 is formed. It is attached to the case body 1 at a position higher than that. A stopper 4b for opening and closing the component outlet 3 is provided on the component outlet 3 side with the support shaft 4a as a center, and protruding downward. The stopper piece 4b is
Are arranged so as to be able to protrude and retract from the inside of the component outlet 3 through the opening communicating with the storage groove 2 from the mounting position.

On the other end side, a compression spring 4c is assembled by being arranged between the lower surface of the shutter 4 and the receiving groove surface of the case body 1. The compression spring 4c is provided so as to bias the shutter 4 via the support shaft 4a so that the stopper piece 4b can always be protruded into the inside of the component outlet 3 so that the shutter 4 can be biased.

FIG. 4 shows a state in which the storage case is mounted on an automatic electronic component supply device. In the figure, reference numeral 10 denotes a base on the side of the automatic supply device for electronic components, 11 denotes an air feeding mechanism for the compressed air of the components mounted on the base 10, 12a and 12
b denotes a stand supporting frame for supporting the case body 1 of the storage case on the plate surface of the base 10, and H denotes a mounting head for mounting electronic components on a printed circuit board.

In this automatic electronic component supply device,
An electronic component storage case is mounted on the base 10 by sandwiching and supporting the case body 1 between left and right stand supporting frames 12a and 12b provided on the plate surface of the base 10.
When the storage case is installed, the component outlets 3 for the lead components E, E,... Are arranged so as to open toward the upper end at the end position of the storage groove 2. Also, a mounting head H for taking out lead components E, E... From the component outlet 3 is arranged so as to be movable in the X and Y directions above the case body 1 mounted on the base 10.

The case main body 1 is provided in the air feeding mechanism 11 for the component feeding air in correspondence with the air feeding holes 5a.
There are provided couplings 13a and 13b to be fitted to each other. An air source is connected to the couplings 13a and 13b so as to intermittently supply compressed air from the air valve 11a via the joints 11b and 11c, the connection pipe 11d, and the branch pipe 11e.

A push pin 14 such as a solenoid driven in synchronism with the air feeding mechanism 11 for the component pressurized air is connected to the electronic component at a position corresponding to the end of the shutter 4 biased and supported by the compression spring 4c. Is provided above as a mechanism on the side of the supply device. The pushing pin 14 is provided so as to retreat the stopper piece 4b from inside the component outlet 3 by pressing one end of the shutter 4 against the compression spring 4c.

In this automatic supply device for electronic components, the component pressurized air is intermittently fed from the air feed holes 5a. Move toward outlet 3. The spacer S receives the compressed air of the component and becomes a resistor of the compressed air when the compressed air is supplied. For this reason, the spacer S is composed of the lead components E, E
. Can be reliably sent out toward the component outlet 3 by pushing and moving the components. The spacers S may be collected together with the lead components E, E,.

In this electronic component storage case, the component outlet 3 is opened toward the upper part of the case main body 1 when the case main body 1 is mounted on the automatic electronic component feeder. The mounting head H that has received the electronic component from 3 can be quickly moved in the XY directions toward the position of the XY table on which the printed circuit board is mounted, without having to move up and down significantly.

[0028]

As described above, according to the package-type lead component storage case according to the present invention, the lead components are separated from each other by the spacers and stored in the case. The terminals can be prevented from being entangled with each other, and the lead components can be pushed and moved by the spacers along with the supply of the component pressurizing air, so that they can be individually separated and smoothly sent out from the component take-out port.

[Brief description of the drawings]

FIG. 1 is an explanatory view partially showing a component storage state in a storage case of a packaged lead component according to the present invention.

FIG. 2 is an explanatory view showing a side view of a storage case for a packaged lead component according to an example of the present invention;

FIG. 3 is an explanatory view showing the storage case in a cross section.

FIG. 4 is an explanatory diagram showing an electronic component automatic supply device equipped with the storage case.

[Explanation of symbols]

 1 Case body 2 Storage groove for electronic components 3 Component outlet E, E ... Package type lead component S ... Spacer

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Takeshi Ito 1-13-1 Nihonbashi, Chuo-ku, Tokyo Inside TDK Corporation (56) References Japanese Utility Model Showa 55-32013 (JP, U)

Claims (4)

(57) [Scope of request for utility model registration] A plurality of packaged lead components are arranged and received in a row in front of and behind a continuous storage groove in a case, and the lead components are sent out of the case through a component outlet by component feeding air for feeding the lead components into the storage groove. In the storage case for packaged lead components that are sent individually to each other, the lead components are housed in the case by separating the components of successive lead components, and the lead components serve as a resistor for component pressure air, and the lead components are stored in the storage grooves. A package-type lead component storage case, characterized in that a spacer that is pushed and moved in the groove is inserted between components. 2. The package-type lead component storage case according to claim 1, wherein paper is sandwiched between said spacers. 3. The package-type lead component storage case according to claim 1, wherein a plastic plate is sandwiched between said spacers. 4. The package-type lead component storage case according to claim 1, wherein a metal plate is sandwiched between said spacers.